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935278713112 [NXP]

SPECIALTY ANALOG CIRCUIT, PDSO16, 3.90 MM, 0.635 MM PITCH, PLASTIC, SOT519-1, SSOP-16;
935278713112
型号： 935278713112
厂家： NXP    NXP
描述：

SPECIALTY ANALOG CIRCUIT, PDSO16, 3.90 MM, 0.635 MM PITCH, PLASTIC, SOT519-1, SSOP-16

光电二极管
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NE1617A  
Temperature monitor for microprocessor systems  
Rev. 5 — 20 March 2012  
Product data sheet  
1. General description  
The NE1617A is an accurate two-channel temperature monitor. It measures the  
temperature of itself and the temperature of a remote sensor. The remote sensor is a  
diode connected transistor. This can be in the form of either a discrete NPN/PNP, such as  
the 2N3904/2N3906, or a diode connected PNP built into another die, such as is done on  
some Intel microprocessors.  
The temperature of both the remote and local sensors is stored in a register that can be  
read via a 2-wire SMBus. The temperatures are updated at a rate that is programmable  
via the SMBus (the average supply current is dependent upon the update rate — the  
faster the rate, the higher the current).  
In addition to the normal operation, which is to update the temperature at the programmed  
rate, there is a one-shot mode that will force a temperature update.  
There is also an alarm that senses either an overtemperature or undertemperature  
condition. The trip points for this alarm are also programmable.  
The device can have one of nine addresses (determined by two address pins), so there  
can be up to nine of the NE1617A on the SMBus.  
It can also be put in standby mode (in order to save power). This can be done either with  
software (over the SMBus) or with hardware (using the STBY pin).  
2. Features and benefits  
Replacement for Maxim MAX1617 and Analog Devices ADM1021  
Monitors local and remote temperature  
Local (on-chip) sensor accuracy:  
2 C at 60 C to 100 C  
3 C at 40 C to 125 C  
Remote sensor accuracy:  
3 C at 60 C to 100 C  
5 C at 40 C to 125 C  
No calibration required  
Programmable overtemperature/undertemperature alarm  
SMBus 2-wire serial interface up to 100 kHz  
3 V to 5.5 V supply range; 5.5 V tolerant  
70 A supply current in operating mode  
3 A (typical) supply current in standby mode  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per  
JESD22-C101  
Latch-up testing is done to JEDEC standard JESD78, which exceeds 100 mA  
Small 16-lead SSOP (QSOP) package  
3. Applications  
Desktop computers  
Notebook computers  
Smart battery packs  
Industrial controllers  
Telecommunications equipment  
4. Ordering information  
Table 1.  
Ordering information  
Tamb = 40 C to +125 C.  
Type number  
Topside  
mark  
Package  
Name  
Description  
Version  
NE1617ADS  
NE1617A SSOP16[1] plastic shrink small outline package; 16 leads; body width 3.9 mm; SOT519-1  
lead pitch 0.635 mm  
[1] Also known as QSOP16.  
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
2 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
5. Block diagram  
STBY  
NE1617A  
ONE-SHOT  
REGISTER  
CONFIGURATION  
REGISTER  
COMMAND POINTER  
REGISTER  
LOCAL  
TEMP  
SENSOR  
CONTROL  
LOGIC  
CONVERSION RATE  
REGISTER  
LOCAL HIGH TEMP  
THRESHOLD  
LOCAL TEMP HIGH  
LIMIT REGISTER  
LOCAL TEMP  
DATA REGISTER  
LOCAL LOW TEMP  
THRESHOLD  
LOCAL TEMP LOW  
LIMIT REGISTER  
D+  
ANALOG  
A-to-D  
MUX  
CONVERTER  
D−  
REMOTE TEMP  
DATA REGISTER  
REMOTE HIGH TEMP  
THRESHOLD  
REMOTE TEMP HIGH  
LIMIT REGISTER  
ADD1  
ADD0  
ADDRESS  
DECODER  
REMOTE LOW TEMP  
THRESHOLD  
REMOTE TEMP LOW  
LIMIT REGISTER  
ALERT  
INTERRUPT  
MASKING  
STATUS REGISTER  
SMBus INTERFACE  
V
GND  
GND  
TEST1 TEST5 TEST9 TEST13 TEST16  
SCLK  
SDATA  
002aad510  
DD  
Fig 1. Block diagram of NE1617A  
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
3 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
6. Pinning information  
6.1 Pinning  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
TEST1  
TEST16  
STBY  
V
DD  
D+  
D−  
SCLK  
TEST13  
SDATA  
ALERT  
ADD0  
NE1617ADS  
TEST5  
ADD1  
GND  
GND  
TEST9  
002aad509  
Fig 2. Pin configuration for SSOP16 (QSOP16)  
6.2 Pin description  
Table 2.  
Symbol  
Pin description  
Pin Description  
TEST1  
VDD  
1
test pin; factory use only[1]  
positive supply[2]  
2
D+  
3
positive side of remote sensor  
negative side of remote sensor  
test pin; factory use only[1]  
device address 1 (3-state)  
ground  
D  
4
TEST5  
ADD1  
GND  
5
6
7, 8  
9
TEST9  
ADD0  
ALERT  
SDATA  
TEST13  
SCLK  
STBY  
test pin; factory use only[1]  
10  
11  
12  
13  
14  
15  
device address 0 (3-state)  
open-drain output used as interrupt or SMBus alert  
SMBus serial data input/output; open-drain  
test pin; factory use only[1]  
SMBus clock input  
hardware standby input  
HIGH = normal operating mode  
LOW = standby mode  
TEST16  
16  
test pin; factory use only[1]  
[1] These pins should either float or be tied to ground.  
[2] VDD pin should be decoupled by a 0.1 F capacitor.  
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
4 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
7. Functional description  
The NE1617A contains an integrating A-to-D converter, an analog multiplexer, a status  
register, digital data registers, SMBus interface, associated control logic and a local  
temperature sensor or channel (refer to Figure 1 “Block diagram of NE1617A”). The  
remote diode-type sensor or channel should be connected to the D+ and Dpins properly.  
Temperature measurements or conversions are either automatically and periodically  
activated when the device is in free-running mode (both STBY pin = HIGH, and the  
configuration register bit 6 = LOW) or generated by one-shot command. The free-running  
period is selected by changing the programmable data of the conversion rate register, as  
described in Section 8.3.4. For each conversion, the multiplexer switches current sources  
through the remote and local temperature sensors over a period of time, about 60 ms, and  
the voltages across the diode-type sensors are sensed and converted into the  
temperature data by the A-to-D converter. The resulting temperature data is then stored in  
the temperature registers, in 8-bit two's complement word format and automatically  
compared with the limits which have been programmed in the temperature limit registers.  
Results of the comparison are reflected accordingly by the flags stored in the status  
register, an out-of-limit condition will set the ALERT output pin to its LOW state. Because  
both channels are automatically measured for each conversion, the results are updated  
for both channels at the end of every successful conversion.  
7.1 Temperature measurement  
The method of the temperature measurement is based on the change of the diode VBE at  
two different operating current levels given by:  
KT  
q
-------  
VBE  
=
n   
LNN  
(1)  
where:  
VBE = change in base emitter voltage drop at two current levels  
n = non-ideality  
K = Boltzman’s constant  
T = absolute temperature in Kelvin  
q = charge on the electron  
LN = natural logarithm  
N = ratio of the two currents  
The NE1617A forces two well-controlled current sources of about 10 A and 100 A and  
measures the remote diode VBE. The sensed voltage between two pins D+ and Dis  
limited between 0.25 V and 0.95 V. The external diode must be selected to meet this  
voltage range at these two current levels and also the non-ideality factor ‘n’ must be close  
to the value of 1.008 to be compatible with the Intel Pentium III internal thermal diode that  
the NE1617A was designed to work with. The diode-connected PNP transistor provided  
on the microprocessor is typically used, or the discrete diode-connected transistor  
2N3904 or 2N3906 is recommended as an alternative.  
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
5 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
Even though the NE1617A integrating A-to-D converter has a good noise performance,  
using the average of 10 measurement cycles, high frequency noise filtering between D+  
and Dshould be considered. An external capacitor of 2200 pF typical (but not higher  
than 3300 pF) connected between D+ and Dis recommended. Capacitance higher than  
3300 pF will introduce measurement error due to the rise time of the switched current  
source.  
7.2 No calibration is required  
As mentioned in Section 7.1, the NE1617A uses two well-controlled current sources of  
10 : 1 ratio to measure the forward voltage of the diode (VBE). This technique eliminates  
the diode saturation current (a heavily process and temperature dependent variable), and  
results in the forward voltage being proportional to absolute temperature.  
7.3 Address logic  
The address pins of the NE1617A can be forced into one of three levels: LOW (GND),  
HIGH (VDD), or ‘not connected’ (n.c.). Because the NE1617A samples and latches the  
address pins at the starting of every conversion, it is suggested that those address pins  
should be hard-wired to the logic applied, so that the logic is consistently existed at the  
address pins. During the address sensing period, the device forces a current at each  
address pin and compares the voltage developed across the external connection with the  
predefined threshold voltage in order to define the logic level. If an external resistor is  
used for the connection of the address, then its value should be less than 2 kto prevent  
the error in logic detection from happening. Resistors of 1 kare recommended.  
8. Temperature monitor with SMBus serial interface  
8.1 Serial bus interface  
The device can be connected to a standard 2-wire serial interface System Management  
Bus (SMBus) as a slave device under the control of a master device, using two device  
terminals SCLK and SDATA. The operation of the device to the bus is described with  
details in the following sections.  
8.2 Slave address  
The device address is defined by the logical connections applied to the device pins ADD0  
and ADD1. A list of selectable addresses are shown in Table 3. The device address can  
be set to any one of those nine combinations and more than one device can reside on the  
same bus without address conflict. Note that the state of the device address pins is  
sampled and latched not only at power-up step, but also at starting point of every  
conversion.  
Table 3.  
Device slave address  
n.c. = not connected  
ADD0[1]  
GND  
GND  
GND  
n.c.  
ADD1[1]  
Address byte  
0011 000  
GND  
n.c.  
0011 001  
VDD  
0011 010  
GND  
0101 001  
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
6 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
Table 3.  
Device slave address …continued  
n.c. = not connected  
ADD0[1]  
n.c.  
ADD1[1]  
Address byte  
n.c.  
0101 010  
0101 011  
1001 100  
1001 101  
1001 110  
n.c.  
VDD  
GND  
n.c.  
VDD  
VDD  
VDD  
VDD  
[1] Any pull-up/pull-down resistor used to connect to GND or VDD should be 2 k.  
8.3 Registers  
The device contains more than 9 registers. They are used to store the data of device  
set-up and operation results. Depending on the bus communication (either read or write  
operations), each register may be called by different names because each register may  
have different sub-addresses or commands for read and write operations. For example,  
the configuration register is called as WC for write mode and as RC for read mode.  
Table 4 shows the names, commands and functions of all registers as well as the register  
POR states.  
Remark: Attempting to write to a read-command or read from a write-command will  
produce an invalid result. The reserved registers are used for factory test purposes and  
should not be written.  
Table 4.  
Register assignments  
Register name  
Command byte  
00h  
POR state  
0000 0000  
0000 0000  
n/a  
Function  
RIT  
read internal or local temp byte  
read external or remote temp byte  
read status byte  
RET  
RS  
01h  
02h  
RC  
03h  
0000 0000  
0000 0010  
0111 1111  
1100 1001  
0111 1111  
1100 1001  
n/a  
read configuration byte  
read conversion rate byte  
read internal temp high limit byte  
read internal temp low limit byte  
read external temp high limit byte  
read external temp low limit byte  
write configuration byte  
write conversion rate byte  
write internal temp high limit byte  
write internal temp low limit byte  
write external temp high limit byte  
write external temp low limit byte  
one-shot command  
RCR  
RIHL  
RILL  
REHL  
RELL  
WC  
04h  
05h  
06h  
07h  
08h  
09h  
WCR  
WIHL  
WILL  
WEHL  
WELL  
OSHT  
-
0Ah  
n/a  
0Bh  
n/a  
0Ch  
0Dh  
0Eh  
n/a  
n/a  
n/a  
0Fh  
n/a  
10h  
n/a  
reserved  
-
11h  
n/a  
reserved  
-
12h  
n/a  
reserved  
-
13h  
n/a  
reserved  
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
7 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
8.3.1 Low power standby modes  
Upon POR, the device is reset to its normal free-running auto-conversion operation mode.  
The device can be put into standby mode by either using hardware control (connect the  
STBY pin to LOW for hardware standby mode) or using software control (set bit 6 of the  
configuration register to HIGH for software standby mode). When the device is put in  
either one of the standby modes, the supply current is reduced to less than 10 A if there  
is no SMBus activity, all data in the device registers are retained and the SMBus interface  
is still alive to bus communication. However, there is a difference in the device ADC  
conversion operation between hardware standby and software standby modes. In  
hardware standby mode, the device conversion is inhibited and the one-shot command  
does not initiate a conversion. In software standby mode, the one-shot command will  
initiate a conversion for both internal and external channels.  
If a hardware standby command is received when the device is in normal mode and a  
conversion is in progress, the conversion cycle will stop and data in reading temperature  
registers will not be updated.  
8.3.2 Configuration register  
The configuration register is used to mask the Alert interrupt and/or to put the device in  
software standby mode. Only two bits of this register (bit 6 and bit 7) are used as listed in  
Table 5. Bit 7 is used to mask the device ALERT output from Alert interruption when this  
bit is set to logic 1, and bit 6 is used to activate the standby software mode when this bit is  
set to logic 1.  
This register can be written or read using the commands of registers named WC and RC  
accordingly. Upon Power-On Reset (POR), both bits are reset to zero.  
Table 5.  
Bit  
Configuration register bit assignments  
Symbol  
POR state  
Function  
7 (MSB) MASK  
0
Mask ALERT interrupt. Interrupt is enabled when this bit  
is LOW, and disabled when this bit is HIGH.  
6
RUN/STOP  
0
Standby or run mode control. When LOW, running mode  
is enabled; when HIGH, standby mode is initiated.  
5 to 0  
-
n/a  
reserved  
8.3.3 External and internal temperature registers  
Results of temperature measurements after every ADC conversion are stored in two  
registers: Internal Temp register (RIT) for internal or local diode temperature, and External  
Temp register (RET) for external or remote diode temperature. These registers can be  
only read over the SMBus. The reading temperature data is in 2's complement binary form  
consisting of 7-bit data and 1-bit sign (MSB), with each data count represents 1 C, and  
the MSB bit is transmitted first over the serial bus. The contents of those two registers are  
updated upon completion of each ADC conversion. Table 6 shows some values of the  
temperature and data.  
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
8 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
Table 6.  
Temperature data format (2’s complement)  
Temperature (C)  
Digital output (8 bits)  
+127  
+126  
+100  
+50  
+25  
+1  
0111 1111  
0111 1110  
0110 0100  
0011 0010  
0001 1001  
0000 0001  
0000 0000  
1111 1111  
1110 0111  
1100 1110  
1011 1111  
0
1  
25  
50  
65  
8.3.4 Conversion rate register  
The conversion rate register is used to store programmable conversion data, which  
defines the time interval between conversions in standard free-running auto-convert  
mode. Table 7 shows all applicable data and rates for the device. Only three LSB bits of  
the register are used and other bits are reserved for future use. This register can be  
written to and read back over the SMBus using commands of the registers named WCR  
and RCR, respectively. The POR default conversion data is 02h (0.25 Hz).  
Notice that the average supply current, as well as the device power consumption, is  
increased with the conversion rate.  
Table 7.  
Data  
00h  
Conversion rate control byte  
Conversion rate (Hz)  
Average supply current (A typical at VDD = 3.3 V)  
0.0625  
67  
01h  
0.125  
68  
02h  
0.25  
70  
03h  
0.5  
75  
04h  
1
80  
05h  
2
95  
06h  
4
125  
180  
n/a  
07h  
8
08h to FFh  
(reserved)  
8.3.5 Temperature limit registers  
The device has four registers to be used for storing programmable temperature limits,  
including the high limit and the low limit for each channel of the external and internal  
diodes. Data of the temperature register (RIT and RET) for each channel are compared  
with the contents of the temperature limit registers of the same channel, resulting in alarm  
conditions. If measured temperature either equals or exceeds the corresponding  
temperature limits, an Alert interrupt is asserted and the corresponding flag bit in the  
status register is set. The temperature limit registers can be written to and read back using  
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
9 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
commands of registers named WIHL, WILL, WEHL, WELL, RIHL, RILL, REHL, RELL,  
accordingly. The POR default values are +127 C (0111 1111) for the HIGH limit and  
55 C (1100 1001) for the LOW limit.  
8.3.6 One-shot command  
The one-shot command is not actually a data register as such and a write operation to it  
will initiate an ADC conversion. The send byte format of the SMBus, as described later,  
with the use of OSHT command (0Fh), is used for this writing operation. In normal  
free-running-conversion operation mode of the device, a one-shot command immediately  
forces a new conversion cycle to begin. However, if a conversion is in progress when a  
one-shot command is received, the command is ignored. In software standby mode the  
one-shot command generates a single conversion and comparison cycle and then puts  
the device back in its standby mode after the conversion. In hardware standby mode, the  
one shot is inhibited.  
8.3.7 Status register  
The content of the status register reflects condition status resulting from all of these  
activities: comparisons between temperature measurements and temperature limits, the  
status of ADC conversion, and the hardware condition of the connection of external diode  
to the device. Bit assignments and bit functions of this register are listed in Table 8. This  
register can only be read using the command of register named RS. Upon POR, the  
status of all flag bits are reset to zero. The status byte is cleared by any successful read of  
the status register unless the fault condition persists.  
Notice that any one of the fault conditions, except the conversion busy, also introduces an  
Alert interrupt to the SMBus that will be described in Section 8.3.8. Also, whenever a  
one-shot command is executed, the status byte should be read after the conversion is  
completed, which is about 170 ms after the one-shot command is sent.  
Table 8.  
Status register bit assignment  
Bit  
Symbol  
BUSY  
IHLF[1]  
ILLF[1]  
EHLF[1]  
ELLF[1]  
OPEN[2]  
-
POR state  
Function  
7 (MSB)  
n/a  
0
HIGH when the ADC is busy converting  
HIGH when the internal temperature high limit has tripped  
HIGH when the internal temperature low limit has tripped  
HIGH when the external temperature high limit has tripped  
HIGH when the external temperature low limit has tripped  
HIGH when the external diode is opened  
reserved  
6
5
0
4
0
3
0
2
0
1 to 0  
0
[1] These flags stay HIGH until the status register is read or POR is activated.  
[2] This flag stays HIGH until POR is activated.  
8.3.8 Alert interrupt  
The ALERT output is used to signal Alert interruption from the device to the SMBus and is  
active LOW. Because this output is an open-drain output, a pull-up resistor (10 ktypical)  
to VDD is required, and slave devices can share a common interrupt line on the same  
SMBus. An Alert interrupt is asserted by the device whenever any one of the fault  
conditions, as described in Section 8.3.7 “Status register”, occurs: measured temperature  
equals or exceeds corresponding temp limits, the remote diode is physically disconnected  
from the device pins. Alert interrupt signal is latched and can only be cleared by reading  
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
10 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
the Alert Response byte from the Alert Response Address, which is a special slave  
address to the SMBus. The ALERT output cannot be reset by reading the device status  
register.  
The device was designed to accommodate the Alert interrupt detection capability of the  
SMBus.1 Basically, the SMBus provides Alert response interrupt pointers in order to  
identify the slave device which has caused the Alert interrupt. The 7-bit Alert response  
slave address is 0001 100 and the Alert response byte reflects the slave address of the  
device which has caused Alert interrupt. Bit assignments of the Alert response byte are  
listed in Table 9. The ALERT output will be reset to HIGH state upon reading the Alert  
response slave address unless the fault condition persists.  
Table 9.  
Bit  
Alert response (Alert response address 0001 100) bit description  
Symbol  
Description  
7 (MSB) ADD7  
indicate address B6 of alerted device  
indicate address B5 of alerted device  
indicate address B4 of alerted device  
indicate address B3 of alerted device  
indicate address B2 of alerted device  
indicate address B1 of alerted device  
indicate address B0 of alerted device  
logic 1  
6
ADD6  
ADD5  
ADD4  
ADD3  
ADD2  
ADD1  
1
5
4
3
2
1
0 (LSB)  
8.4 Power-up default condition  
Upon power-up reset (power is switched off-on), the NE1617A goes into this default  
condition:  
• Interrupt latch is cleared, the ALERT output is pulled HIGH by the external pull-up  
resistor.  
• The auto-conversion rate is at 0.25 Hz; conversion rate data is 02h.  
• Temperature limits for both channels are +127 C for high limit, and 55 C for low  
limit.  
• Command pointer register is set to ‘00’ for quickly reading the RIT.  
8.5 Fault detection  
The NE1617A has a fault detector to the diode connection. The connection is checked  
when a conversion is initiated and the proper flags are set if the fault condition has  
occurred.  
Table 10. Fault detection  
D+ and D  
opened  
ALERT output  
LOW  
RET data storage  
127 C  
Status set flag  
B2 and B4  
B4  
shorted  
LOW  
127 C  
1. The NE1617A implements the collision arbitration function per System Management Bus Specification Revision 1.1, dated  
December 11, 1998, which conforms to standard I2C-bus arbitration as described in NXP document UM10204, “I2C-bus  
specification and user manual”.  
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
11 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
8.6 SMBus interface  
The device can communicate over a standard 2-wire serial interface System Management  
Bus (SMBus) using the device pins SCLK and SDATA. The device employs four standard  
SMBus protocols: write byte, read byte, send byte and receive byte. Data formats of those  
protocols are shown in Figure 3 with following notifications:  
• The SMBus master initiates data transfer by establishing a START condition (S) and  
terminates data transfer by generating a STOP condition (P).  
• Data is sent over the serial bus in sequence of 9 clock pulses according to each 8-bit  
data byte followed by 1-bit status of the device acknowledgement.  
• The 7-bit slave address is equivalent to the selected address of the device.  
• The command byte is equivalent to the selected command of the device register.  
• The ‘send byte’ format is often used for the one-shot conversion command.  
• The ‘receive byte’ format is used for quicker transfer data from a device reading  
register that was previously selected by a read byte format.  
address  
ACK  
command  
ACK  
data  
ACK  
S
7 bits device address  
0
8 bits device register  
8 bits to register  
P
START condition  
acknowledged  
by device  
acknowledged  
by device  
acknowledged STOP  
by device condition  
002aad523  
R/W  
a. Write byte format (for writing data byte to the device register)  
address  
ACK  
command  
ACK  
address  
ACK  
data  
NACK  
S
7 bits device address  
0
8 bits device register  
S
7 bits device address  
1
8 bits from register  
P
acknowledged  
by device  
not STOP  
acknowledged condition  
START condition  
R/W acknowledged  
by device  
acknowledged (re)START  
condition  
R/W  
by device  
by controller  
002aad524  
b. Read byte format (for reading data byte from the device register)  
address  
ACK  
command  
ACK  
S
7 bits device address  
0
8 bits device register  
P
START condition  
acknowledged  
by device  
acknowledged STOP  
by device condition  
002aad525  
R/W  
c. Send byte format (for sending command without data, such as one-shot command)  
address  
ACK  
data  
NACK  
S
7 bits device address  
1
8 bits from register  
P
START condition  
acknowledged  
by device  
not STOP  
acknowledged condition  
R/W  
by controller  
002aad526  
d. Receive byte format (for continuously reading from device register)  
Fig 3. SMBus programming format  
NE1617A  
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Product data sheet  
Rev. 5 — 20 March 2012  
12 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
9. Application design-in information  
9.1 Factors affecting accuracy  
9.1.1 Remote sensing diode  
The NE1617A is designed to work with substrate transistors built into processors’ CPUs  
or with discrete transistors. Substrate transistors are generally PNP types with the  
collector connected to the substrate. Discrete types can be either a PNP or an NPN  
transistor connected as a diode (base shorted to collector). If an NPN transistor is used,  
the collector and base are connected to D+ and the emitter to D. If a PNP transistor is  
used, the collector and base are connected to Dand the emitter to D+. Substrate  
transistors are found in a number of CPUs. To reduce the error due to variations in these  
substrate and discrete transistors, a number of factors should be taken into consideration:  
• The ideality factor, nf, of the transistor. The ideality factor is a measure of the deviation  
of the thermal diode from the ideal behavior. The NE1617A is trimmed for an nf value  
of 1.008. Equation 2 can be used to calculate the error introduced at a temperature  
T C when using a transistor whose nf does not equal 1.008. Consult the processor  
data sheet for nf values.  
This value can be written to the offset register and is automatically added to or  
subtracted from the temperature measurement.  
nnatural – 1.008  
------------------------------------------  
T =  
 273.15 Kelvin + T  
(2)  
1.008  
• Some CPU manufacturers specify the high and low current levels of the substrate  
transistors. The Isource high current level of the NE1617A is 100 A and the low level  
current is 10 A.  
If a discrete transistor is being used with the NE1617A, the best accuracy is obtained by  
choosing devices according to the following criteria:  
• Base-emitter voltage greater than 0.25 V at 6 mA, at the highest operating  
temperature.  
• Base-emitter voltage less than 0.95 V at 100 mA, at the lowest operating temperature.  
• Base resistance less than 100 .  
• Small variation in hFE (say 50 to 150) that indicates tight control of VBE characteristics.  
Transistors such as 2N3904, 2N3906, or equivalents in SOT23 packages are suitable  
devices to use. See Table 11 for representative devices.  
NE1617A  
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Product data sheet  
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NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
Table 11. Representative diodes for temperature sensing  
Manufacturer Model number  
Rohm  
UMT3904  
Diodes Inc.  
MMBT3904-7  
MMBT3904  
Philips  
ST Micro  
MMBT3904  
ON Semiconductor  
Chenmko  
MMBT3904LT1  
MMBT3904  
Infineon Technologies  
Fairchild Semiconductor  
National Semiconductor  
SMBT3904E6327  
MMBT3904FSCT  
MMBT3904N623  
9.1.2 Thermal inertia and self-heating  
Accuracy depends on the temperature of the remote-sensing diode and/or the internal  
temperature sensor being at the same temperature as that being measured, and a  
number of factors can affect this. Ideally, the sensor should be in good thermal contact  
with the part of the system being measured, for example, the processor. If it is not, the  
thermal inertia caused by the mass of the sensor causes a lag in the response of the  
sensor to a temperature change. In the case of the remote sensor, this should not be a  
problem, since it is either a substrate transistor in the processor or a small package  
device, such as the SOT23, placed in close proximity to it.  
The on-chip sensor, however, is often remote from the processor and is only monitoring  
the general ambient temperature around the package. The thermal time constant of the  
SSOP16 package in still air is about 140 seconds, and if the ambient air temperature  
quickly changed by 100 C, it would take about 12 minutes (five time constants) for the  
junction temperature of the NE1617A to settle within 1 C of this. In practice, the  
NE1617A package is in electrical and therefore thermal contact with a printed-circuit  
board and can also be in a forced airflow. How accurately the temperature of the board  
and/or the forced airflow reflect the temperature to be measured also affects the accuracy.  
Self-heating due to the power dissipated in the NE1617A or the remote sensor causes the  
chip temperature of the device or remote sensor to rise above ambient. However, the  
current forced through the remote sensor is so small that self-heating is negligible. In the  
case of the NE1617A, the worst-case condition occurs when the device is converting at  
16 conversions per second while sinking the maximum current of 1 mA at the ALERT  
output. In this case, the total power dissipation in the device is about 11 mW. The thermal  
resistance, Rth(j-a), of the SSOP16 package is about 121 C/W.  
In practice, the package has electrical and therefore thermal connection to the printed  
circuit board, so the temperature rise due to self-heating is negligible.  
NE1617A  
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Product data sheet  
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NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
9.1.3 Layout considerations  
Digital boards can be electrically noisy environments, and the NE1617A is measuring very  
small voltages from the remote sensor, so care must be taken to minimize noise induced  
at the sensor inputs. The following precautions should be taken.  
1. Place the NE1617A as close as possible to the remote sensing diode. Provided that  
the worst noise sources, that is, clock generators, data/address buses, and CRTs, are  
avoided, this distance can be four to eight inches.  
2. Route the D+ and Dtracks close together, in parallel, with grounded guard tracks on  
each side. Provide a ground plane under the tracks if possible.  
3. Use wide tracks to minimize inductance and reduce noise pickup. 10 mil track  
minimum width and spacing is recommended (see Figure 4).  
4. Try to minimize the number of copper/solder joints, which can cause thermocouple  
effects. Where copper/solder joints are used, make sure that they are in both the D+  
and Dpath and at the same temperature.  
Thermocouple effects should not be a major problem since 1 C corresponds to about  
200 V and thermocouple voltages are about 3 V/C of temperature difference.  
Unless there are two thermocouples with a big temperature differential between them,  
thermocouple voltages should be much less than 200 V.  
5. Place a 0.1 F bypass capacitor close to the VDD pin. In very noisy environments,  
place a 1000 pF input filter capacitor across D+ and Dclose to the NE1617A.  
6. If the distance to the remote sensor is more than eight inches, the use of twisted pair  
cable is recommended. This works up to about six feet to 12 feet.  
7. For really long distances (up to 100 feet), use shielded twisted pair, such as  
Belden #8451 microphone cable. Connect the twisted pair to D+ and Dand the  
shield to GND close to the NE1617A. Leave the remote end of the shield  
unconnected to avoid ground loops.  
Because the measurement technique uses switched current sources, excessive cable  
and/or filter capacitance can affect the measurement. When using long cables, the filter  
capacitor can be reduced or removed.  
Cable resistance can also introduce errors. 1 resistance introduces about 1 C error.  
GND  
D+  
10 mil  
10 mil  
10 mil  
10 mil  
10 mil  
10 mil  
10 mil  
D−  
GND  
002aag953  
Fig 4. Typical arrangement of signal tracks  
NE1617A  
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Product data sheet  
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NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
9.2 Power sequencing considerations  
9.2.1 Power supply slew rate  
When powering-up the NE1617A, ensure that the slew rate of VDD is less than 18 mV/s.  
A slew rate larger than this may cause power-on reset issues and yield unpredictable  
results.  
9.2.2 Application circuit  
Figure 5 shows a typical application circuit for the NE1617A, using a discrete sensor  
transistor connected via a shielded, twisted pair cable. The pull-ups on SCLK, SDATA,  
and ALERT are required only if they are not already provided elsewhere in the system.  
The SCLK and SDATA pins of the NE1617A can be interfaced directly to the SMBus of an  
I/O controller, such as the Intel 820 chip set.  
0.1 μF  
V
DD  
2
15  
R
R
R
10 kΩ  
10 kΩ  
10 kΩ  
V
DD  
STBY  
NE1617A  
3
4
14  
12  
11  
D+  
SCLK  
clock  
data  
(1)  
C1  
2200 pF  
SDATA  
ALERT  
D−  
microcontroller  
interrupt  
remote sensor  
2N3904 (NPN),  
2N3906 (PNP)  
or similar stand-alone  
ASIC or processor  
thermal diode  
ADD0 ADD1 GND GND  
10  
6
7
8
002aad511  
(1) Typical value, placed close to temperature sensor.  
Fig 5. Typical application circuit  
NE1617A  
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Product data sheet  
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NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
10. Limiting values  
Table 12. Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol Parameter  
Conditions  
VDD to GND  
D+, ADD0, ADD1  
Dto GND  
Min  
0.3  
0.3  
0.3  
0.3  
1  
Max  
+6  
Unit  
V
VDD  
VI  
supply voltage  
input voltage  
VDD + 0.3  
+0.8  
+6  
V
V
SCLK, SDATA, ALERT, STBY  
SDATA  
V
II  
input current  
+50  
mA  
mA  
C  
C  
D  
-
1  
Tamb  
ambient temperature  
operating  
55  
-
+125  
+150  
Tj(max)  
maximum junction  
temperature  
Tstg  
storage temperature  
65  
+150  
C  
NE1617A  
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Product data sheet  
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NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
11. Characteristics  
Table 13. Characteristics  
VDD = 3.0 V to 3.6 V; Tamb = 0 C to +125 C; unless otherwise specified.  
Symbol Parameter  
Conditions  
Min  
Typ  
-
Max  
-
Unit  
C  
C  
C  
C  
C  
V
Tres  
temperature resolution  
1
-
Tacc(loc)  
local temperature accuracy  
Tamb = +60 C to +100 C  
Tamb = 0 C to +125 C  
< 1  
< 2  
-
2  
-
3  
Tacc(rem) remote temperature accuracy Tremote = +60 C to +100 C  
Tremote = 40 C to +125 C  
Vth(UVLO) undervoltage lockout threshold VDD supply[2]  
voltage[1]  
-
3  
-
-
5  
-
2.7  
2.95  
Vth(POR)  
power-on reset threshold  
voltage  
VDD supply (falling edge)[3]  
1.0  
-
2.5  
V
IDD(AV)  
average supply current  
conversion rate = 0.25 per second  
conversion rate = 2 per second  
SMBus inactive  
-
-
-
-
-
70  
A  
A  
A  
ms  
-
180  
10  
IDD(stb)  
tconv  
standby supply current  
conversion time  
3
-
from STOP bit to conversion  
complete; both channels  
170  
Ef(conv)  
Isource  
conversion rate error  
source current  
percentage error in programmed  
rate  
30  
-
+30  
%
remote sensor  
HIGH level  
LOW level  
-
-
-
100  
10  
-
-
-
A  
A  
A  
[4][5]  
Ibias  
bias current  
ADD0, ADD1; momentary as the  
address is being read  
160  
[1] The value of VDD below which the internal A/D converter is disabled. This is designed to be a minimum of 200 mV above the power-on  
reset. During the time that it is disabled, the temperature that is in the ‘read temperature registers’ will remain at the value that it was  
before the ADC was disabled. This is done to eliminate the possibility of reading unexpected false temperatures due to the A/D  
converter not working correctly due to low voltage. In case of power-up (rising VDD), the reading that is stored in the ‘read temperature  
registers’ will be the default value of 0 C. As soon as VDD has risen to the value of UVLO, the ADC will function correctly and normal  
temperatures will be read.  
[2]  
VDD (rising edge) voltage below which the ADC is disabled.  
[3] VDD (falling edge) voltage below which the logic is reset.  
[4] Address is read at power-up and at start of conversion for all conversions except the fastest rate.  
[5] Due to the bias current, any pull-up/pull-down resistors should be 2 k.  
NE1617A  
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Product data sheet  
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NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
Table 14. Characteristics  
VDD = 3.3 V; Tamb = 40 C to +125 C; unless otherwise specified.[1]  
Symbol Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
ADC and power supply  
[2]  
Tres  
temperature resolution  
local temperature accuracy[3]  
monotonicity guaranteed  
Tamb = +60 C to +100 C  
Tamb = 40 C to +125 C  
Tremote = +60 C to +100 C  
Tremote = 40 C to +125 C  
8
-
-
bits  
C  
C  
C  
C  
V
Tacc(loc)  
-
< 1  
2  
3  
3  
5  
5.5  
156  
-
< 2  
[4]  
[4]  
Tacc(rem) remote temperature  
accuracy[3]  
-
-
-
-
VDD  
tconv  
supply voltage  
conversion time  
3.0  
-
-
from STOP bit to conversion  
complete; both channels  
125  
ms  
Ef(conv)  
conversion rate error  
percentage error in programmed  
rate  
25  
-
+25  
%
SMBus interface  
VIH  
HIGH-level input voltage  
STBY, SCLK, SDATA  
VDD = 3 V  
2.2  
2.4  
-
-
-
-
-
V
V
V
VDD = 5.5 V  
-
VIL  
Isink  
ILOH  
II  
LOW-level input voltage  
sink current  
STBY, SCLK, SDATA;  
VDD = 3 V to 5.5 V  
0.8  
logic output LOW;  
ALERT, SDATA forced to 0.4 V  
6
-
-
-
-
mA  
A  
A  
HIGH-level output leakage  
current  
ALERT; forced to 5.5 V  
-
1
input current  
logic inputs forced to VDD or GND  
2  
+2  
[1] Specifications from 40 C to +125 C are guaranteed by design, not production tested.  
[2] Guaranteed but not 100 % tested.  
[3] Quantization error is not included in specifications for temperature accuracy. For example, if the NE1617A device temperature is exactly  
+66.7 C, the ADC may report +66 C, +67 C or +68 C (due to the quantization error plus the 0.5 C offset used for rounding up) and  
still be within the guaranteed 1 C error limits for the +60 C to +100 C temperature range.  
[4] Tremote is the junction temperature of the remote diode. See Section 7.1 “Temperature measurement” for remote diode forward voltage  
requirements.  
NE1617A  
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Product data sheet  
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NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
Table 15. SMBus interface dynamic characteristics[1]  
VDD = 3.0 V to 3.6 V; Tamb = 0 C to +125 C; unless otherwise specified.[2]  
Symbol  
VIH  
Parameter  
Conditions  
Min  
2.2  
-
Typ  
Max  
Unit  
V
HIGH-level input voltage  
LOW-level input voltage  
logic output LOW sink current  
STBY, SCLK, SDATA  
STBY, SCLK, SDATA  
ALERT; VOL = 0.4 V  
SDATA; VOL = 0.6 V  
VI = VDD  
-
-
VIL  
-
0.8  
V
IOL  
1.0  
6.0  
1  
1  
-
-
-
mA  
mA  
A  
A  
pF  
kHz  
s  
-
-
IIH  
HIGH-level input current  
LOW-level input current  
input capacitance  
-
+1  
IIL  
VI = GND  
-
+1  
Ci  
SCLK, SDATA  
5
-
fSCLK  
tLOW  
tHIGH  
tBUF  
SCLK operating frequency  
SCLK LOW time  
0
-
100  
4.7  
4.0  
4.7  
5.0  
5.0  
-
-
-
-
SCLK HIGH time  
s  
bus free time between a STOP from SDATA STOP  
s  
and START condition  
to SDATA START  
tHD;STA  
tHD;DAT  
tSU;DAT  
tSU;STA  
tSU;STO  
tf  
hold time (repeated) START  
condition  
from SDATA START to first SCLK  
HIGH-to-LOW transition  
4.0  
0
-
-
-
-
-
-
-
s  
ns  
ns  
ns  
s  
s  
data hold time  
from SCLK HIGH-to-LOW transition  
to SDATA edges  
-
data set-up time  
from SDATA edges  
to SCLK LOW-to-HIGH transition  
250  
250  
4.0  
-
-
set-up time for a repeated  
START condition  
from SCLK LOW-to-HIGH transition  
to restart SDATA  
-
set-up time for STOP condition from SCLK LOW-to-HIGH transition  
to SDATA STOP condition  
-
fall time  
SCLK and SDATA signals  
1.0  
[1] The NE1617A does not include the SMBus time-out capability (tLOW;SEXT and tLOW;MEXT).  
[2] Device operation between 3.0 V and 5.5 V is allowed, but parameters may be outside the limit shown in this table.  
t
t
t
HD;STA  
t
r
f
LOW  
SCLK  
t
t
t
t
SU;STO  
HD;STA  
HIGH  
SU;STA  
t
t
SU;DAT  
HD;DAT  
SDATA  
t
BUF  
P
S
S
P
002aae777  
Fig 6. Timing measurements  
NE1617A  
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Product data sheet  
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NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
11.1 Typical performance curves  
002aab749  
002aab747  
20  
temp.  
6
temp.  
error  
(°C)  
error  
(°C)  
10  
2
−2  
−6  
D+ to GND  
0
−10  
−20  
D+ to V  
DD  
2
2
3
4
1
10  
10  
1
10  
10  
10  
10  
leakage resistance (MΩ)  
f (kHz)  
VI = 100 mVpp and AC-coupled to D  
Fig 7. Temperature error versus printed-circuit board  
leakage resistance  
Fig 8. Temperature error versus common-mode  
noise frequency  
002aab748  
002aab750  
6
10  
temp.  
error  
(°C)  
temp.  
error  
(°C)  
2
−2  
−6  
0
−10  
−20  
2
3
4
1
10  
10  
10  
10  
0
40  
80  
120  
f (kHz)  
D+ to D− capacitance (nF)  
VI = 100 mVpp and AC-coupled to Dand D+  
Fig 9. Temperature error versus differential mode  
noise frequency  
Fig 10. Temperature error versus D+ to D  
capacitance  
NE1617A  
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Product data sheet  
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NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
002aad517  
002aad518  
100  
130  
I
DD(stb)  
(μA)  
I
DD  
(μA)  
80  
60  
40  
20  
0
110  
90  
70  
50  
2
3
−2  
−1  
10  
1
10  
10  
10  
10  
1
10  
f
(kHz)  
conversion rate (kHz)  
SCLK  
Fig 11. Standby supply current versus clock  
frequency at VDD = 3.3 V  
Fig 12. Operating supply current versus conversion  
rate at VDD = 3.3 V  
002aad519  
150  
temperature  
(°C)  
100  
50  
0
0
2
6
10  
time (s)  
Fig 13. Response to thermal shock immersed in +115 C fluorinert bath  
NE1617A  
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Product data sheet  
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NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
12. Package outline  
SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm  
SOT519-1  
D
E
A
X
c
y
H
v
M
A
E
Z
9
16  
A
2
A
(A )  
3
A
1
θ
L
p
L
8
1
detail X  
w M  
e
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
v
w
y
Z
θ
p
p
1
2
3
E
max.  
8o  
0o  
0.25  
0.10  
1.55  
1.40  
0.31  
0.20  
0.25  
0.18  
5.0  
4.8  
4.0  
3.8  
6.2  
5.8  
0.89  
0.41  
0.18  
0.05  
mm  
1.73  
0.25  
0.635  
1
0.2  
0.18  
0.09  
Note  
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-05-04  
03-02-18  
SOT519-1  
Fig 14. Package outline SOT519-1 (SSOP16)  
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
23 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
13. Soldering of SMD packages  
This text provides a very brief insight into a complex technology. A more in-depth account  
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow  
soldering description”.  
13.1 Introduction to soldering  
Soldering is one of the most common methods through which packages are attached to  
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both  
the mechanical and the electrical connection. There is no single soldering method that is  
ideal for all IC packages. Wave soldering is often preferred when through-hole and  
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not  
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high  
densities that come with increased miniaturization.  
13.2 Wave and reflow soldering  
Wave soldering is a joining technology in which the joints are made by solder coming from  
a standing wave of liquid solder. The wave soldering process is suitable for the following:  
• Through-hole components  
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board  
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless  
packages which have solder lands underneath the body, cannot be wave soldered. Also,  
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,  
due to an increased probability of bridging.  
The reflow soldering process involves applying solder paste to a board, followed by  
component placement and exposure to a temperature profile. Leaded packages,  
packages with solder balls, and leadless packages are all reflow solderable.  
Key characteristics in both wave and reflow soldering are:  
• Board specifications, including the board finish, solder masks and vias  
• Package footprints, including solder thieves and orientation  
• The moisture sensitivity level of the packages  
• Package placement  
• Inspection and repair  
• Lead-free soldering versus SnPb soldering  
13.3 Wave soldering  
Key characteristics in wave soldering are:  
• Process issues, such as application of adhesive and flux, clinching of leads, board  
transport, the solder wave parameters, and the time during which components are  
exposed to the wave  
• Solder bath specifications, including temperature and impurities  
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
24 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
13.4 Reflow soldering  
Key characteristics in reflow soldering are:  
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to  
higher minimum peak temperatures (see Figure 15) than a SnPb process, thus  
reducing the process window  
• Solder paste printing issues including smearing, release, and adjusting the process  
window for a mix of large and small components on one board  
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is  
heated to the peak temperature) and cooling down. It is imperative that the peak  
temperature is high enough for the solder to make reliable solder joints (a solder paste  
characteristic). In addition, the peak temperature must be low enough that the  
packages and/or boards are not damaged. The peak temperature of the package  
depends on package thickness and volume and is classified in accordance with  
Table 16 and 17  
Table 16. SnPb eutectic process (from J-STD-020C)  
Package thickness (mm) Package reflow temperature (C)  
Volume (mm3)  
< 350  
235  
350  
220  
< 2.5  
2.5  
220  
220  
Table 17. Lead-free process (from J-STD-020C)  
Package thickness (mm) Package reflow temperature (C)  
Volume (mm3)  
< 350  
260  
350 to 2000  
> 2000  
260  
< 1.6  
260  
250  
245  
1.6 to 2.5  
> 2.5  
260  
245  
250  
245  
Moisture sensitivity precautions, as indicated on the packing, must be respected at all  
times.  
Studies have shown that small packages reach higher temperatures during reflow  
soldering, see Figure 15.  
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
25 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
maximum peak temperature  
= MSL limit, damage level  
temperature  
minimum peak temperature  
= minimum soldering temperature  
peak  
temperature  
time  
001aac844  
MSL: Moisture Sensitivity Level  
Fig 15. Temperature profiles for large and small components  
For further information on temperature profiles, refer to Application Note AN10365  
“Surface mount reflow soldering description”.  
14. Abbreviations  
Table 18. Abbreviations  
Acronym  
A/D  
Description  
Analog-to-Digital  
ADC  
CDM  
CPU  
CRT  
Analog-to-Digital Converter  
Charged-Device Model  
Central Processing Unit  
Cathode Ray Tube  
ESD  
ElectroStatic Discharge  
HBM  
LSB  
Human Body Model  
Least Significant Bit  
MM  
Machine Model  
MSB  
NPN  
PCB  
Most Significant Bit  
bipolar transistor with N-type emitter and collector and a P-type base  
Printed-Circuit Board  
PNP  
bipolar transistor with P-type emitter and collector and an N-type base  
Power-On Reset  
POR  
SMBus  
UVLO  
System Management Bus  
UnderVoltage LockOut  
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
26 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
15. Revision history  
Table 19. Revision history  
Document ID  
NE1617A v.5  
Modifications:  
Release date  
Data sheet status  
Change notice  
Supersedes  
20120320  
Product data sheet  
-
NE1617A v.4  
• Section 2 “Features and benefits”, 11th bullet item: deleted phrase “250 V MM per JESD22-A115”  
• Section 7.1 “Temperature measurement”:  
–
–
–
–
section is renamed from “Section 7.1 “Remote diode selection”  
updated Equation 1  
added definition of ‘n’, non-ideality  
third paragraph: appended “and also the non-ideality factor ‘n’ must be close to the value of  
1.008 to be compatible with the Intel Pentium III internal thermal diode that the NE1617A was  
designed to work with” to end of third sentence.  
• Section 9.1 “How do D+, D- work?” deleted.  
• Section 9.2 “What is the difference using diode and transistor?” deleted.  
• Section 9.3 “How is error reduced when necessary to use a wire instead of the PCB trace?”  
deleted.  
• Section 9 “Application design-in information” is re-written.  
• Section 14 “Mounting” deleted.  
NE1617A v.4  
20090730  
Product data sheet  
-
NE1617A v.3  
NE1617A v.2  
NE1617A v.3  
20041005  
Product data sheet  
-
(9397 750 14162)  
NE1617A v.2  
(9397 750 09273)  
20011214  
20000713  
Product specification  
Product specification  
ECN 853-2203 27461 NE1617A v.1  
of 14 Dec 2001  
NE1617A v.1  
(9397 750 07322)  
ECN 853-2203 24123  
of 13 Jul 2000  
-
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
27 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
16. Legal information  
16.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
Suitability for use — NXP Semiconductors products are not designed,  
16.2 Definitions  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
16.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
28 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
16.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
17. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
NE1617A  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 5 — 20 March 2012  
29 of 30  
NE1617A  
NXP Semiconductors  
Temperature monitor for microprocessor systems  
18. Contents  
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1  
14  
15  
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 26  
Revision history . . . . . . . . . . . . . . . . . . . . . . . 27  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
16  
Legal information . . . . . . . . . . . . . . . . . . . . . . 28  
Data sheet status. . . . . . . . . . . . . . . . . . . . . . 28  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
16.1  
16.2  
16.3  
16.4  
6
6.1  
6.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4  
17  
18  
Contact information . . . . . . . . . . . . . . . . . . . . 29  
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
7
Functional description . . . . . . . . . . . . . . . . . . . 5  
Temperature measurement . . . . . . . . . . . . . . . 5  
No calibration is required . . . . . . . . . . . . . . . . . 6  
Address logic . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
7.1  
7.2  
7.3  
8
Temperature monitor with SMBus serial  
interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Serial bus interface. . . . . . . . . . . . . . . . . . . . . . 6  
Slave address. . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Low power standby modes. . . . . . . . . . . . . . . . 8  
Configuration register . . . . . . . . . . . . . . . . . . . . 8  
External and internal temperature registers . . . 8  
Conversion rate register . . . . . . . . . . . . . . . . . . 9  
Temperature limit registers . . . . . . . . . . . . . . . . 9  
One-shot command . . . . . . . . . . . . . . . . . . . . 10  
Status register. . . . . . . . . . . . . . . . . . . . . . . . . 10  
Alert interrupt . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Power-up default condition. . . . . . . . . . . . . . . 11  
Fault detection . . . . . . . . . . . . . . . . . . . . . . . . 11  
SMBus interface . . . . . . . . . . . . . . . . . . . . . . . 12  
8.1  
8.2  
8.3  
8.3.1  
8.3.2  
8.3.3  
8.3.4  
8.3.5  
8.3.6  
8.3.7  
8.3.8  
8.4  
8.5  
8.6  
9
9.1  
Application design-in information . . . . . . . . . 13  
Factors affecting accuracy . . . . . . . . . . . . . . . 13  
Remote sensing diode . . . . . . . . . . . . . . . . . . 13  
Thermal inertia and self-heating . . . . . . . . . . . 14  
Layout considerations. . . . . . . . . . . . . . . . . . . 15  
Power sequencing considerations . . . . . . . . . 16  
Power supply slew rate. . . . . . . . . . . . . . . . . . 16  
Application circuit . . . . . . . . . . . . . . . . . . . . . . 16  
9.1.1  
9.1.2  
9.1.3  
9.2  
9.2.1  
9.2.2  
10  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 18  
Typical performance curves . . . . . . . . . . . . . . 21  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23  
11  
11.1  
12  
13  
Soldering of SMD packages . . . . . . . . . . . . . . 24  
Introduction to soldering . . . . . . . . . . . . . . . . . 24  
Wave and reflow soldering . . . . . . . . . . . . . . . 24  
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 24  
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 25  
13.1  
13.2  
13.3  
13.4  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2012.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 20 March 2012  
Document identifier: NE1617A  

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