935279199112 [NXP]
LIQUID CRYSTAL DISPLAY DRIVER, PDSO40, PLASTIC, SOT158-1, VSOP-40;
| 型号： | 935279199112 |
| 厂家： | 
NXP |
| 描述： | LIQUID CRYSTAL DISPLAY DRIVER, PDSO40, PLASTIC, SOT158-1, VSOP-40 驱动 光电二极管 接口集成电路 |
| 文件： | 总24页 (文件大小：141K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
PCF21xxC family
LCD drivers
1997 Mar 28
Product specification
Supersedes data of 1995 May 03
File under Integrated Circuits, IC12
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
CONTENTS
1
2
3
4
5
6
FEATURES
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAMS
PINNING
6.1
6.2
6.3
PCF2100C
PCF2111C
PCF2112C
7
FUNCTIONAL DESCRIPTION
7.1
7.2
7.3
7.4
7.5
7.6
7.7
PCF2100C
PCF2111C
PCF2112C
Bus control logic
Timing
Input circuitry
Expansion
8
LIMITING VALUES
HANDLING
9
10
11
12
13
DC CHARACTERISTICS
AC CHARACTERISTICS
PACKAGE OUTLINES
SOLDERING
13.1
Plastic dual in-line packages
By dip or wave
Repairing soldered joints
Plastic small outline packages
By wave
By solder paste reflow
Repairing soldered joints (by hand-held
soldering iron or pulse-heated solder tool)
13.1.1
13.1.2
13.2
13.2.1
13.2.2
13.2.3
14
15
DEFINITIONS
LIFE SUPPORT APPLICATIONS
1997 Mar 28
2
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
1
FEATURES
2
GENERAL DESCRIPTION
• Supply voltage 2.25 to 6.0 V
• Low current consumption
• Serial data input
The PCF21xxC family are single-chip, silicon gate CMOS
LCD driver circuits. A 3-line bus (CBUS) structure enables
serial data transfer with microcontrollers. All inputs are
CMOS/NMOS compatible.
• CBUS control
The devices have the same function and performance as
those of the PCF21xx family, which they supersede.
The maximum operating voltage required is reduced from
6.5 to 6.0 V.
• One-point built-in oscillator
• Stand-alone or expanded system
• Power-on reset clear
• LCD segments
– 40 (PCF2100C)
– 64 (PCF2111C)
– 32 (PCF2112C)
• Multiplex rate
– 1 : 2 (PCF2100C)
– 1 : 2 (PCF2111C)
– 1 : 1 (PCF2112C)
• Word length
– 22 bits (PCF2100C)
– 34 bits (PCF2111C)
– 34 bits (PCF2112C).
3
QUICK REFERENCE DATA
SYMBOL
VDD
IDD1
IDD2
PARAMETER
CONDITIONS
MIN.
2.25
−
TYP. MAX. UNIT
supply voltage
supply current 1
supply current 2
−
6.0
50
30
V
outputs open; CBUS inactive
20
20
µA
µA
outputs open; CBUS inactive;
−
Tamb = 25 °C
PO
power dissipation per output
operating ambient temperature
storage temperature
−
−
−
−
100
+85
mW
Tamb
Tstg
−40
−65
°C
+150 °C
4
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
DESCRIPTION
VERSION
PCF2100CP
PCF2100CT
PCF2111CP
PCF2111CT
PCF2112CP
PCF2112CT
DIP28
SO28
plastic dual in-line package; 28 leads (600 mil)
SOT117-1
SOT136-1
SOT129-1
SOT158-1
SOT129-1
SOT158-1
plastic small outline package; 28 leads; body width 7.5 mm
plastic dual in-line package; 40 leads (600 mil)
plastic very small outline package; 40 leads
plastic dual in-line package; 40 leads (600 mil)
plastic very small outline package; 40 leads
DIP40
VSO40
DIP40
VSO40
1997 Mar 28
3
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
5
BLOCK DIAGRAMS
40-SEGMENT LCD
BP1
26
BP2
25
S1 to S20
24 to 5
ANALOG
VOLTAGE
BACKPLANE AND SEGMENT DRIVERS
A
V
DD
2
3
680
C
28
1
DLEN
CLB
O
pF
OSCILLATOR
AND
DIVIDER
LATCHES
BUS
AND
CONTROL
B
OSC
27
DRIVER CONTROL
DATA
R
O
1 MΩ
PCF2100C
4
SHIFT
REGISTER
V
SS
MLD286
Fig.1 Block diagram; PCF2100C.
64-SEGMENT LCD
BP1
38
BP2
37
S1 to S32
36 to 5
ANALOG
VOLTAGE
BACKPLANE AND SEGMENT DRIVERS
A
V
DD
2
3
680
pF
40
1
C
DLEN
O
OSCILLATOR
AND
DIVIDER
LATCHES
BUS
CLB
AND
CONTROL
B
OSC
39
DRIVER CONTROL
DATA
R
O
1 MΩ
PCF2111C
4
SHIFT
REGISTER
V
SS
MLD285
Fig.2 Block diagram; PCF2111C.
4
1997 Mar 28
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
32-SEGMENT LCD
BP
38
S1 to S32
36 to 5
ANALOG
VOLTAGE
BACKPLANE AND SEGMENT DRIVERS
V
DD
2
3
1.5
nF
40
1
C
DLEN
O
OSCILLATOR
AND
DIVIDER
LATCHES
BUS
CLB
AND
CONTROL
OSC
39
DRIVER CONTROL
DATA
R
O
1 MΩ
PCF2112C
4
SHIFT
REGISTER
V
SS
MLD287
Fig.3 Block diagram; PCF2112C.
1997 Mar 28
5
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
6
PINNING
PCF2100C
6.1
SYMBOL PIN
DESCRIPTION
clock burst input (CBUS)
supply voltage
CLB
VDD
OSC
VSS
S20
S19
S18
S17
S16
S15
S14
S13
S12
S11
S10
S9
1
2
3
4
5
6
7
8
9
oscillator input
supply voltage ground
LCD driver output 20
LCD driver output 19
LCD driver output 18
LCD driver output 17
LCD driver output 16
handbook, halfpage
CLB
1
2
28 DLEN
V
27
26
25
DATA
BP1
DD
3
OSC
4
V
BP2
SS
S20
S19
S18
S17
S16
S15
S14
5
24 S1
10 LCD driver output 15
11 LCD driver output 14
12 LCD driver output 13
13 LCD driver output 12
14 LCD driver output 11
15 LCD driver output 10
16 LCD driver output 9
17 LCD driver output 8
18 LCD driver output 7
19 LCD driver output 6
20 LCD driver output 5
21 LCD driver output 4
22 LCD driver output 3
23 LCD driver output 2
24 LCD driver output 1
25 backplane driver output 2
26 backplane driver output 1
27 data input line (CBUS)
28 data input line enable (CBUS)
6
23
22
S2
S3
7
PCF2100C
8
21 S4
9
20
19
18
S5
S6
S7
10
11
S8
S13 12
S12 13
17 S8
16 S9
S7
S6
S5
14
15
S10
S11
S4
MLD295
S3
S2
S1
BP2
BP1
DATA
DLEN
Fig.4 Pin configuration; SOT117-1 and SOT136-1.
1997 Mar 28
6
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
6.2
PCF2111C
SYMBOL PIN
DESCRIPTION
CLB
VDD
OSC
VSS
S32
S31
S30
S29
S28
S27
S26
S25
S24
S23
S22
S21
S20
S19
S18
S17
S16
S15
S14
S13
S12
S11
S10
S9
1
2
3
4
5
6
7
8
9
clock burst input (CBUS)
supply voltage
oscillator input
supply voltage ground
LCD driver output 32
LCD driver output 31
LCD driver output 30
LCD driver output 29
LCD driver output 28
handbook, halfpage
1
2
40
39
38
37
36
35
CLB
DLEN
V
DD
DATA
BP1
3
OSC
10 LCD driver output 27
11 LCD driver output 26
12 LCD driver output 25
13 LCD driver output 24
14 LCD driver output 23
15 LCD driver output 22
16 LCD driver output 21
17 LCD driver output 20
18 LCD driver output 19
19 LCD driver output 18
20 LCD driver output 17
21 LCD driver output 16
22 LCD driver output 15
23 LCD driver output 14
24 LCD driver output 13
25 LCD driver output 12
26 LCD driver output 11
27 LCD driver output 10
28 LCD driver output 9
29 LCD driver output 8
30 LCD driver output 7
31 LCD driver output 6
32 LCD driver output 5
33 LCD driver output 4
34 LCD driver output 3
35 LCD driver output 2
36 LCD driver output 1
37 backplane driver output 2
38 backplane driver output 1
39 data input line (CBUS)
40 data input line enable (CBUS)
V
4
SS
BP2
S1
S32
S31
S30
S29
S28
S27
S26
5
S2
6
7
34 S3
33 S4
8
9
32
31
30
S5
S6
S7
10
11
PCF2111C
S25 12
S24 13
29 S8
28 S9
S23
S22
S10
14
15
27
26
S11
S21 16
S20 17
S19 18
25 S12
24 S13
23 S14
S18
S15
19
S17 20
22
21 S16
S8
S7
MLD291
S6
S5
S4
S3
S2
S1
BP2
BP1
DATA
DLEN
Fig.5 Pin configuration; SOT129-1 and SOT158-1.
1997 Mar 28
7
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
6.3
PCF2112C
SYMBOL PIN
DESCRIPTION
CLB
VDD
OSC
VSS
S32
S31
S30
S29
S28
S27
S26
S25
S24
S23
S22
S21
S20
S19
S18
S17
S16
S15
S14
S13
S12
S11
S10
S9
1
2
3
4
5
6
7
8
9
clock burst input (CBUS)
supply voltage
oscillator input
supply voltage ground
LCD driver output 32
LCD driver output 31
LCD driver output 30
LCD driver output 29
LCD driver output 28
handbook, halfpage
1
2
40
39
38
37
36
35
CLB
DLEN
V
DD
DATA
BP
3
OSC
10 LCD driver output 27
11 LCD driver output 26
12 LCD driver output 25
13 LCD driver output 24
14 LCD driver output 23
15 LCD driver output 22
16 LCD driver output 21
17 LCD driver output 20
18 LCD driver output 19
19 LCD driver output 18
20 LCD driver output 17
21 LCD driver output 16
22 LCD driver output 15
23 LCD driver output 14
24 LCD driver output 13
25 LCD driver output 12
26 LCD driver output 11
27 LCD driver output 10
28 LCD driver output 9
29 LCD driver output 8
30 LCD driver output 7
31 LCD driver output 6
32 LCD driver output 5
33 LCD driver output 4
34 LCD driver output 3
35 LCD driver output 2
36 LCD driver output 1
37 not connected
V
4
SS
n.c.
S1
S32
S31
S30
S29
S28
S27
S26
5
S2
6
7
34 S3
33 S4
8
9
32
31
30
S5
S6
S7
10
11
PCF2112C
S25 12
S24 13
29 S8
28 S9
S23
S22
S10
14
15
27
26
S11
S21 16
S20 17
S19 18
25 S12
24 S13
23 S14
S18
S15
19
S17 20
22
21 S16
S8
S7
MLD292
S6
S5
S4
S3
S2
S1
n.c.
BP
38 backplane driver output
39 data input line (CBUS)
40 data input line enable (CBUS)
DATA
DLEN
Fig.6 Pin configuration; SOT129-1 and SOT158-1.
1997 Mar 28
8
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
7
FUNCTIONAL DESCRIPTION
7.3
PCF2112C
An LCD segment or LED output is activated when the
corresponding DATA bit is HIGH.
When DATA bit 33 is HIGH, the latches are loaded.
CLB pulse 35 transfers data from the shift register to the
selected latches.
7.1
PCF2100C
7.4
Bus control logic
When DATA bit 21 is HIGH, the A-latches (BP1) are
loaded. With DATA bit 21 LOW, the B-latches (BP2) are
loaded. CLB pulse 23 transfers data from the shift register
to the selected latches.
The following tests are carried out by the bus control logic:
1. Test on leading zero
2. Test on number of DATA bits
3. Test of disturbed DLEN and DATA signals during
transmission.
7.2
PCF2111C
When DATA bit 33 is HIGH, the A-latches (BP1) are
loaded. With DATA bit 33 LOW, the B-latches (BP2) are
loaded. CLB pulse 35 transfers data from the shift register
to the selected latches.
If one of the test conditions is not fulfilled, no action follows
the load condition (load pulse with DLEN LOW) and the
driver is ready to receive new data.
DLEN
CLB
1
2
3
4
5
6
7
8
32
20
33
21
34
22
35
23
PCF2111C and PCF2112C
PCF2100C
test leading zero
load pulse
DATA
bit number
output
0
1
S1
2
S2
3
S3
4
S4
5
S5
6
S6
7
S7
31
32
33
PCF2111C and PCF2112C
S31 S32
1
S1
2
S2
3
S3
4
S4
5
S5
6
S6
7
S7
19
20
21
load bit
PCF2100C
S19 S20
leading zero
MLD296
Fig.7 CBUS data format.
1997 Mar 28
9
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
7.5
Timing
OFF / OFF
ON / OFF
OFF / ON
ON / ON
V
DD
0.5 (V
V
)
)
BP1
BP2
SX
DD
SS
V
SS
V
DD
0.5 (V
V
DD
SS
V
SS
V
DD
V
SS
V
V
SS
DD
0.5 (V
V
)
)
DD
SS
0
BP1 SX
0.5 (V
DD
V
SS
(V
DD
V
)
SS
V
V
SS
DD
0.5 (V
V
)
)
DD
SS
0
BP2 SX
0.5 (V
V
SS
DD
(V
DD
V
)
SS
1
f
MLD294
LCD
Fig.8 Timing diagram for PCF2100C and PCF2111C.
handbook, halfpage
V
OFF
ON
DD
BP
V
SS
V
DD
Segment X
(SX)
V
SS
V
V
SS
DD
0
BP SX
(V
DD
V
)
SS
1
MLD299
f
LCD
Fig.9 Timing diagram for PCF2112C.
10
1997 Mar 28
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
7.6
Input circuitry
BUS DRIVER
PCF21XXC
handbook, halfpage
V
V
V
DD2
DD
R
100 kΩ
V
SS
SS
MLD284
VSS line is common. In systems where it is expected that VDD2 > VDD1 + 0.5 V, a resistor should be inserted to reduce the current flowing through the
input protection. Maximum input current ≤40 µA.
Fig.10 Input circuitry.
7.7
Expansion
LCD
BP1
BP2
S1 to S32
V
BP1
BP2
S1 to S32
OSC
BP1
BP2
S1 to S32
OSC
DD
DLEN
CLB
DLEN
CLB
DLEN
CLB
OSC
PCF2111C
MASTER
PCF2111C
SLAVE1
PCF2111C
SLAVE1
DATA
DATA
DATA
V
V
V
SS
SS
SS
DATA
CLB
DLEN1
DLEN2
DLEN3
MLD293
By connecting OSC to VSS the BP pins become inputs and generate signals synchronized to the single oscillator frequency, thus allowing expansion of
several members of the PCF21xxC family up to the BP drive capability of the master. The PCF2112C can only function as a master for other PCF2112Cs.
Fig.11 Expansion possibility (using PCF2111C).
1997 Mar 28
11
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
8
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
−0.5
MAX.
+8.0
UNIT
VDD
VI
supply voltage
V
input voltage DLEN, CLB, DATA and OSC
output voltage BP1, BP2 and S1 to S32
supply current
V
SS − 0.5 VDD + 0.5 V
SS − 0.5 VDD + 0.5 V
VO
V
IDD, ISS
II
−50
−20
−25
−
+50
+20
+25
500
100
+150
mA
DC input current
mA
mA
mW
mW
°C
IO
DC output current
Ptot
PO
total power dissipation per package
power dissipation per output
storage temperature
note 1
−
Tstg
−65
Note
1. Derate by 7.7 mW/K when Tamb > 60 °C.
9
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices. See “Handling MOS devices”.
ESD in accordance with “MIL STD 883C, Method 3015”.
1997 Mar 28
12
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
10 DC CHARACTERISTICS
VDD = 2.25 to 6.0 V; VSS = 0 V; Tamb = −40 to +80 °C; RO = 1 MΩ; CO = 680 pF; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VDD
supply voltage
2.25
−
6.0
V
IDD
supply current
note 1; see Fig.13
−
−
20
20
50
30
µA
µA
note 1; Tamb = 25 °C;
see Fig.13
VPOR
power-on reset voltage level
note 2
−
1.0
1.6
V
Inputs CLB, DATA and DLEN
VIL
VIH
ILI
LOW level input voltage
HIGH level input voltage
input leakage current
input capacitance
−
−
−
−
−
0.8
−
V
2.0
−
V
VI = VSS or VDD
note 3
±1
10
µA
pF
Ci
−
Input OSC
Iosc
oscillator start-up current
VI = VSS
0.5
1.2
5.0
µA
LCD outputs
VBP
DC voltage of backplane drivers
−
−
−
±20
0.5
1
−
mV
kΩ
kΩ
ZO(BP)
ZO(S)
backplane driver output impedance
segment driver output impedance
note 4; VDD = 5 V
note 4; VDD = 5 V
5.0
7
Notes
1. Outputs open; CBUS inactive.
2. Resets all logic, when VDD < VPOR
.
3. Periodically sampled (not 100% tested).
4. Outputs measured one at a time.
1997 Mar 28
13
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
11 AC CHARACTERISTICS
VDD = 2.25 to 6.0 V; VSS = 0 V; Tamb = −40 to +80 °C; RO = 1 MΩ; CO = 680 pF; all timing values are referenced to VIH
and VIL levels with an input voltage swing of VSS to VDD; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS
Inputs CLB, DATA and DLEN (see Fig.12)
MIN.
TYP.
MAX.
UNIT
tSUDA
tHDDA
tSUEN
tSUDI
tSULD
tBUSY
tWH
data set-up time
data hold time
enable set-up time
disable set-up time
load pulse set-up time
busy time
3
3
1
2
−
−
−
−
−
−
−
−
−
−
−
−
µs
−
µs
µs
µs
µs
µs
µs
µs
µs
µs
µs
−
−
2.5
3
−
−
CLB HIGH time
CLB LOW time
CLB cycle time
rise time
1
−
tWL
5
−
tCLB
tr
10
−
−
10
10
tf
fall time
−
LCD timing (see Figs. 12, 14, 15, 16 and 17)
fLCD
LCD frame frequency
PCF2100C, PCF2111C
PCF2112C
60
30
−
75
35
20
20
100
50
Hz
Hz
µs
µs
CO = 1.5 nF
tBS
transfer time with test loads
driver delay time with test loads
VDD = 5 V
VDD = 5 V
100
100
tPLCD
−
1997 Mar 28
14
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
LM2D97
a n d u l l p a g e w i d t h
1997 Mar 28
15
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
MLD283
MLD282
20
80
handbook, halfpage
handbook, halfpage
f
LCD
(Hz)
(1)
I
DD
(µA)
(2)
78
(1)
(3)
(2)
(3)
16
typ
typ
76
74
12
72
8
70
0
0
2
4
6
8
(V)
2
4
6
8
V
DD
V
(V)
DD
(1) Tamb = −40 °c.
(2) Tamb = +85 °c.
(3) Tamb = +25 °c.
(1) Tamb = −40 °c.
(2) Tamb = +25 °c.
(3) Tamb = +85 °c.
Fig.13 Supply current as a function of supply
voltage.
Fig.14 Display frequency as a function of supply
voltage; CO = 680 pF (except PCF2112C).
MLD281
MLD289
3
10
37
handbook, halfpage
handbook, halfpage
f
LCD
(Hz)
f
(1)
LCD
36
(Hz)
(2)
(2)
typ
typ
(1)
2
35
10
(3)
34
33
10
10
0
2
4
6
8
1
1
C
(nF)
10
V
(V)
O
DD
(1) Tamb = −40 °c.
(2) Tamb = +25 °c.
(3) Tamb = +85 °c.
(1) RO = 1 MΩ.
(2) RO = 100 kΩ.
Fig.15 Display frequency as a function of supply
voltage; CO = 1.5 nF (only PCF2112C).
Fig.16 Display frequency as a function of RO and
CO; Tamb = 25 °C; VDD = 5 V.
1997 Mar 28
16
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
MLD288
2
handbook, halfpage
R
O
(kΩ)
handbook, halfpage
BP (PCF2112C), BP1, BP2
1.5
I
I
= 25 µA
= 15 µA
L
L
typ
1
S1 to S32
(1)
(2)
R
S
(3)
(1)
(2)
(3)
0.5
R
BP
MLD298
0
0
2
4
6
8
V
(V)
DD
(1) Tamb = +85 °c.
(2) Tamb = +25 °c.
(3) Tamb = −40 °c.
Fig.18 Output resistance of backplane and
segments.
Fig.17 Test loads.
MLD290
18
handbook, halfpage
I
OL
(1)
(2)
(mA)
16
typ
14
12
(3)
10
8
0
2
4
6
8
V
(V)
DD
(1) Tamb = −40 °c.
(2) Tamb = +25 °c.
(3) Tamb = +85 °c.
Fig.19 LOW level output current as a function of
supply voltage (only PCF2112C).
1997 Mar 28
17
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
12 PACKAGE OUTLINES
handbook, full pagewidth
DIP28: plastic dual in-line package; 28 leads (600 mil)
SOT117-1
D
M
E
A
2
A
L
A
1
c
e
w M
Z
b
1
(e )
1
b
M
H
28
15
pin 1 index
E
1
14
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
max.
A
A
Z
(1)
(1)
1
2
UNIT
mm
b
b
c
D
E
e
e
L
M
M
w
1
1
E
H
min.
max.
max.
1.7
1.3
0.53
0.38
0.32
0.23
36.0
35.0
14.1
13.7
3.9
3.4
15.80
15.24
17.15
15.90
5.1
0.51
4.0
2.54
0.10
15.24
0.60
0.25
0.01
1.7
0.013
0.009
0.066
0.051
0.020
0.014
1.41
1.34
0.56
0.54
0.15
0.13
0.62
0.60
0.68
0.63
inches
0.20
0.020
0.16
0.067
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-01-14
SOT117-1
051G05
MO-015AH
1997 Mar 28
18
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
DIP40: plastic dual in-line package; 40 leads (600 mil)
SOT129-1
D
M
E
A
2
A
L
A
1
c
e
w M
Z
b
1
(e )
1
b
M
H
40
21
pin 1 index
E
1
20
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
(1)
(1)
Z
1
2
w
UNIT
mm
b
b
c
D
E
e
e
L
M
M
1
1
E
H
max.
min.
max.
max.
1.70
1.14
0.53
0.38
0.36
0.23
52.50
51.50
14.1
13.7
3.60
3.05
15.80
15.24
17.42
15.90
4.7
0.51
4.0
2.54
0.10
15.24
0.60
0.254
0.01
2.25
0.067
0.045
0.021
0.015
0.014
0.009
2.067
2.028
0.56
0.54
0.14
0.12
0.62
0.60
0.69
0.63
inches
0.19
0.020
0.16
0.089
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-01-14
SOT129-1
051G08
MO-015AJ
1997 Mar 28
19
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A
X
c
y
H
v
M
A
E
Z
28
15
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
14
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
18.1
17.7
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
1.27
0.050
1.4
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.71
0.014 0.009 0.69
0.30
0.29
0.42
0.39
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
91-08-13
95-01-24
SOT136-1
075E06
MS-013AE
1997 Mar 28
20
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
VSO40: plastic very small outline package; 40 leads
SOT158-1
D
E
A
X
c
y
H
v
M
A
E
Z
40
21
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
detail X
1
20
w
M
b
p
e
0
5
scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(2)
(1)
UNIT
mm
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
0.3
0.1
2.45
2.25
0.42
0.30
0.22
0.14
15.6
15.2
7.6
7.5
12.3
11.8
1.7
1.5
1.15
1.05
0.6
0.3
2.70
0.11
0.25
0.762
0.03
2.25
0.089
0.2
0.1
0.1
7o
0o
0.012 0.096
0.004 0.089
0.017 0.0087 0.61
0.012 0.0055 0.60
0.30
0.29
0.48
0.46
0.067 0.045
0.059 0.041
0.024
0.012
inches
0.010
0.008 0.004 0.004
Notes
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-01-24
SOT158-1
1997 Mar 28
21
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
13 SOLDERING
13.1 Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
13.3.2 WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO and
VSO packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
13.2 DIP
13.2.1 SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
13.2.2 REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
13.3.3 REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
13.3 SO and VSO
13.3.1 REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO and
VSO packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1997 Mar 28
22
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
14 DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
Short-form specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
The data in this specification is extracted from a full data sheet with the same type
number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
15 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Mar 28
23
Philips Semiconductors – a worldwide company
Argentina: see South America
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101, Fax. +43 1 60 101 1210
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Belgium: see The Netherlands
Brazil: see South America
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Portugal: see Spain
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Colombia: see South America
Czech Republic: see Austria
Slovakia: see Austria
Slovenia: see Italy
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 1949
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580/xxx
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2870, Fax. +886 2 2134 2874
Indonesia: see Singapore
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 649 1007
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
Middle East: see Italy
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1997
SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
417067/1200/02/pp24
Date of release: 1997 Mar 28
Document order number: 9397 750 01649
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