935296148003 [NXP]

Telecom Circuit;


型号：	935296148003
厂家：	NXP
描述：	Telecom Circuit 电信电信集成电路
文件：	总13页 (文件大小：147K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SL2S1412; SL2S1512;

SL2S1612

ICODE ILT-M

Rev. 3.0 — 2 May 2012

230330

Product short data sheet

COMPANY PUBLIC

1. General description

The ISO 18000-3 mode 3/EPC Class-1 HF standard allows the commercialized provision

of mass adoption of HF RFID technology for passive smart tags and labels. Main fields of

applications are supply chain management and logistics for worldwide use.

The ICODE ILT-M is a dedicated chip for passive, intelligent tags and labels supporting

the ISO 18000-3 mode 3 RFID standard. It is especially suited for applications where

reliable identification and high anti-collision rates are required.

The ICODE ILT-M is a product out of the NXP Semiconductors ICODE product family. The

entire ICODE product family offers anti-collision functionality. This allows a reader to

simultaneously operate multiple labels/tags within its antenna field. A ICODE ILT-M based

label/tag requires no external power supply.

Its contactless interface generates the power supply via the antenna circuit by inductive

energy transmission from the interrogator (reader), while the system clock is extracted

from the magnetic field. Data transmitted from interrogator to label/tag is demodulated by

the interface, and it also modulates the interrogator's magnetic field for data transmission

from label/tag to interrogator. A label/tag can be operated without the need for line of sight

or battery, as long as it is connected to a dedicated antenna for the targeted frequency

range. When the label/tag is within the interrogator's operating range, the high-speed

wireless interface allows data transmission in both directions.

2. Features and benefits

2.1 Key features

 512-bit user memory

 Up to 240-bit of EPC memory

 96-bit tag identifier (TID) including 48-bit unique serial number

 EAS (Electronic Article Surveillance) functionality

 Recommissioning feature (privacy) with 32-bit kill password

 32-bit access password to allow a transition into the secured state

 Long read/write ranges due to extremely low-power design

 Reliable operation of multiple tags due to advanced anti-collision (up to 800 tags/s)

 Fast initialization (write EPC)

 Forward link: 25 kbit/s to 100 kbit/s

 Return link: 53 kbit/s to 848 kbit/s

SL2S1412; SL2S1512; SL2S1612

NXP Semiconductors

ICODE ILT-M

2.2 Key benefits

 High sensitivity provides long read range

 Highly advanced anti-collision resulting in highest identification speed

 Reliable and robust RFID technology suitable noisy environments and dense label

populations

2.3 Custom features

 EAS

Enables the HF RFID tag to be used as EAS tag without the need for a backend data

base.

3. Applications

 Healthcare and pharmaceutical supply chain

 Medical lab automation

 Document tracking

 Casino chips

 Laundry automation

4. Quick reference data

Table 1.

Quick reference data

Typical ratings are not guaranteed. The values listed are at room temperature.

Symbol

t_ret

Parameter

Conditions

Min

Typ

Max

Unit

year

cycle

MHz

retention time

T_amb≤ 55 °C

N_endu(W)

f_i

write endurance

input frequency

100000

13.553

1.5

[1]

13.56

13.567

V_i(RMS)min

P_i(min)

C_i

minimum RMS input voltage

minimum input power

input capacitance

operating read/write

operating

1.7

[2]

[3]

μW

between LA and LB

SL2S1412FUD

SL2S1512FUD

SL2S1612FUD

22.3

23.5

24.7

102

[1] Bandwidth limitation ( 7 kHz) according to ISM band regulations.

[2] Including losses in the resonant capacitor and rectifier.

[3] Measured with an HP4285A LCR meter at 13.56 MHz and 2 V RMS.

SL2S1412_SL2S1512_SL2S1612

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5. Ordering information

Table 2.

Ordering information

Type number

Package

Name

Description

Version

SL2S1412FUD

SL2S1512FUD

SL2S1612FUD

Wafer

sawn, bumped wafer, 120 μm, on film frame carrier, -

C_ibetween LA and LB = 0 pF (typical)

Wafer

sawn, bumped wafer, 120 μm, on film frame carrier, -

C_ibetween LA and LB = 23.5 pF (typical)

sawn, bumped wafer, 120 μm, on film frame carrier, -

C_ibetween LA and LB = 97 pF (typical)

SL2S1412_SL2S1512_SL2S1612

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ICODE ILT-M

6. Block diagram

The SL2S1412; SL2S1512; SL2S1612 IC consists of three major blocks:

- Analog RF Interface

- Digital Controller

- EEPROM

The analog part provides stable supply voltage and demodulates data received from the

reader for being processed by the digital part. Further, the modulation transistor of the

analog part transmits data back to the reader.

The digital section includes the state machines, processes the protocol and handles

communication with the EEPROM, which contains the EPC and the user data.

ANALOG

RF INTERFACE

DIGITAL CONTROL

ANTICOLLISION

EEPROM

VREG

PAD

VDD

RECT

DEMOD

READ/WRITE

CONTROL

data

ANTENNA

ACCESS CONTROL

MEMORY

MOD

PAD

data

out

R/W

EEPROM INTERFACE

CONTROL

PAD

VDD

OUT

I/O

CONTROL

RF INTERFACE

CONTROL

SEQUENCER

CHARGE PUMP

001aai335

Fig 1. Block diagram

SL2S1412_SL2S1512_SL2S1612

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SL2S1412; SL2S1512; SL2S1612

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7. Functional description

7.1 Power transfer

Whenever connected to a very simple and cheap type of antenna (as a result of the

13.56 MHz carrier frequency) made out of a few windings printed, winded, etched or

punched coil the ICODE ILT-M IC can be operated without line of sight up to a distance of

1.5 m (gate width). No battery is needed.

7.2 Data transfer

7.2.1 Reader to tag Link

An interrogator transmits information to the ICODE ILT-M by modulating an RF signal in

the 13.56 MHz frequency. The ICODE ILT-M receives both information and operating

energy from this RF signal. Tags are passive, meaning that they receive all of their

operating energy from the interrogator's RF waveform.

An interrogator is using a fixed modulation and data rate for the duration of at least an

inventory round. It communicates to the ICODE ILT-M by modulating an RF carrier using

DSB-ASK with PIE encoding.

For further details refer to Section 11, Ref. 2. Interrogator-to-tag (R=>T) communications.

7.2.2 Tag to reader Link

An interrogator receives information from the ICODE ILT-M by transmitting a

continuous-wave RF signal to the tag; the ICODE ILT-M responds by load modulation of

the 13.56 MHz carrier frequency, thereby generating modulated sidebands used to

transmit an information signal to the interrogator. The system is a reader talks first (RTF)

system, meaning that a ICODE ILT-M only responds with an information signal after being

directed by the interrogator.

ICODE ILT-M transmits information using ASK modulation. The returned data are either

coded with FM0 baseband, Miller with sub carrier or Manchester with sub carrier. The

interrogator can select if the ICODE ILT-M shall respond with a sub carrier frequency of

424 kHz or 848 kHz.

For further details refer to Section 11, Ref. 2. tag-to-interrogator (T=>R) communications.

7.3 Air interface standards

The ICODE ILT-M fully supports all parts of the ISO 18000-3 Mode 3 (refer to Section 11,

Ref. 1) and the "EPC™ Radio-Frequency Identity Protocols EPC Class-1 HF RFID Air

Interface Protocol for Communications at 13.56 MHz, Version 2.0.3" (refer to Section 11,

Ref. 2).

SL2S1412_SL2S1512_SL2S1612

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Product short data sheet

COMPANY PUBLIC

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230330

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SL2S1412; SL2S1512; SL2S1612

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ICODE ILT-M

8. Memory configuration

This section contains all information including commands by which a reader selects,

inventories, and accesses a ICODE ILT-M population

An interrogator manages ICODE ILT-M equipped tag populations using three basic

operations. Each of these operations comprises one or more commands. The operations

are defined as follows

Select:

The process by which an interrogator selects a tag population for inventory

and access. Interrogators may use one or more Select commands to select a

particular tag population prior to inventory.

Inventory: The process by which an interrogator identifies ICODE ILT-M equipped tags.

An interrogator begins an inventory round by transmitting a BeginRound

command in one of two sessions. One or more tags may reply. The

interrogator detects a single tag reply and requests the PC, EPC, and

CRC-16 from the chip. An inventory round operates in one and only one

session at a time. For an example of an interrogator inventorying and

accessing a single tag refer to Section 11, Ref. 2.

Access:

The process by which an interrogator transacts with (reads from or writes to)

individual tags. An individual tag must be uniquely identified prior to access.

Access comprises multiple commands, some of which employ one-time-pad

based cover-coding of the R=>T link.

8.1 Memory

For the general memory layout according to the standard Section 11, Ref. 2. The tag

memory is logically subdivided into four distinct banks.

In accordance to the standard Section 11, Ref. 2. The tag memory of the ICODE ILT-M is

organized in following 4 memory sections:

Table 3.

Name

Memory sections

Size

Bank

00b

01b

10b

11b

Reserved memory (32-bit ACCESS and 32-bit KILL password)

EPC (excluding 16 bit CRC-16 and 16-bit PC)

TID (including unique 48 bit serial number)

User memory

64 bit

240 bit

96 bit

512 bit

The logical address of all memory banks begin at zero (00h).

SL2S1412_SL2S1512_SL2S1612

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xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx

xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx

xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx

Addresses 00h

5Fh

TID

MS Byte

Byte 0

LS Byte

Byte 11

Byte 1

Byte 2

Byte 3

Byte 4

Byte 5

Byte 6

MS Bit

LS Bit

Addresses 00h

07h 08h

13h 14h

1Fh 20h

2Fh Addresses 30h

Class Identifier

Mask-Designer Identifier

Model Number

XTID Header

0000h

SNR

Bits

TID Example

Bits

000000000000h - FFFFFFFFFFFFh

E2h

006h

803h

(ICODE EPC G2 M) (EAN.UCC)

(NXP)

(ICODE G2 M)

Addresses 14h

Bits

18h 19h

1Fh

Sub Version Number

Version Number

0000011b

0000b

aaa-002934

(ICODE EPC G2 M)

Fig 2. TID for ICODE ILT-M

Table 4.

Model number

SI (Status Indicator Bit) Sub Version No.

0000b

Version (Silicon) No.

ICODE ILT-M

0000011b

SL2S1412; SL2S1512; SL2S1612

NXP Semiconductors

ICODE ILT-M

9. Limiting values

Table 5.

In accordance with the Absolute Maximum Rating System (IEC 60134).

Limiting values (Wafer)^[1][2]

Symbol

T_stg

Parameter

Conditions

Min

Max

+125

125

+85

Unit

°C

storage temperature

total power dissipation

junction temperature

maximum input current

input current

−55

P_tot

°C

T_j

−40

[3]

[4]

I_i(max)

I_I

LA to LB; peak

LA to LB; RMS

V_ESD

electrostatic discharge voltage

Human body model

[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only

and functional operation of the device at these or any conditions other than those described in the operating conditions and electrical

characteristics sections of this specification is not implied.

[2] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static

charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.

[3] The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to parameter I_I).

[4] For ESD measurement, the IC was mounted in a CDIP8 package.

10. Abbreviations

Table 6.

Acronym

CRC

Abbreviations

Description

Cyclic redundancy check

EEPROM

EPC

Electrically Erasable Programmable Read Only Memory

Electronic Product Code (containing Header, Domain Manager, Object Class

and Serial Number)

FM0

Bi phase space modulation

Integrated Circuit

Radio Frequency

RTF

Reader Talks First

High Frequency

SL2S1412_SL2S1512_SL2S1612

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ICODE ILT-M

11. References

[1] ISO 18000-3M3

[2] EPC™ Radio-Frequency Identity Protocols EPC Class-1 HF RFID Air Interface

Protocol for Communications at 13.56 MHz, Version 2.0.3

[3] EPCglobal: EPC Tag Data Standards 1.5

[4] ECC ERC Recommendation 70-03 Annex 9

[5] ISO/IEC Directives, Part 2: Rules for the structure and drafting of International

Standards

[6] ISO/IEC 3309: Information technology – Telecommunications and information

exchange between systems – High-level data link control (HDLC) procedures –

Frame structure

[7] ISO/IEC 15961: Information technology, Automatic identification and data capture –

Radio frequency identification (RFID) for item management – Data protocol:

application interface

[8] ISO/IEC 15962: Information technology, Automatic identification and data capture

techniques – Radio frequency identification (RFID) for item management – Data

protocol: data encoding rules and logical memory functions

[9] ISO/IEC 15963: Information technology — Radio frequency identification for item

management — Unique identification for RF tags

[10] ISO/IEC 18000-1: Information technology — Radio frequency identification for item

management — Part 1: Reference architecture and definition of parameters to be

standardized

[11] ISO/IEC 19762: Information technology AIDC techniques – Harmonized vocabulary

– Part 3: radio-frequency identification (RFID)

[12] U.S. Code of Federal Regulations (CFR), Title 47, Chapter I, Part 15:

Radio-frequency devices, U.S. Federal Communications Commission

[13] General specification for 8” wafer on UV-tape with electronic fail die

marking — Delivery type description – BU-ID document number: 1093**¹.

[14] Data sheet — SL2S1412; SL2S1512; SL2S1612;– BU-ID document number:

1677**

1. ** ... document version number

SL2S1412_SL2S1512_SL2S1612

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ICODE ILT-M

12. Revision history

Table 7.

Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

SL2S1412_SL2S1512_

SL2S1612 v. 3.0

20120502

Product short data sheet

SL2S1412_SL2S1512_SL2S1612

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ICODE ILT-M

13. Legal information

13.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use — NXP Semiconductors products are not designed,

13.2 Definitions

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

13.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

SL2S1412_SL2S1512_SL2S1612

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Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

13.4 Trademarks

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

ICODE and I-CODE — are trademarks of NXP B.V.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

SL2S1412_SL2S1512_SL2S1612

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15. Contents

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

2.1

2.2

2.3

Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Custom features . . . . . . . . . . . . . . . . . . . . . . . . 2

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 3

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Functional description . . . . . . . . . . . . . . . . . . . 5

Power transfer . . . . . . . . . . . . . . . . . . . . . . . . . 5

Data transfer. . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Reader to tag Link . . . . . . . . . . . . . . . . . . . . . . 5

Tag to reader Link. . . . . . . . . . . . . . . . . . . . . . . 5

Air interface standards . . . . . . . . . . . . . . . . . . . 5

7.1

7.2

7.2.1

7.2.2

7.3

8.1

Memory configuration . . . . . . . . . . . . . . . . . . . . 6

Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 8

References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10

Legal information. . . . . . . . . . . . . . . . . . . . . . . 11

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12

13.1

13.2

13.3

13.4

Contact information. . . . . . . . . . . . . . . . . . . . . 12

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 2 May 2012

230330

935296148003 [NXP]

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