935286881118 [NXP]

LED DISPLAY DRIVER, PDSO8, 3 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-229, SOT-908-1, HVSON-8;
935286881118
型号: 935286881118
厂家: NXP    NXP
描述:

LED DISPLAY DRIVER, PDSO8, 3 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-229, SOT-908-1, HVSON-8

驱动 光电二极管
文件: 总26页 (文件大小:146K)
中文:  中文翻译
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PCA9553  
4-bit I2C-bus LED driver with programmable blink rates  
Rev. 06 — 29 December 2008  
Product data sheet  
1. General description  
The PCA9553 LED blinker blinks LEDs in I2C-bus and SMBus applications where it is  
necessary to limit bus traffic or free up the I2C-bus master's (MCU, MPU, DSP, chip set,  
etc.) timer. The uniqueness of this device is the internal oscillator with two programmable  
blink rates. To blink LEDs using normal I/O expanders like the PCF8574 or PCA9554, the  
bus master must send repeated commands to turn the LED on and off. This greatly  
increases the amount of traffic on the I2C-bus and uses up one of the master's timers. The  
PCA9553 LED blinker instead requires only the initial set-up command to program  
BLINK RATE 1 and BLINK RATE 2 (i.e., the frequency and duty cycle). From then on, only  
one command from the bus master is required to turn each individual open-drain output  
ON, OFF, or to cycle at BLINK RATE 1 or BLINK RATE 2. Maximum output sink current is  
25 mA per bit and 100 mA per package.  
Any bits not used for controlling the LEDs can be used for General Purpose Parallel  
Input/Output (GPIO) expansion.  
Power-On Reset (POR) initializes the registers to their default state, all zeroes, causing  
the bits to be set HIGH (LED off).  
Due to pin limitations, the PCA9553 is not featured with hardware address pins. The  
PCA9553/01 and the PCA9553/02 have different fixed I2C-bus addresses allowing  
operation of both on the same bus.  
2. Features  
I 4 LED drivers (on, off, flashing at a programmable rate)  
I 2 selectable, fully programmable blink rates (frequency and duty cycle) between  
0.172 Hz and 44 Hz (5.82 seconds and 0.023 seconds)  
I Input/outputs not used as LED drivers can be used as regular GPIOs  
I Internal oscillator requires no external components  
I I2C-bus interface logic compatible with SMBus  
I Internal power-on reset  
I Noise filter on SCL/SDA inputs  
I 4 open-drain outputs directly drive LEDs to 25 mA  
I Controlled edge rates to minimize ground bounce  
I No glitch on power-up  
I Supports hot insertion  
I Low standby current  
I Operating power supply voltage range of 2.3 V to 5.5 V  
I 0 Hz to 400 kHz clock frequency  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
I ESD protection exceeds 2000 V HBM per JESD22-A114, 150 V MM per  
JESD22-A115 and 1000 V CDM per JESD22-C101  
I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA  
I Packages offered: SO8, TSSOP8 (MSOP8), HVSON8  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Name  
SO8  
Description  
Version  
PCA9553D/01  
PCA9553D/02  
plastic small outline package; 8 leads;  
body width 3.9 mm  
SOT96-1  
PCA9553DP/01 TSSOP8[1] plastic thin shrink small outline package; 8 leads;  
SOT505-1  
SOT908-1  
body width 3 mm  
PCA9553DP/02  
PCA9553TK[2]  
PCA9553TK/02  
HVSON8 plastic thermal enhanced very thin small outline  
package; no leads; 8 terminals; body 3 × 3 × 0.85 mm  
[1] Also known as MSOP8.  
[2] PCA9553TK uses version /01 address.  
4. Marking  
Table 2.  
Marking codes  
Type number  
PCA9553D/01  
PCA9553D/02  
PCA9553DP/01  
PCA9553DP/02  
PCA9553TK  
Marking code  
9553/1  
9553/2  
P53/1  
P53/2  
P53/1  
PCA9553TK/02  
P53/2  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
2 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
5. Block diagram  
PCA9553  
INPUT  
REGISTER  
2
SCL  
SDA  
INPUT  
FILTERS  
I C-BUS  
LED SELECT (LSn)  
REGISTER  
CONTROL  
0
1
POWER-ON  
RESET  
LEDn  
V
DD  
BLINK0  
BLINK1  
PRESCALER 0  
REGISTER  
PWM0  
REGISTER  
PRESCALER 1  
REGISTER  
PWM1  
REGISTER  
OSCILLATOR  
V
SS  
002aad745  
Only one I/O shown for clarity.  
Fig 1. Block diagram  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
3 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
6. Pinning information  
6.1 Pinning  
1
2
3
4
8
7
6
5
LED0  
LED1  
LED2  
V
DD  
1
2
3
4
8
7
6
5
LED0  
LED1  
LED2  
V
DD  
SDA  
SCL  
PCA9553D/01  
PCA9553D/02  
SDA  
SCL  
PCA9553DP/01  
PCA9553DP/02  
V
SS  
LED3  
V
SS  
LED3  
002aad679  
002aad678  
Fig 2. Pin configuration for SO8  
Fig 3. Pin configuration for TSSOP8  
PCA9553TK  
PCA9553TK/02  
terminal 1  
index area  
LED0  
LED1  
LED2  
1
2
3
4
8
7
6
5
V
DD  
SDA  
SCL  
V
LED3  
SS  
002aad680  
Transparent top view  
Fig 4. Pin configuration for HVSON8  
6.2 Pin description  
Table 3.  
Pin description  
Symbol  
LED0  
LED1  
LED2  
VSS  
Pin  
1
Description  
LED driver 0  
LED driver 1  
LED driver 2  
supply ground  
LED driver 3  
serial clock line  
serial data line  
supply voltage  
2
3
4[1]  
LED3  
SCL  
5
6
SDA  
7
VDD  
8
[1] HVSON8 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must  
be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board  
level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad  
on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the  
PCB in the thermal pad region.  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
4 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
7. Functional description  
Refer to Figure 1 “Block diagram”.  
7.1 Device address  
Following a START condition the bus master must output the address of the slave it is  
accessing. The address of the PCA9553/01 is shown in Figure 5 and PCA9553/02 in  
Figure 6.  
PCA9553TK uses the version /01 address.  
slave address  
slave address  
1
1
0
0
0
1
0
R/W  
1
1
0
0
0
1
1
R/W  
002aad742  
002aad743  
Fig 5. PCA9553/01 slave address  
Fig 6. PCA9553/02 slave address  
The last bit of the address byte defines the operation to be performed. When set to logic 1  
a read is selected, while a logic 0 selects a write operation.  
7.2 Control register  
Following the successful acknowledgement of the slave address, the bus master will send  
a byte to the PCA9553 which will be stored in the Control register.  
0
0
0
AI  
0
B2 B1 B0  
register address  
002aad744  
Auto-Increment  
flag  
Reset state: 00h  
Fig 7. Control register  
The lowest 3 bits are used as a pointer to determine which register will be accessed.  
If the Auto-Increment flag is set, the three low order bits of the Control register are  
automatically incremented after a read or write. This allows the user to program the  
registers sequentially. The contents of these bits will rollover to ‘000’ after the last register  
is accessed.  
When the Auto-Increment flag is set (AI = 1) and a read sequence is initiated, the  
sequence must start by reading a register different from ‘0’ (B2 B1 B0 0 0 0).  
Only the 3 least significant bits are affected by the AI flag.  
Unused bits must be programmed with zeroes.  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
5 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
Table 4.  
Control register definition  
B2  
0
B1  
0
B0  
0
Register name  
INPUT  
PSC0  
Type  
Register function  
input register  
read  
0
0
1
read/write  
read/write  
read/write  
read/write  
read/write  
frequency prescaler 0  
PWM register 0  
frequency prescaler 1  
PWM register 1  
LED selector  
0
1
0
PWM0  
PSC1  
0
1
1
1
0
0
PWM1  
LS0  
1
0
1
7.3 Register descriptions  
7.3.1 INPUT - Input register  
The INPUT register reflects the state of the device pins. Writes to this register will be  
acknowledged but will have no effect.  
Table 5.  
Bit  
INPUT - Input register description  
7
6
5
4
3
LED3  
X
2
LED2  
X
1
LED1  
X
0
LED0  
X
Symbol INPUT[7] INPUT[6] INPUT[5] INPUT[4]  
Default  
0
0
0
0
Remark: The default value ‘X’ is determined by the externally applied logic level (normally  
logic 1) when used for directly driving LED with pull-up to VDD  
.
7.3.2 PSC0 - Frequency Prescaler 0  
PSC0 is used to program the period of the PWM output.  
The period of BLINK0 = (PSC0 + 1) / 44.  
Table 6.  
Bit  
PSC0 - Frequency Prescaler 0 register description  
7
6
5
4
3
2
1
0
Symbol  
Default  
PSC0[7] PSC0[6] PSC0[5] PSC0[4] PSC0[3] PSC0[2] PSC0[1] PSC0[0]  
1
1
1
1
1
1
1
1
7.3.3 PWM0 - Pulse Width Modulation 0  
The PWM0 register determines the duty cycle of BLINK0. The outputs are LOW (LED off)  
when the count is less than the value in PWM0 and HIGH when it is greater. If PWM0 is  
programmed with 00h, then the PWM0 output is always LOW.  
The duty cycle of BLINK0 = (256 PWM0) / 256.  
Table 7.  
Bit  
PWM0 - Pulse Width Modulation 0 register description  
7
6
5
4
3
2
1
0
Symbol  
PWM0  
[7]  
PWM0  
[6]  
PWM0  
[5]  
PWM0  
[4]  
PWM0  
[3]  
PWM0  
[2]  
PWM0  
[1]  
PWM0  
[0]  
Default  
1
0
0
0
0
0
0
0
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
6 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
7.3.4 PSC1 - Frequency Prescaler 1  
PSC1 is used to program the period of the PWM output.  
The period of BLINK1 = (PSC1 + 1) / 44.  
Table 8.  
Bit  
PSC1 - Frequency Prescaler 1 register description  
7
6
5
4
3
2
1
0
Symbol  
Default  
PSC1[7] PSC1[6] PSC1[5] PSC1[4] PSC1[3] PSC1[2] PSC1[1] PSC1[0]  
1
1
1
1
1
1
1
1
7.3.5 PWM1 - Pulse Width Modulation 1  
The PWM1 register determines the duty cycle of BLINK1. The outputs are LOW (LED off)  
when the count is less than the value in PWM1 and HIGH when it is greater. If PWM1 is  
programmed with 00h, then the PWM1 output is always LOW.  
The duty cycle of BLINK1 = (256 PWM1) / 256.  
Table 9.  
Bit  
PWM1 - Pulse Width Modulation 1 register description  
7
6
5
4
3
2
1
0
Symbol  
PWM1  
[7]  
PWM1  
[6]  
PWM1  
[5]  
PWM1  
[4]  
PWM1  
[3]  
PWM1  
[2]  
PWM1  
[1]  
PWM1  
[0]  
Default  
1
0
0
0
0
0
0
0
7.3.6 LS0 - LED selector register  
The LS0 LED select register determines the source of the LED data.  
00 = output is set LOW (LED on)  
01 = output is set high-impedance (LED off; default)  
10 = output blinks at PWM0 rate  
11 = output blinks at PWM1 rate  
Table 10. LS0 - LED selector register bit description  
Legend: * default value.  
Register  
Bit  
Value  
Description  
LS0 - LED0 to LED3 selector  
LS0  
7:6  
5:4  
3:2  
1:0  
01*  
01*  
01*  
01*  
LED3 selected  
LED2 selected  
LED1 selected  
LED0 selected  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
7 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
7.4 Pins used as general purpose I/Os  
LED pins not used to control LEDs can be used as general purpose I/Os.  
For use as input: Set LEDn to high-impedance (01) and then read the pin state via the  
Input register.  
For use as output: Connect external pull-up resistor to the pin and size it according to the  
DC recommended operating characteristics. LED output pin is HIGH when the output is  
programmed as high-impedance, and LOW when the output is programmed LOW through  
the ‘LED selector’ register. The output can be pulse-width controlled when PWM0 or  
PWM1 are used.  
7.5 Power-on reset  
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9553 in  
a reset condition until VDD has reached VPOR. At that point, the reset condition is released  
and the PCA9553 registers are initialized to their default states, with all outputs in the OFF  
state. Thereafter, VDD must be lowered below 0.2 V to reset the device.  
8. Characteristics of the I2C-bus  
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two  
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be  
connected to a positive supply via a pull-up resistor when connected to the output stages  
of a device. Data transfer may be initiated only when the bus is not busy.  
8.1 Bit transfer  
One data bit is transferred during each clock pulse. The data on the SDA line must remain  
stable during the HIGH period of the clock pulse as changes in the data line at this time  
will be interpreted as control signals (see Figure 8).  
SDA  
SCL  
data line  
stable;  
data valid  
change  
of data  
allowed  
mba607  
Fig 8. Bit transfer  
8.1.1 START and STOP conditions  
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW  
transition of the data line while the clock is HIGH is defined as the START condition (S). A  
LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP  
condition (P) (see Figure 9).  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
8 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
SDA  
SCL  
SDA  
SCL  
S
P
STOP condition  
mba608  
START condition  
Fig 9. Definition of START and STOP conditions  
8.2 System configuration  
A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The  
device that controls the message is the ‘master’ and the devices which are controlled by  
the master are the ‘slaves’ (see Figure 10).  
SDA  
SCL  
SLAVE  
TRANSMITTER/  
RECEIVER  
MASTER  
TRANSMITTER/  
RECEIVER  
MASTER  
TRANSMITTER/  
RECEIVER  
2
SLAVE  
RECEIVER  
MASTER  
TRANSMITTER  
I C-BUS  
MULTIPLEXER  
SLAVE  
002aaa966  
Fig 10. System configuration  
8.3 Acknowledge  
The number of data bytes transferred between the START and the STOP conditions from  
transmitter to receiver is not limited. Each byte of eight bits is followed by one  
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,  
whereas the master generates an extra acknowledge related clock pulse.  
A slave receiver which is addressed must generate an acknowledge after the reception of  
each byte. Also a master must generate an acknowledge after the reception of each byte  
that has been clocked out of the slave transmitter. The device that acknowledges has to  
pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable  
LOW during the HIGH period of the acknowledge related clock pulse; set-up time and hold  
time must be taken into account.  
A master receiver must signal an end of data to the transmitter by not generating an  
acknowledge on the last byte that has been clocked out of the slave. In this event, the  
transmitter must leave the data line HIGH to enable the master to generate a STOP  
condition.  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
9 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
data output  
by transmitter  
not acknowledge  
acknowledge  
data output  
by receiver  
SCL from master  
1
2
8
9
S
clock pulse for  
START  
condition  
acknowledgement  
002aaa987  
Fig 11. Acknowledgement on the I2C-bus  
8.4 Bus transactions  
SCL  
1
2
3
4
5
6
7
8
9
slave address  
command byte  
AI B2 B1 B0  
data to register  
DATA 1  
SDA  
S
1
1
0
0
0
1
0
0
A
0
0
0
0
A
A
START condition  
R/W acknowledge  
from slave  
acknowledge  
from slave  
acknowledge  
from slave  
write to register  
t
v(Q)  
data out from port  
DATA 1 VALID  
002aad746  
Fig 12. Write to register  
slave address  
command byte  
AI B2 B1 B0 A  
(cont.)  
SDA  
S
1
1
0
0
0
1
0
0
A
0
0
0
0
START condition  
R/W  
acknowledge  
from slave  
acknowledge  
from slave  
slave address  
data from register  
DATA (first byte)  
data from register  
DATA (last byte)  
(cont.)  
S
1
1
0
0
0
1
0
1
A
A
NA P  
Auto-Increment  
register address  
if AI = 1  
(repeated)  
START condition  
R/W  
acknowledge  
from master  
no acknowledge STOP  
from master condition  
acknowledge  
from slave  
at this moment master-transmitter becomes master-receiver  
and slave-receiver becomes slave-transmitter  
002aad747  
Fig 13. Read from register  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
10 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
no acknowledge  
from master  
slave address  
data from port  
DATA 1  
data from port  
DATA 4  
SDA  
S
1
1
0
0
0
1
0
1
A
A
NA  
P
START condition  
R/W acknowledge  
from slave  
acknowledge  
from master  
STOP  
condition  
read from  
port  
t
t
su(D)  
h(D)  
data into  
port  
DATA 2  
DATA 3  
DATA 4  
002aad748  
This figure assumes the command byte has previously been programmed with 00h.  
PCA9553/01 shown.  
Fig 14. Read input port register  
9. Application design-in information  
5 V  
5 V  
10 kΩ  
10 kΩ  
2
I C-BUS/SMBus  
V
DD  
MASTER  
SDA  
SDA  
SCL  
LED0  
LED1  
LED2  
LED3  
SCL  
PCA9553  
V
SS  
002aad749  
Fig 15. Typical application  
9.1 Minimizing IDD when the I/Os are used to control LEDs  
When the I/Os are used to control LEDs, they are normally connected to VDD through a  
resistor as shown in Figure 15. Since the LED acts as a diode, when the LED is off the I/O  
VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI becomes lower  
than VDD and is specified as IDD in Table 13 “Static characteristics”.  
Designs needing to minimize current consumption, such as battery power applications,  
should consider maintaining the I/O pins greater than or equal to VDD when the LED is off.  
Figure 16 shows a high value resistor in parallel with the LED. Figure 17 shows VDD less  
than the LED supply voltage by at least 1.2 V. Both of these methods maintain the I/O VI at  
or above VDD and prevents additional supply current consumption when the LED is off.  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
11 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
3.3 V  
5 V  
V
DD  
V
100 kΩ  
V
DD  
DD  
LED  
LED  
LEDn  
LEDn  
002aac189  
002aac190  
Fig 16. High value resistor in parallel with  
the LED  
Fig 17. Device supplied by a lower voltage  
9.2 Programming example  
The following example shows how to set LED0 and LED1 off. It will then set LED2 to blink  
at 1 Hz, 50 % duty cycle. LED3 will be set to blink at 4 Hz, 25 % duty cycle. PCA9553/01  
is used in this example.  
Table 11. Programming PCA9553  
Program sequence  
I2C-bus  
S
START  
PCA9553 address  
C4h  
11h  
PSC0 subaddress + Auto-Increment  
Set prescaler PSC0 to achieve a period of 1 second:  
PSC0 + 1  
2Bh  
Blink period = 1 =  
-----------------------  
44  
PSC0 = 43  
Set PWM0 duty cycle to 50 %:  
80h  
0Ah  
C0h  
256 PWM0  
= 0.5  
--------------------------------  
256  
PWM0 = 128  
Set prescaler PSC1 to achieve a period of 0.25 seconds:  
PSC1 + 1  
Blink period = 0.25 =  
-----------------------  
44  
PSC1 = 10  
Set PWM1 output duty cycle to 25 %:  
256 PWM1  
= 0.25  
--------------------------------  
256  
PWM1 = 192  
Set LED0 on, LED1 off, LED2 set to blink at PSC0, PWM0, LED3 set to blink at E4h  
PSC1, PWM1  
STOP  
P
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
12 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
10. Limiting values  
Table 12. Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VDD  
Parameter  
Conditions  
Min  
Max  
+6.0  
5.5  
Unit  
V
supply voltage  
0.5  
VI/O  
voltage on an input/output pin  
output current on pin LEDn  
ground supply current  
total power dissipation  
storage temperature  
ambient temperature  
V
SS 0.5  
V
IO(LEDn)  
ISS  
-
±25  
100  
400  
+150  
+85  
mA  
mA  
mW  
°C  
-
Ptot  
-
Tstg  
65  
40  
Tamb  
operating  
°C  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
13 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
11. Static characteristics  
Table 13. Static characteristics  
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = 40 °C to +85 °C; unless otherwise specified.  
Symbol Parameter  
Supplies  
Conditions  
Min  
Typ[1]  
Max  
Unit  
VDD  
IDD  
supply voltage  
supply current  
2.3  
-
-
5.5  
V
operating mode; VDD = 5.5 V; no load;  
VI = VDD or VSS; fSCL = 100 kHz  
350  
500  
µA  
Istb  
standby current  
Standby mode; VDD = 5.5 V; no load;  
VI = VDD or VSS; fSCL = 100 kHz  
-
-
1.9  
-
3.0  
µA  
µA  
IDD  
additional quiescent  
supply current  
Standby mode; VDD = 5.5 V;  
every LED I/O at VI = 4.3 V;  
325  
fSCL = 0 kHz  
[2]  
VPOR  
power-on reset voltage  
no load; VI = VDD or VSS  
-
1.7  
2.2  
V
Input SCL; input/output SDA  
VIL  
VIH  
IOL  
IL  
LOW-level input voltage  
HIGH-level input voltage  
LOW-level output current  
leakage current  
0.5  
-
+0.3VDD  
V
0.7VDD  
-
5.5  
-
V
VOL = 0.4 V  
VI = VDD = VSS  
VI = VSS  
3
6.5  
-
mA  
µA  
pF  
1  
-
+1  
5
Ci  
input capacitance  
3.7  
I/Os  
VIL  
VIH  
IOL  
LOW-level input voltage  
HIGH-level input voltage  
LOW-level output current  
0.5  
-
-
+0.8  
5.5  
V
V
2.0  
VOL = 0.4 V  
[3]  
[3]  
[3]  
VDD = 2.3 V  
9
-
-
-
-
-
-
mA  
mA  
mA  
VDD = 3.0 V  
12  
15  
VDD = 5.0 V  
VOL = 0.7 V  
[3]  
[3]  
[3]  
VDD = 2.3 V  
15  
20  
25  
1  
-
-
-
mA  
mA  
mA  
µA  
VDD = 3.0 V  
-
-
VDD = 5.0 V  
-
-
ILI  
input leakage current  
VDD = 3.6 V; VI = 0 V or VDD  
-
+1  
5
Cio  
input/output capacitance  
2.1  
pF  
[1] Typical limits at VDD = 3.3 V, Tamb = 25 °C.  
[2] VDD must be lowered to 0.2 V in order to reset part.  
[3] Each I/O must be externally limited to a maximum of 25 mA and the device must be limited to a maximum current of 100 mA.  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
14 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
002aac191  
002aac192  
20 %  
(1)  
20 %  
(1)  
percent  
percent  
variation  
variation  
0 %  
(2)  
0 %  
20 %  
40 %  
(2)  
(3)  
20 %  
(3)  
40 %  
40  
20  
0
20  
40  
60  
80  
amb  
100  
(°C)  
40  
20  
0
20  
40  
60  
80  
amb  
100  
(°C)  
T
T
(1) maximum  
(2) average  
(3) minimum  
(1) maximum  
(2) average  
(3) minimum  
Fig 18. Typical frequency variation over process at  
DD = 2.3 V to 3.0 V  
Fig 19. Typical frequency variation over process at  
VDD = 3.0 V to 5.5 V  
V
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
15 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
12. Dynamic characteristics  
Table 14. Dynamic characteristics  
Symbol  
Parameter  
Conditions  
Standard-mode  
I2C-bus  
Fast-mode I2C-bus Unit  
Min  
0
Max  
100  
-
Min  
0
Max  
400  
-
fSCL  
tBUF  
SCL clock frequency  
kHz  
bus free time between a STOP and  
START condition  
4.7  
1.3  
µs  
tHD;STA  
tSU;STA  
hold time (repeated) START condition  
4.0  
4.7  
-
-
0.6  
0.6  
-
-
µs  
µs  
set-up time for a repeated START  
condition  
tSU;STO  
tHD;DAT  
tVD;ACK  
tVD;DAT  
set-up time for STOP condition  
data hold time  
4.0  
-
-
0.6  
-
-
µs  
ns  
ns  
ns  
ns  
ns  
µs  
µs  
ns  
ns  
ns  
0
0
[1]  
[2]  
[2]  
data valid acknowledge time  
data valid time  
-
600  
600  
1500  
-
-
600  
600  
600  
-
LOW-level  
HIGH-level  
-
-
-
-
tSU;DAT  
tLOW  
tHIGH  
tr  
data set-up time  
250  
4.7  
4.0  
-
100  
1.3  
LOW period of the SCL clock  
HIGH period of the SCL clock  
rise time of both SDA and SCL signals  
fall time of both SDA and SCL signals  
-
-
-
0.6  
-
[3]  
[3]  
1000  
300  
50  
20 + 0.1Cb  
20 + 0.1Cb  
-
300  
300  
50  
tf  
-
tSP  
pulse width of spikes that must be  
suppressed by the input filter  
-
Port timing  
tv(Q)  
data output valid time  
data input set-up time  
data input hold time  
-
100  
1
200  
-
100  
1
200  
ns  
ns  
µs  
tsu(D)  
-
-
-
-
th(D)  
[1] tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW.  
[2] tVD;DAT = minimum time for SDA data output to be valid following SCL LOW.  
[3] Cb = total capacitance of one bus line in pF.  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
16 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
SDA  
t
t
t
t
SP  
t
r
f
HD;STA  
BUF  
t
LOW  
SCL  
t
t
t
SU;STO  
HD;STA  
SU;STA  
t
t
t
SU;DAT  
HD;DAT  
HIGH  
P
S
Sr  
P
002aaa986  
Fig 20. Definition of timing  
START  
condition  
(S)  
bit 7  
MSB  
(A7)  
STOP  
condition  
(P)  
bit 6  
(A6)  
bit 1  
(D1)  
bit 0  
(D0)  
acknowledge  
(A)  
protocol  
t
t
t
HIGH  
SU;STA  
LOW  
1 / f  
SCL  
SCL  
SDA  
t
t
BUF  
f
t
r
t
t
t
t
t
t
HD;DAT  
VD;DAT  
VD;ACK  
SU;STO  
002aab285  
HD;STA  
SU;DAT  
Rise and fall times refer to VIL and VIH.  
Fig 21. I2C-bus timing diagram  
13. Test information  
V
open  
DD  
V
SS  
V
R
500 Ω  
DD  
L
V
V
O
I
PULSE  
DUT  
GENERATOR  
C
50 pF  
L
R
T
002aab880  
RL = load resistor for LEDn. RL for SDA and SCL > 1 k(3 mA or less current).  
CL = load capacitance includes jig and probe capacitance.  
RT = termination resistance should be equal to the output impedance Zo of the pulse generators.  
Fig 22. Test circuitry for switching times  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
17 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
14. Package outline  
SO8: plastic small outline package; 8 leads; body width 3.9 mm  
SOT96-1  
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
4
e
w
M
detail X  
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(2)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
5.0  
4.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.05  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.20  
0.014 0.0075 0.19  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches 0.069  
0.01 0.004  
Notes  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-18  
SOT96-1  
076E03  
MS-012  
Fig 23. Package outline SOT96-1 (SO8)  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
18 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm  
SOT505-1  
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
A
(A )  
2
A
3
A
1
pin 1 index  
θ
L
p
L
1
4
detail X  
e
w M  
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT  
v
w
y
Z
θ
1
2
3
p
max.  
0.15  
0.05  
0.95  
0.80  
0.45  
0.25  
0.28  
0.15  
3.1  
2.9  
3.1  
2.9  
5.1  
4.7  
0.7  
0.4  
0.70  
0.35  
6°  
0°  
mm  
1.1  
0.65  
0.25  
0.94  
0.1  
0.1  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-04-09  
03-02-18  
SOT505-1  
Fig 24. Package outline SOT505-1 (TSSOP8)  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
19 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
HVSON8: plastic thermal enhanced very thin small outline package; no leads;  
8 terminals; body 3 x 3 x 0.85 mm  
SOT908-1  
0
1
2 mm  
scale  
X
D
B
A
E
A
A
1
c
detail X  
terminal 1  
index area  
e
1
terminal 1  
index area  
C
M
M
v
C
C
A
B
e
b
y
y
w
C
1
1
4
L
exposed tie bar (4×)  
E
h
exposed tie bar (4×)  
8
5
D
h
DIMENSIONS (mm are the original dimensions)  
(1)  
A
max.  
(1)  
(1)  
UNIT  
A
b
E
e
e
y
c
D
D
E
L
v
w
y
1
1
h
1
h
0.05  
0.00  
0.3  
0.2  
3.1  
2.9  
2.25  
1.95  
3.1  
2.9  
1.65  
1.35  
0.5  
0.3  
mm  
0.05  
0.1  
1
0.2  
0.5  
1.5  
0.1  
0.05  
Note  
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
05-09-26  
05-10-05  
SOT908-1  
MO-229  
Fig 25. Package outline SOT908-1 (HVSON8)  
PCA9553_6  
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Product data sheet  
Rev. 06 — 29 December 2008  
20 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
15. Handling information  
All input and output pins are protected against ElectroStatic Discharge (ESD) under  
normal handling. When handling ensure that the appropriate precautions are taken as  
described in JESD625-A or equivalent standards.  
16. Soldering of SMD packages  
This text provides a very brief insight into a complex technology. A more in-depth account  
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow  
soldering description”.  
16.1 Introduction to soldering  
Soldering is one of the most common methods through which packages are attached to  
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both  
the mechanical and the electrical connection. There is no single soldering method that is  
ideal for all IC packages. Wave soldering is often preferred when through-hole and  
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not  
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high  
densities that come with increased miniaturization.  
16.2 Wave and reflow soldering  
Wave soldering is a joining technology in which the joints are made by solder coming from  
a standing wave of liquid solder. The wave soldering process is suitable for the following:  
Through-hole components  
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board  
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless  
packages which have solder lands underneath the body, cannot be wave soldered. Also,  
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,  
due to an increased probability of bridging.  
The reflow soldering process involves applying solder paste to a board, followed by  
component placement and exposure to a temperature profile. Leaded packages,  
packages with solder balls, and leadless packages are all reflow solderable.  
Key characteristics in both wave and reflow soldering are:  
Board specifications, including the board finish, solder masks and vias  
Package footprints, including solder thieves and orientation  
The moisture sensitivity level of the packages  
Package placement  
Inspection and repair  
Lead-free soldering versus SnPb soldering  
16.3 Wave soldering  
Key characteristics in wave soldering are:  
© NXP B.V. 2008. All rights reserved.  
PCA9553_6  
Product data sheet  
Rev. 06 — 29 December 2008  
21 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
Process issues, such as application of adhesive and flux, clinching of leads, board  
transport, the solder wave parameters, and the time during which components are  
exposed to the wave  
Solder bath specifications, including temperature and impurities  
16.4 Reflow soldering  
Key characteristics in reflow soldering are:  
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to  
higher minimum peak temperatures (see Figure 26) than a SnPb process, thus  
reducing the process window  
Solder paste printing issues including smearing, release, and adjusting the process  
window for a mix of large and small components on one board  
Reflow temperature profile; this profile includes preheat, reflow (in which the board is  
heated to the peak temperature) and cooling down. It is imperative that the peak  
temperature is high enough for the solder to make reliable solder joints (a solder paste  
characteristic). In addition, the peak temperature must be low enough that the  
packages and/or boards are not damaged. The peak temperature of the package  
depends on package thickness and volume and is classified in accordance with  
Table 15 and 16  
Table 15. SnPb eutectic process (from J-STD-020C)  
Package thickness (mm) Package reflow temperature (°C)  
Volume (mm3)  
< 350  
235  
350  
220  
< 2.5  
2.5  
220  
220  
Table 16. Lead-free process (from J-STD-020C)  
Package thickness (mm) Package reflow temperature (°C)  
Volume (mm3)  
< 350  
260  
350 to 2000  
> 2000  
260  
< 1.6  
260  
250  
245  
1.6 to 2.5  
> 2.5  
260  
245  
250  
245  
Moisture sensitivity precautions, as indicated on the packing, must be respected at all  
times.  
Studies have shown that small packages reach higher temperatures during reflow  
soldering, see Figure 26.  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
22 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
maximum peak temperature  
= MSL limit, damage level  
temperature  
minimum peak temperature  
= minimum soldering temperature  
peak  
temperature  
time  
001aac844  
MSL: Moisture Sensitivity Level  
Fig 26. Temperature profiles for large and small components  
For further information on temperature profiles, refer to Application Note AN10365  
“Surface mount reflow soldering description”.  
17. Abbreviations  
Table 17. Abbreviations  
Acronym  
AI  
Description  
Auto-Increment  
CDM  
DSP  
Charged-Device Model  
Digital Signal Processor  
ElectroStatic Discharge  
General Purpose Input/Output  
Human Body Model  
Inter-Integrated Circuit bus  
Input/Output  
ESD  
GPIO  
HBM  
I2C-bus  
I/O  
LED  
Light Emitting Diode  
MicroController Unit  
Machine Model  
MCU  
MM  
MPU  
PCB  
MicroProcessor Unit  
Printed-Circuit Board  
Power-On Reset  
POR  
PWM  
SMBus  
Pulse Width Modulation  
System Management Bus  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
23 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
18. Revision history  
Table 18. Revision history  
Document ID  
PCA9553_6  
Modifications:  
Release date  
Data sheet status  
Change notice  
Supersedes  
20081229  
Product data sheet  
-
PCA9553_5  
Table 2 “Marking codes”:  
marking code for type number PCA9553D/01 changed from “P9553/1” to “9553/1”  
marking code for type number PCA9553D/02 changed from “P9553/2” to “9553/2”  
marking code for type number PCA9553TK changed from “P53” to “P53/1”  
PCA9553_5  
PCA9553_4  
20080422  
20060818  
20041001  
Product data sheet  
Product data sheet  
Product data sheet  
-
-
-
PCA9553_4  
PCA9553_3  
PCA9553_2  
PCA9553_3  
(9397 750 13728)  
PCA9553_2  
(9397 750 11464)  
20030502  
20021213  
Product data  
Product data  
ECN 853-2397 29856 PCA9553_1  
dated 2003 Apr 24  
PCA9553_1  
(9397 750 10859)  
ECN 853-2397 29264  
dated 2002 Dec 09  
PCA9553_6  
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Product data sheet  
Rev. 06 — 29 December 2008  
24 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
19. Legal information  
19.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
to result in personal injury, death or severe property or environmental  
19.2 Definitions  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
19.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
19.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
I2C-bus — logo is a trademark of NXP B.V.  
20. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
PCA9553_6  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 29 December 2008  
25 of 26  
PCA9553  
NXP Semiconductors  
4-bit I2C-bus LED driver with programmable blink rates  
21. Contents  
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1  
19.1  
19.2  
19.3  
19.4  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
20  
21  
Contact information . . . . . . . . . . . . . . . . . . . . 25  
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
6
6.1  
6.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4  
7
7.1  
7.2  
7.3  
7.3.1  
7.3.2  
7.3.3  
7.3.4  
7.3.5  
7.3.6  
7.4  
Functional description . . . . . . . . . . . . . . . . . . . 5  
Device address. . . . . . . . . . . . . . . . . . . . . . . . . 5  
Control register . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Register descriptions . . . . . . . . . . . . . . . . . . . . 6  
INPUT - Input register. . . . . . . . . . . . . . . . . . . . 6  
PSC0 - Frequency Prescaler 0 . . . . . . . . . . . . . 6  
PWM0 - Pulse Width Modulation 0. . . . . . . . . . 6  
PSC1 - Frequency Prescaler 1 . . . . . . . . . . . . . 7  
PWM1 - Pulse Width Modulation 1. . . . . . . . . . 7  
LS0 - LED selector register. . . . . . . . . . . . . . . . 7  
Pins used as general purpose I/Os . . . . . . . . . 8  
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 8  
7.5  
8
Characteristics of the I2C-bus. . . . . . . . . . . . . . 8  
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
START and STOP conditions . . . . . . . . . . . . . . 8  
System configuration . . . . . . . . . . . . . . . . . . . . 9  
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 10  
8.1  
8.1.1  
8.2  
8.3  
8.4  
9
9.1  
Application design-in information . . . . . . . . . 11  
Minimizing IDD when the I/Os are used to  
control LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Programming example . . . . . . . . . . . . . . . . . . 12  
9.2  
10  
11  
12  
13  
14  
15  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13  
Static characteristics. . . . . . . . . . . . . . . . . . . . 14  
Dynamic characteristics . . . . . . . . . . . . . . . . . 16  
Test information. . . . . . . . . . . . . . . . . . . . . . . . 17  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18  
Handling information. . . . . . . . . . . . . . . . . . . . 21  
16  
Soldering of SMD packages . . . . . . . . . . . . . . 21  
Introduction to soldering . . . . . . . . . . . . . . . . . 21  
Wave and reflow soldering . . . . . . . . . . . . . . . 21  
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21  
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22  
16.1  
16.2  
16.3  
16.4  
17  
18  
19  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 23  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 24  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 25  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2008.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 29 December 2008  
Document identifier: PCA9553_6  

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