935284847118_技术文档

74CBTLV16211

24-bit bus switch

Rev. 6 — 15 December 2011

Product data sheet

1. General description

The 74CBTLV16211 provides a dual 12-bit high-speed bus switch with separate output

enable inputs (1OE, 2OE). The low on-state resistance of the switch allows connections to

be made with minimal propagation delay. The switch is disabled (high-impedance

OFF-state) when the output enable (nOE) input is HIGH.

To ensure the high-impedance OFF-state during power-up or power-down, 1OE and 2OE

should be tied to the V_CCthrough a pull-up resistor. The minimum value of the resistor is

determined by the current-sinking capability of the driver.

Schmitt trigger action at control input makes the circuit tolerant to slower input rise and fall

times across the entire V_CCrange from 2.3 V to 3.6 V.

This device is fully specified for partial power-down applications using I_OFF

.

The I_OFFcircuitry disables the output, preventing the damaging backflow current through

the device when it is powered down.

2. Features and benefits

 Supply voltage range from 2.3 V to 3.6 V

 High noise immunity

 Complies with JEDEC standard:

 JESD8-5 (2.3 V to 2.7 V)

 JESD8-B/JESD36 (2.7 V to 3.6 V)

 ESD protection:

 HBM JESD22-A114F exceeds 2000 V

 MM JESD22-A115-A exceeds 200 V

 CDM AEC-Q100-011 revision B exceeds 1000 V

 5  switch connection between two ports

 Rail to rail switching on data I/O ports

 CMOS low power consumption

 Latch-up performance exceeds 250 mA per JESD78B Class I level A

 I_OFFcircuitry provides partial Power-down mode operation

 TSSOP56 packages: SOT364-1 and SOT481-2

 Specified from 40 C to +85 C and 40 C to +125 C

74CBTLV16211

NXP Semiconductors

24-bit bus switch

3. Ordering information

Table 1.

Ordering information

Type number

Package

Temperature

range

Name

Description

Version

74CBTLV16211DGG 40 C to +125 C TSSOP56 plastic thin shrink small outline package; 56 leads;

SOT364-1

SOT481-2

body width 6.1 mm

74CBTLV16211DGV 40 C to +125 C TSSOP56 plastic thin shrink small outline package; 56 leads;

body width 4.4 mm

4. Functional diagram

1A0

2

1A1

3

1A2

4

1A3

5

1A4

6

1A5

7

1A6

9

1A7

10

1A8

11

1A9

12

1A10 1A11

13

14

56

1OE

54

53

52

51

50

48

47

46

1B7

45

1B8

44

1B9

43

42

1B0

1B1

1B2

1B3

1B4

1B5

1B6

1B10 1B11

2A10 2A11

2A0

2A1

2A2

2A3

2A4

2A5

2A6

2A7

24

2A8

25

2A9

26

15

16

18

20

21

22

23

27

28

55

2OE

41

2B0

40

2B1

39

2B2

37

2B3

36

2B4

35

2B5

34

2B6

33

2B7

32

2B8

31

2B9

30

29

2B10 2B11

001aai097

Fig 1. Logic symbol

nAn

nBn

nOE

001aai099

Fig 2. Logic diagram (one switch)

74CBTLV16211

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Product data sheet

Rev. 6 — 15 December 2011

2 of 16

74CBTLV16211

NXP Semiconductors

24-bit bus switch

5. Pinning information

5.1 Pinning

1

56

55

54

53

52

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

n.c.

1A0

1A1

1A2

1A3

1A4

1A5

GND

1A6

1A7

1A8

1A9

1A10

1A11

2A0

2A1

1OE

2OE

1B0

1B1

1B2

1B3

1B4

GND

1B5

1B6

1B7

1B8

1B9

1B10

1B11

2B0

2B1

2B2

GND

2B3

2B4

2B5

2B6

2B7

2B8

2B9

2B10

2B11

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

74CBTLV16211

V

CC

2A2

GND

2A3

2A4

2A5

2A6

2A7

2A8

2A9

2A10

2A11

001aai100

Fig 3. Pin configuration (SOT364-1 and SOT481-2)

5.2 Pin description

Table 2.

Symbol

n.c.

Pin description

Description

1

not connected

1A0 to 1A11

2A0 to 2A11

GND

2, 3, 4, 5, 6, 7, 9, 10, 11, 12, 13, 14

15, 16, 18, 20, 21, 22, 23, 24, 25, 26, 27, 28

8, 19, 38, 49

independent input or output

ground (0 V)

V_CC

17

supply voltage

2B0 to 2B11

41, 40, 39, 37, 36, 35, 34, 33, 32, 31, 30, 29

independent input or output

74CBTLV16211

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Product data sheet

Rev. 6 — 15 December 2011

3 of 16

74CBTLV16211

NXP Semiconductors

24-bit bus switch

Table 2.

Symbol

1B0 to 1B11

2OE

Pin description …continued

Description

54, 53, 52, 51, 50, 48, 47, 46, 45, 44, 43, 42

independent input or output

55

56

output enable input (active-LOW)

1OE

6. Functional description

Table 3.

Function table^[1]

Output enable input OE

Function switch

ON-state

L

H

OFF-state

[1] H = HIGH voltage level; L = LOW voltage level.

7. Limiting values

Table 4.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol

V_CC

V_I

Parameter

Conditions

Min

0.5

50

-

Max

+4.6

V_CC+ 0.5

-

Unit

V

supply voltage

[1]

input voltage

V

V_SW

I_IK

switch voltage

enable and disable mode

V_I< 0.5 V

V

input clamping current

switch clamping current

switch current

mA

C

I_SK

V_I< 0.5 V

-

I_SW

V_SW= 0 V to V_CC

128

+100

-

I_CC

supply current

-

I_GND

T_stg

P_tot

ground current

100

65

-

storage temperature

total power dissipation

+150

600

[2]

T_amb= 40 C to +125 C

mW

[1] The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed.

[2] For TSSOP56 packages: above 55 C the value of P_totderates linearly with 8.0 mW/K.

8. Recommended operating conditions

Table 5.

Symbol

V_CC

Recommended operating conditions

Parameter

Conditions

Min

2.3

0

Max

3.6

Unit

supply voltage

input voltage

V

V_I

3.6

V

V_SW

switch voltage

ambient temperature

enable and disable mode

0

V_CC

+125

200

V

T_amb

40

0

C

ns/V

[1]

t/V

input transition rise and fall rate V_CC= 2.3 V to 3.6 V

[1] Applies to control signal levels.

74CBTLV16211

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Product data sheet

Rev. 6 — 15 December 2011

4 of 16

74CBTLV16211

NXP Semiconductors

24-bit bus switch

9. Static characteristics

Table 6.

Static characteristics

At recommended operating conditions voltages are referenced to GND (ground = 0 V).

Symbol Parameter

Conditions

T_amb= 40 C to +85 C T_amb= 40 C to +125 C Unit

Min

1.7

2.0

-

Typ^[1]

Max

-

Min

1.7

2.0

-

Max

-

V_IH

V_IL

HIGH-level

input voltage

V_CC= 2.3 V to 2.7 V

V_CC= 3.0 V to 3.6 V

-

V

-

V

LOW-levelinput V_CC= 2.3 V to 2.7 V

voltage

0.7

0.9

1.0

0.7

0.9

20

V

V_CC= 3.0 V to 3.6 V

-

V

I_I

input leakage

current

pin nOE; V_I= GND to V_CC

V_CC= 3.6 V

;

-

A

I_S(OFF)

I_S(ON)

I_OFF

I_CC

OFF-state

leakage current

V_CC= 3.6 V; see Figure 4

V_CC= 3.6 V; see Figure 5

V_Ior V_O= 0 V to 3.6 V;

-

1

-

20

50

50

A

ON-state

leakage current

power-off

leakage current V_CC= 0 V

10

10

supply current V_I= GND or V_CC; I_O= 0 A;

V_SW= GND or V_CC

V_CC= 3.6 V

;

[2]

I_CC

additional

pin nOE; V_I= V_CC 0.6 V;

-

300

-

2000

A

supply current V_SW= GND or V_CC

;

V_CC= 3.6 V

C_I

input

capacitance

pin nOE; V_CC= 3.3 V;

V_I= 0 V to 3.3 V

-

0.9

5.2

-

pF

C_S(OFF)OFF-state

capacitance

V_CC= 3.3 V; V_I= 0 V to 3.3 V

C_S(ON)

ON-state

V_CC= 3.3 V; V_I= 0 V to 3.3 V

14.3

capacitance

[1] All typical values are measured at T_amb= 25 C.

[2] One input at 3 V, other inputs at V_CCor GND.

9.1 Test circuits

V

CC

V

CC

nOE

nBn

nOE

nAn

V

IL

IH

I

s

nAn

nBn

A

GND

V

O

l

O

l

001aam032

001aam033

V_I= V_CCor GND and V_O= GND or V_CC

.

V_I= V_CCor GND and V_O= open circuit.

Fig 4. Test circuit for measuring OFF-state leakage

current (one channel)

Fig 5. Test circuit for measuring ON-state leakage

current (one channel)

74CBTLV16211

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Product data sheet

Rev. 6 — 15 December 2011

5 of 16

74CBTLV16211

NXP Semiconductors

24-bit bus switch

9.2 ON resistance

Table 7.

Resistance R_ON

At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6.

Symbol Parameter Conditions T_amb= 40 C to +85 C T_amb= 40 C to +125 C Unit

Min

Typ^[1]

Max

Min

Max

[2]

R_ON

ON resistance V_CC= 2.3 V to 2.7 V;

see Figure 7 to Figure 9

I_SW= 64 mA; V_I= 0 V

I_SW= 24 mA; V_I= 0 V

I_SW= 15 mA; V_I= 1.7 V

-

4.2

8.4

8.0

40

-

15.0

60.0



V_CC= 3.0 V to 3.6 V;

see Figure 10 to Figure 12

I_SW= 64 mA; V_I= 0 V

I_SW= 24 mA; V_I= 0 V

I_SW= 15 mA; V_I= 2.4 V

-

4.0

6.2

7.0

15

-

11.0

25.5



[1] Typical values are measured at T_amb= 25 C and nominal V_CC

.

[2] Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is

determined by the lower of the voltages of the two (A or B) terminals.

9.3 ON resistance test circuit and graphs

001aai109

11

R

ON

(Ω)

9

7

5

3

V

SW

V

CC

(1)

(2)

nOE

nAn

V

IL

nBn

(3)

(4)

GND

V

I

SW

l

0

0.5

1.0

1.5

2.0

2.5

V (V)

I

001aam034

R_ON= V_SW/ I_SW

.

(1) T_amb= 125 C.

(2) T_amb= 85 C.

(3)

T_amb= 25 C.

(4) T_amb= 40 C.

Fig 6. Test circuit for measuring ON resistance

(one channel)

Fig 7. ON resistance as a function of input voltage;

V_CC= 2.5 V; I_SW= 15 mA

74CBTLV16211

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Product data sheet

Rev. 6 — 15 December 2011

6 of 16

74CBTLV16211

NXP Semiconductors

24-bit bus switch

001aai110

001aai111

11

R

ON

R

ON

(Ω)

9

7

5

3

9

7

5

3

(1)

(2)

(1)

(2)

(3)

(4)

(3)

(4)

0

0.5

1.0

1.5

2.0

2.5

0

0.5

1.0

1.5

2.0

2.5

V (V)

I

V (V)

I

(1) T_amb= 125 C.

(2) _amb= 85 C.

(1) T_amb= 125 C.

(2) _amb= 85 C.

T

(3) T_amb= 25 C.

(4) T_amb= 40 C.

(3) T_amb= 25 C.

(4) T_amb= 40 C.

Fig 8. ON resistance as a function of input voltage;

V_CC= 2.5 V; I_SW= 24 mA

Fig 9. ON resistance as a function of input voltage;

V_CC= 2.5 V; I_SW= 64 mA

001aai105

001aai106

8

R

ON

R

ON

(Ω)

6

4

2

6

4

2

(1)

(2)

(1)

(2)

(3)

(4)

(3)

(4)

0

1

2

3

4

0

1

2

3

4

V (V)

I

V (V)

I

(1) T_amb= 125 C.

(2) _amb= 85 C.

(1) T_amb= 125 C.

(2) _amb= 85 C.

T

(3) T_amb= 25 C.

(4) T_amb= 40 C.

(3) T_amb= 25 C.

(4) T_amb= 40 C.

Fig 10. ON resistance as a function of input voltage;

V_CC= 3.3 V; I_SW= 15 mA

Fig 11. ON resistance as a function of input voltage;

V_CC= 3.3 V; I_SW= 24 mA

74CBTLV16211

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Product data sheet

Rev. 6 — 15 December 2011

7 of 16

74CBTLV16211

NXP Semiconductors

24-bit bus switch

001aai107

7.5

R

ON

(Ω)

6.5

5.5

4.5

3.5

2.5

(1)

(2)

(3)

(4)

0

1

2

3

4

V (V)

I

(1)

(2)

T

_amb= 125 C.

_amb= 85 C.

T

(3) T_amb= 25 C.

(4) T_amb= 40 C.

Fig 12. ON resistance as a function of input voltage; V_CC= 3.3 V; I_SW= 64 mA

10. Dynamic characteristics

Table 8.

Dynamic characteristics

GND = 0 V; for test circuit see Figure 15

Symbol Parameter Conditions

T_amb= 40 C to +85 C T_amb= 40 C to +125 C Unit

Min

Typ^[1]

Max

Min

Max

[2][3]

t_pd

t_en

t_dis

propagation delay nAn to nBn or nBn to

nAn; see Figure 13

V_CC= 2.3 V to 2.7 V

V_CC= 3.0 V to 3.6 V

-

0.13

0.2

-

0.2

ns

0.31

[4]

enable time

disable time

nOE to nAn or nBn;

see Figure 14

V_CC= 2.3 V to 2.7 V

V_CC= 3.0 V to 3.6 V

1.0

2.0

1.7

7.0

6.2

1.0

7.8

6.8

ns

[5]

nOE to nAn or nBn;

see Figure 14

V_CC= 2.3 V to 2.7 V

V_CC= 3.0 V to 3.6 V

1.0

2.6

3.0

7.2

7.7

1.0

8.1

8.8

ns

[1] All typical values are measured at T_amb= 25 C and at nominal V_CC

.

[2] The propagation delay is the calculated RC time constant of the on-state resistance of the switch and the load capacitance, when driven

by an ideal voltage source (zero output impedance).

[3] t_pdis the same as t_PLHand t_PHL

[4] _enis the same as t_PZHand t_PZL

.

t

.

[5] t_disis the same as t_PHZand t_PLZ

.

74CBTLV16211

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Product data sheet

Rev. 6 — 15 December 2011

8 of 16

74CBTLV16211

NXP Semiconductors

24-bit bus switch

11. Waveforms

V

I

V

M

input

0 V

M

t

PLH

PHL

V

OH

V

M

output

M

V

OL

001aai367

Measurement points are given in Table 9.

Logic levels: V_OLand V_OHare typical output voltage levels that occur with the output load.

Fig 13. The data input (nAn or nBn) to output (nBn or nAn) propagation delays

Table 9.

Measurement points

Supply voltage

V_CC

Input

V_M

Output

V_M

V_I

t_r= t_f

V_X

V_Y

2.3 V to 2.7 V

3.0 V to 3.6 V

0.5V_CC

V_CC

 2.0 ns

0.5V_CC

V_OL+ 0.15 V

V_OL+ 0.3 V

V_OH 0.15 V

V_OH 0.3 V

V

I

nOE input

output

V

M

GND

t

PZL

PLZ

V

CC

V

LOW-to-OFF

OFF-to-LOW

M

V

X

V

OL

t

PZH

PHZ

V

OH

V

Y

output

HIGH-to-OFF

OFF-to-HIGH

V

M

GND

switch

enabled

switch

disabled

switch

enabled

001aak860

Measurement points are given in Table 9.

Logic levels: V_OLand V_OHare typical output voltage levels that occur with the output load.

Fig 14. Enable and disable times

74CBTLV16211

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Product data sheet

Rev. 6 — 15 December 2011

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74CBTLV16211

NXP Semiconductors

24-bit bus switch

t

W

V

I

90 %

negative

pulse

V

M

10 %

0 V

t

r

f

t

f

r

V

I

90 %

positive

pulse

V

M

10 %

0 V

t

W

V

EXT

R

V

CC

L

V

O

I

G

DUT

R

T

C

L

R

L

001aae331

Test data is given in Table 10.

Definitions for test circuit:

R_L= Load resistance.

C_L= Load capacitance including jig and probe capacitance.

R_T= Termination resistance should be equal to the output impedance Z_oof the pulse generator.

V_EXT= External voltage for measuring switching times.

Fig 15. Test circuit for measuring switching times

Table 10. Test data

Supply voltage

V_CC

Load

C_L

V_EXT

R_L

t_PLH, t_PHL

open

t_PZH, t_PHZ

GND

t_PZL, t_PLZ

2V_CC

2.3 V to 2.7 V

3.0 V to 3.6 V

30 pF

50 pF

500 

open

GND

2V_CC

74CBTLV16211

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Product data sheet

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10 of 16

74CBTLV16211

NXP Semiconductors

24-bit bus switch

12. Package outline

TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm

SOT364-1

E

D

A

X

c

H

v

M

A

y

E

Z

56

29

Q

A

2

(A )

3

A

1

pin 1 index

θ

L

p

L

detail X

1

28

w

M

b

e

p

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions).

A

(1)

(2)

UNIT

A

b

c

D

E

e

H

E

L

p

Q

v

w

y

Z

θ

1

2

3

p

max.

8^o

0^o

0.15

0.05

1.05

0.85

0.28

0.17

0.2

0.1

14.1

13.9

6.2

6.0

8.3

7.9

0.8

0.4

0.50

0.35

0.5

0.1

mm

1.2

0.5

1

0.25

0.08

0.1

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-19

SOT364-1

MO-153

Fig 16. Package outline SOT364-1 (TSSOP56)

74CBTLV16211

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Product data sheet

Rev. 6 — 15 December 2011

11 of 16

74CBTLV16211

NXP Semiconductors

24-bit bus switch

TSSOP56: plastic thin shrink small outline package; 56 leads; body width 4.4 mm

SOT481-2

E

A

D

X

c

y

H

E

v

M

A

Z

29

56

A

(A )

3

2

A

1

pin 1 index

θ

L

p

L

detail X

1

28

w

M

b

p

e

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

(2)

(1)

UNIT

A

b

c

D

E

e

H

L

p

v

w

y

Z

θ

1

2

3

p

E

max.

8^o

0^o

0.15

0.05

1.05

0.80

0.23

0.13

0.20

0.09

11.4

11.2

4.5

4.3

6.6

6.2

0.75

0.45

0.4

0.1

mm

1.2

0.4

0.25

1

0.2

0.07

0.08

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

01-11-24

SOT481-2

- - -

MO-194

- - -

Fig 17. Package outline SOT481-2 (TSSOP56)

74CBTLV16211

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 6 — 15 December 2011

12 of 16

74CBTLV16211

NXP Semiconductors

24-bit bus switch

13. Abbreviations

Table 11. Abbreviations

Acronym

CDM

Description

Charged Device Model

Complementary Metal-Oxide Semiconductor

Device Under Test

CMOS

DUT

ESD

ElectroStatic Discharge

Human Body Model

HBM

MM

Machine Model

14. Revision history

Table 12. Revision history

Document ID

Release date

20111215

Data sheet status

Change notice

Supersedes

74CBTLV16211 v.6

Modifications:

Product data sheet

-

74CBTLV16211 v.5

• Legal pages updated.

74CBTLV16211 v.5

74CBTLV16211 v.4

74CBTLV16211 v.3

74CBTLV16211 v.2

74CBTLV16211 v.1

20101230

20100816

20100112

20090826

20080620

Product data sheet

-

74CBTLV16211 v.4

74CBTLV16211 v.3

74CBTLV16211 v.2

74CBTLV16211 v.1

-

Product data sheet

74CBTLV16211

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 6 — 15 December 2011

13 of 16

74CBTLV16211

NXP Semiconductors

24-bit bus switch

15. Legal information

15.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

malfunction of an NXP Semiconductors product can reasonably be expected

15.2 Definitions

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

15.3 Disclaimers

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

74CBTLV16211

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 6 — 15 December 2011

14 of 16

74CBTLV16211

NXP Semiconductors

24-bit bus switch

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

15.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

16. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

74CBTLV16211

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 6 — 15 December 2011

15 of 16

74CBTLV16211

NXP Semiconductors

24-bit bus switch

17. Contents

1

2

3

4

General description. . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

5

5.1

5.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

6

7

8

Functional description . . . . . . . . . . . . . . . . . . . 4

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Recommended operating conditions. . . . . . . . 4

9

Static characteristics. . . . . . . . . . . . . . . . . . . . . 5

Test circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

ON resistance. . . . . . . . . . . . . . . . . . . . . . . . . . 6

ON resistance test circuit and graphs. . . . . . . . 6

9.1

9.2

9.3

10

11

12

13

14

Dynamic characteristics . . . . . . . . . . . . . . . . . . 8

Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13

15

Legal information. . . . . . . . . . . . . . . . . . . . . . . 14

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

15.1

15.2

15.3

15.4

16

17

Contact information. . . . . . . . . . . . . . . . . . . . . 15

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 15 December 2011

Document identifier: 74CBTLV16211


型号：	935284847118
厂家：	NXP
描述：	CBTLV/3B SERIES, DUAL 24-BIT DRIVER, TRUE OUTPUT, PDSO56, 4.40 MM, PLASTIC, MO-194, SOT481-1, TSSOP-56 驱动光电二极管输出元件逻辑集成电路
文件：	总16页 (文件大小：152K)
中文：	中文翻译
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