935316709174 [NXP]
Peizoresistive Sensor;
| 型号： | 935316709174 |
| 厂家： | 
NXP |
| 描述： | Peizoresistive Sensor 传感器 换能器 |
| 文件： | 总20页 (文件大小：380K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
escale Semiconductor
Data Sheet: Technical Data
Document Number: MPXA6115A
Rev. 7.3, 04/2015
MPXxx6115A,15to115 kPa,Absolute,
Integrated Pressure Sensor
The MPXxx6115A series sensor integrates on-chip, bipolar op amp circuitry and
thin film resistor networks to provide a high output signal and temperature
compensation. The small form factor and high reliability of on-chip integration make
the pressure sensor a logical and economical choice for the system designer.
MPXA6115A
MPXAZ6115A
MPXH6115A
MPXHZ6115A
Series
The MPXxx6115A series piezoresistive transducer is a state-of-the-art, monolithic,
signal conditioned, silicon pressure sensor. This sensor combines advanced
micromachining techniques, thin film metallization, and bipolar semiconductor
processing to provide an accurate, high level analog output signal that is
proportional to applied pressure.
Top view
Features
•
•
•
•
•
•
•
Resistant to high humidity and common automotive media
DNC
DNC
DNC
DNC
5
6
7
8
4
3
2
1
VOUT
GND
VS
Improved accuracy at high temperature
Available in small and super small outline packages
1.5% maximum error over 0 °C to 85 °C
DNC
Ideally suited for microprocessor or microcontroller-based systems
Temperature compensated from -40 °C to +125 °C
Durable Thermoplastic (PPS) Surface Mount Package
Pin 1 identification
chamfered corner
or notch in pin
Typical applications
Pinout
•
•
•
Industrial controls
Engine control/manifold absolute pressure (MAP)
Weather station and weather reporting device barometers
Small outline packages
MPXAZ6115AP/T1
Case 98ASA99303D
MPXA6115A6U/T1
Case 98ASB17756C
MPXA6115AC6U/T1
MPXAZ6115AC6T1
Case 98ASB17757C
MPXA6115AC7U
Case 98ASB17759C
Super small outline packages
MPXH6115A6U/T1
MPXHZ6115A6U/T1
Case 98ARH99066A
MPXH6115AC6U/T1
MPXHZ6115AC6U/T1
Case 98ARH99089A
Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
© 2007-2012, 2015 Freescale Semiconductor, Inc. All rights reserved.
Ordering information
# of Ports
Pressure type
Device
marking
Device name
Shipping
Package
None Single
Dual
Gauge
Differential Absolute
Small outline package (MPXA6115A series)
MPXA6115A6U
MPXA6115A6T1
MPXA6115AC6U
MPXA6115AC6T1
MPXA6115AC7U
Rails
Tape and Reel
Rails
98ASB17756C
98ASB17756C
98ASB17757C
98ASB17757C
98ASB17759C
•
•
•
•
•
•
•
•
•
•
MPXA6115A
MPXA6115A
MPXA6115A
MPXA6115A
MPXA6115A
Tape and Reel
Rails
Small outline package (Media resistant gel) (MPXAZ6115A series)
MPXAZ6115AC6T1 Tape and Reel
98ASB17757C
98ASA99303D
98ASA99303D
•
•
•
•
•
•
MPXAZ6115A
MPXAZ6115A
MPXAZ6115A
MPXAZ6115AP
Trays
MPXAZ6115APT1
Tape and Reel
Super small outline package (MPXH6115A series)
MPXH6115A6U
MPXH6115A6T1
MPXH6115AC6U
MPXH6115AC6T1
Rails
98ARH99066A
98ARH99066A
98ARH99089A
98ARH99089A
•
•
•
•
•
•
MPXH6115A
MPXH6115A
MPXH6115A
MPXH6115A
Tape and Reel
Rails
•
•
Tape and Reel
Small outline package (Media resistant gel) (MPXHZ6115A series)
MPXHZ6115A6U
MPXHZ6115A6T1
MPXHZ6115AC6U
Rails
Tape and Reel
Rails
98ARH99066A
98ARH99066A
98ARH99089A
98ARH99089A
•
•
•
•
•
•
MPXHZ6115A
MPXHZ6115A
MPXHZ6115A
MPXHZ6115A
•
•
MPXHZ6115AC6T1 Tape and Reel
MPXA6115A
Sensors
2
Freescale Semiconductor, Inc.
Contents
1
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Minimum recommended footprint for small and super small packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 Package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2
3
4
5
Related Documentation
The MPXxx6115A device features and operations are described in a variety of reference manuals, user guides, and application
notes. To find the most-current versions of these documents:
1. Go to the Freescale homepage at:
http://www.freescale.com/
2. In the Keyword search box at the top of the page, enter the device number MPXxx6115A.
3. In the Refine Your Result pane on the left, click on the Documentation link.
MPXA6115A
Sensors
Freescale Semiconductor, Inc.
3
1
General Description
1.1
Block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
+5.0 V
VS Pin 2
MPXxx6115A
to ADC
100 nF
VOUT Pin 4
47 pF
51 K
GND Pin 3
Figure 1. Fully integrated pressure sensor schematic
1.2
Pinout
DNC
DNC
DNC
DNC
5
6
7
8
4
3
2
1
V
OUT
GND
V
S
DNC
Pin 1 identification, chamfered corner or notch in pin
Figure 2. Device pinout (top view)
Table 1. Pin functions
Pin
1
Name
Function
DNC
VS
Do not connect to external circuitry or ground. Pin 1 is denoted by chamfered corner.
Voltage supply
2
3
GND
VOUT
DNC
DNC
DNC
DNC
Ground
4
Output voltage
5
Do not connect to external circuitry or ground.
Do not connect to external circuitry or ground.
Do not connect to external circuitry or ground.
Do not connect to external circuitry or ground.
6
7
8
MPXA6115A
Sensors
Freescale Semiconductor, Inc.
4
2
Mechanical and Electrical Specifications
2.1
Maximum ratings
Table 2. Maximum ratings(1)
Rating
Symbol
Pmax
Tstg
Value
400
Units
kPa
°C
Maximum pressure (P1 > P2)
Storage temperature
-40° to +125°
-40° to +125°
0.5
Operating temperature
TA
°C
Output source current @ full-scale output(2)
Io+
mAdc
Output sink current @ minimum pressure offset(2)
Io-
-0.5
mAdc
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2.Maximum output current is controlled by effective impedance from VOUT to GND or VOUT to VS in the application circuit.
2.2
Operating characteristics
Table 3. Operating characteristics (VS = 5.0 Vdc, TA = 25 °C unless otherwise noted, P1 > P2)
Characteristic
Symbol
POP
Min
15
Typ
—
Max
115
Unit
kPa
Vdc
Pressure range
Supply voltage(1)
Supply current
VS
4.75
5.0
5.25
Io
—
6.0
10
mAdc
Vdc
Minimum pressure offset(2) (0 °C to 85° C) @ VS = 5.0 Volts
Full-scale output(3) (0 °C to 85° C) @ VS = 5.0 Volts
Full-scale span(4) (0 °C to 85° C) @ VS = 5.0 Volts
Voff
0.133
0.200
0.268
VFSO
VFSS
—
4.633
4.433
—
4.700
4.500
—
4.768
4.568
1.5
Vdc
Vdc
Accuracy(5) (0 °C to 85° C)
Sensitivity
%VFSS
V/P
tR
—
—
45.0
1.0
—
—
mV/kPa
ms
Response time(6)
Warm-up time(7)
—
—
—
—
20
—
—
ms
Offset stability(8)
0.25
%VFSS
1.Device is ratiometric within this specified excitation range.
2.Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3.Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure.
4.Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the
minimum rated pressure.
5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at
25 °C due to all sources of error including the following:
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or
maximum rated pressure at 25 °C.
TcSpan:
TcOffset:
Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C.
Output deviation with minimum pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C.
6.Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8.Offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test.
MPXA6115A
Sensors
Freescale Semiconductor, Inc.
5
3
On-chip Temperature Compensation and Calibration
Figure 3 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 98ARH99066A).
Figure 4 shows a typical application circuit (output source current operation).
Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for
operation over 0 °C to 85 °C temperature range. The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm. The MPXxx6115A series pressure sensor operating characteristics, internal reliability and
qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor
performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
Fluorosilicone
Gel Die Coat
Stainless
Steel Cap
Die
P1
Wire Bond
Thermoplastic
Case
Lead
Frame
Die Bond
Absolute Element
Sealed Vacuum Reference
Figure 3. Cross Sectional Diagram SSOP/SOP (not to scale)
+5.0 V
VS Pin 2
MPXxx6115A
to ADC
100 nF
VOUT Pin 4
47 pF
51 K
GND Pin 3
Figure 4. Typical application circuit (output source current operation)
5.0
Transfer Function:
MAX
4.5
V
V
OUT = Vs* (.009*P-.095) ± Error
S = 5.0 Vdc
4.0
TEMP = 0 to 85 °C
3.5
3.0
2.5
TYP
2.0
1.5
1.0
0.5
0
MIN
Pressure (ref: to sealed vacuum) in kPa
Figure 5. Output vs. absolute pressure
MPXA6115A
Sensors
6
Freescale Semiconductor, Inc.
Nominal Transfer Value: VOUT = VS x (0.009 x P - 0.095)
± (Pressure Error x Temp. Factor x 0.009 x VS)
VS = 5.0 ± 0.25 Vdc
Figure 6. Transfer function
4.0
3.0
2.0
1.0
0.0
Break Points
Temp
Multiplier
- 40 °C
0 °C to 85 °C
125 °C
3
1
1.75
-40
-20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0 ºC to -40 ºC and from 85 ºC to 125 ºC
Figure 7. Temperature error band
Error Limits for Pressure
3.0
2.0
1.0
0.0
-1.0
Pressure (in kPa)
20
40
60
80
100
120
Pressure
Error (Max)
±1.5 (kPa)
-2.0
-3.0
15 to 115 (kPa)
Figure 8. Pressure error band
MPXA6115A
Sensors
Freescale Semiconductor, Inc.
7
4
Package Information
4.1
Minimum recommended footprint for small and super small packages
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry,
the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder
mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
0.100 TYP
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
inch
mm
0.100 TYP 8X
2.54
Figure 9. SOP Footprint (Case 98ASB17756C)
0.050
0.387
9.83
1.27
TYP
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 10. SSOP Footprint (Case 98ARH99066A and 98ARH99089A)
MPXA6115A
Sensors
Freescale Semiconductor, Inc.
8
4.2
Package dimensions
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17756C.pdf.
Case 98ASB17756C, Small outline package
MPXA6115A
Sensors
Freescale Semiconductor, Inc.
9
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17757C.pdf.
-A-
D
8 PL
4
1
M
S
S
A
NOTES:
0.25 (0.010)
T
B
5
8
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
N
-B-
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
G
INCHES
MIN MAX
MILLIMETERS
DIM
A
B
C
D
G
H
J
K
M
N
MIN
10.54
10.54
12.70
0.96
MAX
10.79
10.79
13.21
1.07
S
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
W
2.54 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0.05
0.23
1.55
0˚
0.25
0.28
1.80
7˚
V
0˚
7˚
C
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
11.28
18.01
6.22
2.92
11.38
18.41
6.48
3.17
S
V
W
H
J
-T-
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
Case 98ASB17757C, small outline package
MPXA6115A
Sensors
Freescale Semiconductor, Inc.
10
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17759C.pdf.
FREESCALE
D
Case 98ASB17759C, small outline package
MPXA6115A
Sensors
Freescale Semiconductor, Inc.
11
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA99303D.pdf.
PAGE 1 OF 2
Case 98ASA99303D, Small Outline Package
MPXA6115A
Sensors
12
Freescale Semiconductor, Inc.
PAGE 2 OF 2
Case 98ASA99303D, Small outline package
MPXA6115A
Sensors
Freescale Semiconductor, Inc.
13
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99066A.pdf.
PAGE 1 OF 3
Case 98ARH99066A, Super small outline package
MPXA6115A
Sensors
Freescale Semiconductor, Inc.
14
PAGE 2 OF 3
Case 98ARH99066A, Super small outline package
MPXA6115A
Sensors
Freescale Semiconductor, Inc.
15
PAGE 3 OF 3
Case 98ARH99066A, Super small outline package
MPXA6115A
Sensors
Freescale Semiconductor, Inc.
16
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99089A.pdf.
PAGE 1 OF 2
Case 98ARH99089A, Super small outline package
MPXA6115A
Sensors
Freescale Semiconductor, Inc.
17
PAGE 2 OF 2
Case 98ARH99089A, Super small outline package
MPXA6115A
Sensors
Freescale Semiconductor, Inc.
18
5
Revision History
Table 4. Revision history
Revision
number
Revision
date
Description of changes
7.1
7.2
05/2012
10/2012
• Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H,
• On page 1, changed typical output voltage from 4.8V to 4.7V to match typical output voltage listed on page 3 of
document
• Removed obsolete part numbers MPXAZ6115A6U and MPXAZ6115AC6U from data sheet.
• Updated format.
7.3
04/2015
MPXA6115A
Sensors
Freescale Semiconductor, Inc.
19
Information in this document is provided solely to enable system and software
implementers to use Freescale products. There are no express or implied copyright
licenses granted hereunder to design or fabricate any integrated circuits based on the
information in this document.
How to Reach Us:
Home Page:
freescale.com
Web Support:
freescale.com/support
Freescale reserves the right to make changes without further notice to any products
herein. Freescale makes no warranty, representation, or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale assume any
liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental
damages. “Typical” parameters that may be provided in Freescale data sheets and/or
specifications can and do vary in different applications, and actual performance may
vary over time. All operating parameters, including “typicals,” must be validated for each
customer application by customer’s technical experts. Freescale does not convey any
license under its patent rights nor the rights of others. Freescale sells products pursuant
to standard terms and conditions of sale, which can be found at the following address:
freescale.com/salestermsandconditions.
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc.,
Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their
respective owners.
© 2015 Freescale Semiconductor, Inc.
Document Number: MPXA6115A
Rev. 7.3
04/2015
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