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935313755174 [NXP]

Peizoresistive Sensor;
935313755174
型号： 935313755174
厂家： NXP    NXP
描述：

Peizoresistive Sensor

传感器 换能器
文件： 总24页 (文件大小：555K)
中文：  中文翻译
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Pressure  
MPX5010  
Rev 13, 10/2012  
Freescale Semiconductor  
Data Sheet: Technical Data  
Integrated Silicon Pressure Sensor  
On-Chip Signal Conditioned,  
Temperature Compensated and  
Calibrated  
The MPxx5010 series piezoresistive transducers are state-of-the-art  
monolithic silicon pressure sensors designed for a wide range of applications,  
but particularly those employing a microcontroller or microprocessor with A/D  
inputs. This transducer combines advanced micromachining techniques,  
thin-film metallization, and bipolar processing to provide an accurate, high  
level analog output signal that is proportional to the applied pressure. The  
axial port has been modified to accommodate industrial grade tubing.  
MPX5010  
MPXV5010  
MPVZ5010  
Series  
0 to 10 kPa (0 to 1.45 psi)  
(0 to 1019.78 mm H2O)  
0.2 to 4.7 V Output  
Application Examples  
• Hospital Beds  
• HVAC  
• Respiratory Systems  
• Process Control  
Features  
• 5.0% Maximum Error over 0to 85C  
• Ideally Suited for Microprocessor or Microcontroller-Based Systems  
• Durable Epoxy Unibody and Thermoplastic (PPS) Surface Mount Package  
• Temperature Compensated over -40to +125C  
• Washing Machine Water Level  
Measurement (Reference AN1950)  
• Ideally Suited for Microprocessor or  
Microcontroller-Based Systems  
• Patented Silicon Shear Stress Strain Gauge  
• Appliance Liquid Level and Pressure  
Measurement  
• Available in Differential and Gauge Configurations  
• Available in Surface Mount (SMT) or Through-hole (DIP) Configurations  
ORDERING INFORMATION  
# of Ports  
Pressure Type  
Differential  
Device  
Marking  
Device Name  
Case No.  
None  
Single  
Dual  
Gauge  
Absolute  
Unibody Package (MPX5010 Series)  
MPX5010DP  
MPX5010GP  
MPX5010GS  
MPX5010GSX  
867C  
867B  
867E  
867F  
•
•
MPX5010DP  
MPX5010GP  
MPX5010D  
MPX5010D  
•
•
•
•
•
•
Small Outline Package (MPXV5010 Series)  
MPXV5010DP  
1351  
482  
•
•
MPXV5010DP  
MPXV5010G  
MPXV5010G  
MPXV5010G  
MPXV5010G  
MPXV5010GP  
MPXV5010G6U  
MPXV5010GC6T1  
MPXV5010GC6U  
MPXV5010GC7U  
MPXV5010GP  
•
•
•
•
•
•
482A  
482A  
482C  
1369  
•
•
•
•
Small Outline Package (Media Resistant Gel) (MPVZ5010 Series)  
MPVZ5010G6U  
MPVZ5010G7U  
MPVZ5010GW6U  
MPVZ5010GW7U  
482  
482B  
1735  
1560  
•
•
•
•
•
•
MPVZ5010G  
MPVZ5010G  
MZ5010GW  
MZ5010GW  
•
•
© 2007-2009, 2012 Freescale Semiconductor, Inc. All rights reserved.  
Pressure  
SMALL OUTLINE PACKAGES SURFACE MOUNT  
MPVZ5010GW6U  
CASE 1735-01  
MPXV5010G6U,  
MPVZ5010G6U  
CASE 482-01  
MPXV5010GC6U/C6T1  
CASE 482A-01  
MPXV5010DP  
CASE 1351-01  
MPXV5010GP  
CASE 1369-01  
SMALL OUTLINE PACKAGES THROUGH-HOLE  
MPXV5010GC7U  
CASE 482C-03  
MPVZ5010GW7U  
CASE 1560-02  
MPVZ5010G7U  
CASE 482B-03  
UNIBODY PACKAGES  
MPX5010GP  
CASE 867B-04  
MPX5010DP  
CASE 867C-05  
MPX5010GS  
CASE 867E-03  
MPX5010GSX  
CASE 867F-03  
MPX5010  
Sensors  
Freescale Semiconductor, Inc.  
2
Pressure  
Operating Characteristics  
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in  
Figure 3 required to meet specification.)  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Pressure Range  
POP  
0
—
10  
kPa  
1019.78  
mm H2O  
Supply Voltage(1)  
Supply Current  
VS  
Io  
4.75  
—
5.0  
5.0  
0.2  
5.25  
10  
Vdc  
mAdc  
Vdc  
Minimum Pressure Offset(2)  
@ VS = 5.0 Volts  
(0 to 85C)  
(0 to 85C)  
(0 to 85C)  
(0 to 85C)  
Voff  
0
0.425  
Full Scale Output(3)  
@ VS = 5.0 Volts  
VFSO  
4.475  
4.275  
4.7  
4.5  
—
4.925  
4.725  
Vdc  
Vdc  
Full Scale Span(4)  
@ VS = 5.0 Volts  
VFSS  
Accuracy(5)  
Sensitivity  
—
—
—
5.0  
%VFSS  
V/P  
450  
—
mV/mm  
4.413  
mV/mm H2O  
Response Time(6)  
tR  
IO+  
—
—
—
—
—
1.0  
0.1  
—
—
—
—
ms  
mAdc  
ms  
Output Source Current at Full Scale Output  
Warm-Up Time(7)  
20  
Offset Stability(8)  
—
0.5  
%VFSS  
1. Device is ratiometric within this specified excitation range.  
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.  
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.  
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the  
minimum rated pressure.  
5. Accuracy (error budget) consists of the following:  
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.  
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and  
from the minimum or maximum operating temperature points, with zero differential pressure applied.  
Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or  
maximum rated pressure, at 25°C.  
TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.  
TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.  
Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.  
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a  
specified step change in pressure.  
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.  
8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.  
MPX5010  
Sensors  
Freescale Semiconductor, Inc.  
3
Pressure  
Maximum Ratings  
Table 2. Maximum Ratings(1)  
Rating  
Symbol  
Value  
Unit  
Maximum Pressure (P1 > P2)  
Storage Temperature  
Pmax  
40  
kPa  
Tstg  
TA  
–40 to +125  
–40 to +125  
C  
C  
Operating Temperature  
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.  
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.  
VS  
2 (SOP)  
3 (Unibody)  
Gain Stage #2  
and  
Ground  
Reference  
Shift Circuitry  
Thin Film  
Temperature  
Compensation  
and  
1 (Unibody)  
4 (SOP)  
Sensing  
Element  
Vout  
Gain Stage #1  
Pins 1 and 5 through 8 are NO CONNECTS  
for small outline package.  
2 (Unibody)  
3 (SOP)  
GND  
Pins 4, 5, and 6 are NO CONNECTS for  
unibody package.  
Figure 1. Fully Integrated Pressure Sensor Schematic  
MPX5010  
Sensors  
Freescale Semiconductor, Inc.  
4
Pressure  
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION  
The performance over temperature is achieved by  
integrating the shear-stress strain gauge, temperature  
compensation, calibration and signal conditioning circuitry  
onto a single monolithic chip.  
Figure 3 illustrates the Differential or Gauge configuration  
in the basic chip carrier (Case 482). A fluorosilicone gel  
isolates the die surface and wire bonds from the environment,  
while allowing the pressure signal to be transmitted to the  
sensor diaphragm.  
other than dry air, may have adverse effects on sensor  
performance and long-term reliability. Contact the factory for  
information regarding media compatibility in your application.  
Figure 4 shows the recommended decoupling circuit for  
interfacing the integrated sensor to the A/D input of a  
microprocessor or microcontroller. Proper decoupling of the  
power supply is recommended.  
Figure 5 shows the sensor output signal relative to  
pressure input. Typical, minimum, and maximum output  
curves are shown for operation over a temperature range of  
0to 85C using the decoupling circuit shown in Figure 4. The  
output will saturate outside of the specified pressure range.  
The MPxx5010G series pressure sensor operating  
characteristics, and internal reliability and qualification tests  
are based on use of dry air as the pressure media. Media,  
Stainless  
Steel Cap  
Fluoro Silicone  
Gel Die Coat  
Die  
+5 V  
P1  
Thermoplastic  
Case  
OUTPUT  
Vout  
Wire Bond  
Vs  
Lead  
Frame  
IPS  
1.0 F  
GND  
470 pF  
0.01 F  
P2  
Die Bond  
Differential Sensing  
Element  
Figure 2. Cross-Sectional Diagram SOP  
(not to scale)  
Figure 3. Recommended Power Supply Decoupling  
and Output Filtering  
(For additional output filtering, please refer to  
Application Note AN1646.)  
5.0  
Transfer Function (kPa):  
out = VS (0.09 P + 0.04) ± 5.0% VFSS  
V
4.0  
3.0  
2.0  
1.0  
VS = 5.0 Vdc  
TEMP = 0 to 85C  
TYPICAL  
MAX  
MIN  
0
0
8.0  
2.0  
4.0  
Differential Pressure (kPa)  
10  
6.0  
Figure 4. Output vs. Pressure Differential  
MPX5010  
Sensors  
Freescale Semiconductor, Inc.  
5
Pressure  
Transfer Function  
Nominal Transfer Value: Vout = VS x (0.09 x P + 0.04)  
± (Pressure Error x Temp. Factor x 0.09 x VS)  
VS = 5.0 V 0.25 Vdc  
Temperature Error Band  
4.0  
3.0  
2.0  
1.0  
0.0  
Temp  
Multiplier  
–40  
0 to 85  
+125  
3
1
3
Temperature  
Error  
Factor  
–40  
–20  
0
20  
40  
60  
80  
100  
120  
140  
Temperature in C  
NOTE: The Temperature Multiplier is a linear response from 0to –40C and from 85to 125C.  
Pressure Error Band  
0.5  
0.4  
0.3  
0.2  
0.1  
Pressure  
Error  
(kPa)  
Pressure (kPa)  
0
–0.1  
–0.2  
0
1
2
3
4
5
6
7
8
9
10  
–0.3  
–0.4  
–0.5  
Pressure  
Error (Max)  
±0.5 (kPa)  
0 to 10 (kPa)  
MPX5010  
Sensors  
Freescale Semiconductor, Inc.  
6
Pressure  
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE  
Freescale designates the two sides of the pressure sensor  
as the Pressure (P1) side and the Vacuum (P2) side. The  
Pressure (P1) side is the side containing fluorosilicone gel  
which protects the die from harsh media. The MPX pressure  
sensor is designed to operate with positive differential  
pressure applied, P1 > P2.  
The Pressure (P1) side may be identified by using the  
table below:  
Pressure (P1)  
Side Identifier  
Part Number  
Case Type  
MPX5010DP  
867C  
867B  
867E  
867F  
482  
Side with Part Marking  
MPX5010GP  
Side with Port Attached  
Side with Port Attached  
Side with Port Attached  
Stainless Steel Cap  
MPX5010GS  
MPX5010GSX  
MPXV5010G6U  
MPXV5010GC6U/6T1  
MPXV5010GC7U  
MPXV5010GP  
MPXV5010DP  
MPVZ5010G6U  
MPVZ5010G7U  
MPVZ5010GW6U  
MPVZ5010GW7U  
482A  
482C  
1369  
1351  
482  
Side with Port Attached  
Side with Port Attached  
Side with Port Attached  
Side with Part Marking  
Stainless Steel Cap  
Stainless Steel Cap  
482B  
1735  
1560  
Vertical Port Attached  
Vertical Port Attached  
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS  
Surface mount board layout is a critical portion of the total  
design. The footprint for the surface mount packages must be  
the correct size to ensure proper solder connection interface  
between the board and the package. With the correct  
footprint, the packages will self align when subjected to a  
solder reflow process. It is always recommended to design  
boards with a solder mask layer to avoid bridging and  
shorting between solder pads.  
0.100 TYP 8X  
2.54  
0.660  
16.76  
0.060 TYP 8X  
1.52  
0.300  
7.62  
inch  
0.100 TYP 8X  
2.54  
mm SCALE 2:1  
Figure 5. SOP Footprint (Case 482)  
MPX5010  
Sensors  
Freescale Semiconductor, Inc.  
7
Pressure  
PACKAGE DIMENSIONS  
-A-  
D
8 PL  
4
1
M
S
S
A
0.25 (0.010)  
T
B
5
8
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
-B-  
G
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.  
INCHES  
MIN MAX  
MILLIMETERS  
S
N
DIM  
A
B
C
D
G
H
J
K
M
N
MIN  
10.54  
10.54  
5.38  
MAX  
10.79  
10.79  
5.84  
0.415 0.425  
0.415 0.425  
0.212 0.230  
0.038 0.042  
0.100 BSC  
0.96  
1.07  
2.54 BSC  
0.002 0.010  
0.009 0.011  
0.061 0.071  
0.05  
0.23  
1.55  
0˚  
0.25  
0.28  
1.80  
7˚  
H
C
J
0˚  
7˚  
-T-  
0.405 0.415  
0.709 0.725  
10.29  
18.01  
10.54  
18.41  
SEATING  
PLANE  
S
PIN 1 IDENTIFIER  
K
M
CASE 482-01  
ISSUE O  
SMALL OUTLINE PACKAGE  
–A–  
D 8 PL  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.  
4
M
S
S
0.25 (0.010)  
T
B
A
5
8
N
–B–  
G
INCHES  
MILLIMETERS  
1
DIM  
A
B
C
D
MIN  
MAX  
0.425  
0.425  
0.520  
0.042  
MIN  
10.54  
10.54  
12.70  
0.96  
MAX  
10.79  
10.79  
13.21  
1.07  
0.415  
0.415  
0.500  
0.038  
S
W
G
H
J
K
M
N
S
V
W
0.100 BSC  
2.54 BSC  
0.002  
0.009  
0.061  
0
0.010  
0.011  
0.071  
7
0.05  
0.23  
1.55  
0
0.25  
0.28  
1.80  
7
V
0.444  
0.709  
0.245  
0.115  
0.448  
0.725  
0.255  
0.125  
11.28  
18.01  
6.22  
2.92  
11.38  
18.41  
6.48  
3.17  
C
H
J
–T–  
SEATING  
PLANE  
PIN 1 IDENTIFIER  
M
K
CASE 482A-0  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPX5010  
Sensors  
8
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
-A-  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
4
5
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
-B-  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.  
6. DIMENSION S TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
G
8
D
S
8 PL  
1
M
S
0.25 (0.010)  
T B  
A
INCHES  
MILLIMETERS  
DIM MIN MAX MIN  
MAX  
10.79  
10.79  
5.59  
DETAIL X  
A
B
C
D
G
J
K
M
N
S
0.415  
0.425 10.54  
0.425 10.54  
S
N
0.415  
0.210  
0.026  
0.220  
0.034  
5.33  
0.66  
PIN 1 IDENTIFIER  
0.864  
0.100 BSC  
2.54 BSC  
0.009  
0.100  
0˚  
0.011  
0.120  
15˚  
0.23  
2.54  
0˚  
0.28  
3.05  
15˚  
C
0.405  
0.540  
0.415 10.29  
0.560 13.72  
10.54  
14.22  
SEATING  
PLANE  
-T-  
K
M
J
DETAIL X  
CASE 482B-03  
ISSUE B  
SMALL OUTLINE PACKAGE  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
–A–  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
4
5
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.  
6. DIMENSION S TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
N
–B–  
D 8 PL  
G
M
S
S
INCHES  
MILLIMETERS  
8
0.25 (0.010)  
T
B
A
1
DIM  
A
B
C
D
MIN  
MAX  
0.425  
0.425  
0.520  
0.034  
MIN  
10.54  
10.54  
12.70  
0.66  
MAX  
10.79  
10.79  
13.21  
0.864  
0.415  
0.415  
0.500  
0.026  
DETAIL X  
S
W
G
J
K
M
N
S
0.100 BSC  
2.54 BSC  
0.009  
0.100  
0
0.011  
0.120  
15  
0.23  
2.54  
0
0.28  
3.05  
15  
PIN 1  
IDENTIFIER  
V
0.444  
0.540  
0.245  
0.115  
0.448  
0.560  
0.255  
0.125  
11.28  
13.72  
6.22  
2.92  
11.38  
14.22  
6.48  
3.17  
C
V
W
SEATING  
PLANE  
–T–  
K
M
J
DETAIL X  
CASE 482C-03  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPX5010  
Sensors  
Freescale Semiconductor, Inc.  
9
Pressure  
PACKAGE DIMENSIONS  
-T-  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
C
A
U
E
-Q-  
2. CONTROLLING DIMENSION: INCH.  
INCHES  
MILLIMETERS  
DIM MIN MAX  
MIN  
27.43  
18.80  
16.00  
0.68  
MAX  
28.45  
19.30  
16.51  
0.84  
A
B
C
D
E
F
1.080 1.120  
0.740 0.760  
0.630 0.650  
0.027 0.033  
0.160 0.180  
0.048 0.064  
0.100 BSC  
N
S
V
4.06  
1.22  
4.57  
1.63  
B
G
J
2.54 BSC  
R
0.014 0.016  
0.220 0.240  
0.070 0.080  
0.150 0.160  
0.150 0.160  
0.440 0.460  
0.695 0.725  
0.840 0.860  
0.182 0.194  
0.36  
5.59  
0.41  
6.10  
PIN 1  
PORT #1  
K
N
P
Q
R
S
U
V
POSITIVE  
PRESSURE  
(P1)  
1.78  
3.81  
2.03  
4.06  
-P-  
6
5
4
3
2
1
M
M
0.25 (0.010)  
T Q  
3.81  
4.06  
11.18  
17.65  
21.34  
4.62  
11.68  
18.42  
21.84  
4.93  
K
6 PL  
J
D
G
STYLE 1:  
M
S
S
Q
0.13 (0.005)  
T P  
PIN 1.  
2. GROUND  
3.  
4. V1  
5. V2  
6.  
VOUT  
VCC  
F
VEX  
CASE 867F-03  
ISSUE D  
UNIBODY PACKAGE  
MPX5010  
Sensors  
10  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 2  
CASE 867B-04  
ISSUE G  
UNIBODY PACKAGE  
MPX5010  
11  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 2  
CASE 867B-04  
ISSUE G  
UNIBODY PACKAGE  
MPX5010  
12  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 2  
CASE 1351-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPX5010  
13  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 2  
CASE 1351-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPX5010  
14  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 2  
CASE 1369-01  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPX5010  
15  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 2  
CASE 1369-01  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPX5010  
16  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 3  
1560-03  
ISSUE C  
SMALL OUTLINE PACKAGE  
MPX5010  
17  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 3  
CASE 1560-03  
ISSUE D  
SMALL OUTLINE PACKAGE  
MPX5010  
18  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
PAGE 3 OF 3  
CASE 1560-03  
ISSUE D  
SMALL OUTLINE PACKAGE  
MPX5010  
19  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 3  
CASE 1735-02  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPX5010  
20  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 3  
CASE 1735-02  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPX5010  
21  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
PACKAGE DIMENSIONS  
PAGE 3 OF 3  
CASE 1735-02  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPX5010  
22  
Sensors  
Freescale Semiconductor, Inc.  
Pressure  
Table 3. Revision History  
Revision Revision  
Description of changes  
number  
date  
13  
10/2012  
• Deleted references to device number MPVZ5010G6T1, MPVZ5010G6U/T1 and MPVZ5010G6U/  
6T1 throughout the document  
MPX5010  
Sensors  
Freescale Semiconductor, Inc.  
23  
Information in this document is provided solely to enable system and software  
implementers to use Freescale products. There are no express or implied copyright  
licenses granted hereunder to design or fabricate any integrated circuits based on the  
information in this document.  
How to Reach Us:  
Home Page:  
freescale.com  
Web Support:  
freescale.com/support  
Freescale reserves the right to make changes without further notice to any products  
herein. Freescale makes no warranty, representation, or guarantee regarding the  
suitability of its products for any particular purpose, nor does Freescale assume any  
liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation consequential or incidental  
damages. “Typical” parameters that may be provided in Freescale data sheets and/or  
specifications can and do vary in different applications, and actual performance may  
vary over time. All operating parameters, including “typicals,” must be validated for each  
customer application by customer’s technical experts. Freescale does not convey any  
license under its patent rights nor the rights of others. Freescale sells products pursuant  
to standard terms and conditions of sale, which can be found at the following address:  
freescale.com/salestermsandconditions.  
Freescale, the Freescale logo, Energy Efficient Solutions logo, are trademarks of  
Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Xtrinsic is a trademark of  
Freescale Semiconductor, Inc. All other product or service names are the property of  
their respective owners.  
© 2012 Freescale Semiconductor, Inc.  
MPX5010  
Rev. 13  
10/2012  

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