934055997118 [NXP]

600V, 8A, 4 QUADRANT LOGIC LEVEL TRIAC, PLASTIC, SC-63, DPAK-3;


型号：	934055997118
厂家：	NXP
描述：	600V, 8A, 4 QUADRANT LOGIC LEVEL TRIAC, PLASTIC, SC-63, DPAK-3 三端双向交流开关
文件：	总6页 (文件大小：50K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Philips Semiconductors

Product specification

Three quadrant triacs

guaranteed commutation

BTA208S series D, E and F

GENERAL DESCRIPTION

QUICK REFERENCE DATA

Passivated guaranteed commutation

triacs in a plastic envelope suitable for

surface mounting, intended for use in

motor control circuits or with other highly

inductive loads. These devices balance

the requirements of commutation

performance and gate sensitivity. The

"sensitive gate" E series and "logic level"

D series are intended for interfacing with

low power drivers, including micro

controllers.

SYMBOL

PARAMETER

MAX. MAX. UNIT

BTA208S-

600D

600E 800E

600F 800F

V_DRM

Repetitive peak off-state

voltages

RMS on-state current

Non-repetitive peak on-state

current

600

800

I_T(RMS)

I_TSM

PINNING - SOT428

PIN CONFIGURATION

SYMBOL

DESCRIPTION

tab

MT1

MT2

gate

MT2

tab

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134).

SYMBOL PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

-600

600¹

-800

800

V_DRM

Repetitive peak off-state

voltages

I_T(RMS)

I_TSM

RMS on-state current

full sine wave;

T_mb≤ 102 ˚C

Non-repetitive peak

on-state current

full sine wave;

T_j= 25 ˚C prior to

surge

t = 20 ms

t = 16.7 ms

I²t

I²t for fusing

Repetitive rate of rise of

on-state current after

triggering

Peak gate current

Peak gate power

Average gate power

t = 10 ms

A²s

A/µs

dI_T/dt

I_TM= 12 A; I_G= 0.2 A;

dI_G/dt = 0.2 A/µs

100

I_GM

P_GM

P_G(AV)

0.5

over any 20 ms

period

T_stg

T_j

Storage temperature

Operating junction

temperature

-40

150

125

˚C

1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may

switch to the on-state. The rate of rise of current should not exceed 6 A/µs.

March 2002

Rev 2.000

Philips Semiconductors

Product specification

Three quadrant triacs

guaranteed commutation

BTA208S series D, E and F

THERMAL RESISTANCES

SYMBOL PARAMETER

CONDITIONS

MIN. TYP. MAX. UNIT

R_{th j-mb}

Thermal resistance

full cycle

2.0

2.4

K/W

junction to mounting base half cycle

R_{th j-a}

Thermal resistance

junction to ambient

pcb (FR4) mounted; footprint as in Fig.14

STATIC CHARACTERISTICS

T_j= 25 ˚C unless otherwise stated

SYMBOL PARAMETER

CONDITIONS

MIN.

MAX.

...E

UNIT

BTA208S-

...D

...F

I_GT

Gate trigger current²

Latching current

Holding current

V_D= 12 V; I_T= 0.1 A

T2+ G+

T2+ G-

T2- G-

I_L

V_D= 12 V; I_GT= 0.1 A

T2+ G+

T2+ G-

T2- G-

I_H

V_D= 12 V; I_GT= 0.1 A

V_T

On-state voltage

I_T= 10 A

1.65

1.5

V_GT

Gate trigger voltage

V_D= 12 V; I_T= 0.1 A

V_D= 400 V; I_T= 0.1 A;

T_j= 125 ˚C

0.25

I_D

Off-state leakage current

V_D= V_DRM(max); T_j= 125 ˚C

0.5

DYNAMIC CHARACTERISTICS

T_j= 25 ˚C unless otherwise stated

SYMBOL PARAMETER

CONDITIONS

BTA208S-

MIN.

...E

MAX. UNIT

...D

...F

dV_D/dt

dI_com/dt

Critical rate of rise of

off-state voltage

V_DM= 67% V_DRM(max)

;

V/µs

A/ms

T_j= 110 ˚C; exponential

waveform; gate open

circuit

Critical rate of change of

commutating current

V_DM= 400 V; T_j= 125 ˚C;

I_T(RMS)= 8 A;

dV_com/dt = 10V/µs; gate

open circuit

Critical rate of change of

commutating current

V_DM= 400 V; T_j= 125 ˚C;

I_T(RMS)= 8 A;

dV_com/dt = 0.1V/µs; gate

open circuit

2 Device does not trigger in the T2-, G+ quadrant.

March 2002

Rev 2.000

Philips Semiconductors

Product specification

Three quadrant triacs

guaranteed commutation

BTA208S series D, E and F

Tmb(max) / C

= 180

Ptot / W

IT(RMS) / A

BT137

101

105

109

113

120

102 C

117

121

125

-50

Tmb / C

100

150

IT(RMS) / A

Fig.1. Maximum on-state dissipation, P_tot, versus rms

on-state current, I_T(RMS), where α = conduction angle.

Fig.4. Maximum permissible rms current I_T(RMS)

versus mounting base temperature T_mb.

ITSM / A

1000

IT(RMS) / A

dI_T/dt limit

100

TSM

time

Tj initial = 25 C max

10ms 100ms

10us

100us

1ms

T / s

0.01

0.1

surge duration / s

Fig.2. Maximum permissible non-repetitive peak

on-state current I_TSM, versus pulse width t_p, for

sinusoidal currents, t_p≤ 20ms.

Fig.5. Maximum permissible repetitive rms on-state

current I_T(RMS), versus surge duration, for sinusoidal

currents, f = 50 Hz; T_mb≤ 102˚C.

ITSM / A

VGT(Tj)

VGT(25 C)

1.6

TSM

time

1.4

1.2

Tj initial = 25 C max

0.8

0.6

0.4

100

1000

-50

Tj / C

100

150

Number of half cycles at 50Hz

Fig.3. Maximum permissible non-repetitive peak

on-state current I_TSM, versus number of cycles, for

sinusoidal currents, f = 50 Hz.

Fig.6. Normalised gate trigger voltage

V_GT(T_j)/ V_GT(25˚C), versus junction temperature T_j.

March 2002

Rev 2.000

Philips Semiconductors

Product specification

Three quadrant triacs

guaranteed commutation

BTA208S series D, E and F

IT / A

IGT(Tj)

IGT(25°C)

Tj = 125 C

Tj = 25 C

2.5

T2+ G+

T2+ G-

T2- G-

max

typ

Vo = 1.264 V

Rs = 0.0378 Ohms

1.5

0.5

1.5

VT / V

2.5

-50

Tj/°C

100

150

Fig.7. Normalised gate trigger current

I_GT(T_j)/ I_GT(25˚C), versus junction temperature T_j.

Fig.10. Typical and maximum on-state characteristic.

Zth j-mb (K/W)

IL(Tj)

IL(25 C)

unidirectional

2.5

bidirectional

1.5

0.1

0.5

0.01

10us

0.1ms

1ms

10ms

tp / s

0.1s

10s

-50

Tj / C

100

150

Fig.11. Transient thermal impedance Z_{th j-mb}, versus

pulse width t_p.

Fig.8. Normalised latching current I_L(T_j)/ I_L(25˚C),

versus junction temperature T_j.

dIcom/dt (A/ms)

100

F TYPE

E TYPE

D TYPE

IH(Tj)

IH(25C)

2.5

1.5

0.5

120

100

140

Tj/˚C

-50

100

150

Tj / C

Fig.12. Minimum, critical rate of change of

commutating current, dI_com/dt versus junction

temperature,dV_com/dt = 10 V/us

Fig.9. Normalised holding current I_H(T_j)/ I_H(25˚C),

versus junction temperature T_j.

March 2002

Rev 2.000

Philips Semiconductors

Product specification

Three quadrant triacs

guaranteed commutation

BTA208S series D, E and F

MECHANICAL DATA

Dimensions in mm

Net Mass: 1.1 g

seating plane

2.38 max

0.93 max

1.1

5.4

6.73 max

tab

4 min

4.6

6.22 max

0.5 min

10.4 max

0.5

0.3

0.5

0.8 max

(x2)

2.285 (x2)

Fig.13. SOT428 : centre pin connected to tab.

MOUNTING INSTRUCTIONS

Dimensions in mm

7.0

2.15

2.5

1.5

4.57

Fig.14. SOT428 : minimum pad sizes for surface mounting.

Notes

1. Plastic meets UL94 V0 at 1/8".

March 2002

Rev 2.000

Philips Semiconductors

Product specification

Three quadrant triacs

guaranteed commutation

BTA208S series D, E and F

DEFINITIONS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one

or more of the limiting values may cause permanent damage to the device. These are stress ratings only and

operation of the device at these or at any other conditions above those given in the Characteristics sections of

this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Philips Electronics N.V. 2002

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the

The information presented in this document does not form part of any quotation or contract, it is believed to be

accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under patent or other

industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these

products can be reasonably expected to result in personal injury. Philips customers using or selling these products

for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting

from such improper use or sale.

March 2002

Rev 2.000

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