933835630005 [NXP]

IC 64 X 9 OTHER FIFO, 520 ns, UUC, DIE, FIFO;
933835630005
型号: 933835630005
厂家: NXP    NXP
描述:

IC 64 X 9 OTHER FIFO, 520 ns, UUC, DIE, FIFO

先进先出芯片
文件: 总22页 (文件大小:166K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
INTEGRATED CIRCUITS  
DATA SHEET  
For a complete data sheet, please also download:  
The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications  
The IC06 74HC/HCT/HCU/HCMOS Logic Package Information  
The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines  
74HC/HCT7030  
9-bit x 64-word FIFO register;  
3-state  
December 1990  
Product specification  
File under Integrated Circuits, IC06  
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
FEATURES  
Data outputs (Q0 to Q8)  
Synchronous or asynchronous operation  
3-state outputs  
As there is no weighting of the outputs, any output can be  
assigned as the MSB. The size of the FIFO memory can  
be reduced from the 9 × 64 configuration as described for  
data inputs. In a reduced format, the unused data output  
pins must be left open circuit.  
Master-reset input to clear control functions  
33 MHz (typ.) shift-in, shift-out rates with or without flags  
Very low power consumption  
Master-reset (MR)  
Cascadable to 25 MHz (typ.)  
When MR is LOW, the control functions within the FIFO  
are cleared, and data content is declared invalid. The  
data-in-ready (DIR) flag is set HIGH and the  
data-out-ready (DOR) flag is set LOW. The output stage  
remains in the state of the last word that was shifted out,  
or in the random state existing at power-up.  
Readily expandable in word and bit dimensions  
Pinning arranged for easy board layout: input pins  
directly opposite output pins  
Output capability: standard  
ICC category: LSI  
Status flag outputs (DIR, DOR)  
GENERAL DESCRIPTION  
Indication of the status of the FIFO is given by two status  
flags, data-in-ready (DIR) and data-out-ready (DOR):  
The 74HC/HCT7030 are high-speed Si-gate CMOS  
devices specified in compliance with JEDEC standard  
no. 7A.  
DIR = HIGH indicates the input stage is empty and  
ready to accept valid data  
The 74HC/HCT7030 is an expandable, First-In First-Out  
(FIFO) memory organized as 64 words by 9 bits. A 33 MHz  
data-rate makes it ideal for high-speed applications. Even  
at high frequencies, the ICC dynamic is very low  
DIR = LOW indicates that the FIFO is full or that a  
previous shift-in operation is not complete  
(busy)  
(fmax = 18 MHz; VCC = 5 V produces a dynamic ICC of  
80 mA). If the device is not continuously operating at fmax  
then ICC will decrease proportionally.  
DOR = HIGH assures valid data is present at the  
outputs Q0 to Q8 (does not indicate that new  
data is awaiting transfer into the output stage)  
,
With separate controls for shift-in (SI) and shift-out (SO),  
reading and writing operations are completely  
DOR = LOW indicates the output stage is busy or  
there is no valid data  
independent, allowing synchronous and asynchronous  
data transfers. Additional controls include a master-reset  
input (MR) and an output enable input (OE). Flags for  
data-in-ready (DIR) and data-out-ready (DOR) indicate the  
status of the device.  
Shift-in control (SI)  
Data is loaded into the input stage on a LOW-to-HIGH  
transition of SI. A HIGH-to-LOW transition triggers an  
automatic data transfer process (ripple through). If SI is  
held HIGH during reset, data will be loaded at the rising  
edge of the MR signal.  
Devices can be interconnected easily to expand word and  
bit dimensions. All output pins are directly opposite the  
corresponding input pins thus simplifying board layout in  
expanded applications.  
Shift-out control (SO)  
A LOW-to-HIGH transition of SO causes the DOR flags to  
go LOW. A HIGH-to-LOW transition of SO causes  
upstream data to move into the output stage, and empty  
locations to move towards the input stage (bubble-up).  
INPUTS AND OUTPUTS  
Data inputs (D0 to D8)  
As there is no weighting of the inputs, any input can be  
assigned as the MSB. The size of the FIFO memory can  
be reduced from the 9 × 64 configuration, i.e. 8 × 64,  
7 × 64, down to 1 × 64, by tying unused data input pins to  
Output enable (OE)  
The outputs Q0 to Q8 are enabled when OE = LOW. When  
OE = HIGH the outputs are in the high impedance  
OFF-state.  
V
CC or GND.  
December 1990  
2
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
QUICK REFERENCE DATA  
GND = 0 V; Tamb = 25 °C; tr = tf = 6 ns  
TYPICAL  
UNIT  
SYMBOL  
PHL/ tPLH  
PARAMETER  
CONDITIONS  
HC  
HCT  
t
propagation delay  
MR to DIR and DOR  
SO to Qn  
CL = 15 pF; VCC = 5 V  
21  
36  
33  
26  
40  
29  
ns  
ns  
fmax  
maximum clock frequency  
SI and SO  
MHz  
CI  
input capacitance  
3.5  
3.5  
pF  
pF  
CP  
power dissipation capacitance per package notes 1 and 2  
660  
660  
Notes  
1. CPD is used to determine the dynamic power dissipation (PD in µW):  
PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where:  
fi = input frequency in MHz  
fo = output frequency in MHz  
(CL × VCC2 × fo) = sum of outputs  
CL = output load capacitance in pF  
VCC = supply voltage in V  
2. For HC the condition is VI = GND to VCC  
For HCT the condition is VI = GND to VCC 1.5 V  
ORDERING INFORMATION  
See “74HC/HCT/HCU/HCMOS Logic Package Information”.  
December 1990  
3
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
PIN DESCRIPTION  
PIN NO.  
SYMBOL  
GND  
DIR  
NAME AND FUNCTION  
ground (0 V)  
1, 2, 14  
3
data-in-ready output  
4
SI  
shift-in input (LOW-to-HIGH, edge-triggered)  
parallel data inputs  
5, 6, 7, 8, 9, 10, 11, 12, 13  
D0 to D8  
OE  
15  
output enable input (active LOW)  
3-state parallel data outputs  
24, 23, 22, 21, 20, 19, 18, 17, 16  
Q0 to Q8  
DOR  
SO  
25  
26  
27  
28  
data-out-ready output  
shift-out input (HIGH-to-LOW, edge-triggered)  
asynchronous master-reset input (active LOW)  
positive supply voltage  
MR  
VCC  
Note  
1. Pin 14 must be connected to GND. Pins 1 and 2 can be left floating or connected to GND, however it is not allowed  
to let current flow in either direction between pins 1, 2 and 14.  
Fig.1 Pin configuration.  
Fig.2 Logic symbol.  
Fig.3 IEC logic symbol.  
December 1990  
4
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
Fig.4 Functional diagram.  
APPLICATIONS  
High-speed disc or tape controller  
Video timebase correction  
A/D output buffers  
Voice synthesis  
Input/output formatter for digital filters and FFTs  
Bit-rate smoothing  
December 1990  
5
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
With the FIFO empty, the SO input can be held HIGH until  
the SI control input is used. Following an SI pulse, data  
moves through the FIFO to the output stage, resulting in  
the DOR flag pulsing HIGH and a shift-out of data  
occurring. The SO control must be made LOW before  
additional data can be shifted out (see Fig.10).  
FUNCTIONAL DESCRIPTION  
Data input  
Following power-up, the master-reset (MR) input is pulsed  
LOW to clear the FIFO memory (see Fig.8). The  
data-in-ready flag (DIR = HIGH) indicates that the FIFO  
input stage is empty and ready to receive data. When DIR  
is valid (HIGH), data present at D0 to D8 can be shifted-in  
using the SI control input. With SI = HIGH, data is shifted  
into the input stage and a busy indication is given by DIR  
going LOW.  
High-speed burst mode  
If it is assumed that the shift-in/shift-out pulses are not  
applied until the respective status flags are valid, it follows  
that the shift-in/shift-out rates are determined by the status  
flags. However, without the status flags a high-speed burst  
mode can be implemented. In this mode, the  
burst-in/burst-out rates are determined by the pulse widths  
of the shift-in/shift-out inputs and burst rates of 35 MHz can  
be obtained. Shift pulses can be applied without regard to  
the status flags but shift-in pulses that would overflow the  
storage capacity of the FIFO are not allowed (see Figs 11  
and 12).  
The data remains at the first location in the FIFO until SI is  
set to LOW. With SI = LOW data moves through the FIFO  
to the output stage, or to the last empty location. If the  
FIFO is not full after the SI pulse, DIR again becomes valid  
(HIGH) to indicate that space is available in the FIFO. The  
DIR flag remains LOW if the FIFO is full (see Fig.6). The  
SI pulse must be made LOW in order to complete the  
shift-in process.  
With the FIFO full, SI can be held HIGH until a shift-out  
(SO) pulse occurs. Then, following a shift-out of data, an  
empty location appears at the FIFO input and DIR goes  
HIGH to allow the next data to be shifted-in. This remains  
at the first FIFO location until SI again goes LOW (see  
Fig.7).  
Expanded format  
With the addition of a logic gate, the FIFO is easily  
expanded to increase word length (see Fig.17). The basic  
operation and timing are identical to a single FIFO, with the  
exception of an additional gate delay on the flag outputs. If  
during application, the following occurs:  
Data transfer  
SI is held HIGH when the FIFO is empty, some  
additional logic is required to produce a composite DIR  
pulse (see Figs 7 and 18).  
After data has been transferred from the input stage of the  
FIFO following SI = LOW, data moves through the FIFO  
asynchronously and is stacked at the output end of the  
register. Empty locations appear at the input end of the  
FIFO as data moves through the device.  
SO is held HIGH when the FIFO is full, some additional  
logic is required to produce a composite DOR pulse (see  
Figs 10 and 18).  
Due to the part-to-part spread of the ripple through time,  
the flag signals of FIFOA and FIFOB will not always  
coincide and the AND-gate will not produce a composite  
flag signal. The solution is given in Fig.18.  
Data output  
The data-out-ready flag (DOR = HIGH) indicates that  
there is valid data at the output (Q0 to Q8). The initial  
master-reset at power-on (MR = LOW) sets DOR to LOW  
(see Fig.8). After MR = HIGH, data shifted into the FIFO  
moves through to the output stage causing DOR to go  
HIGH. As the DOR flag goes HIGH, data can be  
shifted-out using the SO control input. With SO = HIGH,  
data in the output stage is shifted out and a busy indication  
is given by DOR going LOW. When SO is made LOW,  
data moves through the FIFO to fill the output stage and an  
empty location appears at the input stage. When the  
output stage is filled DOR goes HIGH, but if the last of the  
valid data has been shifted out leaving the FIFO empty the  
DOR flag remains LOW (see Fig.9). With the FIFO empty,  
the last word that was shifted-out is latched at the output  
Q0 to Q8.  
The “7030” is easily cascaded to increase the word  
capacity and no external components are needed. In the  
cascaded configuration, all necessary communications  
and timing are performed by the FIFOs. The  
intercommunication speed is determined by the minimum  
flag pulse widths and the flag delays. The data rate of  
cascaded devices is typically 25 MHz. Word-capacity can  
be expanded to and beyond 128-words × 9-bits (see  
Fig.19).  
December 1990  
6
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
December 1990  
7
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
DC CHARACTERISTICS FOR 74HC  
For the DC characteristics see “74HC/HCT/HCU/HCMOS Logic Family Specifications”.  
Output capability: standard  
ICC category: LSI  
AC CHARACTERISTICS FOR 74HC  
GND = 0 V; tr = tf = 6 ns; CL = 50 pF  
Tamb (°C)  
TEST CONDITIONS  
74HC  
SYMBOL PARAMETER  
UNIT  
VCC  
+25  
40 to +85 40 to +125  
WAVEFORMS  
(V)  
min. typ. max. min. max. min. max.  
tPHL/ tPLH propagation delay  
MR to DIR, DOR  
69  
25  
20  
210  
42  
36  
265  
53  
45  
315  
63  
54  
ns  
ns  
ns  
ns  
ns  
µs  
µs  
ns  
ns  
ns  
ns  
2.0  
4.5  
6.0  
Fig.8  
t
t
t
t
PHL/ tPLH propagation delay  
SI to DIR  
77  
28  
22  
235  
47  
40  
295  
59  
50  
355  
71  
60  
2.0  
4.5  
6.0  
Fig.6  
PHL/ tPLH propagation delay  
SO to DOR  
102 315  
37  
30  
395  
79  
67  
475  
95  
81  
2.0  
4.5  
6.0  
Fig.9  
63  
54  
PHL/ tPLH propagation delay  
DOR to Qn  
11  
4
3
35  
7
6
45  
9
8
55  
11  
9
2.0  
4.5  
6.0  
Fig.10  
Fig.14  
Fig.10  
Fig.7  
PHL/ tPLH propagation delay  
SO to Qn  
113 345  
41  
33  
430  
86  
73  
520  
104  
88  
2.0  
4.5  
6.0  
69  
59  
tPLH  
propagation delay/  
ripple through delay  
SI to DOR  
2.5  
0.9  
0.7  
8.0  
1.6  
1.3  
10  
2.0  
1.6  
12  
2.4  
1.9  
2.0  
4.5  
6.0  
tPLH  
propagation delay/  
bubble-up delay  
SO to DIR  
3.3  
1.2  
1.0  
10.0  
2.0  
1.6  
12  
2.5  
2.0  
15  
3.0  
2.4  
2.0  
4.5  
6.0  
t
t
PZH/ tPZL 3-state output enable  
52  
19  
15  
175  
35  
30  
220  
44  
37  
265  
53  
45  
2.0  
4.5  
6.0  
Fig.16  
Fig.16  
Fig.14  
Fig.6  
OE to Qn  
PHZ/ tPLZ 3-state output disable  
OE to Qn  
50  
18  
14  
150  
30  
26  
190  
38  
33  
225  
45  
38  
2.0  
4.5  
6.0  
tTHL/ tTLH output transition time  
19  
7
6
75  
15  
13  
95  
19  
16  
110  
22  
19  
2.0  
4.5  
6.0  
tW  
SI pulse width  
HIGH or LOW  
50  
10  
9
14  
5
4
65  
13  
11  
75  
15  
13  
2.0  
4.5  
6.0  
December 1990  
8
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
Tamb (°C)  
TEST CONDITIONS  
74HC  
SYMBOL PARAMETER  
UNIT  
VCC  
+25  
40 to +85 40 to +125  
WAVEFORMS  
(V)  
min. typ. max. min. max. min. max.  
tW  
SO pulse width  
HIGH or LOW  
100 33  
125  
25  
21  
150  
30  
26  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
2.0  
4.5  
6.0  
Fig.9  
20  
17  
12  
10  
tW  
DIR pulse width  
HIGH  
10  
5
4
47  
17  
14  
145  
29  
25  
8
4
3
180  
36  
31  
8
4
3
220  
44  
38  
2.0  
4.5  
6.0  
Fig.7  
tW  
DOR pulse width  
HIGH  
10  
5
4
47  
17  
14  
145  
29  
25  
8
4
3
180  
36  
31  
8
4
3
220  
44  
38  
2.0  
4.5  
6.0  
Fig.10  
tW  
MR pulse width  
LOW  
70  
14  
12  
22  
8
6
90  
18  
15  
105  
21  
18  
2.0  
4.5  
6.0  
Fig.8  
trem  
removal time  
MR to SI  
80  
16  
14  
24  
8
7
100  
20  
17  
120  
24  
20  
2.0  
4.5  
6.0  
Fig.15  
tsu  
set-up time  
Dn to SI  
35 36  
45  
9  
8  
55  
11  
9  
2.0  
4.5  
6.0  
Fig.13  
7  
6  
13  
10  
th  
hold time  
Dn to SI  
135 44  
170  
34  
29  
205  
41  
35  
2.0  
4.5  
6.0  
Fig.13  
27  
23  
16  
13  
fmax  
fmax  
fmax  
maximum clock pulse  
frequency  
9.9  
30  
36  
2.8  
14  
16  
2.4  
12  
14  
MHz 2.0  
4.5  
Figs 11 and 12  
Figs 6 and 9  
Figs 6 and 9  
SI, SO burst mode  
6.0  
maximum clock pulse  
frequency  
9.9  
30  
36  
2.8  
14  
16  
2.4  
12  
14  
MHz 2.0  
4.5  
SI, SO using flags  
6.0  
maximum clock pulse  
frequency  
7.6  
23  
27  
2.2  
11  
13  
1.8  
9.2  
11  
MHz 2.0  
4.5  
SI, SO cascaded  
6.0  
December 1990  
9
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
DC CHARACTERISTICS FOR 74HCT  
For the DC characteristics see “74HC/HCT/HCU/HCMOS Logic Family Specifications”.  
Output capability: standard  
ICC category: LSI  
Note to HCT types  
The value of additional quiescent supply current (ICC) for a unit load of 1 is given in the family specifications.  
To determine ICC per input, multiply this value by the unit load coefficient shown in the table below.  
INPUT  
UNIT LOAD COEFFICIENT  
OE  
SI  
Dn  
MR  
SO  
1.00  
1.50  
0.75  
1.50  
1.50  
AC CHARACTERISTICS FOR 74HCT  
GND = 0 V; tr = tf = 6 ns; CL = 50 pF  
Tamb (°C)  
TEST CONDITIONS  
74HCT  
SYMBOL PARAMETER  
UNIT  
VCC  
+25  
40 to +85 40 to +125  
WAVEFORMS  
(V)  
min. typ. max. min. max. min. max.  
t
t
PHL/ tPLH propagation delay  
MR to DIR, DOR  
30 51  
29 49  
39 67  
46 78  
53  
61  
84  
98  
15  
2.0  
63  
ns  
ns  
ns  
ns  
ns  
µs  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
Fig.8  
PHL/ tPLH propagation delay  
SI to DIR  
74  
Fig.6  
tPHL/ tPLH propagation delay  
SO to DOR  
101  
117  
18  
Fig.9  
t
PHL/ tPLH propagation delay  
SO to Qn  
Fig.14  
Fig.10  
Fig.10  
t
PHL/ tPLH propagation delay  
DOR to Qn  
7
12  
tPLH  
propagation delay/ripple  
through delay  
0.9 1.6  
1.2 2.0  
2.4  
SI to DOR  
tPLH  
propagation delay/  
bubble-up delay  
SO to DIR  
2.5  
3.0  
µs  
4.5  
Fig.7  
tPZH/ tPZL 3-state output enable  
OE to Qn  
20 35  
19 35  
44  
44  
19  
53  
53  
22  
ns  
ns  
ns  
4.5  
4.5  
4.5  
Fig.16  
Fig.16  
Fig.14  
t
PHZ/ tPLZ 3-state output disable  
OE to Qn  
tTHL/ tTLH output transition time  
7
15  
December 1990  
10  
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
Tamb (°C)  
TEST CONDITIONS  
74HCT  
SYMBOL PARAMETER  
UNIT  
VCC  
(V)  
+25  
40 to +85 40 to +125  
WAVEFORMS  
min. typ. max. min. max. min. max.  
tW  
SI pulse width  
HIGH or LOW  
12  
15  
7
6
15  
19  
6
18  
22  
6
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
Fig.6  
tW  
SO pulse width  
HIGH or LOW  
9
Fig.9  
tW  
DIR pulse width  
HIGH  
22 37  
20 35  
10  
46  
44  
56  
53  
Fig.7  
tW  
DOR pulse width  
HIGH  
6
5
5
Fig.10  
Fig.8  
tW  
MR pulse width  
LOW  
18  
18  
5  
30  
15  
23  
23  
4  
38  
12  
27  
27  
4  
45  
10  
trem  
tsu  
th  
removal time  
MR to SI  
10  
Fig.15  
Fig.13  
Fig.13  
Figs 11 and 12  
set-up time  
Dn to SI  
16  
18  
hold time  
Dn to SI  
fmax  
maximum clock pulse  
frequency  
26  
MHz 4.5  
MHz 4.5  
MHz 4.5  
SI, SO burst mode  
fmax  
maximum clock pulse  
frequency  
15  
13  
26  
22  
12  
10  
10  
Figs 6 and 9  
Figs 6 and 9  
SI, SO using flags  
fmax  
maximum clock pulse  
frequency  
8.6  
SI, SO cascaded  
December 1990  
11  
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
AC WAVEFORMS  
Shifting in sequence FIFO empty to FIFO full  
Notes to Fig.6  
1. DIR initially HIGH; FIFO is  
prepared for valid data.  
2. SI set HIGH; data loaded into  
input stage.  
3. DIR drops LOW, input stage  
“busy”.  
4. SI set LOW; data from first  
location “ripple through”.  
5. DIR goes HIGH, status flag  
indicates FIFO prepared for  
additional data.  
6. Repeat process to load 2nd word  
through to 64th word into FIFO.  
7. DIR remains LOW; with attempt  
to shift into full FIFO, no data  
transfer occurs.  
(1) HC : VM = 50%; VI = GND to VCC  
.
HCT: VM = 1.3 V; VI = GND to 3 V.  
Fig.6 Waveforms showing the SI input to DIR output propagation  
delay. The SI pulse width and SI maximum pulse frequency.  
With FIFO full; SI held HIGH in anticipation of empty location  
Notes to Fig.7  
1. FIFO is initially full, shift-in is held  
HIGH.  
2. SO pulse; data in the output  
stage is unloaded, “bubble-up  
process of empty locations  
begins”.  
3. DIR HIGH; when empty location  
reached input stage, flag  
indicates FIFO is prepared for  
data input.  
4. DIR returns to LOW; FIFO is full  
again.  
5. SI brought LOW; necessary to  
complete shift-in process, DIR  
remains LOW, because FIFO is  
full.  
(1) HC : VM = 50%; VI = GND to VCC  
.
HCT: VM = 1.3 V; VI = GND to 3 V.  
Fig.7 Waveforms showing bubble-up delay, SO input to DIR output  
and DIR output pulse width.  
December 1990  
12  
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
Master reset applied with FIFO full  
Notes to Fig.8  
1. DIR LOW, output ready HIGH;  
assume FIFO is full.  
2. MR pulse LOW; clears FIFO.  
3. DIR goes HIGH; flag indicates  
input prepared for valid data.  
4. DOR drops LOW; flag indicates  
FIFO empty.  
(1) HC : VM = 50%; VI = GND to VCC  
.
HCT: VM = 1.3 V; VI = GND to 3 V.  
Fig.8 Waveforms showing the MR input to DIR, DOR output  
propagation delays and the MR pulse width.  
Shifting out sequence; FIFO full to FIFO empty  
Notes to Fig.9  
1. DOR HIGH; no data transfer in  
progress, valid data is present at  
output stage.  
2. SO set HIGH; results in DOR  
going LOW.  
3. DOR drops LOW; output stage  
“busy”.  
4. SO is set LOW; data in the input  
stage is unloaded, and new data  
replaces it as empty location  
“bubbles-up” to input stage.  
5. DOR goes HIGH; transfer  
process completed, valid data  
present at output after the  
specified propagation delay.  
(1) HC : VM = 50%; VI = GND to VCC  
.
6. Repeat process to unload the 3rd  
through to the 64th word from  
FIFO.  
HCT: VM = 1.3 V; VI = GND to 3 V.  
Fig.9 Waveforms showing the SO input to DIR output propagation  
delay. The SO pulse width and SO maximum pulse frequency.  
7. DOR remains LOW; FIFO is  
empty.  
December 1990  
13  
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
With FIFO empty; SO is held HIGH in anticipation  
Notes to Fig.10  
1. FIFO is initially empty, SO is held  
HIGH.  
2. SI pulse; loads data into FIFO  
and initiates ripple through  
process.  
3. DOR flag signals the arrival of  
valid data at the output stage.  
4. Output transition; data arrives at  
output stage after the specified  
propagation delay between the  
rising edge of the DOR pulse to  
the Qn output.  
5. DOR goes LOW; FIFO is empty  
again.  
6. SO set LOW; necessary to  
complete shift-out process. DOR  
remains LOW, because FIFO is  
empty.  
(1) HC : VM = 50%; VI = GND to VCC  
.
HCT: VM = 1.3 V; VI = GND to 3 V.  
Fig.10 Waveforms showing ripple through delay SI input to DOR output,  
DOR output pulse width and propagation delay from the DOR  
pulse to the Qn output.  
Shift-in operation; high-speed burst mode  
In the high-speed mode, the burst-in rate is determined by the minimum shift-in HIGH and shift-in LOW  
specifications. The DIR status flag is a don’t care condition, and a shift-in pulse can be applied regardless of  
the flag. A SI pulse which would overflow the storage capacity of the FIFO is ignored.  
(1) HC : VM = 50%; VI = GND to VCC  
.
HCT: VM = 1.3 V; VI = GND to 3 V.  
Fig.11 Waveforms showing SI minimum pulse width and SI maximum pulse frequency, in high-speed shift-in  
burst mode.  
December 1990  
14  
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
Shift-out operation; high-speed burst mode  
In the high-speed mode, the burst-out rate is determined by the minimum shift-out HIGH and shift-out LOW  
specifications. The DOR flag is a don’t care condition and a SO pulse can be applied without regard to the flag.  
(1) HC : VM = 50%; VI = GND to VCC  
.
HCT: VM = 1.3 V; VI = GND to 3 V.  
Fig.12 Waveforms showing SO minimum pulse width and maximum pulse frequency, in high-speed shift-out  
burst mode.  
The shaded areas indicate when the input is permitted to change for predictable output performance.  
(1) HC : VM = 50%; VI = GND to VCC  
.
HCT: VM = 1.3 V; VI = GND to 3 V.  
Fig.13 Waveforms showing hold and set-up times for Dn input to SI input.  
December 1990  
15  
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
(1) HC : VM = 50%; VI = GND to VCC  
.
(1) HC : VM = 50%; VI = GND to VCC  
.
HCT: VM = 1.3 V; VI = GND to 3 V.  
HCT: VM = 1.3 V; VI = GND to 3 V.  
Fig.15 Waveforms showing the  
MR input to SI input removal  
time.  
Fig.14 Waveforms showing SO input to Qn output  
propagation delays and output transition time.  
(1) HC : VM = 50%; VI = GND to VCC  
.
HCT: VM = 1.3 V; VI = GND to 3 V.  
Fig.16 Waveforms showing the 3-state enable and disable times for input OE.  
December 1990  
16  
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
APPLICATION INFORMATION  
The PC74HC/HCT7030 is easily expanded to increase word length. Composite  
DIR and DOR flags are formed with the addition of an AND gate. The basic  
operation and timing are identical to a single FIFO, with the exception of an added  
gate delay on the flags.  
Fig.17 Expanded FIFO for increased word length; 64 words × 18 bits.  
This circuit is only required if the SI input is constantly held HIGH, when the FIFO  
is empty and the automatic shift-in cycles are started or if SO output is constantly  
held HIGH, when the FIFO is full and the automatic shift-out cycles are started  
(see Figs 7 and 10).  
Fig.18 Expanded FIFO for increased word length.  
December 1990  
17  
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
Expanded format  
Fig.19 shows two cascaded FIFOs providing a capacity of 128 words × 9 bits.  
Fig.20 shows the signals on the nodes of both FIFOs after the application of a SI pulse, when both FIFOs are initially  
empty. After a rippled through delay, data arrives at the output of FIFOA. Due to SOA being HIGH, a DOR pulse is  
generated. The requirements of SIB and DnB are satisfied by the DORA pulse width and the timing between the rising  
edge of DORA and QnA. After a second ripple through delay, data arrives at the output of FIFOB.  
Fig.21 shows the signals on the nodes of both FIFOs after the application of a SOB pulse, when both FIFOs are initially  
full. After a bubble-up delay a DIRB pulse is generated, which acts as a SOA pulse for FIFOA. One word is transferred  
from the output of FIFOA to the input of FIFOB. The requirements of the SOA pulse for FIFOA is satisfied by the pulse  
width of DORB. After a second bubble-up delay an empty space arrives at DnA, at which time DIRA goes HIGH.  
Fig.22 shows the waveforms at all external nodes of both FIFOs during a complete shift-in and shift-out sequence.  
The PC74HC/HCT7030 is easily cascaded to increase word capacity without any  
external circuitry. In cascaded format, all necessary communications are handled  
by the FIFOs. Figs 17 to 19 demonstrate the intercommunication timing between  
FIFOA and FIFOB. Fig.22 gives an overview of pulses and timing of two cascaded  
FIFOs, when shifted full and shifted empty again.  
Fig.19 Cascading for increased word capacity; 128 words × 9 bits.  
December 1990  
18  
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
Notes to Fig.20  
1. FIFOA and FIFOB initially empty,  
SOA held HIGH in anticipation of  
data.  
2. Load one word into FIFOA; SI  
pulse applied, results in DIR  
pulse.  
3. Data out A/data in B transition;  
valid data arrives at FIFOA output  
stage after a specified delay of  
the DOR flag, meeting data input  
set-up requirements of FIFOB.  
4. DORA and SIB pulse HIGH;  
(ripple through delay after  
SIA LOW) data is unloaded from  
FIFOA as a result of the data  
output ready pulse, data is shifted  
into FIFOB.  
5. DIRB and SOA go LOW; flag  
indicates input stage of FIFOB is  
busy, shift-out of FIFOA is  
complete.  
6. DIRB and SOA go HIGH  
automatically; the input stage of  
FIFOB is again able to receive  
data, SO is held HIGH in  
anticipation of additional data.  
(1) HC : VM = 50%; VI = GND to VCC  
.
HCT: VM = 1.3 V; VI = GND to 3 V.  
7. DORB goesHIGH;(ripplethrough  
delay after SIB LOW) valid data is  
present one propagation delay  
later at the FIFOB output stage.  
Fig.20 FIFO to FIFO communication; input timing under empty condition.  
December 1990  
19  
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
Notes to Fig.21  
1. FIFOA and FIFOB initially full,  
SIB held HIGH in anticipation of  
shifting in new data as empty  
location bubbles-up.  
2. Unload one word from FIFOB;  
SO pulse applied, results in DOR  
pulse.  
3. DIRB and SOA pulse HIGH;  
(bubble-up delay after SOB LOW)  
data is loaded into FIFOB as a  
result of the DIR pulse, data is  
shifted out of FIFOA.  
4. DORA and SIB go LOW; flag  
indicates the output stage of  
FIFOA is busy, shift-in to FIFOB is  
complete.  
5. DORA and SIB go HIGH; flag  
indicates valid data is again  
available at FIFOA output stage,  
SIB is held HIGH, awaiting  
bubble-up of empty location.  
6. DIRA goes HIGH; (bubble-up  
delay after SOA LOW) an empty  
location is present at input stage  
of FIFOA.  
(1) HC : VM = 50%; VI = GND to VCC  
.
HCT: VM = 1.3 V; VI = GND to 3 V.  
Fig.21 FIFO to FIFO communication; output timing under full condition.  
December 1990  
20  
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
Sequence 1 (Both FIFOs empty, starting shift-in process):  
After a MR pulse has been applied FIFOA and FIFOB are empty. The DOR flags of FIFOA and FIFOB go  
LOW due to no valid data being present at the outputs. The DIR flags are set HIGH due to the FIFOs being  
ready to accept data. SOB is held HIGH and two SIA pulses are applied (1). These pulses allow two data  
words to ripple through to the output stage of FIFOA and to the input stage of FIFOB (2). When data arrives  
at the output of FIFOB, a DORB pulse is generated (3). When SOB goes LOW, the first bit is shifted out and  
a second bit ripples through to the output after which DORB goes HIGH (4).  
Sequence 2 (FIFOB runs full):  
After the MR pulse, a series of 64 SI pulses are applied. When 64 words are shifted in, DIRB remains LOW  
due to FIFOB being full (5). DORA goes LOW due to FIFOA being empty.  
Sequence 3 (FIFOA runs full):  
When 65 words are shifted in, DORA remains HIGH due to valid data remaining at the output of FIFOA.  
QnA remains HIGH, being the polarity of the 65th data word (6). After the 128th SI pulse, DIR remains LOW  
and both FIFOs are full (7). Additional pulses have no effect.  
Sequence 4 (Both FIFOs full, starting shift-out process):  
SIA is held HIGH and two SOB pulses are applied (8). These pulses shift out two words and thus allow two  
empty locations to bubble-up to the input stage of FIFOB, and proceed to FIFOA (9). When the first empty  
location arrives at the input of FIFOA, a DIRA pulse is generated (10) and a new word is shifted into FIFOA.  
SIA is made LOW and now the second empty location reaches the input stage of FIFOA, after which  
DIRA remains HIGH (11).  
Sequence 5 (FIFOA runs empty):  
At the start of sequence 5 FIFOA contains 63 valid words due to two words being shifted out and one word  
being shifted in in sequence 4. An additional series of SOB pulses are applied. After 63 SOB pulses, all  
words from FIFOA are shifted into FIFOB. DORA remains LOW (12).  
Sequence 6 (FIFOB runs empty):  
After the next SOB pulse, DIRB remains HIGH due to the input stage of FIFOB being empty (13). After  
another 63 SOB pulses, DORB remains LOW due to both FIFOs being empty (14). Additional SOB pulses  
have no effect. The last word remains available at the output Qn.  
Fig.22 Waveforms showing the functionality and intercommunication between two FIFOs (refer to Fig.19).  
December 1990  
21  
Philips Semiconductors  
Product specification  
9-bit x 64-word FIFO register; 3-state  
74HC/HCT7030  
PACKAGE OUTLINES  
See “74HC/HCT/HCU/HCMOS Logic Package Outlines”.  
December 1990  
22  

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