935191500005 [NXP]
IC DATACOM, INTERFACE CIRCUIT, UUC8, DIE-8, Network Interface;
| 型号： | 935191500005 |
| 厂家： | 
NXP |
| 描述： | IC DATACOM, INTERFACE CIRCUIT, UUC8, DIE-8, Network Interface 电信 电信集成电路 |
| 文件： | 总20页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
PCA82C250
CAN controller interface
Product specification
2000 Jan 13
Supersedes data of 1997 Oct 21
File under Integrated Circuits, IC18
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
FEATURES
APPLICATIONS
• Fully compatible with the “ISO 11898” standard
• High speed (up to 1 Mbaud)
• High-speed applications (up to 1 Mbaud) in cars.
GENERAL DESCRIPTION
• Bus lines protected against transients in an automotive
environment
The PCA82C250 is the interface between the CAN
protocol controller and the physical bus. The device
provides differential transmit capability to the bus and
differential receive capability to the CAN controller.
• Slope control to reduce Radio Frequency Interference
(RFI)
• Differential receiver with wide common-mode range for
high immunity against ElectroMagnetic Interference
(EMI)
• Thermally protected
• Short-circuit proof to battery and ground
• Low-current standby mode
• An unpowered node does not disturb the bus lines
• At least 110 nodes can be connected.
QUICK REFERENCE DATA
SYMBOL
VCC
PARAMETER
CONDITIONS
MIN.
4.5
MAX.
5.5
UNIT
supply voltage
supply current
V
ICC
standby mode
−
170
−
µA
Mbaud
V
1/tbit
VCAN
Vdiff
tPD
maximum transmission speed
CANH, CANL input/output voltage
differential bus voltage
non-return-to-zero
1
−8
1.5
−
+18
3.0
50
V
propagation delay
high-speed mode
ns
Tamb
ambient temperature
−40
+125
°C
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
CODE
SOT97-1
SOT96-1
−
PCA82C250
PCA82C250T
PCA82C250U
DIP8
SO8
−
plastic dual in-line package; 8 leads (300 mil)
plastic small outline package; 8 leads; body width 3.9 mm
bare die; 2790 × 1780 × 380 µm
2000 Jan 13
2
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
BLOCK DIAGRAM
V
CC
3
PROTECTION
DRIVER
1
TXD
8
SLOPE/
STANDBY
Rs
HS
7
6
CANH
CANL
4
RXD
RECEIVER
5
REFERENCE
VOLTAGE
V
ref
PCA82C250
2
MKA669
GND
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
transmit data input
TXD
GND
VCC
1
2
3
4
5
6
handbook, halfpage
TXD
ground
1
2
3
4
8
7
6
5
Rs
supply voltage
GND
CANH
CANL
PCA82C250
RXD
Vref
receive data output
reference voltage output
V
CC
V
RXD
ref
CANL
LOW-level CAN voltage
input/output
MKA670
CANH
Rs
7
8
HIGH-level CAN voltage
input/output
Fig.2 Pin configuration.
slope resistor input
2000 Jan 13
3
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
FUNCTIONAL DESCRIPTION
Pin 8 (Rs) allows three different modes of operation to be
selected: high-speed, slope control or standby.
The PCA82C250 is the interface between the CAN
protocol controller and the physical bus. It is primarily
intended for high-speed applications (up to 1 Mbaud) in
cars. The device provides differential transmit capability to
the bus and differential receive capability to the CAN
controller. It is fully compatible with the “ISO 11898”
standard.
For high-speed operation, the transmitter output
transistors are simply switched on and off as fast as
possible. In this mode, no measures are taken to limit the
rise and fall slope. Use of a shielded cable is
recommended to avoid RFI problems. The high-speed
mode is selected by connecting pin 8 to ground.
A current limiting circuit protects the transmitter output
stage against short-circuit to positive and negative battery
voltage. Although the power dissipation is increased
during this fault condition, this feature will prevent
destruction of the transmitter output stage.
For lower speeds or shorter bus length, an unshielded
twisted pair or a parallel pair of wires can be used for the
bus. To reduce RFI, the rise and fall slope should be
limited. The rise and fall slope can be programmed with a
resistor connected from pin 8 to ground. The slope is
proportional to the current output at pin 8.
If the junction temperature exceeds a value of
approximately 160 °C, the limiting current of both
transmitter outputs is decreased. Because the transmitter
is responsible for the major part of the power dissipation,
this will result in a reduced power dissipation and hence a
lower chip temperature. All other parts of the IC will remain
in operation. The thermal protection is particularly needed
when a bus line is short-circuited.
If a HIGH level is applied to pin 8, the circuit enters a low
current standby mode. In this mode, the transmitter is
switched off and the receiver is switched to a low current.
If dominant bits are detected (differential bus voltage
>0.9 V), RXD will be switched to a LOW level.
The microcontroller should react to this condition by
switching the transceiver back to normal operation (via
pin 8). Because the receiver is slow in standby mode, the
first message will be lost.
The CANH and CANL lines are also protected against
electrical transients which may occur in an automotive
environment.
Table 1 Truth table of the CAN transceiver
SUPPLY
TXD
CANH
HIGH
CANL
LOW
BUS STATE
dominant
recessive
recessive
recessive
recessive
RXD
0
4.5 to 5.5 V
4.5 to 5.5 V
0
1 (or floating)
X(1)
floating
floating
floating
floating
floating
floating
1
<2 V (not powered)
2 V < VCC < 4.5 V
2 V < VCC < 4.5 V
X(1)
X(1)
X(1)
>0.75VCC
X(1)
floating if
floating if
VRs > 0.75VCC
VRs > 0.75VCC
Note
1. X = don’t care.
Table 2 Pin Rs summary
CONDITION FORCED AT PIN Rs
Rs > 0.75VCC
MODE
RESULTING VOLTAGE OR CURRENT AT PIN Rs
V
standby
IRs < 10 µA
0.4VCC < VRs < 0.6VCC
IRs < −500 µA
−10 µA < IRs < −200 µA
slope control
high-speed
VRs < 0.3VCC
2000 Jan 13
4
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin 2;
positive input current.
SYMBOL
VCC
PARAMETER
supply voltage
CONDITIONS
MIN.
−0.3
MAX.
+9.0
UNIT
V
V
V
Vn
DC voltage at pins 1, 4, 5 and 8
DC voltage at pins 6 and 7
−0.3
−8.0
VCC + 0.3
+18.0
V6, 7
0 V < VCC < 5.5 V;
no time limit
Vtrt
transient voltage at pins 6 and 7
storage temperature
see Fig.8
−150
−55
+100
+150
+125
+150
+2000
+200
V
Tstg
Tamb
Tvj
°C
°C
°C
V
ambient temperature
−40
virtual junction temperature
electrostatic discharge voltage
note 1
note 2
note 3
−40
Vesd
−2000
−200
V
Notes
1. In accordance with “IEC 60747-1”. An alternative definition of virtual junction temperature is:
Tvj = Tamb + Pd × Rth(vj-a), where Rth(j-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits
the allowable combinations of power dissipation (Pd) and ambient temperature (Tamb).
2. Classification A: human body model; C = 100 pF; R = 1500 Ω; V = ±2000 V.
3. Classification B: machine model; C = 200 pF; R = 25 Ω; V = ±200 V.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
in free air
VALUE
UNIT
thermal resistance from junction to ambient
PCA82C250
100
160
K/W
K/W
PCA82C250T
QUALITY SPECIFICATION
According to “SNW-FQ-611 part E”.
2000 Jan 13
5
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
CHARACTERISTICS
VCC = 4.5 to 5.5 V; Tamb = −40 to +125 °C; RL = 60 Ω; I8 > −10 µA; unless otherwise specified; all voltages referenced
to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design,
but only 100% tested at +25 °C.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
I3
supply current
dominant; V1 = 1 V
−
−
−
−
70
mA
recessive; V1 = 4 V;
R8 = 47 kΩ
14
mA
mA
µA
recessive; V1 = 4 V;
V8 = 1 V
−
−
−
18
standby; Tamb < 90 °C;
100
170
note 1
DC bus transmitter
VIH
VIL
IIH
HIGH-level input voltage
LOW-level input voltage
HIGH-level input current
LOW-level input current
recessive bus voltage
output recessive
output dominant
V1 = 4 V
0.7VCC
−0.3
−200
−100
2.0
−
−
−
−
−
−
−
−
−
−
−
VCC + 0.3 V
0.3VCC
+30
−600
3.0
V
µA
µA
V
IIL
V1 = 1 V
V6,7
ILO
V1 = 4 V; no load
off-state output leakage current −2 V < (V6,V7) < 7 V
−5 V < (V6,V7) < 18 V
−2
+1
mA
mA
V
−5
+12
4.5
V7
CANH output voltage
CANL output voltage
V1 = 1 V
2.75
0.5
V6
V1 = 1 V
2.25
3.0
V
∆V6, 7
difference between output
voltage at pins 6 and 7
V1 = 1 V
1.5
V
V1 = 1 V; RL = 45 Ω;
1.5
−
V
VCC ≥ 4.9 V
V1 = 4 V; no load
V7 = −5 V; VCC ≤ 5 V
V7 = −5 V; VCC = 5.5 V
V6 = 18 V
−500
−
−
−
−
+50
mV
mA
mA
mA
Isc7
short-circuit CANH current
short-circuit CANL current
−
−
−
−105
−120
160
Isc6
DC bus receiver: V1 = 4 V; pins 6 and 7 externally driven; −2 V < (V6, V7) < 7 V; unless otherwise specified
Vdiff(r)
differential input voltage
(recessive)
−1.0
−1.0
−
−
+0.5
+0.4
V
V
−7 V < (V6, V7) < 12 V;
not standby mode
Vdiff(d)
differential input voltage
(dominant)
0.9
1.0
−
−
5.0
5.0
V
V
−7 V < (V6, V7) < 12 V;
not standby mode
Vdiff(hys)
VOH
differential input hysteresis
see Fig.5
−
150
−
mV
V
HIGH-level output voltage
(pin 4)
I4 = −100 µA
0.8VCC
−
VCC
VOL
LOW-level output voltage (pin 4) I4 = 1 mA
I4 = 10 mA
0
0
5
−
−
−
0.2VCC
1.5
V
V
Ri
CANH, CANL input resistance
25
kΩ
2000 Jan 13
6
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
100
UNIT
kΩ
Rdiff
Ci
differential input resistance
CANH, CANL input capacitance
differential input capacitance
20
−
−
−
−
20
10
pF
pF
Cdiff
−
Reference output
Vref
reference output voltage
V8 = 1 V;
−50 µA < I5 < 50 µA
0.45VCC
0.4VCC
−
−
0.55VCC
0.6VCC
V
V
V8 = 4 V;
−5 µA < I5 < 5 µA
Timing (see Figs 4, 6 and 7)
tbit
minimum bit time
V8 = 1 V
V8 = 1 V
V8 = 1 V
V8 = 1 V
−
−
−
−
−
−
1
µs
ns
ns
ns
ns
tonTXD
toffTXD
tonRXD
toffRXD
delay TXD to bus active
delay TXD to bus inactive
delay TXD to receiver active
delay TXD to receiver inactive
−
50
40
55
82
80
120
150
V8 = 1 V; VCC < 5.1 V;
Tamb < +85 °C
V8 = 1 V; VCC < 5.1 V;
Tamb < +125 °C
−
−
−
82
90
90
170
170
190
ns
ns
ns
V8 = 1 V; VCC < 5.5 V;
Tamb < +85 °C
V8 = 1 V; VCC < 5.5 V;
Tamb < +125 °C
tonRXD
delay TXD to receiver active
delay TXD to receiver inactive
R8 = 47 kΩ
R8 = 24 kΩ
R8 = 47 kΩ
R8 = 24 kΩ
R8 = 47 kΩ
−
−
−
−
−
390
260
260
210
14
520
320
450
320
−
ns
ns
toffRXD
ns
ns
SR
differential output voltage slew
rate
V/µs
tWAKE
tdRXDL
wake-up time from standby
(via pin 8)
−
−
−
−
20
3
µs
µs
bus dominant to RXD LOW
V8 = 4 V; standby mode
Standby/slope control (pin 8)
V8
input voltage for high-speed
−
−
−
−
−
−
0.3VCC
−500
−
V
I8
input current for high-speed
input voltage for standby mode
slope control mode current
slope control mode voltage
V8 = 0 V
−
µA
V
Vstb
Islope
Vslope
0.75VCC
−10
−200
0.6VCC
µA
V
0.4VCC
Note
1. I1 = I4 = I5 = 0 mA; 0 V < V6 < VCC; 0 V < V7 < VCC; V8 = VCC
.
2000 Jan 13
7
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
+5 V
handbook, halfpage
100 pF
CANH
V
CC
TXD
PCA82C250
V
62 Ω
100 pF
ref
CANL
RXD
Rs
GND
30 pF
R
ext
MKA671
Fig.3 Test circuit for dynamic characteristics.
V
CC
V
TXD
0 V
0.9 V
V
diff
0.5 V
0.7V
CC
V
RXD
0.3V
CC
t
t
offTXD
onTXD
t
t
MKA672
onRXD
offRXD
Fig.4 Timing diagram for dynamic characteristics.
8
2000 Jan 13
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
V
RXD
HIGH
LOW
hysteresis
0.5 V
0.9 V
V
MKA673
diff
Fig.5 Hysteresis.
V
CC
V
Rs
0 V
V
RXD
t
MKA674
WAKE
V1 = 1 V.
Fig.6 Timing diagram for wake-up from standby.
9
2000 Jan 13
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
1.5 V
0 V
V
diff
V
RXD
t
MKA675
dRXDL
V1 = 4 V; V8 = 4 V.
Fig.7 Timing diagram for bus dominant to RXD LOW.
+5 V
V
CC
1 nF
TXD
CANH
PCA82C250
SCHAFFNER
GENERATOR
62 Ω
1 nF
RXD
CANL
V
ref
MKA676
Rs
GND
R
ext
The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b.
Fig.8 Test circuit for automotive transients.
2000 Jan 13
10
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
APPLICATION INFORMATION
handbook, halfpage
P8xC592/P8xCE598
CAN-CONTROLLER
CTX0 CRX0 CRX1 PX,Y
R
ext
+5 V
TXD
RXD
V
Rs
ref
V
CC
PCA82C250T
CAN-TRANSCEIVER
100 nF
GND
CANH
CANL
CAN BUS
LINE
124 Ω
124 Ω
MKA677
Fig.9 Application of the CAN transceiver.
2000 Jan 13
11
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
SJA1000
CAN-CONTROLLER
TX0 TX1
RX0 RX1
3.6 kΩ
6.8 kΩ
390 Ω
+5 V
100 nF
390 Ω
V
DD
V
SS
6N137
0 V
6N137
390 Ω
+5 V
100 nF
390 Ω
+5 V
+5 V
TXD
RXD
V
Rs
ref
V
CC
PCA82C250
CAN-TRANSCEIVER
R
100 nF
ext
GND
CANH CANL
124 Ω
124 Ω
CAN BUS LINE
MKA678
Fig.10 Application with galvanic isolation.
2000 Jan 13
12
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
INTERNAL PIN CONFIGURATION
V
CC
3
1
TXD
8
Rs
4
RXD
7
6
CANH
CANL
PCA82C250
5
V
ref
2
MKA679
GND
Fig.11 Internal pin configuration.
2000 Jan 13
13
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
BONDING PAD LOCATIONS
SYMBOL
COORDINATES(1)
PAD
x
y
TXD
GND
VCC
1
2
3
4
5
6
7
8
196
1280
1767
2588
2594
1689
948
135
135
135
RXD
Vref
135
1640
1640
1640
1640
CANL
CANH
Rs
196
Note
1. All coordinates (µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of
the die (x/y = 0).
5
8
7
6
1.78
mm
PCA82C250U
1
2
3
4
0
x
0
y
MGL945
2.79 mm
Fig.12 Bonding pad locations.
2000 Jan 13
14
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
D
M
E
A
2
A
A
1
L
c
w M
Z
b
1
e
(e )
1
M
H
b
b
2
8
5
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.10
7.62
0.30
0.254
0.01
1.15
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.020
0.13
0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-02-04
99-12-27
SOT97-1
050G01
MO-001
SC-504-8
2000 Jan 13
15
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
97-05-22
99-12-27
SOT96-1
076E03
MS-012
2000 Jan 13
16
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
SOLDERING
Introduction
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
• For packages with leads on two sides and a pitch (e):
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
300 and 400 °C, contact may be up to 5 seconds.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Surface mount packages
REFLOW SOLDERING
MANUAL SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2000 Jan 13
17
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
Suitability of IC packages for wave, reflow and dipping soldering methods
SOLDERING METHOD
WAVE
REFLOW(1) DIPPING
suitable(2)
MOUNTING
PACKAGE
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
−
suitable
Surface mount
BGA, LFBGA, SQFP, TFBGA
not suitable
not suitable(3)
suitable
suitable
−
−
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, SMS
PLCC(4), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
suitable
−
−
−
not recommended(4)(5) suitable
not recommended(6)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2000 Jan 13
18
Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
BARE DIE DISCLAIMER
All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of Philips’ delivery. If there are data sheet limits not guaranteed, these will be separately
indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors
has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing,
handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in
which the die is used.
2000 Jan 13
19
Philips Semiconductors – a worldwide company
Argentina: see South America
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Pakistan: see Singapore
Belgium: see The Netherlands
Brazil: see South America
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Colombia: see South America
Czech Republic: see Austria
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Hungary: see Austria
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Middle East: see Italy
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
69
SCA
© Philips Electronics N.V. 2000
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
285002/05/pp20
Date of release: 2000 Jan 13
Document order number: 9397 750 06609
相关型号：
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明