933897010112 [NXP]
IC SPECIALTY TELECOM CIRCUIT, PDIP8, 0.300 INCH, PLASTIC, SOT-97, DIP-8, Telecom IC:Other;
| 型号： | 933897010112 |
| 厂家： | 
NXP |
| 描述： | IC SPECIALTY TELECOM CIRCUIT, PDIP8, 0.300 INCH, PLASTIC, SOT-97, DIP-8, Telecom IC:Other 电信 光电二极管 电信集成电路 |
| 文件： | 总18页 (文件大小：115K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TEA1081
Supply circuit with power-down for
telephone set peripherals
September 1994
Product specification
Supersedes data of February 1988
File under Integrated Circuits, IC03
Philips Semiconductors
Philips Semiconductors
Product specification
Supply circuit with power-down for
telephone set peripherals
TEA1081
FEATURES
GENERAL DESCRIPTION
• High input impedance for audio signals
• Low DC series resistance
• High output current
The TEA1081 is an integrated circuit for use in
line-powered telephone sets to supply peripheral circuits
for extended dialling and/or loudspeaker facilities.
The IC uses a part of the surplus line current normally
drawn by the voltage regulator of the speech/transmission
circuit. A power-down function isolates the IC from its load
and reduces the input current.
• Large audio signal handling capability
• Low distortion
• Two modes of operation:
– output voltage that follows the DC line voltage
– regulated output voltage
• Power-down input
• Low number of external components.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
2.5
TYP. MAX. UNIT
VLN
VO
operating DC line voltage
DC output voltage
−
12.0
10.0
−
V
V
V
Ω
2.0
−
−
∆VLN-O
RS
voltage drop from line to output
internal series resistance
output current (pin 7)
TEA1081
IO = 0 mA
0.5
20
−
−
IO
VLN = 4 V
−
−
−
−
30
20
−
mA
mA
V
TEA1081T
−
VLN(rms)
IINT
AC line voltage (RMS value)
VLN = 4 V; IO = 15 mA;
THD = 2%
1.5
internal supply current
VLN = 4 V; IO = 0 mA;
PD = LOW; VSP = VO
−
0.8
1.4
mA
Tamb
operating ambient temperature
−25
−
+70
°C
ORDERING INFORMATION
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TEA1081
DIP8
SO8
plastic dual in-line package; 8 leads (300 mil)
SOT97-1
SOT96-1
TEA1081T
plastic small outline package; 8 leads; body width 3.9 mm
September 1994
2
Philips Semiconductors
Product specification
Supply circuit with power-down for
telephone set peripherals
TEA1081
BLOCK DIAGRAM
R
S
1
7
TR1
QS
LN
TR2
0.5 V
A1
A2
5
3
8
4
SP
PD
IF
POWER-
DOWN
AD
REFERENCE
CURRENT
1/2 V
O
A3
6
VA
2
VN
TEA1081
MLC166
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
page
LN
VN
AD
PD
IF
1
2
3
4
5
6
7
8
positive line terminal
negative line terminal
amplifier decoupling
power-down input
LN
VN
AD
PD
1
2
3
4
8
7
6
5
SP
QS
VA
IF
TEA1081
low-pass filter input
MLC167
VA
QS
SP
output voltage adjustment
power supply output
Fig.2 Pin configuration.
supply input; power-down circuit
September 1994
3
Philips Semiconductors
Product specification
Supply circuit with power-down for
telephone set peripherals
TEA1081
The output voltage follows the line voltage and is
FUNCTIONAL DESCRIPTION
expressed by formula (2); see also Table 2.
The TEA1081 is a supply interface between telephone line
and peripheral devices in the telephone set. The high input
impedance of the circuit allows direct connection to the
telephone line (via a diode bridge). An inductor function is
obtained by amplifier A1, resistor RS (see Fig.1) and an
external low-pass RC filter.
VO = VLN– (I1 × RS + 0.5) (V)
(2)
Table 2 Explanation of formula (2).
SYMBOL
VLN
DESCRIPTION
line voltage
input current
Under the control of amplifier A2, transistor TR1 supplies
peripheral devices and transistor TR2 minimizes line
signal distortion by momentarily diverting input current to
ground whenever the instantaneous value of the line
voltage drops below the output voltage.
I1
RS
internal series resistance
REGULATED OUTPUT VOLTAGE (SEE FIG.4)
Internal circuits are biased by a temperature and line
voltage compensated reference current source.
The circuit operates in this mode when an external resistor
(RV) is connected between QS and VA (see Fig.6).
The power-down circuit isolates the supply circuit from
external circuitry.
The output voltage is held constant at VO = 2 × I6 × RV (V)
as soon as the line voltage
VLN > (2 × I6 × RV + I1 × RS + 0.5) (V)
Line terminals: LN and VN (pins 1 and 2)
The control current I6 is typically 20 µA.
The input terminals LN and VN can be connected directly
to the line. The minimum DC line voltage required at the
input is expressed by formula (1); see also Table 1.
MLC168
VLN = I1 × RS + VLNmin + VLN (P) (V)
(1)
10
handbook, halfpage
V
O
(V)
8
Table 1 Explanation of formula (1).
SYMBOL
I1
DESCRIPTION
(1)
input current
(2)
6
RS
internal series resistance
(3)
VLNmin
minimum instantaneous line voltage
(1.4 V at IO = 5 mA)
4
VLN(P)
required peak level of AC line voltage
2
0
The internal current (IINT) at IO = 0 mA is typically 0.8 mA
at VLN = 4 V and reaches a maximum of 1.4 mA at
VLN = 12 V.
0
2
4
6
8
10
(V)
V
LN
Supply terminals: QS and VA (pins 7 and 6)
Application without RV.
(1) I1 = 5 mA.
Peripheral devices are supplied from QS (pin 7). Two
modes of output voltage regulation are available.
(2) I1 = 20 mA.
(3) I1 = 30 mA; not valid for TEA1081T.
OUTPUT VOLTAGE FOLLOWS LINE VOLTAGE (SEE FIG.3)
The TEA1081 operates in this mode when there is no
external resistor (RV) between QS and VA (see Fig.6).
Fig.3 Output voltage as a function of line voltage.
September 1994
4
Philips Semiconductors
Product specification
Supply circuit with power-down for
telephone set peripherals
TEA1081
Input current at VLN(rms) = 1 V and without RV
approximates to:
MLC169
6
handbook, halfpage
I1 = IINT + 2 × IO (mA)
V
O
The maximum supply current (within the specified output
current limits) available for peripheral devices is shown by:
(V)
R
= 100 kΩ
V
4
I
LINEmin – ILNmin – IINT
(1)
(2)
IOmax
=
----------------------------------------------------------
2
75 kΩ
50 kΩ
Where:
(3)
2
0
ILINEmin is the minimum line current of the telephone set;
ILNmin is the specified minimum input current of the
speech/transmission circuit.
Input low-pass filter: IF (pin 5)
0
2
4
6
8
10
V
(V)
LN
The input impedance between LN and VN at audio
frequencies is determined by the filter elements CL
(between pins 1 and 5), RL (between pins 5 and 7) and the
internal resistor RS (typical value 20 Ω).
RV connected between QS and VA.
(1) I1 = 5 mA.
(2) I1 = 20 mA.
At audio frequencies the TEA1081 behaves as an inductor
of the value LI = CL × RL × RS (H). The typical value of LI at
CL = 2.2 µF and RL = 100 kΩ is 4.4 H.
(3) I1 = 30 mA; not valid for TEA1081T.
Fig.4 Output voltage as a function of line voltage.
Amplifier decoupling: AD (pin 3)
Input and output currents I1 and IO (pins 1 and 7)
To ensure stability, a 68 pF decoupling capacitor is
required between AD (pin 3) and LN (pin 1).
If IOmin < 1.5 mA, a 47 pF capacitor has to be added
between AD (pin 3) and VA (pin 6).
The maximum available current into pin 1 (I1) is
determined by:
• The minimum line current (ILINEmin) that is available for
the telephone set
Power-down inputs: PD and SP (pins 4 and 8)
• The specified minimum input current (ILNmin) for the
speech/transmission circuit.
During pulse dialling or register recall, or if the input current
to pin 1 is insufficient to maintain the output current, the
supply to peripheral devices can be switched off by
activating the PD input at pin 4. With PD = HIGH, the input
current is reduced to 40 µA (typ.) at VLN = 4 V and the
internal circuits are isolated from the load at QS (pin 7).
That is I1max = ILINEmin − ILNmin
.
At VLN(rms) < 150 mV, the input current I1 is approximately:
I1 = IINT + k × IO (mA)
Where:
The power-down circuit is supplied via the SP input (pin 8).
SP can be wired to QS in conditions where VO > VSPmin
during line interruptions. When VO < VSPmin, SP should be
wired to an external supply point (e.g. to VCC of the
TEA1060 family circuit).
IINT = internal supply current (0.8 mA at VLN = 4 V);
k = correction factor (k < 1.1 for the specified output
current range).
With large line signals the instantaneous line voltage may
drop below VO + 0.4 V. Normally (when VLN > VO + 0.4 V),
instantaneous current flows from LN to QS (pin 1 to pin 7)
to the output load.
When power-down is not required, the PD and SP inputs
can be left open-circuit.
When VLN < VO + 0.4 V, the instantaneous current is
diverted to pin 2 to prevent distortion of the line signal.
September 1994
5
Philips Semiconductors
Product specification
Supply circuit with power-down for
telephone set peripherals
TEA1081
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
positive line voltage
CONDITIONS
MIN.
MAX.
UNIT
VLN
continuous
during switch-on or line interruptions
−
−
−
12
V
12.5
28
V
V
VLN(RM)
repetitive peak line voltage for a 12 Ω resistor in series with pin 1
1 ms pulse per 5 s
VI
I1
input voltage (all other terminals)
DC input current
VVN − 0.5 VLN + 0.5
V
TEA1081
−
−
120
80
mA
mA
mA
TEA1081T
II
input current (all other terminals)
total power dissipation
operating ambient temperature
storage temperature
junction temperature
−1
+1
see Fig.5
+70
Ptot
Tamb
Tstg
Tj
−25
−40
−
°C
°C
°C
+125
+125
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient in free air
TEA1081
120
260
K/W
K/W
TEA1081T (mounted on a printed-circuit board of 50 × 50 × 1.5 mm)
MLC170
800
handbook, halfpage
P
tot
(mW)
(1)
(2)
600
400
200
0
0
20
40
60
80
100
120
o
T
( C)
amb
(1) TEA1081.
(2) TEA1081T.
Fig.5 Power derating curves.
September 1994
6
Philips Semiconductors
Product specification
Supply circuit with power-down for
telephone set peripherals
TEA1081
CHARACTERISTICS
VLN = 4 V; VLN(rms) = 100 mV; IO = 5 mA; f = 300 to 3400 Hz; RL = 100 kΩ; CL = 2.2 µF; RV = 75 kΩ; Tamb = 25 °C;
unless otherwise specified; see Fig.6.
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
VLN
operating DC line voltage
2.5
−
−
−
−
12.0
1.4
−
V
V
V
VLNmin
VLNmax
minimum instantaneous line voltage
maximum instantaneous line voltage
12.0
Characteristics with RV = 75 kΩ connected between pins 6 and 7 and CL = 10 µF
I1
input current (pin 1)
VLN(rms) = 0 V
−
−
−
5.8
30
−
−
−
mA
mA
V
VLN(rms) = 1.5 V; IO = 15 mA
VO
output voltage (pin 7)
3.0
∆VO
variation of output voltage over the
ranges of:
line voltage
temperature
V
LN = 4 to 6 V
−
−
−
−
−
100
−
−
−
−
−
mV
mV
mV
mV
µA
T
amb = +25 to −25 °C
amb = +25 to +75 °C
−100
−100
−100
20
temperature
T
output current
control current (pin 6)
IO = 5 to 20 mA
I6
Characteristics without RV
I1
input current (pin 1)
VLN(rms) = 0 V
LN(rms) = 1.5 V; IO = 15 mA
−
−
−
−
6.0
31
−
−
−
−
mA
mA
V
V
∆VLN-O
voltage drop from line to output
IO = 0 mA
0.5
1.1
IO = 15 mA; VLN(rms) = 1.5 V
V
IO
output current (pin 7)
TEA1081
−
−
−
−
−
−
30
20
−
mA
mA
Ω
TEA1081T
−
RS
internal series resistance
internal supply current
20
0.8
40
IINT
IO = 0 mA; PD = LOW; VSP = VO
1.4
60
mA
µA
IO = 0 mA; PD = HIGH (note 1);
VSP > 2 V
THD
total harmonic distortion
V
LN(rms) = 1.5 V
−
−
2
−
−
%
BRL
balance return loss
600 Ω reference
25
−
−
dB
VLN(2H)
second harmonic level of line voltage
f = 500 Hz; VLN = 0 dBm;
−58
dBm
Zline = 600 Ω
VLN(3H)
Vni(rms)
third harmonic level of line voltage
f = 500 Hz; VLN = 0 dBm;
Zline = 600 Ω
−
−
−60
−83
−
−
dBm
noise voltage on input terminal
(RMS value)
VLN(rms) = 0 V; RL = 600 Ω;
P53 curve
dBmp
Power-down input (pin 4)
VIL
VIH
I4
LOW level input voltage
−
−
−
−
0.3
VSP
10
V
HIGH level input voltage
input current
1.5
−
V
µA
September 1994
7
Philips Semiconductors
Product specification
Supply circuit with power-down for
telephone set peripherals
TEA1081
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
Power-down input (pin 8)
V8
I8
supply voltage for power-down
supply current to power-down circuit
2
−
−
VLN
70
V
V8 = 3 V
−
µA
Note
1. Power-down circuit supplied via external source.
APPLICATION INFORMATION
I
C
1
= 2.2 µF
1
L
C
68 pF
=
D
LN
IF
6
C
47 pF
=
S
VA
5
AD
PD
SP
R
= 100 kΩ
L
3
SPEECH/
TRANSMISSION
CIRCUIT
R
V
TEA1081
V
4
8
LN
QS
I
TELEPHONE
LINE
7
2
O
PERIPHERAL
CIRCUITS
VN
V
O
C
O
MLC171
Fig.6 Application diagram.
September 1994
8
Philips Semiconductors
Product specification
Supply circuit with power-down for
telephone set peripherals
TEA1081
PACKAGE OUTLINES
8.25
7.80
9.8
9.2
3.2
max
4.2
max
0.51
min
3.60
3.05
2.54
(3x)
0.254 M
0.38 max
1.15
max
0.53
max
7.62
1.73 max
10.0
8.3
MSA252 - 1
8
1
5
6.48
6.20
4
Dimensions in mm.
Fig.7 Plastic dual in-line package; 8 leads (300 mil); DIP8; SOT97-1.
September 1994
9
Philips Semiconductors
Product specification
Supply circuit with power-down for
telephone set peripherals
TEA1081
4.0
3.8
5.0
4.8
A
6.2
5.8
S
0.1 S
0.7
0.3
8
1
5
4
0.7
0.6
1.45
1.25
1.75
1.35
0.25
0.19
1.0
0.5
0.25
0.10
o
0 to 8
pin 1
index
detail A
MBC180 - 1
1.27
0.49
0.36
0.25 M
(8x)
Dimensions in mm.
Fig.8 Plastic small outline package; 8 leads; body width 3.9 mm (SO8; SOT96-1).
September 1994
10
Philips Semiconductors
Product specification
Supply circuit with power-down for
telephone set peripherals
TEA1081
SOLDERING
BY SOLDER PASTE REFLOW
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
Plastic dual in-line packages
BY DIP OR WAVE
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)
Apply a low-voltage soldering iron below the seating plane
(or not more than 2 mm above it). If its temperature is
below 300 °C, it must not be in contact for more than 10 s;
if between 300 and 400 °C, for not more than 5 s.
Plastic small-outline packages
BY WAVE
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
September 1994
11
Philips Semiconductors
Product specification
Supply circuit with power-down for
telephone set peripherals
TEA1081
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
September 1994
12
Philips Semiconductors
Product specification
Supply circuit with power-down for
telephone set peripherals
TEA1081
NOTES
September 1994
13
Philips Semiconductors
Product specification
Supply circuit with power-down for
telephone set peripherals
TEA1081
NOTES
September 1994
14
Philips Semiconductors
Product specification
Supply circuit with power-down for
telephone set peripherals
TEA1081
NOTES
September 1994
15
Philips Semiconductors – a worldwide company
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TEA1081; Supply circuit with power-down for telephone set peripherals
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The TEA1081 is an integrated circuit for use in line-powered telephone sets to supply peripheral circuits for extended dialling and/or
loudspeaker facilities.
PC/PC-peripherals
The IC uses a part of the surplus line current normally drawn by the voltage regulator of the speech/transmission circuit. A power-down
function isolates the IC from its load and reduces the input current.
Cross reference
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End of Life information
Datahandbook system
Features
l High input impedance for audio signals
l Low DC series resistance
l High output current
l Large audio signal handling capability
l Low distortion
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l Two modes of operation:
- output voltage that follows the DC line voltage
- regulated output voltage
l Power-down input
l Low number of external components.
TEA1081
TEA1081
Datasheet
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TEA1081 Supply circuit with power-down for
telephone set peripherals
01-Sep-94
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Products, packages, availability and ordering
North American
Partnumber
Order code
(12nc)
Partnumber
marking/packing
package device status buy online
TEA1081/C2 TEA1081N
TEA1081T/C2 TEA1081TD
9338 970 10112 Standard Marking * Bulk Pack
9338 970 20112 Standard Marking * Bulk Pack
SOT97 Full production
SOT96 Full production
Standard Marking * Reel Pack,
TEA1081TD-T
9338 970 20118
SMD, 13"
SOT96 Full production
Please read information about some discontinued variants of this product.
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