935287868518 [NXP]
Support Circuit;
NXP 
PN533
Near Field Communication (NFC) controller
Rev. 3.3 — 16 July 2012
158233
Product short data sheet
PUBLIC
1. General description
The PN533 is a highly integrated transceiver module for contactless communication at
13.56 MHz based on the 80C51 microcontroller core. A dedicated ROM code is
implemented to handle different RF protocols.
1.1 RF protocols
The PN533 supports four main operating modes:
• ISO/IEC 14443A Reader/Writer (including MIFARE product family)
• ISO/IEC 14443B Reader/Writer
• FeliCa Reader/Writer
• ISO/IEC 18092, ECMA 340 Peer-to-Peer
The PN533 hardware implements a demodulator and decoder for signals from
ISO/IEC 14443A compatible cards and transponders. The PN533 hardware handles the
complete ISO/IEC 14443A framing and error detection and upper layers of this protocol
(i.e. ISO/IEC 14443-4) are implemented in firmware.
The PN533 supports all MIFARE products (e.g. MIFARE crypto method). It supports
contactless communication using higher transfer speeds up to 848 kbit/s in both
directions.
The PN533 hardware supports layers 2 and 3 of the ISO/IEC 14443B Reader/Writer
communication scheme, except anticollision. Anticollision is implemented in firmware as
well as upper layers (i.e. ISO/IEC 14443-4).
The PN533 can demodulate and decode FeliCa coded signals. The PN533 handles the
FeliCa framing and error detection. It supports contactless communication using FeliCa
Higher transfer speeds up to 424 kbit/s in both directions.
Compliant to ECMA 340 and ISO/IEC 18092 NFCIP-1 Passive and Active communication
modes, the PN5331B3HN/C270 offers the possibility to communicate to another NFCIP-1
compliant device, at transfer speeds up to 424 kbit/s. The PN533 handles the complete
NFCIP-1 framing and error detection.
1.2 Interfaces
The PN533 supports USB 2.0 full speed interface (bus powered or host powered mode).
PN533 also has a master I2C interface enabling the drive of following peripherals:
• An external EEPROM
• A TDA8029 smart card reader
PN533
NXP Semiconductors
Near Field Communication (NFC) controller
1.3 Standards compliancy
PN533 offers commands in order for applications to be compliant in reader mode with
“Paypass-ISO/IEC 14443 Implementation v1.1”.
PN533 supports RF protocols ISO/IEC 14443A and B such as compliancy with Smart eID
standard can be achieved at application level.
A dedicated command is implemented in PN533 firmware to support NFC secure
applications in accordance with “NFC sec Security layer for NFC” specification in order to
enable USB wireless or BT enabler applications in a host baseband.
2. Features and benefits
80C51 microcontroller core with 45056 bytes ROM and 1224 bytes RAM
Highly integrated demodulator and decoder
Buffered output drivers to connect an antenna with minimum number of external
components
Integrated RF level detector
Integrated data mode detector
Supports ISO/IEC 14443A Reader/Writer mode up to 848 kbit/s
Supports ISO/IEC 14443B Reader/Writer mode up to 848 kbit/s
Supports MIFARE encryption in Reader/Writer mode and higher transfer speed
communication at 212 kbit/s, 424 kbit/s and 848kbit/s
Supports contactless communication according to the FeliCa protocol at 212 kbit/s and
424 kbit/s
Typical operating distance in Reader/Writer mode for communication to
ISO/IEC 14443A/MIFARE, ISO/IEC 14443B or FeliCa cards up to 50 mm depending
on antenna size and tuning
Support NFCIP-1 mode up to 424 kbit/s
Typical operating distance in NFCIP-1 mode up to 50 mm depending on antenna size,
tuning and power supply
Supported USB 2.0 full speed interface
Restricted I2C master interface to control an external I2C EEPROM or TDA8029 smart
card reader
Low-power modes
Hard-Power-Down mode
Soft-Power-Down mode
27.12 MHz Crystal oscillator
On-Chip PLL to generate internally 96 MHz for the USB interface
Power modes
USB bus power mode
2.5 V to 3.6 V power supply operating range in non-USB bus power mode
Dedicated IO ports for external device control
PN533_SDS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.3 — 16 July 2012
158233
2 of 9
PN533
NXP Semiconductors
Near Field Communication (NFC) controller
3. Quick reference data
Table 1.
Symbol
VBUS
Quick reference data
Parameter
Conditions
Min
4.02
2.5
Typ
5
Max
5.25
3.6
Unit
V
bus supply voltage
(non-USB mode);
3.3
V
VBUS = VDDD; VSSD = 0 V
[1]
[1]
[1]
VDDA
analog supply voltage
digital supply voltage
TVDD supply voltage
PVDD supply voltage
SVDD supply voltage
VDDA = VDDD = VDD(TVDD)
=
2.5
2.5
2.5
1.6
3.3
3.3
3.3
-
3.6
V
V
V
V
V
VDD(PVDD); VSSA = VSSD
=
VDDD
3.6
VSS(PVSS) = VSS(TVSS) = 0 V
VDD(TVDD)
VDD(PVDD)
VDD(SVDD)
3.6
3.6
VSSA = VSSD = VSS(PVSS)
=
VDDD0.1 -
VDDD
VSS(TVSS) = 0 V; reserved for
future use
IBUS
bus supply current
power-down current
maximum load current (USB
mode); measured on VBUS
150
100
mA
mA
maximum inrush current
limitation; at power-up
(curlimoff = 0)
Ipd
VDDA = VDDD = VDD(TVDD) = VDD(PVDD) = 3 V; not powered from USB
hard power-down; RF
level detector off
10
30
250
-
A
A
A
mA
soft power-down; RF level
detector on
[1]
[1]
ICCSL
IDDD
suspended low-power
device supply current
RF level detector on,
(without resistor on DP/DM)
-
-
-
digital supply current
RF level detector on,
VDD(SVDD) switch off
15
IDD(SVDD)
IDDA
SVDD supply current
analog supply current
TVDD supply current
VDDS = 3 V
-
-
-
-
30
-
mA
mA
mA
RF level detector on
6
IDD(TVDD)
during RF transmission;
VDD(TVDD) = 3 V
60
100
Ptot
total power dissipation
ambient temperature
Tamb = 30 C to +85 C
-
-
-
0.55
+85
W
Tamb
30
C
[1] VDDD, VDDA and VDD(TVDD) must always be at the same supply voltage.
4. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
SOT618-1
PN5331B3HN/C270[1][2]
HVQFN40
plastic thermal enhanced very thin quad flat package; no
leads; 40 terminals; body 6 x 6 x 0.85 mm
[1] 70 refers to the ROM code version described in User Manual.
[2] Refer to Section 9.4 “Licenses”
PN533_SDS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.3 — 16 July 2012
158233
3 of 9
PN533
NXP Semiconductors
Near Field Communication (NFC) controller
5. Block diagram
The following block diagram describes hardware blocks controlled by PN533 firmware or
which can be accessible for data transaction by a host baseband.
RSTPD
RSTOUT
DVDD
IRQ
GND
VBUS
VGND
SUPPLY
SUPER
VISOR
REGULATOR
3.3 V
SVDD
SIGIN
SIGOUT
P34
SVDD
SWITCH
27 MHz OSC
AND
FRAC N
PLL
XTAL1
XTAL2
PCR
48 MHz
Delatt
USB
DEVICE
TVDD
AVDD
RX
NSS
MOSI
I0
NFC
ANALOG
FRONT END
AND
MATX
80C51 CPU
VMID
TX1
I1
44 k ROM
1.2 k BYTES RAM
CLUART
TGND
TX2
SDA
SCL
2
I C
MASTER
PVDD
P30 P31 P32 P33 P35
GPIOs
001aai112
Fig 1. Block diagram
PN533_SDS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.3 — 16 July 2012
158233
4 of 9
PN533
NXP Semiconductors
Near Field Communication (NFC) controller
6. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDDA
Parameter
Conditions
Min
0.5
0.5
0.5
0.5
0.5
0.5
-
Max
+4
Unit
V
analog supply voltage
digital supply voltage
VDDD
+4
V
VDD(TVDD) TVDD supply voltage
VDD(PVDD) PVDD supply voltage
VDD(SVDD) SVDD supply voltage
+4
V
+4
V
+4
V
VBUS
bus supply voltage
+5.5
500
30
V
Ptot
total power dissipation
SVDD supply current
mW
mA
IDD(SVDD)
maximum current in
VDDS switch
-
Vi
input voltage
TX1, TX2, RX pins
0.5
+4
V
[1]
[2]
[3]
VESD
electrostatic discharge HBM
2.0
200
1
kV
V
voltage
MM
-
CDM
storage temperature
-
kV
C
C
Tstg
Tj
55
40
+150
+125
junction temperature
[1] 1500 , 100 pF; EIA/JESD22-A114-A
[2] 0.75 mH, 200 pF; EIA/JESD22-A115-A
[3] Field induced model; EIA/JESC22-C101-C
7. Abbreviations
Table 4.
Abbreviations
Description
Acronym
CDM
Charge Device Model
CRC
Cyclic Redundancy Check
EEPROM
HBM
Electrically Erasable Programmable Read-Only Memory
Human Body Model
HPD
Hard Power Down
MM
Machine Model
NFC
Near Field Communication
Soft Power-Down Mode
SPD
PN533_SDS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.3 — 16 July 2012
158233
5 of 9
PN533
NXP Semiconductors
Near Field Communication (NFC) controller
8. Revision history
Table 5.
Revision history
Document ID
Release date
Data sheet status
Change notice Supersedes
PN533_SDS v.3.3
Modifications:
20120716
Product short data sheet
-
-
-
PN533_SDS v.3.2
Section 9.4 “Licenses”: updated
PN533_SDS v.3.2
Modifications:
20120202
Product short data sheet
PN5331B3HN_ SDS_N_1
-
• Section 1 “General description”: updated
PN5331B3HN_SDS_N_1 20081231
Product short data sheet
PUBLIC
PN533_SDS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.3 — 16 July 2012
158233
6 of 9
PN533
NXP Semiconductors
Near Field Communication (NFC) controller
9. Legal information
9.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
9.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
9.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
PN533_SDS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.3 — 16 July 2012
158233
7 of 9
PN533
NXP Semiconductors
Near Field Communication (NFC) controller
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
9.4
Licenses
Purchase of NXP ICs with ISO/IEC 14443 type B functionality
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
This NXP Semiconductors IC is ISO/IEC 14443 Type B
software enabled and is licensed under Innovatron’s
Contactless Card patents license for ISO/IEC 14443 B.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
The license includes the right to use the IC in systems
and/or end-user equipment.
RATP/Innovatron
Technology
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Purchase of NXP ICs with NFC technology
Purchase of an NXP Semiconductors IC that complies with one of the Near
Field Communication (NFC) standards ISO/IEC 18092 and ISO/IEC 21481
does not convey an implied license under any patent right infringed by
implementation of any of those standards.
9.5
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
MIFARE — is a trademark of NXP B.V.
I2C-bus — logo is a trademark of NXP B.V.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PN533_SDS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.3 — 16 July 2012
158233
8 of 9
PN533
NXP Semiconductors
Near Field Communication (NFC) controller
11. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
RF protocols . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Standards compliancy. . . . . . . . . . . . . . . . . . . . 2
2
3
4
5
6
7
8
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 3
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6
9
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
9.1
9.2
9.3
9.4
9.5
10
11
Contact information. . . . . . . . . . . . . . . . . . . . . . 8
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 July 2012
158233
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