935279564029 [NXP]
8 I/O, PIA-GENERAL PURPOSE, UUC, DIE;
| 型号： | 935279564029 |
| 厂家： | 
NXP |
| 描述： | 8 I/O, PIA-GENERAL PURPOSE, UUC, DIE |
| 文件： | 总35页 (文件大小：585K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PCA9554; PCA9554A
8-bit I2C-bus and SMBus I/O port with interrupt
Rev. 9 — 19 March 2013
Product data sheet
1. General description
The PCA9554 and PCA9554A are 16-pin CMOS devices that provide 8 bits of General
Purpose parallel Input/Output (GPIO) expansion for I2C-bus/SMBus applications and
were developed to enhance the NXP Semiconductors family of I2C-bus I/O expanders.
The improvements include higher drive capability, 5 V I/O tolerance, lower supply current,
individual I/O configuration, 400 kHz clock frequency, and smaller packaging. I/O
expanders provide a simple solution when additional I/O is needed for ACPI power
switches, sensors, push buttons, LEDs, fans, and so on.
The PCA9554/PCA9554A consist of an 8-bit Configuration register (Input or Output
selection); 8-bit Input Port register, 8-bit Output Port register and an 8-bit Polarity
Inversion register (active HIGH or active LOW operation). The system master can enable
the I/Os as either inputs or outputs by writing to the I/O configuration bits. The data for
each input or output is kept in the corresponding Input Port or Output Port register. The
polarity of the read register can be inverted with the Polarity Inversion register. All
registers can be read by the system master. Although pin-to-pin and I2C-bus address
compatible with the PCF8574 series, software changes are required due to the
enhancements and are discussed in Application Note AN469.
The PCA9554/PCA9554A open-drain interrupt output is activated when any input state
differs from its corresponding Input Port register state and is used to indicate to the
system master that an input state has changed. The power-on reset sets the registers to
their default values and initializes the device state machine.
Three hardware pins (A0, A1, A2) vary the fixed I2C-bus address and allow up to eight
devices to share the same I2C-bus/SMBus. The PCA9554A is identical to the PCA9554
except that the fixed I2C-bus address is different allowing up to sixteen of these devices
(eight of each) on the same I2C-bus/SMBus.
2. Features and benefits
Operating power supply voltage range of 2.3 V to 5.5 V
5 V tolerant I/Os
Polarity Inversion register
Active LOW interrupt output
Low standby current
Noise filter on SCL/SDA inputs
No glitch on power-up
Internal power-on reset
8 I/O pins which default to 8 inputs
0 Hz to 400 kHz clock frequency
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per
JESD22-C101
Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
AEC-Q100 compliance available
Packages offered: SO16, SSOP16, SSOP20, TSSOP16, HVQFN16 (2 versions:
4 4 0.85 mm and 3 3 0.85 mm), and bare die
3. Ordering information
Table 1.
Ordering information
Type number
Topside
marking
Package
Name
Description
Version
PCA9554D
PCA9554D
PCA9554AD
9554DB
SO16
plastic small outline package; 16 leads;
body width 7.5 mm
SOT162-1
PCA9554AD
PCA9554DB
PCA9554ADB
PCA9554TS
PCA9554ATS
PCA9554PW
SSOP16
SSOP20
TSSOP16
plastic shrink small outline package; 16 leads;
body width 5.3 mm
SOT338-1
SOT266-1
SOT403-1
9554A
PCA9554
PA9554A
9554DH
plastic shrink small outline package; 20 leads;
body width 4.4 mm
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
PCA9554PW/Q900[1] 9554DH
PCA9554APW
PCA9554BS
PCA9554ABS
PCA9554BS3
PCA9554ABS3
PCA9554U
9554ADH
9554
554A
P54
HVQFN16
HVQFN16
bare die
plastic thermal enhanced very thin quad flat package;
no leads; 16 terminals; body 4 4 0.85 mm
SOT629-1
SOT758-1
-
plastic thermal enhanced very thin quad flat package;
no leads; 16 terminals; body 3 3 0.85 mm
54A
-
-
[1] PCA9554PW/Q900 is AEC-Q100 compliant. Contact i2c.support@nxp.com for PPAP.
3.1 Ordering options
Table 2.
Ordering options
Type number
Orderable
part number
Package Packing method
Minimum Temperature
order
quantity
PCA9554D
PCA9554D,112
PCA9554D,118
PCA9554AD,112
PCA9554AD,118
PCA9554DB,112
PCA9554DB,118
SO16
Standard marking *
IC’s tube - DSC bulk pack
1920
1000
1920
1000
1092
2000
T
amb = 40 C to +85 C
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C
SO16
Reel 13” Q1/T1
*standard mark SMD
PCA9554AD
PCA9554DB
SO16
Standard marking *
IC’s tube - DSC bulk pack
SO16
Reel 13” Q1/T1
*standard mark SMD
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C
SSOP16
SSOP16
Standard marking *
IC’s tube - DSC bulk pack
Reel 13” Q1/T1
Tamb = 40 C to +85 C
*standard mark SMD
PCA9554_9554A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
2 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
Table 2.
Ordering options …continued
Type number
Orderable
part number
Package Packing method
Minimum Temperature
order
quantity
PCA9554ADB
PCA9554TS
PCA9554ATS
PCA9554PW
PCA9554ADB,112
PCA9554ADB,118
PCA9554TS,112
PCA9554TS,118
PCA9554ATS,112
PCA9554ATS,118
PCA9554PW,112
PCA9554PW,118
SSOP16
SSOP16
SSOP20
SSOP20
SSOP20
SSOP20
Standard marking *
IC’s tube - DSC bulk pack
1092
2000
1350
2500
1350
2500
2400
2500
2500
2400
2500
6000
6000
6000
6000
7000
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C
Reel 13” Q1/T1
*standard mark SMD
Standard marking *
IC’s tube - DSC bulk pack
Reel 13” Q1/T1
*standard mark SMD
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C
Standard marking *
IC’s tube - DSC bulk pack
Reel 13” Q1/T1
*standard mark SMD
Tamb = 40 C to +85 C
TSSOP16 Standard marking *
IC’s tube - DSC bulk pack
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C
TSSOP16 Reel 13” Q1/T1
*standard mark SMD
PCA9554PW/Q900 PCA9554PW/Q900,118 TSSOP16 Reel 13” Q1/T1
*standard mark SMD
T
amb = 40 C to +85 C
Tamb = 40 C to +85 C
amb = 40 C to +85 C
PCA9554APW
PCA9554APW,112
PCA9554APW,118
PCA9554BS,118
PCA9554ABS,118
PCA9554BS3,118
PCA9554ABS3,118
PCA9554U,029
TSSOP16 Standard marking *
IC’s tube - DSC bulk pack
TSSOP16 Reel 13” Q1/T1
*standard mark SMD
T
PCA9554BS
PCA9554ABS
PCA9554BS3
PCA9554ABS3
PCA9554U
HVQFN16 Reel 13” Q1/T1
*standard mark SMD
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C
HVQFN16 Reel 13” Q1/T1
*standard mark SMD
HVQFN16 Reel 13” Q1/T1
*standard mark SMD
Tamb = 40 C to +85 C
HVQFN16 Reel 13” Q1/T1
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C
*standard mark SMD
bare die
Reel 7” Q1/T1 *no mark
die mounted on punched
tape
PCA9554_9554A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
3 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
4. Block diagram
PCA9554/PCA9554A
A0
A1
A2
IO0
IO1
IO2
IO3
IO4
IO5
IO6
IO7
8-bit
SCL
SDA
INPUT
FILTER
INPUT/
OUTPUT
PORTS
2
I C-BUS/SMBus
CONTROL
write pulse
read pulse
V
DD
POWER-ON
RESET
V
DD
V
SS
LP
FILTER
INT
002aac492
All I/Os are set to inputs at reset.
Fig 1. Block diagram of PCA9554/PCA9554A
PCA9554_9554A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
4 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
5. Pinning information
5.1 Pinning
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A0
A1
V
DD
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A0
A1
V
DD
SDA
SCL
INT
IO7
IO6
IO5
IO4
SDA
SCL
INT
IO7
IO6
IO5
IO4
A2
A2
IO0
IO1
IO2
IO3
PCA9554DB
PCA9554ADB
IO0
IO1
IO2
IO3
PCA9554D
PCA9554AD
V
SS
V
SS
002aac487
002aac486
Fig 2. Pin configuration for SO16
Fig 3. Pin configuration for SSOP16
1
2
20
19
18
17
16
15
14
13
12
11
INT
SCL
n.c.
IO7
IO6
n.c.
IO5
IO4
3
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A0
A1
V
DD
4
SDA
SDA
SCL
INT
IO7
IO6
IO5
IO4
5
V
A2
DD
PCA9554TS
PCA9554ATS
PCA9554PW
PCA9554PW/Q900
PCA9554APW
6
A0
A1
V
IO0
IO1
IO2
IO3
SS
7
IO3
n.c.
IO2
IO1
8
n.c.
A2
9
10
IO0
V
SS
002aac488
002aac489
Fig 4. Pin configuration for TSSOP16
Fig 5. Pin configuration for SSOP20
PCA9554BS
PCA9554BS3
PCA9554ABS
PCA9554ABS3
terminal 1
index area
terminal 1
index area
1
2
3
4
12
11
10
9
A2
IO0
IO1
IO2
SCL
INT
IO7
IO6
1
2
3
4
12
11
10
9
A2
IO0
IO1
IO2
SCL
INT
IO7
IO6
002aac490
002aac491
Transparent top view
Transparent top view
Fig 6. Pin configuration for HVQFN16
(SOT629-1)
Fig 7. Pin configuration for HVQFN16
(SOT758-1)
PCA9554_9554A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
5 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
5.2 Pin description
Table 3.
Symbol Pin
SO16, SSOP16, HVQFN16 SSOP20
Pin description
Description
TSSOP16
A0
1
15
16
1
6
address input 0
address input 1
address input 2
input/output 0
A1
2
7
A2
3
9
IO0
IO1
IO2
IO3
VSS
IO4
IO5
IO6
IO7
INT
SCL
SDA
VDD
n.c.
4
2
10
5
3
11
input/output 1
6
4
12
input/output 2
7
5
6[1]
14
input/output 3
8
15
supply ground
input/output 4
9
7
16
10
11
12
13
14
15
16
-
8
17
input/output 5
9
19
input/output 6
10
11
12
13
14
-
20
input/output 7
1
interrupt output (open-drain)
serial clock line
serial data line
supply voltage
not connected
2
4
5
3, 8, 13, 18
[1] HVQFN16 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must
be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board
level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad
on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the
PCB in the thermal pad region.
6. Functional description
Refer to Figure 1 “Block diagram of PCA9554/PCA9554A”.
6.1 Registers
6.1.1 Command byte
Table 4.
Command byte
Command
Protocol
Function
0
1
2
3
read byte
Input Port register
Output Port register
Polarity Inversion register
Configuration register
read/write byte
read/write byte
read/write byte
The command byte is the first byte to follow the address byte during a write transmission.
It is used as a pointer to determine which of the following registers will be written or read.
PCA9554_9554A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
6 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
6.1.2 Register 0 - Input Port register
This register is a read-only port. It reflects the incoming logic levels of the pins, regardless
of whether the pin is defined as an input or an output by Register 3. Writes to this register
have no effect.
The default ‘X’ is determined by the externally applied logic level, normally ‘1’ when no
external signal externally applied because of the internal pull-up resistors.
Table 5.
Register 0 - Input Port register bit description
Bit
7
Symbol
Access
Value
Description
I7
I6
I5
I4
I3
I2
I1
I0
read only
read only
read only
read only
read only
read only
read only
read only
X
X
X
X
X
X
X
X
determined by externally applied logic level
6
5
4
3
2
1
0
6.1.3 Register 1 - Output Port register
This register reflects the outgoing logic levels of the pins defined as outputs by Register 3.
Bit values in this register have no effect on pins defined as inputs. Reads from this register
return the value that is in the flip-flop controlling the output selection, not the actual pin
value.
Table 6.
Register 1 - Output Port register bit description
Legend: * default value.
Bit
7
Symbol
O7
Access
Value
1*
Description
R
R
R
R
R
R
R
R
reflects outgoing logic levels of pins defined as
outputs by Register 3
6
O6
1*
5
O5
1*
4
O4
1*
3
O3
1*
2
O2
1*
1
O1
1*
0
O0
1*
PCA9554_9554A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
7 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
6.1.4 Register 2 - Polarity Inversion register
This register allows the user to invert the polarity of the Input Port register data. If a bit in
this register is set (written with ‘1’), the corresponding Input Port data is inverted. If a bit in
this register is cleared (written with a ‘0’), the Input Port data polarity is retained.
Table 7.
Register 2 - Polarity Inversion register bit description
Legend: * default value.
Bit
7
Symbol
N7
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Value
0*
Description
inverts polarity of Input Port register data
0 = Input Port register data retained (default value)
1 = Input Port register data inverted
6
N6
0*
5
N5
0*
4
N4
0*
3
N3
0*
2
N2
0*
1
N1
0*
0
N0
0*
6.1.5 Register 3 - Configuration register
This register configures the directions of the I/O pins. If a bit in this register is set, the
corresponding port pin is enabled as an input with high-impedance output driver. If a bit in
this register is cleared, the corresponding port pin is enabled as an output. At reset, the
I/Os are configured as inputs with a weak pull-up to VDD
.
Table 8.
Register 3 - Configuration register bit description
Legend: * default value.
Bit
7
Symbol
C7
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Value
1*
Description
configures the directions of the I/O pins
0 = corresponding port pin enabled as an output
6
C6
1*
1 = corresponding port pin configured as input
(default value)
5
C5
1*
4
C4
1*
3
C3
1*
2
C2
1*
1
C1
1*
0
C0
1*
6.2 Power-on reset
When power is applied to VDD, an internal Power-On Reset (POR) holds the
PCA9554/PCA9554A in a reset condition until VDD has reached VPOR. At that point, the
reset condition is released and the PCA9554/PCA9554A registers and state machine will
initialize to their default states. Thereafter, VDD must be lowered below 0.2 V to reset the
device.
For a power reset cycle, VDD must be lowered below 0.2 V and then restored to the
operating voltage.
PCA9554_9554A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
8 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
6.3 Interrupt output
The open-drain interrupt output is activated when one of the port pins change state and
the pin is configured as an input. The interrupt is deactivated when the input returns to its
previous state or the Input Port register is read.
Note that changing an I/O from and output to an input may cause a false interrupt to occur
if the state of the pin does not match the contents of the Input Port register.
6.4 I/O port
When an I/O is configured as an input, FETs Q1 and Q2 are off, creating a
high-impedance input with a weak pull-up (100 k typ.) to VDD. The input voltage may be
raised above VDD to a maximum of 5.5 V.
If the I/O is configured as an output, then either Q1 or Q2 is enabled, depending on the
state of the Output Port register. Care should be exercised if an external voltage is applied
to an I/O configured as an output because of the low-impedance paths that exist between
the pin and either VDD or VSS
.
data from
shift register
output port
register data
configuration
register
V
DD
data from
shift register
Q1
D
Q
FF
100 kΩ
write configuration
pulse
D
Q
CK
Q
FF
IO0 to IO7
write pulse
CK
Q2
output port
register
V
SS
input port
register
D
Q
input port
register data
FF
read pulse
CK
to INT
polarity inversion
register
data from
shift register
polarity inversion
register data
D
Q
FF
write polarity
pulse
CK
002aac493
Remark: At power-on reset, all registers return to default values.
Fig 8. Simplified schematic of IO0 to IO7
PCA9554_9554A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
9 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
6.5 Device address
slave address
slave address
0
1
1
1
A2 A1 A0 R/W
0
1
0
0
A2 A1 A0 R/W
fixed
hardware
selectable
fixed
hardware
selectable
002aac495
002aac494
Fig 9. PCA9554 device address
Fig 10. PCA9554A device address
6.6 Bus transactions
Data is transmitted to the PCA9554/PCA9554A registers using the Write mode as shown
in Figure 11 and Figure 12. Data is read from the PCA9554/PCA9554A registers using the
Read mode as shown in Figure 13 and Figure 14. These devices do not implement an
auto-increment function, so once a command byte has been sent, the register which was
addressed will continue to be accessed by reads until a new command byte has been
sent.
SCL
SDA
1
2
3
4
5
6
7
8
9
slave address
A2 A1 A0
command byte
data to port
DATA 1
S
0
1
0
0
0
A
0
0
0
0
0
0
0
1
A
A
P
START condition
R/W
acknowledge
from slave
acknowledge
from slave
STOP
condition
acknowledge
from slave
write to port
t
v(Q)
data out
from port
data 1 valid
002aac472
Fig 11. Write to Output Port register
SCL
SDA
1
2
3
4
5
6
7
8
9
slave address
A2 A1 A0
command byte
data to register
DATA
S
0
1
0
0
0
A
0
0
0
0
0
0
1
1/0
A
A
P
START condition
R/W
acknowledge
from slave
acknowledge
from slave
STOP
condition
acknowledge
from slave
data to
register
002aac473
Fig 12. Write to Configuration register or Polarity Inversion register
PCA9554_9554A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
10 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
slave address
(cont.)
A
SDA
S
0
1
0
0
A2 A1 A0
0
A
command byte
START condition
R/W
acknowledge
from slave
acknowledge
from slave
slave address
data from register
DATA (first byte)
data from register
DATA (last byte)
(cont.)
S
0
1
0
0
A2 A1 A0
1
A
A
NA
P
(repeated)
START condition
R/W
acknowledge
no acknowledge
from master
STOP
from master
condition
acknowledge
from slave
at this moment master-transmitter becomes master-receiver
and slave-receiver becomes slave-transmitter
002aac474
Fig 13. Read from register
SCL
SDA
1
2
3
4
5
6
7
8
9
slave address
A2 A1 A0
data from port
DATA 1
data from port
DATA 4
S
0
1
0
0
1
A
A
NA
P
START condition
R/W
acknowledge
from master
no acknowledge
from master
STOP
condition
acknowledge
from slave
read from
port
t
su(D)
t
h(D)
data into
port
DATA 2
DATA 3
DATA 4
t
t
rst(INT_N)
v(INT_N)
INT
002aac475
This figure assumes the command byte has previously been programmed with 00h.
Transfer of data can be stopped at any moment by a STOP condition.
Fig 14. Read Input Port register
PCA9554_9554A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
11 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
7. Application design-in information
V
DD
(5 V)
2 kΩ
10 kΩ
10 kΩ
10 kΩ
10 kΩ
V
V
DD
DD
MASTER
CONTROLLER
PCA9554
SUBSYSTEM 1
IO0
(e.g., temp. sensor)
SCL
SCL
SDA
INT
SDA
INT
IO1
IO2
IO3
IO4
IO5
IO6
IO7
RESET
INT
SUBSYSTEM 2
(e.g., counter)
V
SS
A
controlled switch
(e.g., CBT device)
enable
A2
A1
A0
B
V
SS
ALARM
SUBSYSTEM 3
(e.g., alarm system)
V
DD
002aac496
Device address configured as 0100 100X for this example.
IO0, IO1, IO2 configured as outputs.
IO3, IO4, IO5 configured as inputs.
IO6 and IO7 are not used and must be configured as outputs.
Fig 15. Typical application
8. Limiting values
Table 9.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDD
II
Parameter
Conditions
Min
Max
+6.0
20
5.5
Unit
V
supply voltage
0.5
input current
-
mA
V
VI/O
IO(IOn)
IDD
voltage on an input/output pin
output current on pin IOn
supply current
VSS 0.5
-
50
85
mA
mA
mA
mW
C
-
ISS
ground supply current
total power dissipation
storage temperature
ambient temperature
-
100
200
+150
+85
Ptot
-
Tstg
65
40
Tamb
operating
C
PCA9554_9554A
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Product data sheet
Rev. 9 — 19 March 2013
12 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
9. Static characteristics
Table 10. Static characteristics
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Supplies
VDD
supply voltage
supply current
2.3
-
-
5.5
V
IDD
operating mode; VDD = 5.5 V;
no load; fSCL = 100 kHz
104
175
A
Istb
standby current
Standby mode; VDD = 5.5 V; no load;
VI = VSS; fSCL = 0 kHz; I/O = inputs
-
-
-
550
0.25
1.5
700
1
A
A
V
Standby mode; VDD = 5.5 V; no load;
VI = VDD; fSCL = 0 kHz; I/O = inputs
[1]
VPOR
power-on reset voltage
no load; VI = VDD or VSS
1.65
Input SCL; input/output SDA
VIL
VIH
IOL
IL
LOW-level input voltage
HIGH-level input voltage
LOW-level output current
leakage current
0.5
-
+0.3VDD
V
0.7VDD
-
5.5
-
V
VOL = 0.4 V
VI = VDD = VSS
VI = VSS
3
6
-
mA
A
pF
1
-
+1
10
Ci
input capacitance
6
I/Os
VIL
VIH
IOL
LOW-level input voltage
HIGH-level input voltage
LOW-level output current
0.5
2.0
8
-
+0.8
V
-
5.5
V
[2]
[2]
[2]
[2]
[2]
[2]
[3]
[3]
[3]
[3]
[3]
[3]
VOL = 0.5 V; VDD = 2.3 V
VOL = 0.7 V; VDD = 2.3 V
VOL = 0.5 V; VDD = 3.0 V
VOL = 0.7 V; VDD = 3.0 V
VOL = 0.5 V; VDD = 4.5 V
VOL = 0.7 V; VDD = 4.5 V
10
13
14
19
17
24
-
-
mA
mA
mA
mA
mA
mA
V
10
8
-
-
10
8
-
-
10
1.8
1.7
2.6
2.5
4.1
4.0
1
-
-
VOH
HIGH-level output voltage IOH = 8 mA; VDD = 2.3 V
IOH = 10 mA; VDD = 2.3 V
-
-
-
V
IOH = 8 mA; VDD = 3.0 V
-
-
V
IOH = 10 mA; VDD = 3.0 V
-
-
V
IOH = 8 mA; VDD = 4.75 V
-
-
V
IOH = 10 mA; VDD = 4.75 V
-
-
V
ILI
IL
input leakage current
leakage current
VDD = 3.6 V; VI = VDD
VDD = 5.5 V; VI = VSS
-
+1
100
5
A
A
pF
pF
-
Ci
Co
input capacitance
output capacitance
-
3.7
3.7
-
5
Interrupt INT
IOL
LOW-level output current
VOL = 0.4 V
3
-
-
mA
PCA9554_9554A
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Product data sheet
Rev. 9 — 19 March 2013
13 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
Table 10. Static characteristics …continued
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Select inputs A0, A1, A2
VIL
VIH
ILI
LOW-level input voltage
0.5
2.0
1
-
-
-
0.8
5.5
1
V
HIGH-level input voltage
input leakage current
V
A
[1] VDD must be lowered to 0.2 V for at least 5 s in order to reset part.
[2] Each I/O must be externally limited to a maximum of 25 mA and the device must be limited to a maximum current of 100 mA.
[3] The total current sourced by all I/Os must be limited to 85 mA.
10. Dynamic characteristics
Table 11. Dynamic characteristics
Symbol
Parameter
Conditions
Standard-mode
I2C-bus
Fast-mode I2C-bus Unit
Min
0
Max
100
-
Min
0
Max
400
-
fSCL
tBUF
SCL clock frequency
kHz
bus free time between a STOP and
START condition
4.7
1.3
s
tHD;STA
tSU;STA
hold time (repeated) START condition
4.0
4.7
-
-
0.6
0.6
-
-
s
s
set-up time for a repeated START
condition
tSU;STO
tHD;DAT
tVD;ACK
tVD;DAT
tSU;DAT
tLOW
tHIGH
tr
set-up time for STOP condition
data hold time
4.0
0
-
0.6
-
s
s
s
ns
ns
s
s
ns
ns
ns
-
0
-
0.9
-
[1]
[2]
data valid acknowledge time
data valid time
0.3
300
250
4.7
4.0
-
3.45
0.1
-
50
data set-up time
-
-
100
1.3
-
LOW period of the SCL clock
HIGH period of the SCL clock
rise time of both SDA and SCL signals
fall time of both SDA and SCL signals
-
-
0.6
-
[3]
[3]
1000
300
50
20 + 0.1Cb
20 + 0.1Cb
-
300
300
50
tf
-
tSP
pulse width of spikes that must be
suppressed by the input filter
-
Port timing
tv(Q)
data output valid time
data input set-up time
data input hold time
-
100
1
200
-
100
1
200
ns
ns
s
tsu(D)
-
-
-
-
th(D)
Interrupt timing
tv(INT_N)
valid time on pin INT
reset time on pin INT
-
-
4
4
-
-
4
4
s
s
trst(INT_N)
[1] tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW.
[2] tVD;DAT = minimum time for SDA data output to be valid following SCL LOW.
[3] Cb = total capacitance of one bus line in pF.
PCA9554_9554A
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Product data sheet
Rev. 9 — 19 March 2013
14 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
0.7 × V
0.3 × V
DD
SDA
DD
t
t
t
t
SP
t
r
f
HD;STA
BUF
t
LOW
0.7 × V
0.3 × V
DD
SCL
DD
t
t
t
SU;STO
HD;STA
SU;STA
t
t
t
SU;DAT
HD;DAT
HIGH
P
S
Sr
P
002aaa986
Fig 16. Definition of timing
PCA9554_9554A
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Product data sheet
Rev. 9 — 19 March 2013
15 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
11. Package outline
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A
X
c
H
v
M
A
E
y
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
detail X
e
w
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
mm
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
2.65
0.1
0.25
0.01
1.27
0.05
1.4
0.25 0.25
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.41
0.014 0.009 0.40
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches
0.055
0.01 0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT162-1
075E03
MS-013
Fig 17. Package outline SOT162-1 (SO16)
PCA9554_9554A
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
16 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
8
1
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
1.00
0.55
mm
2
0.25
0.65
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT338-1
MO-150
Fig 18. Package outline SOT338-1 (SSOP16)
PCA9554_9554A
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
17 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
D
E
A
X
c
y
H
v
M
A
E
Z
11
20
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
10o
0o
0.15
0
1.4
1.2
0.32
0.20
0.20
0.13
6.6
6.4
4.5
4.3
6.6
6.2
0.75
0.45
0.65
0.45
0.48
0.18
mm
1.5
0.65
1
0.2
0.25
0.13
0.1
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT266-1
MO-152
Fig 19. Package outline SOT266-1 (SSOP20)
PCA9554_9554A
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
18 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
8
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.40
0.06
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT403-1
MO-153
Fig 20. Package outline SOT403-1 (TSSOP16)
PCA9554_9554A
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
19 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
HVQFN16: plastic thermal enhanced very thin quad flat package; no leads;
16 terminals; body 4 x 4 x 0.85 mm
SOT629-1
B
A
D
terminal 1
index area
A
A
1
E
c
detail X
e
1
C
1/2 e
y
y
e
v
M
M
b
C
C
A B
C
1
w
5
8
L
9
4
1
e
e
E
h
2
1/2 e
12
terminal 1
index area
16
13
X
D
h
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
E
e
e
e
2
y
D
D
E
L
v
w
y
1
1
h
1
h
max.
0.05 0.38
0.00 0.23
4.1
3.9
2.25
1.95
4.1
3.9
2.25
1.95
0.75
0.50
mm
0.05
0.1
1
0.2
0.65
1.95 1.95
0.1 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
01-08-08
02-10-22
SOT629-1
- - -
MO-220
- - -
Fig 21. Package outline SOT629-1 (HVQFN16)
PCA9554_9554A
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
20 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
HVQFN16: plastic thermal enhanced very thin quad flat package; no leads;
16 terminals; body 3 x 3 x 0.85 mm
SOT758-1
B
A
D
terminal 1
index area
A
E
A
1
c
detail X
e
C
1
1/2 e
y
y
v
M
C
A B
C
1
e
b
w
M
C
5
8
L
4
9
e
e
E
2
h
1/2 e
12
1
16
13
terminal 1
index area
D
h
X
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
E
e
e
e
2
D
D
E
L
y
1
v
w
y
1
h
1
h
max.
0.05 0.30
0.00 0.18
3.1 1.75
2.9 1.45
3.1
2.9
1.75
1.45
0.5
0.3
mm
0.05
0.1
1
0.2
0.5
1.5
1.5
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-03-25
02-10-21
SOT758-1
- - -
MO-220
- - -
Fig 22. Package outline SOT758-1 (HVQFN16)
PCA9554_9554A
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
21 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
12. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
13. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
PCA9554_9554A
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
22 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
13.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 23) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 12 and 13
Table 12. SnPb eutectic process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
235
350
220
< 2.5
2.5
220
220
Table 13. Lead-free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 23.
PCA9554_9554A
All information provided in this document is subject to legal disclaimers.
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Product data sheet
Rev. 9 — 19 March 2013
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PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 23. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
PCA9554_9554A
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Product data sheet
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NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
14. Soldering: PCB footprints
Footprint information for reflow soldering of SO16 package
SOT162-1
Hx
Gx
P2
(0.125)
(0.125)
Hy Gy
By Ay
C
D2 (4x)
P1
D1
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 P2 Ay
By
C
D1
D2
Gx
Gy
Hx
Hy
1.270 1.320 11.200 6.400 2.400 0.700 0.800 10.040 8.600 11.900 11.450
sot162-1_fr
Fig 24. PCB footprint for SOT162-1 (SO16); reflow soldering
PCA9554_9554A
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Product data sheet
Rev. 9 — 19 March 2013
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PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
Footprint information for reflow soldering of TSSOP16 package
SOT338-1
Hx
Gx
P2
(0.125)
(0.125)
Hy Gy
By Ay
C
D2 (4x)
P1
D1
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 P2 Ay
By
C
D1
D2
Gx
Gy
Hx
Hy
0.650 0.750 8.600 5.400 1.600 0.400 0.600 5.600 6.100 7.000 8.850
sot338-1_fr
Fig 25. PCB footprint for SOT338-1 (HVQFN16); reflow soldering
PCA9554_9554A
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Product data sheet
Rev. 9 — 19 March 2013
26 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
Footprint information for reflow soldering of SSOP20 package
SOT266-1
Hx
Gx
(0.125)
(0.125)
P2
Hy
Gy
By
Ay
C
D2 (4x)
P1
D1
solder land
occupied area
DIMENSIONS in mm
P1 P2 Ay
By
C
D1
D2
Gx
Gy
Hx
Hy
0.650 0.750 7.200 4.500 1.350 0.400 0.600 6.900 5.300 7.300 7.450
sot266-1_fr
Fig 26. PCB footprint for SOT266-1 (SSOP20); reflow soldering
PCA9554_9554A
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Product data sheet
Rev. 9 — 19 March 2013
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PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
Footprint information for reflow soldering of TSSOP16 package
SOT403-1
Hx
Gx
P2
(0.125)
(0.125)
Hy Gy
By Ay
C
D2 (4x)
P1
D1
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 P2 Ay
By
C
D1
D2
Gx
Gy
Hx
Hy
0.650 0.750 7.200 4.500 1.350 0.400 0.600 5.600 5.300 5.800 7.450
sot403-1_fr
Fig 27. PCB footprint for SOT403-1 (TSSOP16); reflow soldering
PCA9554_9554A
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
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PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
Footprint information for reflow soldering of HVQFN16 package
SOT629-1
Hx
Gx
D
P
0.025
0.025
C
(0.105)
SPx
SPy
nSPx
Hy Gy
SLy By
Ay
nSPy
SPx tot
SLx
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
nSPx nSPy
2
2
Dimensions in mm
Ax
P
Ay
Bx
By
C
D
SLx
SLy
SPx tot
1.200
SPy tot
1.200
SPx
SPy
Gx
Gy
Hx
Hy
0.650 5.000 5.000 2.800 2.800 1.100 0.300 2.000 2.000
0.450 0.450 4.300 4.300 5.250 5.250
07-05-07
Issue date
sot629-1_fr
09-06-15
Fig 28. PCB footprint for SOT629-1 (HVQFN16); reflow soldering
PCA9554_9554A
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Product data sheet
Rev. 9 — 19 March 2013
29 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
Footprint information for reflow soldering of HVQFN16 package
SOT758-1
Hx
Gx
P
D
0.025
0.025
C
(0.105)
SPx
SPy
nSPx
Hy
Gy
nSPy
SLy By
Ay
SPx tot
SLx
Bx
Ax
solder land
solder paste deposit
solder land plus solder paste
occupied area
nSPx nSPy
2
2
Dimensions in mm
P
Ax
Ay
Bx
By
C
D
SLx
SLy SPx tot SPy tot SPx
1.50 0.90 0.90 0.30
SPy
0.30
Gx
Gy
3.30
Hx
Hy
0.50
4.00
4.00
2.20
2.20
0.90
0.24
1.50
3.30
4.25
4.25
12-03-07
12-03-08
Issue date
sot758-1_fr
Fig 29. PCB footprint for SOT758-1 (HVQFN16); reflow soldering
PCA9554_9554A
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
30 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
15. Abbreviations
Table 14. Abbreviations
Acronym
ACPI
CDM
CMOS
ESD
Description
Advanced Configuration and Power Interface
Charged Device Model
Complementary Metal-Oxide Semiconductor
ElectroStatic Discharge
Field-Effect Transistor
FET
GPIO
HBM
I2C-bus
I/O
General Purpose Input/Output
Human Body Model
Inter-Integrated Circuit bus
Input/Output
LED
Light-Emitting Diode
MM
Machine Model
PCB
Printed-Circuit Board
POR
Power-On Reset
SMBus
System Management Bus
PCA9554_9554A
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
31 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
16. Revision history
Table 15. Revision history
Document ID
Release date
20130319
Data sheet status
Change notice
Supersedes
PCA9554_9554A v.9
Modifications:
Product data sheet
-
PCA9554_9554A v.8
• Removed DIP16 package option (type numbers PCA9554N and PCA9554AN)
• Added Section 3.1 “Ordering options”
• Deleted (old) Figure 2, “Pin configuration for DIP16”
• Figure 10 “PCA9554A device address” modified: label corrected from “programmable” to
“hardware selectable”
• Figure 16 “Definition of timing” modified: added 0.7 VDD and 0.3 VDD reference lines
• Deleted (old) Figure 18, “Package outline SOT38-4 (DIP16)”
• Deleted (old) Section 14, “Soldering of through-hole mount packages”
• Added Section 14 “Soldering: PCB footprints”
PCA9554_9554A v.8
PCA9554_9554A v.7
20110726
20061113
20040930
Product data sheet
Product data sheet
Product data
-
-
-
PCA9554_9554A v.7
PCA9554_9554A v.6
PCA9554_9554A v.5
PCA9554_9554A v.6
(9397 750 13289)
PCA9554_9554A v.5
(9397 750 10163)
20020726
20020513
20010507
20010319
20010319
Product data
853-2243 28672 of PCA9554_9554A v.4
26 July 2002
PCA9554_9554A v.4
(9397 750 09817)
Product specification
Product specification
Product specification
Product specification
-
-
-
-
PCA9554_9554A v.3
PCA9554_9554A v.2
PCA9554_9554A v.1
-
PCA9554_9554A v.3
(9397 750 08342)
PCA9554_9554A v.2
(9397 750 08209)
PCA9554_9554A v.1
(9397 750 08159)
PCA9554_9554A
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Product data sheet
Rev. 9 — 19 March 2013
32 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
17.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
PCA9554_9554A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
33 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
Bare die — All die are tested on compliance with their related technical
specifications as stated in this data sheet up to the point of wafer sawing and
are handled in accordance with the NXP Semiconductors storage and
transportation conditions. If there are data sheet limits not guaranteed, these
will be separately indicated in the data sheet. There are no post-packing tests
performed on individual die or wafers.
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
NXP Semiconductors has no control of third party procedures in the sawing,
handling, packing or assembly of the die. Accordingly, NXP Semiconductors
assumes no liability for device functionality or performance of the die or
systems after third party sawing, handling, packing or assembly of the die. It
is the responsibility of the customer to test and qualify their application in
which the die is used.
All die sales are conditioned upon and subject to the customer entering into a
written die sale agreement with NXP Semiconductors through its legal
department.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
I2C-bus — logo is a trademark of NXP B.V.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PCA9554_9554A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
34 of 35
PCA9554; PCA9554A
NXP Semiconductors
8-bit I2C-bus and SMBus I/O port with interrupt
19. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
3.1
4
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
6
6.1
Functional description . . . . . . . . . . . . . . . . . . . 6
Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Command byte . . . . . . . . . . . . . . . . . . . . . . . . . 6
Register 0 - Input Port register . . . . . . . . . . . . . 7
Register 1 - Output Port register. . . . . . . . . . . . 7
Register 2 - Polarity Inversion register . . . . . . . 8
Register 3 - Configuration register . . . . . . . . . . 8
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 8
Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . . 9
I/O port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Device address. . . . . . . . . . . . . . . . . . . . . . . . 10
Bus transactions. . . . . . . . . . . . . . . . . . . . . . . 10
6.1.1
6.1.2
6.1.3
6.1.4
6.1.5
6.2
6.3
6.4
6.5
6.6
7
Application design-in information . . . . . . . . . 12
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
Static characteristics. . . . . . . . . . . . . . . . . . . . 13
Dynamic characteristics . . . . . . . . . . . . . . . . . 14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
Handling information. . . . . . . . . . . . . . . . . . . . 22
8
9
10
11
12
13
Soldering of SMD packages . . . . . . . . . . . . . . 22
Introduction to soldering . . . . . . . . . . . . . . . . . 22
Wave and reflow soldering . . . . . . . . . . . . . . . 22
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 22
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 23
13.1
13.2
13.3
13.4
14
15
16
Soldering: PCB footprints. . . . . . . . . . . . . . . . 25
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 31
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 32
17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 33
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 33
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 34
17.1
17.2
17.3
17.4
18
19
Contact information. . . . . . . . . . . . . . . . . . . . . 34
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 March 2013
Document identifier: PCA9554_9554A
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