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935313752174 [NXP]

Peizoresistive Sensor;
935313752174
型号： 935313752174
厂家： NXP    NXP
描述：

Peizoresistive Sensor

传感器 换能器
文件： 总19页 (文件大小：406K)
中文：  中文翻译
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Pressure  
Document Number: MPX2202  
Rev 8, 10/2012  
Freescale Semiconductor  
Data Sheet: Technical Data  
200 kPa On-Chip Temperature  
Compensated Silicon  
Pressure Sensors  
The MPX2202 devices series are silicon piezoresistive pressure sensor  
providing a highly accurate and linear voltage output directly proportional to  
the applied pressure. The sensor is a single monolithic silicon diaphragm with  
the strain gauge and a thin-film resistor network integrated on chip. The chip  
is laser trimmed for precise span and offset calibration and temperature  
compensation. They are designed for use in applications such as pump/  
motor controllers, robotics, level indicators, medical diagnostics, pressure  
switching, barometers, altimeters, etc.  
MPX2202  
Series  
0 to 200 kPa (0 to 29 psi)  
40 mV Full Scale  
(Typical)  
Application Examples  
•
•
•
•
•
•
•
Pump/Motor Controllers  
Robotics  
Level Indicators  
Medical Diagnostics  
Pressure Switching  
Barometers  
Features  
• Temperature Compensated Over 0C to +85C  
• Easy-to-Use Chip Carrier Package Options  
• Available in Absolute, Differential and Gauge Configurations  
• Ratiometric to Supply Voltage  
Altimeters  
• Available in Easy-to-Use Tape and Reel  
ORDERING INFORMATION  
# of Ports  
Single  
Pressure Type  
Differential  
Case  
No.  
Device Name  
Device Marking  
None  
Dual  
Gauge  
Absolute  
Unibody Package (MPX2202 Series)  
MPX2202A  
344  
MPX2202A  
MPX2202DP  
MPX2202AP  
MPX2202GP  
MPX2202A  
•
•
MPX2202DP  
MPX2202AP  
MPX2202GP  
MPX2202ASX  
344C  
344B  
344B  
344F  
•
•
•
•
•
•
•
•
•
Small Outline Package (MPXV2202 Series)  
MPXV2202GP  
MPXV2202DP  
MPXV2202GC6TI  
1369  
1351  
482A  
MPXV2202GP  
MPXV2202DP  
MPXV2202G  
•
•
•
•
•
MPAK Package (MPXM2202 Series)  
MPXM2202D  
1320  
1320  
MPXM2202D  
MPXM2202D  
MPXM2202A  
MPXM2202GS  
MPXM2202GS  
MPXM2202AS  
•
•
•
•
•
MPXM2202DT1  
MPXM2202A  
1320  
•
•
MPXM2202GS  
MPXM2202GST1  
MPXM2202AS  
1320A  
1320A  
1320A  
•
•
•
•
•
© 2005-2008, 2012 Freescale Semiconductor, Inc. All rights reserved.  
Pressure  
UNIBODY PACKAGES  
MPX2202ASX  
CASE 344F-01  
MPX2202A  
CASE 344-15  
MPX2202AP/GP  
CASE 344B-01  
MPX2202DP  
CASE 344C-01  
MPAK  
SMALL OUTLINE PACKAGES  
MPXV2202DP  
CASE 1351-01  
MPXV2202GP  
CASE 1369-01  
MPXV2202GC6T1  
CASE 482A-01  
MPXM2202A  
CASE 1320-02  
MPXM2202GS/AS  
CASE 1320A-02  
MPX2202  
Sensors  
Freescale Semiconductor, Inc.  
2
Pressure  
Operating Characteristics  
Table 1. Operating Characteristics  
(VS = 10 Vdc, TA = 25C unless otherwise noted, P1 > P2)  
Characteristics  
Symbol  
Min  
Typ  
Max  
Unit  
Pressure Range(1)  
POP  
POP  
20  
0
—
—
200  
200  
kPa  
kPa  
Absolute Pressure Range MPX2202A  
Differential Pressure Range MPX2202D  
Supply Voltage(2)  
Supply Current  
VS  
—
10  
16  
Vdc  
Io  
—
6.0  
40  
—
mAdc  
mV  
Full Scale Span(3)  
VFSS  
38.5  
41.5  
Offset(4)  
Voff  
-1.0  
-2.0  
—
—
1.0  
2.0  
mV  
MPX2202D, MPXM2202D/G Series  
MPX2202A, MPXM2202A Series  
Sensitivity  
V/P  
—
0.2  
—
mV/kPa  
%VFSS  
Linearity(5)  
—
-0.6  
-1.0  
—
—
0.4  
1.0  
MPXM2202D/G, MPX2202D Series  
MPXM2202A, MPX2202A Series  
Pressure Hysteresis(5) (0 to 200 kPa)  
—
—
—
—
0.1  
0.5  
—
—
—
%VFSS  
%VFSS  
%VFSS  
mV  
Temperature Hysteresis(5) (-40C to +125C)  
Temperature Effect on Full Scale Span(5)  
TCVFSS  
TCVoff  
-2.0  
-1.0  
2.0  
1.0  
Temperature Effect on Offset(5)  
Input Impedance  
—
Zin  
Zout  
tR  
1000  
1400  
—
—
—
2500  
3000  
—
Output Impedance  
Response Time(6) (10% to 90%)  
Warm-Up  
1.0  
ms  
—
—
—
—
20  
—
—
ms  
Offset Stability(7)  
0.5  
%VFSS  
1. 1.0 kPa (kiloPascal) equals 0.145 psi.  
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional  
error due to device self-heating.  
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the  
minimum rated pressure.  
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.  
5. Accuracy (error budget) consists of the following:  
Linearity:Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.  
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and  
from the minimum or maximum operating temperature points, with zero differential pressure applied.  
Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or  
maximum rated pressure, at 25C.  
TcSpan:Output deviation at full rated pressure over the temperature range of 0 to 85C, relative to 25C.  
TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C.  
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a  
specified step change in pressure.  
7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.  
MPX2202  
Sensors  
Freescale Semiconductor, Inc.  
3
Pressure  
Maximum Ratings  
Table 2. Maximum Ratings(1)  
Rating  
Max Value  
400  
Unit  
kPa  
C  
Maximum Pressure (P1 > P2)  
Storage Temperature  
-40 to 125  
-40 to 125  
Operating Temperature  
C  
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.  
Voltage Output versus Applied Differential  
The differential voltage output of the sensor is directly  
proportional to the differential pressure applied.  
The absolute sensor has a built-in reference vacuum. The  
output voltage will decrease as vacuum, relative to ambient,  
is drawn on the pressure (P1) side.  
(P1) side relative to the vacuum (P2) side. Similarly, output  
voltage increases as increasing vacuum is applied to the  
vacuum (P2) side relative to the pressure (P1) side.  
Figure 1 illustrates a block diagram of the internal circuitry  
on the stand-alone pressure sensor chip.  
The output voltage of the differential or gauge sensor  
increases with increasing pressure applied to the pressure  
VS  
3
Thin Film  
2
4
+VOUT  
–VOUT  
Temperature  
Compensation  
and Calibration  
Circuitry  
Sensing  
Element  
1
GND  
Figure 1. Temperature Compensated and Calibrated  
Pressure Sensor Schematic  
MPX2202  
Sensors  
4
Freescale Semiconductor, Inc.  
Pressure  
On-Chip Temperature Compensation and Calibration  
40  
35  
30  
25  
20  
15  
10  
5
VS = 10 VDC  
TA = 25C  
P1 > P2  
TYP  
Span  
Range  
(TYP)  
MAX  
MIN  
0
-5  
Offset  
(TYP)  
kPa  
PSI  
0
25  
50  
7.25  
75  
100 125  
14.5  
Pressure  
150  
21.75  
175 200  
29  
Figure 2. Output vs. Pressure Differential  
Figure 2 shows the output characteristics of the MPX2202  
series at 25C. The output is directly proportional to the  
differential pressure and is essentially a straight line.  
The effects of temperature on full scale span and offset are  
very small and are shown under Operating Characteristics.  
Absolute  
Die  
Differential/Gauge  
Silicone Gel  
Stainless Steel  
Metal Cover  
Silicone Gel  
Die Coat  
Die  
Stainless Steel  
Metal Cover  
Die Coat  
P1  
P1  
Epoxy  
Case  
Epoxy  
Case  
Wire Bond  
Wire Bond  
Lead Frame  
Bond  
Die  
Lead Frame  
Differential/Gauge Element  
P2  
Die  
Bond  
Absolute Element  
P2  
Figure 3. Cross Sectional Diagram (not to scale)  
Figure 3 illustrates the differential/gauge die in the basic  
chip carrier (Case 344). A silicone gel isolates the die surface  
and wire bonds from the environment, while allowing the  
pressure signal to be transmitted to the silicon diaphragm.  
The MPX2202 series pressure sensor operating  
characteristics and internal reliability and qualification tests  
are based on use of dry air as the pressure media. Media  
other than dry air may have adverse effects on sensor  
performance and long term reliability. Contact the factory for  
information regarding media compatibility in your application.  
Least  
Square  
Deviation  
Least Squares Fit  
Exaggerated  
Performance  
Curve  
Straight Line  
Deviation  
LINEARITY  
End Point Straight  
Line Fit  
Linearity refers to how well a transducer's output follows  
the equation: Vout = Voff + sensitivity x P over the operating  
pressure range. There are two basic methods for calculating  
nonlinearity: (1) end point straight line fit (see Figure 4) or  
(2) a least squares best line fit. While a least squares fit gives  
the “best case” linearity error (lower numerical value), the  
calculations required are burdensome.  
Offset  
50  
100  
0
Pressure (% Full Scale)  
Conversely, an end point fit will give the “worst case” error  
(often more desirable in error budget calculations) and the  
calculations are more straightforward for the user.  
Freescale’s specified pressure sensor linearities are based  
on the end point straight line method measured at the  
midrange pressure.  
Figure 4. Linearity Specification Comparison  
MPX2202  
Sensors  
Freescale Semiconductor, Inc.  
5
Pressure  
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE  
Freescale designates the two sides of the pressure sensor  
as the Pressure (P1) side and the Vacuum (P2) side. The  
Pressure (P1) side is the side containing silicone gel which  
isolates the die from the environment. The Freescale MPX  
pressure sensor is designed to operate with positive  
differential pressure applied, P1 > P2.  
The Pressure (P1) side may be identified by using the  
following table.  
Table 3. Pressure (P1) Side Delineation  
Part Number  
Case Type  
344  
Pressure (P1) Side Identifier  
MPX2202A  
Stainless Steel Cap  
MPX2202DP  
Side with Part Marking  
Side with Port Attached  
Side with Port Attached  
Side with Port Attached  
Side with Part Marking  
Side with Port Attached  
Side with Part Marking  
Side with Port Attached  
Side with Part Marking  
Side with Port Attached  
344C  
344B  
344F  
1369  
MPX2202GP/AP  
MPX2202ASX  
MPX2202GP  
MPX2202DP  
1351  
MPXV2202GP  
1369  
MPXV2202DP  
1351  
MPXV2202GC6TI  
MPXM2202A/ATI/DT/DTI  
MPXM2202GS/GSTI/AS/ASTI  
482A  
1320  
1320A  
MPX2202  
Sensors  
6
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
–A–  
D 8 PL  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.  
4
M
S
S
0.25 (0.010)  
T
B
A
5
8
N
–B–  
G
INCHES  
MILLIMETERS  
1
DIM  
A
B
C
D
MIN  
MAX  
0.425  
0.425  
0.520  
0.042  
MIN  
10.54  
10.54  
12.70  
0.96  
MAX  
10.79  
10.79  
13.21  
1.07  
0.415  
0.415  
0.500  
0.038  
S
W
G
H
J
K
M
N
S
V
W
0.100 BSC  
2.54 BSC  
0.002  
0.009  
0.061  
0
0.010  
0.011  
0.071  
7
0.05  
0.23  
1.55  
0
0.25  
0.28  
1.80  
7
V
0.444  
0.709  
0.245  
0.115  
0.448  
0.725  
0.255  
0.125  
11.28  
18.01  
6.22  
2.92  
11.38  
18.41  
6.48  
3.17  
C
H
J
–T–  
SEATING  
PLANE  
PIN 1 IDENTIFIER  
M
K
CASE 482A–01  
ISSUE A  
MPX2202  
Sensors  
Freescale Semiconductor, Inc.  
7
Pressure  
PACKAGE DIMENSIONS  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
C
R
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD  
STOP RING. MOLD STOP RING NOT TO EXCEED  
16.00 (0.630).  
M
Z
1
4
2
3
INCHES  
MILLIMETERS  
B
-A-  
DIM MIN MAX MIN  
MAX  
16.00  
13.56  
5.59  
A
B
C
D
F
0.595  
0.630 15.11  
0.534 13.06  
N
0.514  
0.200  
0.016  
0.048  
L
1
2
3
4
0.220  
0.020  
0.064  
5.08  
0.41  
1.22  
PIN 1  
0.51  
1.63  
-T-  
SEATING  
PLANE  
G
J
L
0.100 BSC  
2.54 BSC  
F
0.014  
0.695  
0.016 0.36  
0.725 17.65  
0.40  
18.42  
G
J
F
4 PL  
Y
M
N
R
Y
Z
30˚ NOM  
30˚ NOM  
D
0.475  
0.430  
0.048  
0.106  
0.495 12.07  
0.450 10.92  
12.57  
11.43  
1.32  
DAMBAR TRIM ZONE:  
THIS IS INCLUDED  
WITHIN DIM. "F" 8 PL  
M
M
0.136 (0.005)  
T A  
0.052  
0.118  
1.22  
2.68  
3.00  
STYLE 1:  
PIN 1. GROUND  
STYLE 2:  
PIN 1.  
STYLE 3:  
VCC  
PIN 1. GND  
2. -VOUT  
3. VS  
2. + OUTPUT  
3. + SUPPLY  
4. - OUTPUT  
2. - SUPPLY  
3. + SUPPLY  
4. GROUND  
4. +VOUT  
CASE 344-15  
ISSUE AA  
UNIBODY PACKAGE  
NOTES:  
SEATING  
PLANE  
-A-  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
-T-  
U
L
R
INCHES  
DIM MIN MAX  
MILLIMETERS  
H
MIN  
29.08  
17.40  
7.75  
MAX  
29.85  
18.16  
8.26  
A
B
C
D
F
1.145  
0.685  
0.305  
0.016  
0.048  
1.175  
0.715  
0.325  
0.020  
0.064  
N
B
PORT #1  
-Q-  
POSITIVE  
PRESSURE  
(P1)  
0.41  
1.22  
0.51  
1.63  
G
H
J
K
L
N
P
Q
R
S
U
0.100 BSC  
2.54 BSC  
0.182  
0.014  
0.695  
0.290  
0.420  
0.153  
0.153  
0.230  
0.220  
0.194  
0.016  
0.725  
0.300  
0.440  
0.159  
0.159  
0.250  
0.240  
4.62  
0.36  
17.65  
7.37  
10.67  
3.89  
3.89  
5.84  
5.59  
4.93  
0.41  
18.42  
7.62  
11.18  
4.04  
4.04  
6.35  
6.10  
1
2 3 4  
PIN 1  
K
-P-  
S
M
S
0.25 (0.010)  
T Q  
J
F
0.910 BSC  
23.11 BSC  
G
D
C
4 PL  
M
S
S
0.13 (0.005)  
T
S
Q
STYLE 1:  
PIN 1. GROUND  
2. + OUTPUT  
3. + SUPPLY  
4. - OUTPUT  
CASE 344B-01  
ISSUE B  
UNIBODY PACKAGE  
MPX2202  
Sensors  
Freescale Semiconductor, Inc.  
8
Pressure  
PACKAGE DIMENSIONS  
NOTES:  
-A-  
U
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
V
PORT #1  
W
L
R
H
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN MAX  
29.08 29.85  
17.40 18.16  
10.29 11.05  
PORT #2  
PORT #1  
POSITIVE PRESSURE  
(P1)  
PORT #2  
VACUUM  
(P2)  
A
B
C
D
F
1.145  
0.685  
0.405  
0.016  
0.048  
1.175  
0.715  
0.435  
0.020  
0.064  
N
-Q-  
0.41  
1.22  
0.51  
1.63  
G
H
J
K
L
N
P
Q
R
S
U
V
W
0.100 BSC  
2.54 BSC  
SEATING  
PLANE  
SEATING  
PLANE  
B
0.182  
0.014  
0.695  
0.290  
0.420  
0.153  
0.153  
0.063  
0.220  
0.194  
0.016  
0.725  
0.300  
0.440  
0.159  
0.159  
0.083  
0.240  
4.62  
0.36  
4.93  
0.41  
1
2 3 4  
17.65 18.42  
7.37 7.62  
10.67 11.18  
PIN 1  
K
-P-  
M
S
0.25 (0.010)  
T Q  
3.89  
3.89  
1.60  
5.59  
4.04  
4.04  
2.11  
6.10  
-T-  
-T-  
S
F
J
G
C
0.910 BSC  
23.11 BSC  
D
4 PL  
0.248  
0.310  
0.278  
0.330  
6.30  
7.87  
7.06  
8.38  
M
S
S
0.13 (0.005)  
T S  
Q
4. - OUTPUT  
CASE 344C-01  
ISSUE B  
UNIBODY PACKAGE  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
2. CONTROLLING DIMENSION: INCH.  
-A-  
U
L
SEATING  
PLANE  
INCHES  
MILLIMETERS  
-T-  
DIM MIN MAX MIN  
MAX  
29.85  
18.16  
8.26  
PORT #2  
VACUUM  
(P2)  
A
B
C
D
F
1.145  
1.175 29.08  
0.715 17.40  
H
R
POSITIVE  
PRESSURE  
(P1)  
0.685  
0.305  
0.016  
0.048  
0.325  
0.020  
0.064  
7.75  
0.41  
1.22  
0.51  
1.63  
N
-Q-  
G
H
J
K
L
N
P
Q
R
S
U
0.100 BSC  
2.54 BSC  
0.182  
0.014  
0.695  
0.290  
0.420  
0.153  
0.153  
0.230  
0.220  
0.194  
0.016  
4.62  
0.36  
4.93  
0.41  
18.42  
7.62  
11.18  
4.04  
4.04  
6.35  
6.10  
0.725 17.65  
0.300 7.37  
0.440 10.67  
B
0.159  
0.158  
0.250  
0.240  
3.89  
3.89  
5.84  
5.59  
1
2
3
4
K
PIN 1  
S
0.910 BSC  
23.11 BSC  
C
F
-P-  
G
J
M
S
T Q  
0.25 (0.010)  
D
4 PL  
M
S
S
Q
0.13 (0.005)  
T
S
CASE 344D-01  
ISSUE B  
UNIBODY PACKAGE  
MPX2202  
Sensors  
Freescale Semiconductor, Inc.  
9
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 2  
CASE 1351-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPX2202  
10  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PAGE 2 OF 2  
CASE 1351-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPX2202  
11  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
CASE 1369-01  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPX2202  
12  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
CASE 1369-01  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPX2202  
13  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
CASE 1320-02  
ISSUE B  
MPAK  
MPX2202  
14  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
CASE 1320-02  
ISSUE B  
MPAK  
MPX2202  
15  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
PIN 4  
PIN 1  
CASE 1320A-02  
ISSUE A  
MPAK  
MPX2202  
16  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
CASE 1320A-02  
ISSUE A  
MPAK  
MPX2202  
17  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
REVISION HISTORY  
Revision Revision  
Description of changes  
number  
date  
7
01/2012  
• In Table 1. Operating Characteristics, in the Characteristic column under Pressure Range, added  
rows for Absolute Pressure Range MPX2202A and Differential Pressure Range MPX2202D  
devices  
8
10/2012  
• Deleted references to device number MPXV2022GC6U throughout the document  
MPX2202  
Sensors  
Freescale Semiconductor, Inc.  
18  
Information in this document is provided solely to enable system and software  
implementers to use Freescale products. There are no express or implied copyright  
licenses granted hereunder to design or fabricate any integrated circuits based on the  
information in this document.  
How to Reach Us:  
Home Page:  
freescale.com  
Web Support:  
freescale.com/support  
Freescale reserves the right to make changes without further notice to any products  
herein. Freescale makes no warranty, representation, or guarantee regarding the  
suitability of its products for any particular purpose, nor does Freescale assume any  
liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation consequential or incidental  
damages. “Typical” parameters that may be provided in Freescale data sheets and/or  
specifications can and do vary in different applications, and actual performance may  
vary over time. All operating parameters, including “typicals,” must be validated for each  
customer application by customer’s technical experts. Freescale does not convey any  
license under its patent rights nor the rights of others. Freescale sells products pursuant  
to standard terms and conditions of sale, which can be found at the following address:  
freescale.com/salestermsandconditions.  
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc.,  
Reg. U.S. Pat. & Tm. Off.  
All other product or service names are the property of their respective owners.  
© 2012 Freescale Semiconductor, Inc. All rights reserved.  
MPX2202  
Rev. 8  
10/2012  

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