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935321189117 [NXP]

Peizoresistive Sensor;
935321189117
型号： 935321189117
厂家： NXP    NXP
描述：

Peizoresistive Sensor

传感器 换能器
文件： 总22页 (文件大小：477K)
中文：  中文翻译
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Pressure  
MPXV4006  
Rev 3, 1/2009  
Freescale Semiconductor  
+
Integrated Silicon Pressure Sensor  
MPXV4006  
Series  
Integrated  
On-Chip Signal Conditioned,  
Temperature Compensated and  
Calibrated  
Pressure Sensor  
0 to 6 kPa (0 to 0.87 psi)  
0.2 to 4.8 V Output  
The MPXV4006 series piezoresistive transducers are state-of-the-art  
monolithic silicon pressure sensors designed for the appliance, consumer,  
health care and industrial market. The analog output can be read directly into  
the A/D input of Freescale microcontrollers. This transducer combines  
advanced micromachining techniques, thin-film metallization, and bipolar  
processing to provide an accurate, high level analog output signal that is  
proportional to the applied pressure. The axial port has been modified to  
accommodate industrial grade tubing.  
Application Examples  
•
•
•
•
Washing Machine Water Level  
Measurement (Reference AN1950)  
Ideally Suited for Microprocessor or  
Microcontroller-Based Systems  
Features  
Appliance Liquid Level and Pressure  
Measurement  
•
•
•
•
•
2.5% Maximum Error over +10°C to +60°C with Auto Zero  
5% Maximum Error over +10°C to +60°C without Auto Zero  
Durable Thermoplastic (PPS) Package  
Respiratory Equipment  
Available in Surface Mount (SMT) or Through-Hole (DIP) Configurations  
Available with Standard Fluorosilicone Gel or Media Resistant Gel  
ORDERING INFORMATION  
# of Ports  
Pressure Type  
Option  
Device  
Package  
Options  
Case  
No.  
Device Name  
Surface Through-  
Marking  
None Single Dual Gauge Differential Absolute  
Mount  
Hole  
Small Outline Package (Media Resistant Gel) (MPVZ4006 Series)  
MPVZ4006GW6U  
MPVZ4006GW7U  
MPVZ4006G6U  
MPVZ4006G6T1  
MZ4006GW  
MZ4006GW  
MPVZ4006G  
MPVZ4006G  
Rail  
Rail  
Rail  
1735  
1560  
482  
•
•
•
•
•
•
•
•
•
•
•
•
Tapeand  
Reel  
482  
MPVZ4006G7U  
MPVZ4006G  
Rail  
482B  
•
•
•
•
Small Outline Package (MPXV4006 Series)  
MPXV4006GC6U  
MPXV4006G  
MPXV4006G  
Rail  
482A  
482A  
•
•
•
•
•
•
MPXV4006GC6T1  
Tapeand  
Reel  
MPXV4006GC7U  
MPXV4006GP  
MPXV4006DP  
MPXV4006G  
MPXV4006GP  
MPXV4006DP  
Rail  
Tray  
Tray  
482C  
1369  
1351  
•
•
•
•
•
•
•
•
© Freescale Semiconductor, Inc., 2006-2009. All rights reserved.  
Pressure  
SMALL OUTLINE PACKAGE SURFACE MOUNT  
MPVZ4006G6U/T1  
CASE 482-01  
MPVZ4006GW6U  
CASE 1735-01  
MPXV4006GC6U/C6T1  
CASE 482A-01  
MPXV4006DP  
CASE 1351-01  
MPXV4006GP  
CASE 1369-01  
SMALL OUTLINE PACKAGE THROUGH-HOLE  
MPXV4006GC7U  
CASE 482C-03  
MPVZ4006GW7U  
CASE 1560-02  
MPVZ4006G7U  
CASE 482B-03  
MPXV4006  
Sensors  
2
Freescale Semiconductor  
Pressure  
Operating Characteristics  
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Pressure Range  
POP  
0
—
6.0  
kPa  
612  
mm H2O  
Supply Voltage(1)  
Supply Current  
Full Scale Span(2)  
Offset(3)(5)  
VS  
IS  
4.75  
—
5.0  
—
5.25  
10  
Vdc  
mAdc  
V
VFSS  
Voff  
V/P  
—
4.6  
—
0.152  
—
0.265  
0.378  
—
V
Sensitivity  
766  
mV/kPa  
7.511  
mV/mm H2O  
Accuracy(4)(5)  
(10 to 60°C)  
—
—
—
—
—
—
±2.46  
±5.0  
%VFSS with  
auto zero  
%VFSS without  
auto zero  
1. Device is ratiometric within this specified excitation range.  
2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the  
minimum rated pressure.  
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.  
4. Accuracy (error budget) consists of the following:  
Linearity:  
Output deviation from a straight line relationship with pressure over the specified pressure range.  
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to  
and from the minimum or maximum operating temperature points, with zero differential pressure applied.  
Pressure Hysteresis:  
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum  
or maximum rated pressure, at 25°C.  
Offset Stability:  
Output deviation, after 1000 temperature cycles, -30 to 100°C, and 1.5 million pressure cycles, with  
minimum rated pressure applied.  
TcSpan:  
TcOffset:  
Output deviation over the temperature range of 10° to 60°C, relative to 25°C.  
Output deviation with minimum pressure applied, over the temperature range of 10° to 60°C, relative to 25°C.  
5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV4006, external mechanical stresses and mounting position can affect the  
zero pressure output reading. To obtain the 2.46% FSS accuracy, the device output must be “autozeroed'' after installation. Autozeroing is  
defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. The specified  
accuracy assumes a maximum temperature change of ±5°C between autozero and measurement.  
MPXV4006  
Sensors  
Freescale Semiconductor  
3
Pressure  
Maximum Ratings  
Table 2. Maximum Ratings(1)  
Parametrics  
Symbol  
Pmax  
Tstg  
Value  
24  
Units  
kPa  
°C  
Maximum Pressure (P1 > P2)  
Storage Temperature  
-30° to +100°  
+10° to +60°  
Operating Temperature  
TA  
°C  
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.  
VS  
2
Gain Stage #2  
Thin Film  
4
Vout  
and  
Ground  
Reference  
Shift Circuitry  
Temperature  
Compensation  
and  
Sensing  
Element  
Gain Stage #1  
Pins 1, 5, 6, 7, and 8 are NO CONNECTS  
for small outline package device  
3
GND  
Figure 1. Fully Integrated Pressure Sensor Schematic  
MPXV4006  
Sensors  
Freescale Semiconductor  
4
Pressure  
On-Chip Temperature Compensation and Calibration  
The performance over temperature is achieved by  
integrating the shear-stress strain gauge, temperature  
compensation, calibration and signal conditioning circuitry  
onto a single monolithic chip.  
Figure 2 illustrates the Differential or Gauge configuration  
in the basic chip carrier (Case 482). A gel die coat isolates the  
die surface and wire bonds from the environment, while  
allowing the pressure signal to be transmitted to the silicon  
diaphragm.  
The MPXV4006/MPVZ4006 series sensor operating  
characteristics are based on use of dry air as pressure media.  
Media, other than dry air, may have adverse effects on sensor  
performance and long-term reliability. Internal reliability and  
qualification test for dry air, and other media, are available  
from the factory. Contact the factory for information regarding  
media tolerance in your application.  
Figure 3 shows the recommended decoupling circuit for  
interfacing the output of the integrated sensor to the A/D input  
of a microprocessor or microcontroller. Proper decoupling of  
the power supply is recommended.  
Figure 4 and Figure 5 shows the sensor output signal  
relative to pressure input. Typical, minimum and maximum  
output curves are shown for operation over a temperature  
range of 10°C to 60°C using the decoupling circuit shown in  
Figure 3. The output will saturate outside of the specified  
pressure range.  
Fluorosilicone  
Gel Die Coat  
Stainless  
Steel Cap  
Die  
+5 V  
P1  
Wire  
OUTPUT  
Vout  
Thermoplastic  
Case  
Bond  
Vs  
IPS  
Lead  
Frame  
1.0 μF  
0.01 μF  
GND  
470 pF  
P2  
Differential Sensing  
Element  
Die Bond  
Figure 3. Recommended Power Supply Decoupling  
and Output Filtering Recommendations  
(For additional output filtering, please refer to  
Application Note AN1646.)  
Figure 2. Cross Sectional Diagram SOP  
(not to scale)  
5.0  
5.0  
Transfer Function (kPa):  
out = VS*[(0.1533*P) + 0.053] ± 2.46% VFSS  
Transfer Function (kPa):  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
V
V
out = VS*[(0.1533*P) + 0.053] ± 5.0% VFSS  
VS = 5.0 Vdc  
TEMP = 10 to 60°C  
VS = 5.0 Vdc  
TEMP = 10 to 60°C  
TYPICAL  
MAX  
MAX  
TYPICAL  
MIN  
MIN  
0.5  
0
0
2.0  
4.0  
6.0  
0
2.0  
4.0  
6.0  
Differential Pressure (kPa)  
Differential Pressure (kPa)  
Figure 4. Output versus Pressure Differential  
at ±5.0% VFSS (without auto zero, Note 5 in  
Operating Characteristics)  
Figure 5. Output versus Pressure Differential  
at ±2.46% VFSS (with auto zero, Note 5 in  
Operating Characteristics)  
MPXV4006  
Sensors  
Freescale Semiconductor  
5
Pressure  
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE  
Freescale designates the two sides of the pressure sensor  
as the Pressure (P1) side and the Vacuum (P2) side. The  
Pressure (P1) side is the side containing a gel die coat which  
isolates the die from the environment. The pressure sensor is  
designed to operate with positive differential pressure  
applied, P1 > P2.  
The Pressure (P1) side may be identified by using the  
table below:  
Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table  
Part Number  
MPVZ4006GW6U  
Case Type  
1735-01  
1560-02  
482-01  
Pressure (P1) Side Identifier  
Vertical Port Attached  
Vertical Port Attached  
Stainless Steel Cap  
MPVZ4006GW7U  
MPVZ4006G6U/T1  
MPVZ4006G7U  
MPXV4006GC6U/T1  
MPXV4006GC7U  
MPXV4006GP  
482B-03  
482A  
Stainless Steel Cap  
Vertical Port Attached  
Vertical Port Attached  
Side with Port Attached  
Side with Part Marking  
482C-03  
1369-01  
1351-01  
MPXV4006DP  
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS  
Surface mount board layout is a critical portion of the total  
design. The footprint for the surface mount packages must be  
the correct size to ensure proper solder connection interface  
between the board and the package. With the correct  
footprint, the packages will self align when subjected to a  
solder reflow process. It is always recommended to design  
boards with a solder mask layer to avoid bridging and  
shorting between solder pads.  
0.100 TYP  
2.54  
0.660  
16.76  
0.060 TYP 8X  
1.52  
0.300  
7.62  
inch  
mm  
0.100 TYP 8X  
2.54  
Figure 6. SOP Footprint (Case 482)  
MPXV4006  
Sensors  
6
Freescale Semiconductor  
Pressure  
CASE 1351-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPXV4006  
Sensors  
Freescale Semiconductor  
7
Pressure  
CASE 1351-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPXV4006  
Sensors  
8
Freescale Semiconductor  
Pressure  
CASE 1369-01  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPXV4006  
Sensors  
Freescale Semiconductor  
9
Pressure  
CASE 1369-01  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPXV4006  
10  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
-A-  
D 8 PL  
0.25 (0.010)  
4
1
M
S
S
A
T
B
5
8
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
-B-  
G
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.  
INCHES  
MIN MAX  
MILLIMETERS  
S
N
DIM  
A
B
C
D
G
H
J
K
M
N
MIN  
10.54  
10.54  
5.38  
MAX  
10.79  
10.79  
5.84  
0.415 0.425  
0.415 0.425  
0.212 0.230  
0.038 0.042  
0.100 BSC  
0.96  
1.07  
2.54 BSC  
0.002 0.010  
0.009 0.011  
0.061 0.071  
0.05  
0.23  
1.55  
0˚  
0.25  
0.28  
1.80  
7˚  
H
C
J
0˚  
7˚  
-T-  
0.405 0.415  
0.709 0.725  
10.29  
18.01  
10.54  
18.41  
SEATING  
PLANE  
S
PIN 1 IDENTIFIER  
K
M
CASE 482-01  
ISSUE O  
SMALL OUTLINE PACKAGE  
-A-  
NOTES:  
4
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
5
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
-B-  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.  
6. DIMENSION S TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
G
8
D 8 PL  
1
M
S
S
A
0.25 (0.010)  
T B  
INCHES  
MILLIMETERS  
DIM MIN MAX MIN  
MAX  
10.79  
10.79  
5.59  
DETAIL X  
A
B
C
D
G
J
K
M
N
S
0.415  
0.425 10.54  
0.425 10.54  
S
N
0.415  
0.210  
0.026  
0.220  
0.034  
5.33  
0.66  
PIN 1 IDENTIFIER  
0.864  
0.100 BSC  
2.54 BSC  
0.009  
0.100  
0˚  
0.011  
0.120  
15˚  
0.23  
2.54  
0˚  
0.28  
3.05  
15˚  
C
0.405  
0.540  
0.415 10.29  
0.560 13.72  
10.54  
14.22  
SEATING  
PLANE  
-T-  
K
M
J
DETAIL X  
CASE 482B-03  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPXV4006  
Sensors  
Freescale Semiconductor  
11  
Pressure  
PACKAGE DIMENSIONS  
–A–  
D 8 PL  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
4
M
S
S
0.25 (0.010)  
T
B
A
5
N
–B–  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.  
G
INCHES  
MILLIMETERS  
8
1
DIM  
A
B
C
D
MIN  
MAX  
0.425  
0.425  
0.520  
0.042  
MIN  
10.54  
10.54  
12.70  
0.96  
MAX  
10.79  
10.79  
13.21  
1.07  
0.415  
0.415  
0.500  
0.038  
S
W
G
H
J
K
M
N
S
V
W
0.100 BSC  
2.54 BSC  
0.002  
0.009  
0.061  
0
0.010  
0.011  
0.071  
7
0.05  
0.23  
1.55  
0
0.25  
0.28  
1.80  
7
V
0.444  
0.709  
0.245  
0.115  
0.448  
0.725  
0.255  
0.125  
11.28  
18.01  
6.22  
2.92  
11.38  
18.41  
6.48  
3.17  
C
H
J
–T–  
SEATING  
PLANE  
PIN 1 IDENTIFIER  
M
K
CASE 482A-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPXV4006  
Sensors  
Freescale Semiconductor  
12  
Pressure  
PACKAGE DIMENSIONS  
CASE 1560-02  
ISSUE C  
SMALL OUTLINE PACKAGE  
MPXV4006  
13  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
CASE 1560-02  
ISSUE C  
SMALL OUTLINE PACKAGE  
MPXV4006  
14  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
CASE 1560-02  
ISSUE C  
SMALL OUTLINE PACKAGE  
MPXV4006  
15  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
CASE 1735-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPXV4006  
16  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
CASE 1735-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPXV4006  
17  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
CASE 1735-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPXV4006  
18  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
–A–  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.  
6. DIMENSION S TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
4
5
8
N
–B–  
D 8 PL  
G
M
S
S
INCHES  
MILLIMETERS  
0.25 (0.010)  
T
B
A
1
DIM  
A
B
C
D
MIN  
MAX  
0.425  
0.425  
0.520  
0.034  
MIN  
10.54  
10.54  
12.70  
0.66  
MAX  
10.79  
10.79  
13.21  
0.864  
0.415  
0.415  
0.500  
0.026  
DETAIL X  
S
W
G
J
K
M
N
S
0.100 BSC  
2.54 BSC  
0.009  
0.100  
0
0.011  
0.120  
15  
0.23  
2.54  
0
0.28  
3.05  
15  
PIN 1  
IDENTIFIER  
V
0.444  
0.540  
0.245  
0.115  
0.448  
0.560  
0.255  
0.125  
11.28  
13.72  
6.22  
2.92  
11.38  
14.22  
6.48  
3.17  
C
V
W
SEATING  
PLANE  
–T–  
K
M
J
DETAIL X  
CASE 482C-03  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPXV4006  
19  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
2 PLACES 4 TIPS  
0.006 (0.15) C A  
B
E
A
GAGE  
PLANE  
e
5
4
1
e/2  
.014 (0.35)  
θ
L
A1  
D
F
DETAIL G  
8
NOTES:  
8X b  
0.004 (0.1)  
1. CONTROLLING DIMENSION: INCH.  
2. INTERPRET DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 1994.  
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE  
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)  
PER SIDE.  
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.  
STYLE 1:  
PIN 1. GND  
STYLE 2:  
PIN 1. N/C  
2. Vs  
M
C
A
B
2. +Vout  
3. Vs  
3. GND  
4. Vout  
5. N/C  
6. N/C  
7. N/C  
8. N/C  
4. -Vout  
5. N/C  
6. N/C  
7. N/C  
8. N/C  
E1  
B
INCHES  
DIM MIN MAX  
0.370  
A1 0.002  
MILLIMETERS  
MIN MAX  
N
T
∅
A
0.390  
0.010  
0.042  
0.485  
0.700  
0.485  
9.39  
0.05  
0.96  
9.91  
0.25  
1.07  
b
D
E
0.038  
0.465  
0.680  
11.81 12.32  
17.27 17.78  
11.81 12.32  
2.54 BSC  
E1 0.465  
M
A
e
F
K
L
M
N
P
T
θ
0.100 BSC  
0.240  
0.115  
0.040  
0.270  
0.160  
0.009  
0.110  
0˚  
0.260  
0.135  
0.060  
0.290  
0.180  
0.011  
0.130  
7˚  
6.10  
2.92  
1.02  
6.86  
4.06  
0.23  
2.79  
0˚  
6.60  
3.43  
1.52  
7.37  
4.57  
0.28  
3.30  
7˚  
8X  
0.004 (0.1)  
K
P
DETAIL G  
SEATING  
PLANE  
C
CASE 1351-01  
ISSUE O  
SMALL OUTLINE PACKAGE  
MPXV4006  
Sensors  
Freescale Semiconductor  
20  
Pressure  
PACKAGE DIMENSIONS  
2 PLACES 4 TIPS  
0.008 (0.20) C A  
B
E
A
GAGE  
PLANE  
e
5
4
1
e/2  
.014 (0.35)  
θ
L
A1  
D
F
DETAIL G  
8
NOTES:  
1. CONTROLLING DIMENSION: INCH.  
2. INTERPRET DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 1994.  
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE  
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)  
PER SIDE.  
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.  
8X b  
0.004 (0.1)  
M
C
A
B
E1  
B
INCHES  
DIM MIN MAX  
0.300  
A1 0.002  
MILLIMETERS  
MIN  
7.11  
MAX  
7.62  
0.25  
N
T
∅
A
0.330  
0.010  
0.042  
0.485  
K
0.05  
0.96  
b
D
E
0.038  
0.465  
0.717 BSC  
1.07  
12.32  
11.81  
18.21 BSC  
E1 0.465  
0.485  
11.81  
2.54 BSC  
12.32  
A
M
e
F
K
L
M
N
P
T
θ
0.100 BSC  
0.245  
0.120  
0.061  
0.270  
0.080  
0.009  
0.115  
0˚  
0.255  
0.130  
0.071  
0.290  
0.090  
0.011  
0.125  
7˚  
6.22  
3.05  
1.55  
6.86  
2.03  
0.23  
2.92  
0˚  
6.47  
3.30  
1.80  
7.36  
2.28  
0.28  
3.17  
7˚  
8X  
0.004 (0.1)  
P
DETAIL G  
SEATING  
PLANE  
C
CASE 1369-01  
ISSUE O  
SMALL OUTLINE PACKAGE  
MPXV4006  
Sensors  
Freescale Semiconductor  
21  
How to Reach Us:  
Home Page:  
www.freescale.com  
Web Support:  
http://www.freescale.com/support  
USA/Europe or Locations Not Listed:  
Freescale Semiconductor, Inc.  
Technical Information Center, EL516  
2100 East Elliot Road  
Tempe, Arizona 85284  
1-800-521-6274 or +1-480-768-2130  
www.freescale.com/support  
Europe, Middle East, and Africa:  
Freescale Halbleiter Deutschland GmbH  
Technical Information Center  
Schatzbogen 7  
81829 Muenchen, Germany  
+44 1296 380 456 (English)  
+46 8 52200080 (English)  
+49 89 92103 559 (German)  
+33 1 69 35 48 48 (French)  
www.freescale.com/support  
Information in this document is provided solely to enable system and software  
implementers to use Freescale Semiconductor products. There are no express or  
implied copyright licenses granted hereunder to design or fabricate any integrated  
circuits or integrated circuits based on the information in this document.  
Freescale Semiconductor reserves the right to make changes without further notice to  
any products herein. Freescale Semiconductor makes no warranty, representation or  
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Semiconductor was negligent regarding the design or manufacture of the part.  
For Literature Requests Only:  
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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.  
All other product or service names are the property of their respective owners.  
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© Freescale Semiconductor, Inc. 2009. All rights reserved.  
MPXV4006  
Rev. 3  
1/2009  

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