935030270602 [NXP]

IC ADDR LATCH BASED PRPHL DRVR, PDIP16, 0.300 INCH, PLASTIC, SOT38-4, DIP-16, Peripheral Driver;
935030270602
型号: 935030270602
厂家: NXP    NXP
描述:

IC ADDR LATCH BASED PRPHL DRVR, PDIP16, 0.300 INCH, PLASTIC, SOT38-4, DIP-16, Peripheral Driver

驱动 双倍数据速率 光电二极管 接口集成电路
文件: 总10页 (文件大小:123K)
中文:  中文翻译
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INTEGRATED CIRCUITS  
NE/SA5090  
Addressable relay driver  
Product data  
2001 Aug 03  
Supersedes data of 1994 Aug 31  
File under Integrated Circuits; IC11 Data Handbook  
Philips  
Semiconductors  
Philips Semiconductors  
Product data  
Addressable relay driver  
NE/SA5090  
DESCRIPTION  
PIN CONFIGURATION  
The NE/SA5090 addressable relay driver is a high-current latched  
driver, similar in function to the 9934 address decoder. The device  
has 8 open-collector Darlington power outputs, each capable of  
150 mA load current. The outputs are turned on or off by  
respectively loading a logic “1” or logic “0” into the device data input.  
The required output is defined by a 3-bit address. The device must  
be enabled by a CE input line which also serves the function of  
further address decoding. A common clear input, CLR, turns all  
outputs off when a logic “0” is applied. The device is packaged in a  
16-pin plastic DIP or SO package.  
1
D , N Packages  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
A
A
V
0
1
CC  
CLR  
CE  
A
Q
2
D
0
1
2
Q
Q
Q
7
Q
6
Q
Q
5
3
GND  
Q
4
FEATURES  
8 high-current outputs  
TOP VIEW  
Low-loading bus-compatible inputs  
Power-on clear ensures safe operation  
Will operate in addressable or demultiplex mode  
Allows random (addressed) data entry  
Easily expandable  
NOTE:  
1. SOL - Released in Large SO package only.  
SL00234  
Figure 1. Pin Configuration  
APPLICATIONS  
Relay driver  
Pin-compatible with 9334 (Philips or Fairchild)  
Indicator lamp driver  
Triac trigger  
LED display digit driver  
Stepper motor driver  
BLOCK DIAGRAM  
CLR  
CE  
LATCH  
LATCH  
LATCH  
LATCH  
Q
Q
0
1
2
3
Q
Q
A
0
A
CONTROL  
GATE  
1–OF–8  
DECODER  
1
2
LATCH  
Q
Q
Q
4
5
6
7
A
LATCH  
LATCH  
D
LATCH  
Q
INPUT STAGE  
OUTPUT STAGE  
V
CC  
SL00235  
Figure 2. Block Diagram  
2
2001 Aug 03  
853-0892 26833  
Philips Semiconductors  
Product data  
Addressable relay driver  
NE/SA5090  
PIN DESIGNATION  
PIN NO.  
SYMBOL  
A -A  
NAME AND FUNCTION  
1-3  
A 3-bit binary address on these pins defines which of the 8 output latches is to receive the data.  
The 8 device outputs.  
0
2
4-7, 9-12  
13  
Q -Q  
0
7
D
The data input. When the chip is enabled, this data bit is transferred to the defined output such that:  
“1” turns output switch “ON”  
“0” turns output switch “OFF”  
14  
15  
CE  
The chip enable. When this input is low, the output latches will accept data. When CE goes high, all  
outputs will retain their existing state, regardless of address of data input condition.  
CLR  
The clear input. When CLR goes low all output switches are turned “OFF”. The high data input will  
override the clear function on the addressed latch.  
ORDERING INFORMATION  
DESCRIPTION  
TEMPERATURE RANGE  
0 °C to +70 °C  
ORDER CODE  
NE5090D  
DWG #  
SOT162–1  
SOT38–4  
SOT162–1  
SOT38–4  
16-Pin Plastic Small Outline Large (SOL) Package  
16-Pin Plastic Dual In-Line Package (DIP)  
0 °C to +70 °C  
NE5090N  
16-Pin Plastic Small Outline Large (SOL) Package  
16-Pin Plastic Dual In-Line Package (DIP)  
–40 °C to +85 °C  
–40 °C to +85 °C  
SA5090D  
SA5090N  
TRUTH TABLE  
INPUTS  
OUTPUTS  
MODE  
CLR  
L
CE  
H
L
D
X
L
A
A
A
Q
Q
Q
Q
Q
Q
Q
Q
7
0
1
2
0
1
2
3
4
5
6
X
X
X
H
H
H
H
H
H
H
H
Clear  
L
L
L
L
L
L
L
H
L
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
H
L
L
L
H
H
H
H
X
L
L
H
H
H
H
Demultiplex  
Memory  
L
L
H
L
L
L
L
L
H
H
X
H
H
X
H
H
L
L
H
X
H
H
Q
N-1  
H
H
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
Q
Q
N–1  
H
L
N–1  
H
H
H
H
H
L
L
Q
Q
Q
Q
H
Q
Q
N–1  
N–1  
N–1  
N–1  
N–1  
N–1  
Addressable Latch  
H
H
L
L
L
L
H
H
H
H
H
H
H
L
H
NOTES:  
X=Don’t care condition  
Q
=Previous output state  
N-1  
L=Low voltage level/“ON” output state  
H=High voltage level/“OFF” output state  
3
2001 Aug 03  
Philips Semiconductors  
Product data  
Addressable relay driver  
NE/SA5090  
ABSOLUTE MAXIMUM RATINGS  
T
amb  
= 25 °C, unless otherwise specified.  
SYMBOL  
PARAMETER  
RATING  
–0.5 to +7  
–0.5 to +15  
0 to +30  
500  
UNIT  
V
V
V
V
Supply voltage  
Input voltage  
CC  
IN  
V
Output voltage  
Ground current  
V
OUT  
GND  
I
I
mA  
Output current  
Each output  
200  
mA  
OUT  
P
D
Maximum power dissipation,  
1
T
= 25 °C (still-air)  
amb  
N package  
D package  
1712  
1315  
mW  
mW  
T
Ambient temperature range  
Junction temperature  
0 to +70  
150  
°C  
°C  
°C  
°C  
amb  
T
j
T
stg  
Storage temperature range  
–65 to +150  
230  
T
sld  
Lead soldering temperature (10 sec. max)  
NOTE:  
1. Derate above 25 °C at the following rates:  
N package at 13.7 mW/°C  
D package at 10.5 mW/°C  
DC ELECTRICAL CHARACTERISTICS  
1
V
= 4.75 V to 5.25 V; 0 °C T  
+70 °C, unless otherwise specified.  
CC  
amb  
LIMITS  
SYMBOL  
PARAMETER  
TEST CONDITIONS  
UNIT  
Min  
Typ  
Max  
Input voltage  
V
V
High  
Low  
2.0  
V
IH  
0.8  
IL  
Output voltage  
Low  
V
OL  
I
OL  
= 150 mA, T = 25 °C  
amb  
1.05  
1.30  
1.50  
V
Over temperature  
Input current  
High  
I
I
I
V
= V  
CC  
<1.0  
–3.0  
5
10  
µA  
µA  
IH  
IN  
Low  
V
= 0 V  
–250  
250  
IL  
IN  
Leakage current  
Supply current  
All outputs low  
All outputs high  
Power dissipation  
V
OUT  
= 28 V  
OH  
I
I
V
= 5.25 V  
35  
22  
60  
50  
mA  
mW  
CCL  
CC  
CCH  
P
No output load  
315  
D
NOTE:  
1. All typical values are at V = 5 V and T  
= 25 °C.  
amb  
CC  
4
2001 Aug 03  
Philips Semiconductors  
Product data  
Addressable relay driver  
NE/SA5090  
SWITCHING CHARACTERISTICS  
V
= 5 V; T  
= 25 °C; V  
= 5 V; I  
= 100 mA; V = 0.8 V; V = 2.0 V.  
CC  
amb  
OUT  
OUT IL IH  
SYMBOL  
Propagation delay time  
PARAMETER  
TO  
FROM  
MIN  
TYP  
MAX  
UNIT  
1
t
t
t
t
t
t
t
t
Low-to-high  
Output  
CE  
900  
130  
920  
130  
900  
130  
920  
1800  
260  
ns  
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
1
High-to-low  
Low-to-high  
2
3
4
1850  
260  
Output  
Output  
Output  
Data  
Address  
CLR  
ns  
ns  
ns  
2
High-to-low  
Low-to-high  
1800  
260  
3
High-to-low  
Low-to-high  
1850  
4
High-to-low  
Switching setup requirements  
Set-up time HIGH  
Chip enable  
Chip enable  
Chip enable  
Chip enable  
Chip enable  
High data  
Low data  
Address  
40  
50  
40  
10  
10  
40  
t
t
t
t
ns  
ns  
ns  
ns  
S(H)  
Set-up time LOW  
Address set-up time  
Hold time HIGH  
S(A)  
High data  
Low data  
H(H)  
PW(E)  
Hold time LOW  
1
Chip enable pulse width  
NOTES:  
1. See Turn-On and Turn-Off Delays, Enable-to-Output and Enable Pulse Width timing diagram.  
2. See Turn-On and Turn-Off Delays, Data-to-Output timing diagram.  
3. See Turn-On and Turn-Off Delays, Address-to-Output timing diagram.  
4. See Turn-Off Delay, Clear-to-Output timing diagram.  
5. See Set-up and Hold Time, Data-to-Enable timing diagram.  
6. See Set-up Time, Address-to-Enable timing diagram.  
dissipation by the device is limited to 0.75 W at room temperature,  
and decreases as ambient temperature rises.  
FUNCTIONAL DESCRIPTION  
This peripheral driver has latched outputs which hold the input date  
until cleared. The NE5090 has active-LOW, open-collector outputs,  
all of which are cleared when power is first applied. This device is  
identical to the NE590, except the outputs can withstand 28 V.  
The maximum die junction temperature must be limited to 165 °C,  
and the temperature rise above ambient and the junction  
temperature are defined as:  
T
= θ × P  
Addressable Latch Function  
R
JA  
D
R
T = T  
j
+ t  
Any given output can be turned on or off by presenting the address  
of the output to be set or cleared to the three address pins, by  
holding the “D” input High to turn on the selected output, or by  
holding it Low to turn off, holding the CLR input High, and bringing  
the CE input Low. Once an output is turned on or off, it will remain  
so until addressed again, or until all outputs are cleared by bringing  
the CLR input Low while holding the CE input High.  
amb  
For example, if we are using the NE5090 in a plastic package in an  
application where the ambient temperature is never expected to rise  
above 50 °C, and the output current at the 8 outputs, when on, are  
100, 40, 50, 200, 15, 30, 80, and 10 mA, we find from the graph of  
output voltage vs load current that the output voltages are expected  
to be about 0.92, 0.75, 0.78, 1.04, 0.5, 0.7, 0.9, and 0.4 V,  
respectively. Total device power due to these loads is found to be  
473.5 mW. Adding the 200 mW due to the power supply brings total  
device power dissipation to 723.5 mW. The thermal resistances are  
83 °C per W for plastic packages. Using the equations above we  
find:  
Demultiplexer Operation  
By holding the CLR and CE inputs Low and the ”D“ input High, the  
addressed output will remain on and all other outputs will be off.  
High Current Outputs  
The obvious advantage of this device over other drivers such as the  
9334 and N74LS259 is the fact that the outputs of the NE5090 are  
each capable of 200 mA and 28 V. It must be noted, however, that  
the total power dissipation would be over 2.5 W if all 8 outputs were  
on together and carrying 200 mA each. Since the total power  
dissipation is limited by the package to 1 W, and since power  
dissipation due to supply current is 0.25 W, the total load power  
Plastic T =83×0.7235=60°C  
R
Plastic T =50+60=100°C  
J
Thus we find that T is below the 165 °C maximum, and either  
J
package could be used in this application. The graphs of total load  
power versus ambient temperature would also give us this same  
information, although interpreting the graphs would not yield the  
same accuracy.  
5
2001 Aug 03  
Philips Semiconductors  
Product data  
Addressable relay driver  
NE/SA5090  
TIMING DIAGRAMS  
D
D
t
t
PW  
PW  
CE  
t
t
PHL  
PLH  
t
t
PHL  
PLH  
Q
Q
NOTE:  
Other Inputs: CLR = H, A = Stable  
NOTE:  
Other Inputs: CE = I, CLR = H, A = Stable  
Turn-On and Turn-Off Delays, Enable-to-Output  
and Enable Pulse Width  
Turn-On and Turn-Off Delays, Data-to-Output  
A
CLR  
t
PLH  
A
Q
Q
t
t
PHL  
PLH  
NOTE:  
Other Inputs: CE = L, CLR = L, D = H  
Turn-On and Turn-Off Delays, Address-to-Output  
Turn-Off Delays, Clear-to-Output  
D
t
t
HH  
HL  
t
SH  
A
t
SL  
CE  
t
S
CE  
Q
NOTE:  
Other Inputs: CLR = H, A = Stable  
NOTE:  
Other Inputs: CLR = H  
Set-up and Hold Time, Data-to-Enable  
Figure 3. Timing Diagrams  
Set-up Time, Address-to-Enable  
SL00236  
6
2001 Aug 03  
Philips Semiconductors  
Product data  
Addressable relay driver  
NE/SA5090  
TYPICAL APPLICATIONS  
+ 5V  
+5V TO 28V  
R
L
+28V  
DATA  
BUS  
Q
Q
Q
0
1
2
µP  
+ 5V  
D
4
+ 5V  
Q
Q
Q
Q
Q
3
0
5090  
RELAY  
LOAD  
5
6
7
CE  
D
A
A
A
Q
Q
Q
Q
Q
Q
Q
Q
A
A
A
Q
0
2
1
0
0
1
2
3
0
5
6
7
2
1
0
Q
1
Q
2
Q
3
5090  
5090  
Q
0
Q
5
Driving Simple Loads  
CE  
CLR  
CE  
CLR  
Q
6
Q
7
IQ  
CONTROL  
+5V  
+5V  
+5V  
CLEAR  
Q
Q
Q
0
1
2
D
A
A
A
0
1
3–BIT  
COUNTER  
Q
Q
Q
Q
Q
3
0
555  
NOTE:  
5090  
2
A
, A , A may be connected to the address bus if permitted by system design.  
5
6
7
0
1
2
CE  
CLR  
Interfacing With a Microprocessor System  
Operating in Demultiplex Mode  
SL00237  
Figure 4. Typical Applications  
TYPICAL PERFORMANCE CHARACTERISTICS  
Output Voltage  
vs Load Current  
Total Load Power  
vs Temperature  
1.2  
1.0  
1.0  
N PACKAGE  
0.75  
0.8  
0.50  
0.25  
0 C  
25 C  
F PACKAGE  
0.6  
70 C  
0.4  
0
200  
50  
100  
0
25  
50  
75  
100  
125  
150  
o
TEMPERATURE ( C)  
OUTPUT LOAD CURRENT (mA)  
SL00238  
Figure 5. Typical Performance Characteristics  
7
2001 Aug 03  
Philips Semiconductors  
Product data  
Addressable relay driver  
NE/SA5090  
SO16: plastic small outline package; 16 leads; body width 7.5 mm  
SOT162-1  
8
2001 Aug 03  
Philips Semiconductors  
Product data  
Addressable relay driver  
NE/SA5090  
DIP16: plastic dual in-line package; 16 leads (300 mil)  
SOT38-4  
9
2001 Aug 03  
Philips Semiconductors  
Product data  
Addressable relay driver  
NE/SA5090  
Data sheet status  
Product  
status  
Definitions  
[1]  
Data sheet status  
[2]  
Objective data  
Development  
This data sheet contains data from the objective specification for product development.  
Philips Semiconductors reserves the right to change the specification in any manner without notice.  
Preliminary data  
Product data  
Qualification  
Production  
This data sheet contains data from the preliminary specification. Supplementary data will be  
published at a later date. Philips Semiconductors reserves the right to change the specification  
without notice, in order to improve the design and supply the best possible product.  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply.  
Changes will be communicated according to the Customer Product/Process Change Notification  
(CPCN) procedure SNW-SQ-650A.  
[1] Please consult the most recently issued data sheet before initiating or completing a design.  
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL  
http://www.semiconductors.philips.com.  
Definitions  
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or  
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended  
periods may affect device reliability.  
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips  
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or  
modification.  
Disclaimers  
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications  
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.  
RighttomakechangesPhilipsSemiconductorsreservestherighttomakechanges, withoutnotice, intheproducts, includingcircuits,standard  
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless  
otherwise specified.  
Koninklijke Philips Electronics N.V. 2001  
Contact information  
All rights reserved. Printed in U.S.A.  
For additional information please visit  
http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
Date of release: 12-01  
9397 750 09176  
For sales offices addresses send e-mail to:  
sales.addresses@www.semiconductors.philips.com.  
Document order number:  
Philips  
Semiconductors  

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