933834100215 [NXP]
DIODE 0.07 A, 70 V, 2 ELEMENT, SILICON, SIGNAL DIODE, TO-236AB, PLASTIC, SMD, 3 PIN, Signal Diode;
| 型号： | 933834100215 |
| 厂家： | 
NXP |
| 描述： | DIODE 0.07 A, 70 V, 2 ELEMENT, SILICON, SIGNAL DIODE, TO-236AB, PLASTIC, SMD, 3 PIN, Signal Diode 光电二极管 |
| 文件： | 总8页 (文件大小：66K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
age
BAS70 series
Schottky barrier (double) diodes
Product specification
2001 Oct 11
Supersedes data of 1999 Jun 01
Philips Semiconductors
Product specification
Schottky barrier (double) diodes
BAS70 series
FEATURES
PINNING
• Low forward current
DESCRIPTION
SOT23
BAS70-04 BAS70-05
• High breakdown voltage
• Guard ring protected
SOT143B
PIN
BAS70
BAS70-06
BAS70-07
• Small plastic SMD package
• Low diode capacitance.
(see Fig.1b) (see Fig.1c) (see Fig.1d) (see Fig.1e) (see Fig.2)
1
2
3
4
a1
n.c.
k1
a1
k2
a1
a2
k1
k2
k1
k2
a2
a1
APPLICATIONS
k1, a2
−
k1, k2
−
a1, a2
−
• Ultra high-speed switching
• Voltage clamping
−
• Protection circuits.
3
3
1
DESCRIPTION
Planar Schottky barrier diodes with an
integrated guard ring for stress
protection. Single diodes and double
diodes with different pinning are
available.
2
MGC485
c. BAS70-04
1
2
3
1
Top view
MGC482
The diodes BAS70, BAS70-04,
BAS70-05 and BAS70-06 are
encapsulated in a SOT23 small
plastic SMD package. The BAS70-07
is encapsulated in a SOT143B small
plastic SMD package.
2
a. Simplified outline SOT23.
MGC484
d. BAS70-05.
3
3
MARKING
2
n.c.
1
2
1
MARKING
TYPE NUMBER
MGC483
MGC486
CODE(1)
b. BAS70 single diode.
e. BAS70-06.
BAS70
73
74
75
76
77
BAS70-04
BAS70-05
BAS70-06
BAS70-07
Fig.1 Simplified outline (SOT23) and symbols.
Note
1.
handbook, halfp
4
3
2
= p: Made in Hong Kong.
= t: Made in Malaysia.
= W: Made in China.
4
3
2
1
1
Top view
MAM194
Fig.2 Simplified outline (SOT143B) BAS70-07 and symbol.
2
2001 Oct 11
Philips Semiconductors
Product specification
Schottky barrier (double) diodes
BAS70 series
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
Per diode
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VR
continuous reverse voltage
continuous forward current
repetitive peak forward current
non-repetitive peak forward current
storage temperature
−
−
−
−
70
V
IF
70
mA
mA
mA
°C
IFRM
IFSM
Tstg
Tj
tp ≤ 1 s; δ ≤ 0.5
70
tp < 10 ms
100
+150
150
+150
−65
−
junction temperature
°C
Tamb
operating ambient temperature
−65
°C
ELECTRICAL CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MAX.
UNIT
Per diode
VF
forward voltage
see Fig.3
IF = 1 mA
IF = 10 mA
IF = 15 mA
410
750
1
mV
mV
V
IR
reverse current
VR = 50 V; note 1; see Fig.4
VR = 70 V; note 1; see Fig.4
IF = 5 mA
100
10
nA
µA
ps
τ
charge carrier life time (Krakauer
method)
100
Cd
diode capacitance
f = 1 MHz; VR = 0; see Fig.6
2
pF
Note
1. Pulse test: tp = 300 µs; δ = 0.02.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
thermal resistance from junction to ambient note 1
CONDITIONS
VALUE
UNIT
K/W
Rth j-a
500
Note
1. Refer to SOT23 or SOT143B standard mounting conditions.
2001 Oct 11
3
Philips Semiconductors
Product specification
Schottky barrier (double) diodes
BAS70 series
GRAPHICAL DATA
MRA803
MRA805
2
2
10
10
I
R
I
(1)
F
(µA)
(mA)
10
10
(2)
(3)
1
1
1
10
1
10
2
3
10
(1)
(2) (3) (4)
2
10
10
0
0.2
0.4
0.6
0.8
1
0
20
40
60
80
V
(V)
V
(V)
R
F
(1) Tamb = 125 °C.
(2) Tamb = 85 °C.
(3) Tamb = 25 °C.
(4) Tamb = −40 °C.
(1) Tamb = 150 °C.
(2) Tamb = 85 °C.
(3) Tamb = 25 °C.
Fig.3 Forward current as a function of forward
voltage; typical values.
Fig.4 Reverse current as a function of reverse
voltage; typical values.
MRA804
MGL762
3
10
2
C
d
r
dif
(pF)
(Ω)
1.5
2
10
1
0.5
0
10
1
10
−1
2
0
20
40
60
80
1
10
10
I
(mA)
V
(V)
F
R
f = 10 kHz.
f = 1 MHz.
Fig.5 Differential forward resistance as a function
of forward current; typical values.
Fig.6 Diode capacitance as a function of reverse
voltage; typical values.
2001 Oct 11
4
Philips Semiconductors
Product specification
Schottky barrier (double) diodes
BAS70 series
PACKAGE OUTLINES
Plastic surface mounted package; 3 leads
SOT23
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
1
b
p
w M
B
L
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.
1.1
0.9
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
2.5
2.1
0.45
0.15
0.55
0.45
mm
0.1
1.9
0.95
0.2
0.1
REFERENCES
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEDEC
EIAJ
97-02-28
99-09-13
SOT23
TO-236AB
2001 Oct 11
5
Philips Semiconductors
Product specification
Schottky barrier (double) diodes
BAS70 series
Plastic surface mounted package; 4 leads
SOT143B
D
B
E
A
X
y
H
v
M
A
E
e
b
p
w
M
B
4
3
Q
A
A
1
c
1
2
L
p
b
1
e
1
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
max
UNIT
A
b
b
c
D
E
e
e
H
L
p
Q
v
w
y
p
1
1
E
1.1
0.9
0.48
0.38
0.88
0.78
0.15
0.09
3.0
2.8
1.4
1.2
2.5
2.1
0.45
0.15
0.55
0.45
0.1
mm
1.9
1.7
0.2
0.1
0.1
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
97-02-28
SOT143B
2001 Oct 11
6
Philips Semiconductors
Product specification
Schottky barrier (double) diodes
BAS70 series
DATA SHEET STATUS
PRODUCT
DATA SHEET STATUS(1)
STATUS(2)
DEFINITIONS
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2001 Oct 11
7
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2001
SCA73
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613514/06/pp8
Date of release: 2001 Oct 11
Document order number: 9397 750 08761
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