935321201174 [NXP]
Peizoresistive Sensor;
| 型号： | 935321201174 |
| 厂家： | 
NXP |
| 描述： | Peizoresistive Sensor |
| 文件： | 总17页 (文件大小：357K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Pressure
Document Number: MPX2102
Rev 9, 01/2012
Freescale Semiconductor
100 kPa On-Chip Temperature
Compensated Silicon
Pressure Sensors
MPX2102
Series
0 to 100 kPa (0 to 14.5 psi)
40 mV Full Scale
(Typical)
The MPX2102 series devices are silicon piezoresistive pressure sensors
providing a highly accurate and linear voltage output directly proportional to the
applied pressure. The sensor is a single, monolithic silicon diaphragm with the
strain gauge and a thin-film resistor network integrated on chip. The chip is laser
trimmed for precise span and offset calibration and temperature compensation.
Application Examples
• Pump/Motor Control
• Robotics
Features
• Level Detectors
• Medical Diagnostics
• Pressure Switching
• Barometers
• Temperature Compensated Over 0°C to +85°C
• Easy-to-Use Chip Carrier Package Options
• Available in Absolute, Differential and Gauge Configurations
• Absolute, Differential and Gauge Options
• Altimeters
ORDERING INFORMATION
# of Ports
Single
Pressure Type
Differential Absolute
Package
Options
Case
No.
Device Name
Device Marking
None
Dual
Gauge
Unibody Package (MPX2102 Series)
MPX2102A
Tray
Tray
Tray
Tray
Tray
Tray
344
MPX2102A
MPX2102AP
MPX2102A
•
•
•
•
MPX2102AP
MPX2102ASX
MPX2102DP
MPX2102GP
MPX2102GVP
344B
344F
344C
344B
344D
•
•
MPX2102DP
MPX2102GP
MPX2102GVP
•
•
•
•
•
•
Small Outline Package (MPXV2102G Series)
MPXV2102GP
Tray
1369
MPXV2102GP
•
•
MPAK Package (MPXM2102 Series)
MPXM2102A
Rail
Tape and Reel
Rail
1320
1320
MPXM2102A
MPXM2102A
MPXM2102AS
MPXM2102AS
MPXM2102D
MPXM2102D
MPXM2102GS
MPXM2102GS
•
•
•
•
•
•
MPXM2102AT1
MPXM2102AS
MPXM2102AST1
MPXM2102D
1320A
1320A
1320
•
•
Tape and Reel
Rail
•
•
•
•
MPXM2102DT1
MPXM2102GS
MPXM2102GST1
Tape and Reel
Rail
1320
1320A
1320A
•
•
•
•
Tape and Reel
© 2005-2008, 2010, 2012 Freescale Semiconductor, Inc. All rights reserved.
Pressure
UNIBODY PACKAGES
MPX2102A
CASE 344
MPX2102AP/GP
CASE 344B
MPX2102DP
CASE 344C
MPX2102GVP
CASE 344D
MPX2102ASX
CASE 344F
MPAK
SMALL OUTLINE PACKAGE
MPXV2102GP
CASE 1369
MPXM2102A/ATI
MPXM2102D/DT1
CASE 1320
MPXM2102AS/AST1
MPXM2102GS/AS
CASE 1320A
MPX2102
Sensors
Freescale Semiconductor, Inc.
2
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Units
Pressure Range(1)
POP
POP
20
0
—
—
100
100
kPa
kPa
Absolute Pressure Range MPX2102A
Differential Pressure Range MPX2102D
Supply Voltage(2)
Supply Current
VS
IO
—
—
10
6.0
40
16
—
VDC
mAdc
mV
Full Scale Span(3)
Offset(4)
VFSS
38.5
41.5
VOFF
VOFF
-1.0
-2.0
-1.0
-2.0
—
—
—
—
1.0
2.0
1.0
2.0
mV
mV
MPX2102D Series
MPX2102A Series
MPXM2102D/G Series
MPXM2102A Series
Sensitivity
Linearity(5)
ΔV/ΔΡ
—
0.4
—
mV/kPa
—
—
—
—
-0.6
-1.0
-0.6
-1.0
—
—
—
—
0.4
1.0
0.4
1.0
%VFSS
%VFSS
MPX2102D Series
MPX2102A Series
MPXM2102D/G Series
MPXM2102A Series
Pressure Hysteresis(5) (0 to 100 kPa)
—
—
—
—
±0.1
±0.5
—
—
—
%VFSS
%VFSS
%VFSS
mV
Temperature Hysteresis(5)(-40°C to +125°C)
Temperature Coefficient of Full Scale Span(5)
TCVFSS
TCVOFF
ZIN
-2.0
-1.0
1000
1400
—
2.0
Temperature Coefficient of Offset(5)
Input Impedance
—
1.0
—
2500
3000
—
W
Output Impedance
ZOUT
tR
—
W
Response Time(6) (10% to 90%)
Warm-Up Time
1.0
ms
—
—
—
—
20
—
—
ms
Offset Stability(7)
±0.5
%VFSS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum related pressure.
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum or
maximum rated pressure at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
6. Response Time is defined as the time from the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX2102
Sensors
Freescale Semiconductor, Inc.
3
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
Storage Temperature
PMAX
400
kPa
TSTG
TA
-40 to +125
-40 to +125
°C
°C
Operating Temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Voltage Output vs. Applied Differential
The differential voltage output of the sensor is directly
proportional to the differential pressure applied.
The absolute sensor has a built-in reference vacuum. The
output voltage will decrease as vacuum, relative to ambient,
is drawn on the pressure (P1) side.
(P1) side relative to the vacuum (P2) side. Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum (P2) side relative to the pressure (P1) side.
Figure 1 illustrates a block diagram of the internal circuitry
on the stand-alone pressure sensor chip.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
VS
3
Thin Film
X-ducer
Sensing
Element
2
4
Temperature
Compensation
and
+ VOUT
- VOUT
Calibration
Circuitry
1
GND
Figure 1. Temperature Compensated Pressure Sensor Schematic
MPX2102
Sensors
Freescale Semiconductor, Inc.
4
Pressure
On-Chip Temperature Compensation and Calibration
Figure 2 shows the output characteristics of the MPX2102
series at 25°C. The output is directly proportional to the
differential pressure and is essentially a straight line.
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating
Characteristics.
VS = 10 VDC
40
TA = 25°C
MPX2102
35
30
25
20
15
10
5
TYP
P1 > P2
Span
Range
(TYP)
MAX
MIN
0
-5
Offset
(TYP)
kPa
PSI
0
25
3.62
50
7.25
75
10.88
100
14.5
Figure 2. Output vs. Pressure Differential
Differential/Gauge
Die
Absolute
Die
Stainless Steel
Metal Cover
Silicone Gel
Die Coat
Silicone Gel
Die Coat
Stainless Steel
Metal Cover
P1
P1
Epoxy
Case
Epoxy
Case
Wire Bond
Wire Bond
Lead Frame
Bond
Die
Lead Frame
Die
Bond
Absolute Element
P2
Differential/GaugeElement
P2
Figure 3. Cross Sectional Diagrams (Not to Scale)
Figure 3 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2102 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
Least Squares Fit
Least
Square
Deviation
Exaggerated
Performance
Curve
Straight Line
Deviation
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: VOUT = VOFF + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 4) or (2)
a least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
End Point Straight
Line Fit
Offset
50
100
0
Pressure (% Full scale)
Figure 4. Linearity Specification Comparison
MPX2102
Sensors
Freescale Semiconductor, Inc.
5
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which isolates the die. The differential or gauge sensor is
designed to operate with positive differential pressure
applied, P1 > P2. The absolute sensor is designed for
vacuum applied to P1 side.
Table 3. Pressure (P1) Side Delineation
Case
Type
Pressure (P1) Side
Part Number
MPX2102A
Identifier
344
Stainless Steel Cap
MPX2102DP
344C Side with Part Marking
344B Side with Port Attached
The Pressure (P1) side may be identified by using Table 3.
MPX2102AP,
MPX2102GP
MPX2102GVP
MPX2102ASX
MPXV2102GP
344D Stainless Steel Cap
344F Side with Port Marking
1369
Side with Port Attached
MPXM2102A,
MPX2102ATI,
MPXM2102D,
MPXM2102DT1
1320
Stainless Steel Cap
MPXM2102AS,
MPXM2102GS,
MPXM2102ASTI,
MPXM2102GSTI
1320A Side with Port Attached
MPX2102
Sensors
Freescale Semiconductor, Inc.
6
Pressure
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
C
R
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
Z
1
4
2
3
INCHES
MILLIMETERS
B
-A-
DIM MIN MAX MIN
MAX
16.00
13.56
5.59
A
B
C
D
F
0.595
0.630 15.11
0.534 13.06
N
0.514
0.200
0.016
0.048
L
1
2
3
4
0.220
0.020
0.064
5.08
0.41
1.22
PIN 1
0.51
1.63
-T-
SEATING
PLANE
G
J
L
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016 0.36
0.725 17.65
0.40
18.42
G
J
F
4 PL
Y
M
N
R
Y
Z
30˚ NOM
30˚ NOM
D
0.475
0.430
0.048
0.106
0.495 12.07
0.450 10.92
12.57
11.43
1.32
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
M
0.136 (0.005)
T A
0.052
0.118
1.22
2.68
3.00
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
NOTES:
SEATING
PLANE
-A-
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-T-
U
L
R
INCHES
DIM MIN MAX
MILLIMETERS
H
MIN
29.08
17.40
7.75
MAX
29.85
18.16
8.26
A
B
C
D
F
1.145
0.685
0.305
0.016
0.048
1.175
0.715
0.325
0.020
0.064
N
B
PORT #1
-Q-
POSITIVE
PRESSURE
(P1)
0.41
1.22
0.51
1.63
G
H
J
K
L
N
P
Q
R
S
U
0.100 BSC
2.54 BSC
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.230
0.220
0.194
0.016
0.725
0.300
0.440
0.159
0.159
0.250
0.240
4.62
0.36
17.65
7.37
10.67
3.89
3.89
5.84
5.59
4.93
0.41
18.42
7.62
11.18
4.04
4.04
6.35
6.10
1
2 3 4
PIN 1
K
-P-
S
M
S
0.25 (0.010)
T Q
J
F
0.910 BSC
23.11 BSC
G
D
C
4 PL
M
S
S
0.13 (0.005)
T S
Q
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX2102
Sensors
Freescale Semiconductor, Inc.
7
Pressure
16
PACKAGE DIMENSIONS
NOTES:
-A-
U
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
V
PORT #1
W
L
R
H
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
29.08 29.85
17.40 18.16
10.29 11.05
PORT #2
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
A
B
C
D
F
1.145
0.685
0.405
0.016
0.048
1.175
0.715
0.435
0.020
0.064
N
-Q-
0.41
1.22
0.51
1.63
G
H
J
K
L
N
P
Q
R
S
U
V
W
0.100 BSC
2.54 BSC
SEATING
PLANE
SEATING
PLANE
B
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.063
0.220
0.194
0.016
0.725
0.300
0.440
0.159
0.159
0.083
0.240
4.62
0.36
4.93
0.41
1
2 3 4
17.65 18.42
7.37 7.62
10.67 11.18
PIN 1
K
-P-
M
S
0.25 (0.010)
T Q
3.89
3.89
1.60
5.59
4.04
4.04
2.11
6.10
-T-
-T-
S
F
J
G
C
0.910 BSC
23.11 BSC
D
4 PL
0.248
0.310
0.278
0.330
6.30
7.87
7.06
8.38
M
S
S
0.13 (0.005)
T S
Q
4. - OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
-A-
U
L
SEATING
PLANE
INCHES
MILLIMETERS
-T-
DIM MIN MAX MIN
MAX
29.85
18.16
8.26
PORT #2
VACUUM
(P2)
A
B
C
D
F
1.145
1.175 29.08
0.715 17.40
H
R
POSITIVE
PRESSURE
(P1)
0.685
0.305
0.016
0.048
0.325
0.020
0.064
7.75
0.41
1.22
0.51
1.63
N
-Q-
G
H
J
K
L
N
P
Q
R
S
U
0.100 BSC
2.54 BSC
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.230
0.220
0.194
0.016
4.62
0.36
4.93
0.41
18.42
7.62
11.18
4.04
4.04
6.35
6.10
0.725 17.65
0.300 7.37
0.440 10.67
B
0.159
0.158
0.250
0.240
3.89
3.89
5.84
5.59
1
2
3
4
K
PIN 1
S
0.910 BSC
23.11 BSC
C
F
-P-
G
J
M
S
T Q
0.25 (0.010)
D
4 PL
M
S
S
Q
0.13 (0.005)
T S
CASE 344D-01
ISSUE B
UNIBODY PACKAGE
MPX2102
Sensors
Freescale Semiconductor, Inc.
8
Pressure
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
-T-
C
E
A
U
-Q-
2. CONTROLLING DIMENSION: INCH.
INCHES
MILLIMETERS
DIM MIN MAX MIN
MAX
28.45
19.30
16.51
0.51
A
B
C
D
E
F
1.080
0.740
0.630
0.016
0.160
0.048
1.120 27.43
0.760 18.80
0.650 16.00
0.020
0.180
0.064
0.41
4.06
1.22
N
B
V
4.57
1.63
G
J
0.100 BSC
2.54 BSC
R
0.014
0.220
0.070
0.150
0.150
0.440
0.695
0.840
0.182
0.016
0.240
0.080
0.160
0.160
0.36
5.59
1.78
3.81
3.81
0.41
6.10
K
N
P
Q
R
S
U
V
PORT #1
PIN 1
2.03
4.06
POSITIVE
-P-
PRESSURE
(P1)
M
M
0.25 (0.010)
T Q
4
3
2
1
4.06
S
0.460 11.18
0.725 17.65
0.860 21.34
11.68
18.42
21.84
4.92
K
0.194
4.62
F
J
G
D
4 PL
M
S
S
0.13 (0.005)
T P
Q
CASE 344F-01
ISSUE B
UNIBODY PACKAGE
MPX2102
Sensors
Freescale Semiconductor, Inc.
9
Pressure
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2102
10
Sensors
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2102
11
Sensors
Freescale Semiconductor, Inc.
Pressure
CASE 1320-02
ISSUE B
MPAK
MPX2102
12
Sensors
Freescale Semiconductor, Inc.
Pressure
CASE 1320-02
ISSUE B
MPAK
MPX2102
13
Sensors
Freescale Semiconductor, Inc.
Pressure
PIN 4
PIN 1
CASE 1320A-02
ISSUE A
MPAK
MPX2102
14
Sensors
Freescale Semiconductor, Inc.
Pressure
CASE 1320A-02
ISSUE A
MPAK
MPX2102
15
Sensors
Freescale Semiconductor, Inc.
Pressure
REVISION HISTORY
Revision Revision
Description of changes
number
date
9
01/2012
• In Table 1. Operating Characteristics, in the Characteristic column under Pressure Range, added
rows for Absolute Pressure Range MPX2102A and Differential Pressure Range MPX2102D
devices
MPX2102
Sensors
Freescale Semiconductor, Inc.
16
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