933986360115 [NXP]

TRANSISTOR 500 mA, PNP, Si, SMALL SIGNAL TRANSISTOR, PLASTIC, SMD, SC-73, 4 PIN, BIP General Purpose Small Signal;
933986360115
型号: 933986360115
厂家: NXP    NXP
描述:

TRANSISTOR 500 mA, PNP, Si, SMALL SIGNAL TRANSISTOR, PLASTIC, SMD, SC-73, 4 PIN, BIP General Purpose Small Signal

开关 光电二极管 晶体管
文件: 总8页 (文件大小:49K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
handbook, halfpage  
BSP60; BSP61; BSP62  
PNP Darlington transistors  
Product specification  
2001 May 31  
Supersedes data of 1999 Apr 29  
Philips Semiconductors  
Product specification  
PNP Darlington transistors  
BSP60; BSP61; BSP62  
FEATURES  
PINNING  
PIN  
High current (max. 0.5 A)  
Low voltage (max. 80 V)  
Integrated diode and resistor.  
DESCRIPTION  
1
2, 4  
3
base  
collector  
emitter  
APPLICATIONS  
Industrial switching applications such as:  
– Print hammer  
4
2, 4  
– Solenoid  
1
– Relay and lamp drivers.  
DESCRIPTION  
1
2
3
PNP Darlington transistor in a SOT223 plastic package.  
NPN complements: BSP50, BSP51 and BSP52.  
3
Top view  
MAM266  
Fig.1 Simplified outline (SOT223) and symbol.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
SYMBOL  
PARAMETER  
collector-base voltage  
CONDITIONS  
open emitter  
MIN.  
MAX.  
UNIT  
VCBO  
BSP60  
60  
V
V
V
BSP61  
80  
90  
BSP62  
VCES  
collector-emitter voltage  
BSP60  
VBE = 0  
45  
60  
80  
5  
V
V
V
V
A
A
BSP61  
BSP62  
VEBO  
IC  
ICM  
IB  
emitter-base voltage  
collector current (DC)  
peak collector current  
base current (DC)  
total power dissipation  
storage temperature  
junction temperature  
operating ambient temperature  
open collector  
1  
2  
100  
1.25  
+150  
150  
+150  
mA  
W
Ptot  
Tstg  
Tj  
Tamb 25 °C; note 1  
65  
°C  
°C  
°C  
Tamb  
65  
Note  
1. Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2.  
For other mounting conditions, see “Thermal considerations for the SOT223 in the General Part of associated  
Handbook”.  
2001 May 31  
2
Philips Semiconductors  
Product specification  
PNP Darlington transistors  
BSP60; BSP61; BSP62  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
VALUE  
UNIT  
Rth j-a  
Rth j-s  
thermal resistance from junction to ambient  
thermal resistance from junction to solder point  
note 1  
98  
17  
K/W  
K/W  
Note  
1. Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2.  
For other mounting conditions, see “Thermal considerations for the SOT223 in the General Part of associated  
Handbook”.  
CHARACTERISTICS  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
ICES  
PARAMETER  
collector cut-off current  
BSP60  
CONDITIONS  
MIN.  
TYP. MAX. UNIT  
VBE = 0; VCE = 45 V  
50  
50  
50  
50  
nA  
nA  
nA  
nA  
BSP61  
V
BE = 0; VCE = 60 V  
BE = 0; VCE = 80 V  
BSP62  
V
IEBO  
hFE  
emitter cut-off current  
DC current gain  
IC = 0; VEB = 4 V  
VCE = 10 V; note 1; see Fig.2  
IC = 150 mA  
1000  
2000  
IC = 500 mA  
VCEsat  
collector-emitter saturation  
voltage  
IC = 500 mA; IB = 0.5 mA  
1.3  
1.3  
V
V
IC = 500 mA; IB = 0.5 mA;  
Tj = 150 °C  
VBEsat  
fT  
base-emitter saturation voltage IC = 500 mA; IB = 0.5 mA  
1.9  
V
transition frequency  
IC = 500 mA; VCE = 5 V;  
200  
MHz  
f = 100 MHz  
Switching times (between 10% and 90% levels); see Fig.3  
ton  
toff  
turn-on time  
turn-off time  
ICon = 500 mA; IBon = 0.5 mA;  
IBoff = 0.5 mA  
400  
ns  
ns  
1500  
Note  
1. Pulse test: tp 300 µs; δ ≤ 0.02.  
2001 May 31  
3
Philips Semiconductors  
Product specification  
PNP Darlington transistors  
BSP60; BSP61; BSP62  
MGD839  
6000  
h
FE  
5000  
4000  
3000  
2000  
1000  
0
10  
1  
2
3
1  
10  
10  
10  
I
(mA)  
C
VCE = 10 V.  
Fig.2 DC current gain; typical values.  
V
B
V
C
BB  
CC  
R
R
V
(probe)  
(probe)  
o
oscilloscope  
oscilloscope  
450 Ω  
450 Ω  
R2  
V
i
DUT  
R1  
MGD624  
Vi = 10 V; T = 200 µs; tp = 6 µs; tr = tf 3 ns.  
R1 = 56 ; R2 = 10 k; RB = 10 k; RC = 18 .  
VBB = 1.8 V; VCC = 10.7 V.  
Oscilloscope: input impedance Zi = 50 .  
Fig.3 Test circuit for switching times.  
4
2001 May 31  
Philips Semiconductors  
Product specification  
PNP Darlington transistors  
BSP60; BSP61; BSP62  
PACKAGE OUTLINE  
Plastic surface mounted package; collector pad for good heat transfer; 4 leads  
SOT223  
D
B
E
A
X
c
y
H
v
M
A
E
b
1
4
Q
A
A
1
L
1
2
3
p
e
b
p
w
M
B
detail X  
1
e
0
2
4 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
UNIT  
A
b
b
c
D
E
e
e
H
L
p
Q
v
w
y
p
1
1
1
E
1.8  
1.5  
0.10 0.80  
0.01 0.60  
3.1  
2.9  
0.32  
0.22  
6.7  
6.3  
3.7  
3.3  
7.3  
6.7  
1.1  
0.7  
0.95  
0.85  
mm  
4.6  
2.3  
0.2  
0.1  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
97-02-28  
99-09-13  
SOT223  
SC-73  
2001 May 31  
5
Philips Semiconductors  
Product specification  
PNP Darlington transistors  
BSP60; BSP61; BSP62  
DATA SHEET STATUS  
PRODUCT  
DATA SHEET STATUS(1)  
STATUS(2)  
DEFINITIONS  
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Changes will be  
communicated according to the Customer Product/Process Change  
Notification (CPCN) procedure SNW-SQ-650A.  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes, without notice, in the  
products, including circuits, standard cells, and/or  
software, described or contained herein in order to  
improve design and/or performance. Philips  
Semiconductors assumes no responsibility or liability for  
the use of any of these products, conveys no licence or title  
under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that  
these products are free from patent, copyright, or mask  
work right infringement, unless otherwise specified.  
Application information  
Applications that are  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2001 May 31  
6
Philips Semiconductors  
Product specification  
PNP Darlington transistors  
BSP60; BSP61; BSP62  
NOTES  
2001 May 31  
7
Philips Semiconductors – a worldwide company  
Argentina: see South America  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,  
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139  
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,  
Tel. +64 9 849 4160, Fax. +64 9 849 7811  
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,  
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210  
Norway: Box 1, Manglerud 0612, OSLO,  
Tel. +47 22 74 8000, Fax. +47 22 74 8341  
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,  
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773  
Pakistan: see Singapore  
Belgium: see The Netherlands  
Brazil: see South America  
Philippines: Philips Semiconductors Philippines Inc.,  
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,  
51 James Bourchier Blvd., 1407 SOFIA,  
Tel. +359 2 68 9211, Fax. +359 2 68 9102  
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,  
Tel. +48 22 5710 000, Fax. +48 22 5710 001  
Portugal: see Spain  
Romania: see Italy  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,  
Tel. +1 800 234 7381, Fax. +1 800 943 0087  
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,  
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,  
Tel. +852 2319 7888, Fax. +852 2319 7700  
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,  
Tel. +7 095 755 6918, Fax. +7 095 755 6919  
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,  
Colombia: see South America  
Czech Republic: see Austria  
Tel. +65 350 2538, Fax. +65 251 6500  
Slovakia: see Austria  
Slovenia: see Italy  
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,  
Tel. +45 33 29 3333, Fax. +45 33 29 3905  
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,  
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,  
Tel. +27 11 471 5401, Fax. +27 11 471 5398  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
Tel. +358 9 615 800, Fax. +358 9 6158 0920  
France: 7 - 9 Rue du Mont Valérien, BP317, 92156 SURESNES Cedex,  
Tel. +33 1 4728 6600, Fax. +33 1 4728 6638  
South America: Al. Vicente Pinzon, 173, 6th floor,  
04547-130 SÃO PAULO, SP, Brazil,  
Tel. +55 11 821 2333, Fax. +55 11 821 2382  
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,  
Tel. +49 40 2353 60, Fax. +49 40 2353 6300  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. +34 93 301 6312, Fax. +34 93 301 4107  
Hungary: Philips Hungary Ltd., H-1119 Budapest, Fehervari ut 84/A,  
Tel: +36 1 382 1700, Fax: +36 1 382 1800  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745  
India: Philips INDIA Ltd, Band Box Building, 2nd floor,  
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,  
Tel. +91 22 493 8541, Fax. +91 22 493 0966  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2741 Fax. +41 1 488 3263  
Indonesia: PT Philips Development Corporation, Semiconductors Division,  
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,  
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080  
Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,  
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,  
Tel. +66 2 361 7910, Fax. +66 2 398 3447  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. +353 1 7640 000, Fax. +353 1 7640 200  
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,  
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,  
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007  
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813  
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
Tel. +39 039 203 6838, Fax +39 039 203 6800  
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057  
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. +82 2 709 1412, Fax. +82 2 709 1415  
Tel. +1 800 234 7381, Fax. +1 800 943 0087  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Uruguay: see South America  
Vietnam: see Singapore  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Tel. +381 11 3341 299, Fax.+381 11 3342 553  
Middle East: see Italy  
For all other countries apply to: Philips Semiconductors,  
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,  
The Netherlands, Fax. +31 40 27 24825  
Internet: http://www.semiconductors.philips.com  
72  
SCA  
© Philips Electronics N.V. 2001  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
613514/05/pp8  
Date of release: 2001 May 31  
Document order number: 9397 750 07906  

相关型号:

933987780112

IC HC/UH SERIES, 9 1-INPUT INVERT GATE, PDSO20, SO-20, Gate
NXP

933987780118

IC HC/UH SERIES, 9 1-INPUT INVERT GATE, PDSO20, SO-20, Gate
NXP

933987790005

IC HC/UH SERIES, 9 1-INPUT INVERT GATE, UUC, DIE, Gate
NXP

933987810112

IC HCT SERIES, 9 1-INPUT INVERT GATE, PDSO20, SO-20, Gate
NXP

933987810118

IC HCT SERIES, 9 1-INPUT INVERT GATE, PDSO20, SO-20, Gate
NXP

933987820005

IC HCT SERIES, 9 1-INPUT INVERT GATE, UUC, DIE, Gate
NXP

933987830112

IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, PDIP20, DIP-20, Gate
NXP

933987840112

IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, PDSO20, SO-20, Gate
NXP

933987840118

IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, PDSO20, SO-20, Gate
NXP

933987860112

IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, PDIP20, DIP-20, Gate
NXP

933987870112

IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, PDSO20, SO-20, Gate
NXP

933987870118

IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, PDSO20, SO-20, Gate
NXP