934049780118 [NXP]

600V, 8A, 4 QUADRANT LOGIC LEVEL TRIAC, PLASTIC, SC-63, DPAK-3;


型号：	934049780118
厂家：	NXP
描述：	600V, 8A, 4 QUADRANT LOGIC LEVEL TRIAC, PLASTIC, SC-63, DPAK-3 三端双向交流开关
文件：	总6页 (文件大小：43K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Philips Semiconductors

Product specification

Triacs

BT137S series

GENERAL DESCRIPTION

QUICK REFERENCE DATA

Passivated triacs in a plastic envelope,

suitable for surface mounting, intended

for use in applications requiring high

bidirectional transient and blocking

voltage capability and high thermal

SYMBOL

PARAMETER

MAX. MAX. UNIT

BT137S-

600

800

BT137S- 600F 800F

BT137S- 600G 800G

cycling

performance.

Typical

V_DRM

Repetitive peak off-state

voltages

RMS on-state current

Non-repetitive peak on-state

current

600

800

applications include motor control,

industrial and domestic lighting, heating

and static switching.

I_T(RMS)

I_TSM

PINNING - SOT428

PIN CONFIGURATION

SYMBOL

DESCRIPTION

tab

MT1

MT2

gate

MT2

tab

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134).

SYMBOL PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

-600

-800

800

V_DRM

Repetitive peak off-state

voltages

600¹

I_T(RMS)

I_TSM

RMS on-state current

Non-repetitive peak

on-state current

full sine wave; T_mb≤ 102 ˚C

full sine wave; T_j= 25 ˚C prior to

surge

t = 20 ms

t = 16.7 ms

I²t

dI_T/dt

I²t for fusing

Repetitive rate of rise of

on-state current after

triggering

t = 10 ms

A²s

I_TM= 12 A; I_G= 0.2 A;

dI_G/dt = 0.2 A/µs

T2+ G+

0.5

150

125

A/µs

T2+ G-

T2- G-

T2- G+

I_GM

Peak gate current

Peak gate voltage

Peak gate power

Average gate power

Storage temperature

Operating junction

temperature

V_GM

P_GM

P_G(AV)

T_stg

T_j

over any 20 ms period

-40

˚C

1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may

switch to the on-state. The rate of rise of current should not exceed 6 A/µs.

June 2001

Rev 1.400

Philips Semiconductors

Product specification

Triacs

BT137S series

THERMAL RESISTANCES

SYMBOL PARAMETER

CONDITIONS

MIN. TYP. MAX. UNIT

R_{th j-mb}

Thermal resistance

full cycle

2.0

2.4

K/W

junction to mounting base half cycle

R_{th j-a}

Thermal resistance

junction to ambient

pcb (FR4) mounted; footprint as in Fig.14

STATIC CHARACTERISTICS

T_j= 25 ˚C unless otherwise stated

SYMBOL PARAMETER

CONDITIONS

MIN. TYP.

MAX.

...F

UNIT

BT137S-

V_D= 12 V; I_T= 0.1 A

...

...G

I_GT

Gate trigger current

Latching current

Holding current

T2+ G+

T2+ G-

T2- G-

T2- G+

100

I_L

V_D= 12 V; I_GT= 0.1 A

T2+ G+

T2+ G-

T2- G-

T2- G+

I_H

V_D= 12 V; I_GT= 0.1 A

V_T

On-state voltage

I_T= 10 A

1.3

0.7

0.4

1.65

1.5

V_GT

Gate trigger voltage

V_D= 12 V; I_T= 0.1 A

V_D= 400 V; I_T= 0.1 A;

T_j= 125 ˚C

0.25

I_D

Off-state leakage current V_D= V_DRM(max)

;

0.1

0.5

T_j= 125 ˚C

DYNAMIC CHARACTERISTICS

T_j= 25 ˚C unless otherwise stated

SYMBOL PARAMETER

CONDITIONS

MIN.

TYP. MAX. UNIT

BT137S-

V_DM= 67% V_DRM(max)

...

...F

...G

dV_D/dt

dV_com/dt

t_gt

Critical rate of rise of

off-state voltage

;

100

200

250

V/µs

µs

T_j= 125 ˚C; exponential

waveform; gate open

circuit

Critical rate of change of

commutating voltage

V_DM= 400 V; T_j= 95 ˚C;

I_T(RMS)= 8 A;

dI_com/dt = 3.6 A/ms; gate

open circuit

Gate controlled turn-on

time

I_TM= 12 A; V_D= V_DRM(max);

I_G= 0.1 A; dI_G/dt = 5 A/µs

June 2001

Rev 1.400

Philips Semiconductors

Product specification

Triacs

BT137S series

Tmb(max) / C

= 180

Ptot / W

IT(RMS) / A

BT137

101

105

109

113

120

102 C

117

121

125

-50

Tmb / C

100

150

IT(RMS) / A

Fig.1. Maximum on-state dissipation, P_tot, versus rms

on-state current, I_T(RMS), where α = conduction angle.

Fig.4. Maximum permissible rms current I_T(RMS)

versus mounting base temperature T_mb.

ITSM / A

1000

IT(RMS) / A

TSM

time

Tj initial = 25 C max

100

dI_T/dt limit

T2- G+ quadrant

10us

100us

1ms

T / s

10ms

100ms

0.01

0.1

surge duration / s

Fig.2. Maximum permissible non-repetitive peak

on-state current I_TSM, versus pulse width t_p, for

sinusoidal currents, t_p≤ 20ms.

Fig.5. Maximum permissible repetitive rms on-state

current I_T(RMS), versus surge duration, for sinusoidal

currents, f = 50 Hz; T_mb≤ 102˚C.

ITSM / A

VGT(Tj)

VGT(25 C)

1.6

TSM

time

1.4

1.2

Tj initial = 25 C max

0.8

0.6

0.4

100

1000

-50

Tj / C

100

150

Number of cycles at 50Hz

Fig.3. Maximum permissible non-repetitive peak

on-state current I_TSM, versus number of cycles, for

sinusoidal currents, f = 50 Hz.

Fig.6. Normalised gate trigger voltage

V_GT(T_j)/ V_GT(25˚C), versus junction temperature T_j.

June 2001

Rev 1.400

Philips Semiconductors

Product specification

Triacs

BT137S series

IT / A

IGT(Tj)

IGT(25 C)

Tj = 125 C

Tj = 25 C

T2+ G+

T2+ G-

T2- G-

T2- G+

max

typ

2.5

Vo = 1.264 V

Rs = 0.0378 Ohms

1.5

0.5

1.5

VT / V

2.5

-50

Tj / C

100

150

Fig.7. Normalised gate trigger current

I_GT(T_j)/ I_GT(25˚C), versus junction temperature T_j.

Fig.10. Typical and maximum on-state characteristic.

Zth j-mb (K/W)

IL(Tj)

IL(25 C)

2.5

unidirectional

bidirectional

1.5

0.1

0.5

0.01

10us

0.1ms

1ms

10ms

tp / s

0.1s

10s

-50

Tj / C

100

150

Fig.8. Normalised latching current I_L(T_j)/ I_L(25˚C),

Fig.11. Transient thermal impedance Z_{th j-mb}, versus

pulse width t_p.

versus junction temperature T_j.

dV/dt (V/us)

1000

IH(Tj)

IH(25C)

off-state dV/dt limit

BT137...G SERIES

2.5

BT137 SERIES

100

BT137...F SERIES

1.5

dIcom/dt =

10 A/ms

7.9

6.1 4.7 3.6 2.8

0.5

-50

Tj / C

100

150

100

150

Tj / C

Fig.9. Normalised holding current I_H(T_j)/ I_H(25˚C),

Fig.12. Typical commutation dV/dt versus junction

temperature, parameter commutation dI_T/dt. The triac

should commutate when the dV/dt is below the value

on the appropriate curve for pre-commutation dI_T/dt.

versus junction temperature T_j.

June 2001

Rev 1.400

Philips Semiconductors

Product specification

Triacs

BT137S series

MECHANICAL DATA

Dimensions in mm

Net Mass: 1.1 g

seating plane

2.38 max

0.93 max

1.1

5.4

6.73 max

tab

4 min

4.6

6.22 max

0.5 min

10.4 max

0.5

0.3

0.5

0.8 max

(x2)

2.285 (x2)

Fig.13. SOT428 : centre pin connected to tab.

MOUNTING INSTRUCTIONS

Dimensions in mm

7.0

2.15

2.5

1.5

4.57

Fig.14. SOT428 : minimum pad sizes for surface mounting.

Notes

1. Plastic meets UL94 V0 at 1/8".

June 2001

Rev 1.400

Philips Semiconductors

Product specification

Triacs

BT137S series

DEFINITIONS

DATA SHEET STATUS

DATA SHEET

STATUS²

PRODUCT

DEFINITIONS

STATUS³

Objective data

Development

This data sheet contains data from the objective specification for

product development. Philips Semiconductors reserves the right to

change the specification in any manner without notice

Preliminary data

Qualification

Production

This data sheet contains data from the preliminary specification.

Supplementary data will be published at a later date. Philips

Semiconductors reserves the right to change the specification without

notice, in ordere to improve the design and supply the best possible

product

Product data

This data sheet contains data from the product specification. Philips

Semiconductors reserves the right to make changes at any time in

order to improve the design, manufacturing and supply. Changes will

be communicated according to the Customer Product/Process

Change Notification (CPCN) procedure SNW-SQ-650A

Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one

or more of the limiting values may cause permanent damage to the device. These are stress ratings only and

operation of the device at these or at any other conditions above those given in the Characteristics sections of

this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Philips Electronics N.V. 2001

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the

The information presented in this document does not form part of any quotation or contract, it is believed to be

accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under patent or other

industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these

products can be reasonably expected to result in personal injury. Philips customers using or selling these products

for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting

from such improper use or sale.

2 Please consult the most recently issued datasheet before initiating or completing a design.

3 The product status of the device(s) described in this datasheet may have changed since this datasheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

June 2001

Rev 1.400

相关型号：