935201520512 [NXP]
IC PARALLEL, WORD INPUT LOADING, 0.002 us SETTLING TIME, 10-BIT DAC, PQCC28, PLASTIC, LCC-28, Digital to Analog Converter;
| 型号： | 935201520512 |
| 厂家： | 
NXP |
| 描述： | IC PARALLEL, WORD INPUT LOADING, 0.002 us SETTLING TIME, 10-BIT DAC, PQCC28, PLASTIC, LCC-28, Digital to Analog Converter 输入元件 转换器 |
| 文件： | 总22页 (文件大小：161K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8776A
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
1996 Jun 04
Product specification
Supersedes data of 1995 May 11
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
FEATURES
APPLICATIONS
• 10-bit resolution
High-speed digital-to-analog conversion for:
• High resolution video and graphics
• Direct digital synthesis (DDS)
• Telecommunication
• Conversion rate up to 1000 MHz
• 10K/100K ECL input levels
• Internal reference voltage generator
• No deglitching circuit required
• Internal input register
• High-speed modems.
GENERAL DESCRIPTION
• Power dissipation only 925 mW (typical)
• Internal 50 Ω output load (connected to the analog
ground)
The TDA8776A is a 10-bit Digital-to-Analog Converter
(DAC) for high resolution video and other high frequency
applications. It converts the digital input signal into an
analog output voltage at a maximum conversion rate of
1000 Msps. No external reference voltage is required and
all digital inputs are 10K/100K-ECL compatible.
• Very few external components required.
QUICK REFERENCE DATA
SYMBOL
VEEA
PARAMETER
analog supply voltage
digital supply voltage
CONDITIONS
MIN.
−5.46
−5.46
−5.46
TYP.
−5.20
−5.20
−5.20
MAX.
−4.94
−4.94
−4.94
UNIT
V
VEED
VEEI
V
V
input stages digital supply
voltage
note 1
IEEA
IEED
IEEI
analog supply current
digital supply current
note 1
note 1
note 1
−
−
−
108
60
145
85
mA
mA
mA
input stages digital supply
current
10
15
VOUT − VOUT
full-scale analog output voltage notes 1 and 2; ZL = 50 Ω
1.7
2.0
2.5
V
(peak-to-peak value)
INL
DC integral non-linearity
DC differential non-linearity
maximum clock frequency
settling time (differential)
total power dissipation
note 3
note 3
−
±0.3
±0.2
−
±0.5
LSB
LSB
MHz
ns
DNL
fclk(max)
tS1
−
±0.45
1000
−
−
−
10% to 90% full scale; Fig.9 −
0.5
925
Ptot
−
mW
Notes
1. D0 to D9 connected to either HIGH or LOW level, CLK is HIGH and CLK is LOW.
2. The analog output voltages (VOUT and VOUT) are negative with respect to AGND (see Table 1). The external output
resistance between AGND and each of these outputs is typically 50 Ω.
3. A warm-up time is necessary to reach optimal performances.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
TDA8776AK
1996 Jun 04
PLCC28
plastic leaded chip carrier; 28 leads
SOT261-2
2
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
BLOCK DIAGRAM
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
IGND
12
22 21 20 19 18 17 16 15 14 13
ECL BUFFERS
25
V
EEI
COLUMN DECODER
DELAY
28
DGND2
10
AGND2
ROW
DECODER
11
V
EED3
24
V
EEA
R-2R DIVIDER
TDA8776A
2
5
3
4
9
8
6
7
27
26
MBE581
V
V
V
V
V
V
DGND1 AGND1
CLK
CLK
EED1
EED2
OUT2
OUT1 OUT1
OUT2
Fig.1 Block diagram.
1996 Jun 04
3
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
PINNING
SYMBOL PIN
DESCRIPTION
15 data input; bit 2
16 data input; bit 3
SYMBOL PIN
DESCRIPTION
not connected
D2
n.c.
1
2
3
4
5
6
7
8
D3
DGND1
VEED1
VEED2
AGND1
VOUT1
VOUT2
VOUT1
digital ground 1
D4
17 data input; bit 4
18 data input; bit 5
19 data input; bit 6
20 data input; bit 7
21 data input; bit 8
digital supply voltage 1 (−5.2 V)
digital supply voltage 2 (−5.2 V)
analog ground 1
D5
D6
D7
analog voltage output 1
analog voltage output 2
D8
D9
22 data input; bit 9 (MSB)
23 not connected
complementary analog voltage
output 1
n.c.
VEEA
VEEI
VOUT2
9
complementary analog voltage
output 2
24 analog supply voltage (−5.2 V)
25 input supply voltage for ECL input
AGND2
VEED3
IGND
D0
10 analog ground 2
buffers (−5.2 V)
11 digital supply voltage 3 (−5.2 V)
12 input ground for ECL input buffers
13 data input; bit 0 (LSB)
14 data input; bit 1
CLK
26 complementary clock input
27 clock input
CLK
DGND2
28 digital ground 2
D1
V
5
6
AGND1
25
24
EEI
V
V
OUT1
EEA
V
7
23 n.c.
OUT2
V
8
22
21
20
D9
D8
D7
TDA8776A
OUT1
V
9
OUT2
10
11
AGND2
V
19 D6
EED3
MBE582
Fig.2 Pin configuration.
4
1996 Jun 04
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VEEA
PARAMETER
analog supply voltage
CONDITIONS
MIN.
−7.0
MAX.
±0.3
UNIT
V
V
V
V
V
V
VEED
VEEI
digital supply voltage
−7.0
−7.0
−0.5
−0.1
VEEI
−5
±0.3
±0.3
+0.5
+0.1
±0.3
+50
+150
70
input stages digital supply voltage
supply voltage differential
VEEA − VEED
AGND − DGND ground voltage differential
VI
input voltage
IOUT/IOUT
total output current
storage temperature
operating ambient temperature
junction temperature
ZL = 50 Ω
mA
°C
°C
°C
Tstg
Tamb
Tj
−55
0
−
150
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
VALUE
UNIT
thermal resistance from junction to ambient in free air
55 (typ.)
K/W
1996 Jun 04
5
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
CHARACTERISTICS
VEEA = V24 to V5 and V10 = −5.46 to −4.94 V; VEED = V3, V4 and V11 to V2 and V28 = −5.46 to −4.94 V;
VEEI = V25 to V12 = −5.46 to −4.94 V; VEED and VEEI shorted together; Tamb = 0 to +70 °C; AGND, DGND and IGND
shorted together; VOUT − VOUT = 2 V (p-p); ZL = 50 Ω; unless otherwise specified (typical values measured at
VEEA = VEED = −5.2 V and Tamb = 25 °C).
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
VEEA
VEED
VEEI
IEEA
IEED
IEEI
analog supply voltage
−5.46 −5.20 −4.94
−5.46 −5.20 −4.94
−5.46 −5.20 −4.94
V
digital supply voltage
V
input stages digital supply voltage
analog supply current
note 1
V
note 1
note 1
note 1
−
108
60
10
−
145
85
mA
mA
mA
V
digital supply current
−
input stages digital supply current
−
15
AGND − DGND ground voltage differential
−0.1
+0.1
Inputs
DIGITAL INPUTS (D9 TO D0) AND CLOCK INPUTS (CLK AND CLK)
VIL
LOW level input voltage
HIGH level input voltage
LOW level input current
HIGH level input current
maximum clock frequency
−1.9
−1.2
−
−1.8
−0.9
−
−1.6
−0.8
10
V
VIH
IIL
V
VI = −1.8 V
VI = −0.9 V
µA
µA
MHz
IIH
−
−
20
fclk(max)
1000
−
−
Outputs (referenced to AGND); notes 1 and 2
V
OUT − VOUT(p-p) full-scale analog output voltage
ZL = 50 Ω
1.7
2.0
50
2.5
V
(peak-to-peak value)
ZO
output impedance
−
−
Ω
Transfer function
INL
DC integral non-linearity
note 3
note 3
−
−
±0.3
±0.2
±0.5
LSB
DNL
DC differential non-linearity
±0.45 LSB
Spurious free dynamic range (fclk = 1000 MHz); VEEA = VEED = 5.2 V; Tamb = 25 °C; note 4; see Fig.3
SFDR
spurious free dynamic range
fOUT = 10 MHz
−65
−
−69
−60
−57
−46
−
−
−
−
dB
dB
dB
dB
f
f
OUT = 50 MHz
OUT = 100 MHz
−52
−
fOUT = 200 MHz
1996 Jun 04
6
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
Switching characteristics (fclk = 1000 MHz); notes 5 and 6; see Figs 8 and 9
tSU;DAT
tHD;DAT
tPD
data set-up time
−
400
150
0.8
0.5
2.0
1.4
500
−
ps
ps
ns
ns
ns
ns
data hold time
100
−
propagation delay time
settling time
0.9
−
tS1
10% to 90% full scale
−
tS2
settling time
change to ±1 LSB
−
−
td
input to 50% output delay time
−
1.5
Output transients; glitches (fclk = 1000 MHz); note 7; see Fig.10
Eg
differential glitch energy from code
transition 511 to 512
−
1
2
pV.s
Notes
1. D0 to D9 connected to either HIGH or LOW level, CLK is HIGH and CLK is LOW.
2. The analog output voltages (VOUT and VOUT) are negative with respect to AGND (see Table 1). The external output
resistance between AGND and each of these outputs is typically 50 Ω.
3. Due to on-chip regulator behaviour a warm-up time is necessary to reach optimal performances; a typical time is
1 minute.
4. Devices with higher SFDR (min.) can be delivered on special request.
5. The worst case characteristics are obtained at the transition from input code 0 to 1023 and if an external load
impedance greater than 50 Ω is connected between VOUT or VOUT and AGND in parallel with the external 50 Ω load.
The specified values have been measured directly on a 50 Ω load between VOUT and AGND. No further load
impedance between VOUT and AGND has been applied. All input data is latched at the falling edge of the clock.
6. The data set-up (tSU;DAT) is the minimum period preceding the falling edge of the clock that the input data must be
stable in order to be correctly registered. A negative set-up time indicates that the data may be initiated after the
falling edge of the clock and still be recognized. The data hold time (tHD;DAT) is the minimum period following the
falling edge of the clock that the input data must be stable in order to be correctly registered. A negative hold time
indicates that the data may be released prior to the falling edge of the clock and still be recognized.
7. The definition of glitch energy and the measurement set-up are shown in Fig.10. The glitch energy is measured at
the input transition between code 511 to 512.
Table 1 Input coding and DAC output voltages (typical values; referenced to AGND regardless of the offset voltage)
DAC OUTPUT
BINARY INPUT DATA
VOLTAGES (V)
CODE
ZL = 50 Ω
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
VOUT
VOUT
0
1
0
0
.
0
0
.
0
0
.
0
0
.
0
0
.
0
0
.
0
0
.
0
0
.
0
0
.
0
1
.
0
−1.0
−0.0010 −0.9990
.
.
−0.5
.
.
−0.5
.
512
.
1
.
0
.
0
.
0
.
0
.
0
.
0
.
0
.
0
.
0
.
1022
1023
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
−0.9990 −0.0010
−1.0
0
1996 Jun 04
7
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
MGD478
80
SFDR
(dB)
70
60
50
40
2
3
1
10
10
10
f (MHz)
Fig.3 Typical spurious free dynamic range (SFDR) as a function of output frequency.
MGD475
20
DAC
OUTPUT
SPECTRUM
(dB)
0
−20
−40
−60
−80
−100
0
100
200
300
400
500
f (MHz)
Fig.4 Typical output spectrum; fclk = 1000 MHz; fOUT = 10 MHz.
1996 Jun 04
8
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
MGD474
20
DAC
OUTPUT
SPECTRUM
(dB)
0
−20
−40
−60
−80
−100
0
100
200
300
400
500
f (MHz)
Fig.5 Typical output spectrum; fclk = 1000 MHz; fOUT = 50 MHz.
MGD477
20
DAC
OUTPUT
SPECTRUM
(dB)
0
−20
−40
−60
−80
−100
0
100
200
300
400
500
f (MHz)
Fig.6 Typical output spectrum; fclk = 1000 MHz; fOUT = 100 MHz.
1996 Jun 04
9
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
MGD476
20
DAC
OUTPUT
SPECTRUM
(dB)
0
−20
−40
−60
−80
−100
0
100
200
300
400
500
f (MHz)
Fig.7 Typical output spectrum; fclk = 1000 MHz; fOUT = 200 MHz.
t
t
HD; DAT
SU; DAT
0.9 V
1.35 V
1.8 V
input data
stable
0.9 V
1.35 V
1.8 V
CLK
MLD202
The shaded areas indicate when the input data may change and be correctly registered. Data input update must be completed within tbf ns after the
falling edge of the clock (tSU;DAT is negative; tbf ns). Data must be held at least tbf ns after the falling edge (tHD;DAT = tbf ns).
Fig.8 Data set-up and hold times.
1996 Jun 04
10
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
CLK
1.35 V
code 1023
input data
1.35 V
code 0
(example of a
full-scale input
transition)
1 LSB
0 V
(code 0)
10 %
50 %
90 %
t
d
V
OUT
1.0 V
(code 1023)
1 LSB
t
S1
t
t
MLD203
PD
S2
Fig.9 Switching characteristics.
1996 Jun 04
11
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
HP80000
TEK 11801A
f
clk /10
D9 MSB
V
20 GHz
SAMPLING
SCOPE
OUT
(2)
DATA
D8
D7
D6
D5
D4
D3
D2
D1
V
OUT
GENERATOR
f
clk /10
(1)
TDA8776A
clock
(3)
(1)
(2)
D0 (LSB)
f
clk
f
PULSE
GENERATOR
(MASTER)
clk
(3)
MODEL HP8133A
code 512
1 LSB
timing diagram
code 511
MBE583
V
V
OUT
OUT
time
The value of the glitch energy is the sum of the shaded areas measured in pV.s.
Fig.10 Glitch energy measurement.
1996 Jun 04
12
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
INTERNAL PIN CONFIGURATIONS
IGND
handbook, 4 columns
internal reference
D0 to D9
V
EEI
MLD205
Fig.11 D9 to D0.
handbook, halfpage
AGND
DGND
olumns
50 Ω
50 Ω
V
OUT
V
OUT
CLK
CLK
EED
V
EEA
bit
n
bit
n
V
MLD207
switches and
current generators
MLD206
Fig.12 Analog outputs.
Fig.13 CLK and CLK.
1996 Jun 04
13
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
APPLICATION INFORMATION
50 Ω digital input matched lines
V
TT
1µF
10
nF
10
nF
10
nF
10
nF
10
nF
10
nF
50 Ω
50 Ω
50 Ω
50 Ω
50 Ω
50 Ω
D5
D4
D3
D2
D1
D0
IGND
12
10 nF
10 nF
10 nF
10 nF
18
17
16
15
14
13
50 Ω
50 Ω
50 Ω
50 Ω
(1)
C
V
D6
EED3
19
20
21
22
23
24
25
11
10
9
AGND2
D7
D8
50 Ω digital
input matched
lines
V
OUT2
OUT
OUT
V
D9
OUT1
TDA8776A
8
50 Ω analog
output matched
lines
V
n.c.
OUT2
7
V
V
EEA2
OUT1
6
(1)
C
V
AGND1
EEI
5
26
27
CLK
28
DGND2
1
2
3
4
V
V
EED2
CLK
n.c.
DGND1
22 µF
EED1
(1)
C
50 Ω
50 Ω
1 µF
10
nF
10
nF
LM337T
ADJ
IN
OUT
V
(−2 V)
12
µH
TT
22
µF
1
µF
1
µF
22
µF
120
Ω
50 Ω clock input
matched lines
V
(−5.2 V)
75
Ω
EE
MGD480
(1) C = 1 µF in parallel with 10 nF in parallel with 1 nF; all three mounted close to the supply pin of the DAC with 1 nF the nearest.
Fig.14 Application diagram.
1996 Jun 04
14
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
PACKAGE OUTLINE
PLCC28: plastic leaded chip carrier; 28 leads
SOT261-2
e
e
E
E
y
X
A
E
b
p
25
19
b
1
Z
E
18
26
w
M
28
1
H
E
pin 1 index
e
A
A
1
A
4
12
4
k
1
β
(A )
3
k
5
11
L
p
v
M
A
Z
e
D
detail X
D
H
B
v
M
B
D
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
(1)
(1)
A
min.
A
max.
k
1
max.
Z
Z
E
(1)
(1)
1
4
D
UNIT
mm
A
A
b
D
E
e
e
e
H
H
k
L
p
v
w
y
β
b
D
E
D
E
3
p
1
max. max.
4.57
4.19
0.81 11.58 11.58
0.66 11.43 11.43
10.92 10.92 12.57 12.57 1.22
9.91 9.91 12.32 12.32 1.07
1.44
1.02
0.53
0.33
0.51
0.51 0.25 3.05
0.020 0.01 0.12
1.27
0.05
0.18 0.18 0.10 2.16 2.16
0.007 0.007 0.004 0.085 0.085
o
45
0.180
0.165
0.032 0.456 0.456
0.026 0.450 0.450
0.430 0.430 0.495 0.495 0.048
0.390 0.390 0.485 0.485 0.042
0.057
0.040
0.021
0.013
inches
0.020
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-25
SOT261-2
1996 Jun 04
15
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration:
45 minutes at 45 °C.
SOLDERING PLCC
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
cases reflow soldering is often used.
Wave soldering
Wave soldering techniques can be used for all PLCC
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook2”
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
(order code 9398 65290011).
the downstream corners.
Reflow soldering
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering techniques are suitable for all PLCC
packages.
The choice of heating method may be influenced by larger
plastic packages (44 leads, or more). If infrared or vapour
phase heating is used and the large packages are not
absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our “Quality
Reference Manual” (order code 9398 510 63011).
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds at 270 to 320 °C
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
1996 Jun 04
16
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jun 04
17
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
NOTES
1996 Jun 04
18
Philips Semiconductors
Product specification
10-bit, 1000 Msps Digital-to-Analog
Converter (DAC)
TDA8776A
NOTES
1996 Jun 04
19
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Tel. +381 11 825 344, Fax.+381 11 635 777
Middle East: see Italy
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com/ps/
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1996
SCA49
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
537021/1200/02/pp20
Date of release: 1996 Jun 04
Document order number: 9397 750 00888
Philips Semiconductors: Product information on TDA8776A, 10-bit, 1000 Msps Digital-to-Analog Converter (DAC)
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The TDA8776A is a 10-bit Digital-to-Analog Converter (DAC) for high resolution video and other high
frequency applications. It converts the digital input signal into an analog output voltage at a maximum
conversion rate of 1000 Msps. No external reference voltage is required and all digital inputs are
10K/100K-ECL compatible.
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TDA8776A
Features
TDA8776A
● 10-bit resolution
● Conversion rate up to 1000 MHz
● 10K/100K ECL input levels
● Internal reference voltage generator
● No deglitching circuit required
● Internal input register
● Power dissipation only 925 mW (typical)
● Internal 50 Ω output load (connected to the analog ground)
● Very few external components required.
Applications
High-speed digital-to-analog conversion for:
● High resolution video and graphics
● Direct digital synthesis (DDS)
● Telecommunication
● High-speed modems.
An Overview Of Data Converters (date 01-Dec-91)
A High-Speed Converter For Every Application (date 18-Sep-96)
Datasheet
File
size
Publication
release date
Page
Type nr.
Title
Datasheet status
count (kB) Datasheet
file:///E|/export/projects/bitting2/imaging/BITTING/mail_pdf/cpl_images/c1.html (1 of 2) [7/17/2001 6:33:11 PM]
Philips Semiconductors: Product information on TDA8776A, 10-bit, 1000 Msps Digital-to-Analog Converter (DAC)
TDA8776A 10-bit, 1000 Msps
Digital-to-Analog Converter
(DAC)
04-Jun-96
Product
Specification
20
120
Download
Block diagram
Block diagram of
tda8776ak/c1
Products, packages, availability and ordering
marking/packing
North American Order code
Partnumber
package
device status
buy online
IC packing
Partnumber
(12nc)
info
Standard
9352 015 20512 Marking * Tube
Dry Pack
SOT261-2
(PLCC28)
TDA8776AK/C1 TDA8776AKA
Full production
-
Standard
Marking * Reel
Dry Pack, SMD,
13"
SOT261-2
(PLCC28)
order this
-
TDA8776AKA-T 9352 015 20518
Full production
Products in the above table are all in production. Some variants are discontinued; click here for information on
these variants.
Parametrics
No.
Function of Application
Pins
# of Maximum Power
Bits Dissipation(Mw)
Typenumber
Package
Converter Type
SOT261-2
(PLCC28)
TDA8776AK/C1
Converters 28 General-purpose/Linear ICs Digital-to-Analog 10 925
Find similar products:
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function or related to the part number(s) as listed on this page. The similar products page includes products
from the same catalog tree(s) , relevant selection guides and products from the same functional category.
Copyright © 2001
Royal Philips Electronics
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