ACT108-600D [NXP]

600V, 0.8A, TRIAC, TO-92, PLASTIC, SC-43A, 3 PIN;
ACT108-600D
型号: ACT108-600D
厂家: NXP    NXP
描述:

600V, 0.8A, TRIAC, TO-92, PLASTIC, SC-43A, 3 PIN

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ACT108-600D  
2
9
-
TO  
AC Thyristor power switch  
Rev. 02 — 27 December 2010  
Product data sheet  
1. Product profile  
1.1 General description  
AC Thyristor power switch in a SOT54 plastic package with self-protective capabilities  
against low and high energy transients  
1.2 Features and benefits  
„ Exclusive negative gate triggering  
„ Full cycle AC conduction  
„ High noise immunity  
„ Safe clamping of low energy  
over-voltage transients  
„ Self-protective turn-on during high  
energy voltage transients  
„ Remote gate separates the gate driver  
„ Very sensitive gate for lowest gate  
from the effects of the load current  
trigger current  
1.3 Applications  
„ Fan motor circuits  
„ Pump motor circuits  
„ Lower-power highly inductive, resistive  
and safety loads  
1.4 Quick reference data  
Table 1.  
Symbol  
VDRM  
Quick reference data  
Parameter  
Conditions  
Min Typ Max Unit  
repetitive peak  
off-state voltage  
-
-
-
-
-
-
600  
V
IGT  
gate trigger current  
VD = 12 V; IT = 100 mA; LD- G-;  
Tj = 25 °C  
0.5  
0.5  
-
5
mA  
mA  
A
VD = 12 V; IT = 100 mA; LD+ G-;  
Tj = 25 °C; see Figure 6  
5
IT(RMS)  
dVD/dt  
RMS on-state  
current  
full sine wave; Tlead 71 °C;  
see Figure 2  
0.8  
-
rate of rise of  
off-state voltage  
VDM = 402 V; Tj = 125 °C; gate  
open circuit; exponential  
waveform; see Figure 10  
300  
V/µs  
VCL  
clamping voltage  
ICL = 100 µA; tp = 1 ms;  
650  
-
-
V
Tj 125 °C; see Figure 13  
 
 
 
 
 
ACT108-600D  
NXP Semiconductors  
AC Thyristor power switch  
Table 1.  
Quick reference data …continued  
Parameter Conditions  
Symbol  
Min Typ Max Unit  
VGT  
gate trigger voltage VD = 12 V; IT = 100 mA;  
Tj = 25 °C  
-
-
-
-
-
-
0.9  
V
VPP  
VT  
peak pulse voltage  
Tj = 25 °C; non-repetitive,  
off-state; see Figure 1  
2
kV  
V
on-state voltage  
IT = 1.1 A; see Figure 9  
1.3  
2. Pinning information  
Table 2.  
Pinning information  
Symbol Description  
Pin  
1
Simplified outline  
Graphic symbol  
CM  
G
common  
gate  
LD  
2
3
LD  
load  
G
CM  
001aaj924  
3 2 1  
SOT54 (TO-92)  
3. Ordering information  
Table 3.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
ACT108-600D  
TO-92  
plastic single-ended leaded (through hole) package; 3 leads  
SOT54  
ACT108-600D  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 02 — 27 December 2010  
2 of 14  
 
 
ACT108-600D  
NXP Semiconductors  
AC Thyristor power switch  
4. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VDRM  
Parameter  
Conditions  
Min  
Max  
600  
0.8  
Unit  
V
repetitive peak off-state voltage  
RMS on-state current  
-
-
-
IT(RMS)  
ITSM  
full sine wave; Tlead 71 °C; see Figure 2  
A
non-repetitive peak on-state current full sine wave; Tj(init) = 25 °C;  
tp = 16.7 ms  
8.8  
A
full sine wave; Tj(init) = 25 °C; tp = 20 ms;  
-
8
A
see Figure 3; see Figure 4  
tp = 10 ms; sine-wave pulse  
IT = 1 A; IG = 10 mA; dIG/dt = 0.2 A/µs  
t = 20 μs  
I2t  
I2t for fusing  
-
0.32  
50  
A2s  
A/µs  
A
dIT/dt  
IGM  
rate of rise of on-state current  
peak gate current  
-
-
1
VGM  
PG(AV)  
Tstg  
Tj  
peak gate voltage  
positive applied gate voltage  
over any 20 ms period  
-
15  
V
average gate power  
storage temperature  
junction temperature  
peak pulse voltage  
-
0.1  
150  
125  
2
W
-40  
°C  
°C  
kV  
-
-
VPP  
Tj = 25 °C; non-repetitive, off-state;  
see Figure 1  
IEC 61000-4-5 Standards  
Surge Generator  
Open Circuit Voltage  
1.2 μs/50 μs waveform  
R
R
L
Gen  
5 μH  
2 Ω  
150 Ω  
R
G
DUT  
Load Model  
Surge pulse  
220 Ω  
003aad077  
Fig 1. Test circuit for inductive and resistive loads with conditions equivalent to IEC 61000-4-5  
ACT108-600D  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 02 — 27 December 2010  
3 of 14  
 
 
ACT108-600D  
NXP Semiconductors  
AC Thyristor power switch  
003aac803  
1.0  
P
(W)  
tot  
α = 180°  
α
0.8  
α
0.6  
0.4  
0.2  
0
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
I
(A)  
T(RMS)  
α = conduction angle  
Fig 2. Total power dissipation as a function of RMS on-state current; maximum values  
003aac804  
10  
I
TSM  
(A)  
8
6
4
2
0
I
I
TSM  
T
t
1/f  
T
= 25 °C max  
j(init)  
2
3
1
10  
10  
10  
number of cycles  
f = 50 Hz  
Fig 3. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum  
values  
ACT108-600D  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 02 — 27 December 2010  
4 of 14  
ACT108-600D  
NXP Semiconductors  
AC Thyristor power switch  
003aac805  
103  
I
I
T
TSM  
ITSM  
(A)  
t
t
p
102  
T
j(init)  
= 25 °C max  
10  
1
105  
104  
103  
102  
tp (s)  
tp 20 ms  
Fig 4. Non-repetitive peak on-state current as a function of pulse width; maximum values  
ACT108-600D  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 02 — 27 December 2010  
5 of 14  
ACT108-600D  
NXP Semiconductors  
AC Thyristor power switch  
5. Thermal characteristics  
Table 5.  
Symbol  
Rth(j-lead)  
Thermal characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
thermal resistance from  
junction to lead  
full cycle with heatsink compound;  
see Figure 5  
-
-
60  
K/W  
Rth(j-a)  
thermal resistance from  
junction to ambient  
full cycle; printed-circuit board mounted;  
lead length 4 mm  
-
150  
-
K/W  
003aad294  
2
10  
Z
th(j-lead)  
(K/W)  
10  
1
P
1  
10  
t
t
p
2  
10  
5  
4  
3  
2  
10  
1  
10  
10  
10  
1
10  
10  
t
p
(s)  
Fig 5. Transient thermal impedance from junction to lead as a function of pulse width  
ACT108-600D  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 02 — 27 December 2010  
6 of 14  
 
 
ACT108-600D  
NXP Semiconductors  
AC Thyristor power switch  
6. Characteristics  
Table 6.  
Symbol  
IGT  
Characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
gate trigger current  
VD = 12 V; IT = 100 mA; LD- G-;  
Tj = 25 °C  
0.5  
-
5
mA  
VD = 12 V; IT = 100 mA; LD+ G-;  
Tj = 25 °C; see Figure 6  
0.5  
-
-
-
5
mA  
mA  
IL  
latching current  
VD = 12 V; IG = 12 mA; Tj = 25 °C;  
see Figure 7  
25  
IH  
holding current  
VD = 12 V; Tj = 25 °C; see Figure 8  
IT = 1.1 A; see Figure 9  
-
-
-
-
-
-
-
-
20  
1.3  
-
mA  
V
VT  
VGT  
on-state voltage  
gate trigger voltage  
-
VD = 12 V; IT = 100 mA; Tj 125 °C  
VD = 12 V; IT = 100 mA; Tj = 25 °C  
VD = 600 V; Tj 25 °C  
0.15  
V
-
0.9  
2
V
ID  
off-state current  
-
µA  
mA  
V/µs  
VD = 600 V; Tj 125 °C  
-
0.2  
-
dVD/dt  
rate of rise of off-state voltage VDM = 402 V; Tj = 125 °C; gate open  
circuit; exponential waveform;  
300  
see Figure 10  
dIcom/dt  
rate of change of commutating VD = 400 V; Tj = 125 °C;  
0.15  
650  
-
-
-
A/ms  
V
current  
IT(RMS) = 1 A; dVcom/dt = 15 V/µs;  
gate open circuit; see Figure 11;  
see Figure 12  
VCL  
clamping voltage  
ICL = 100 µA; tp = 1 ms; Tj 125 °C;  
-
see Figure 13  
003aac811  
003aac809  
3
3
I
I
L
GT  
(1)  
(2)  
I
I
L(25°C)  
GT(25°C)  
2
2
1
1
(2)  
(1)  
0
50  
0
50  
0
50  
100  
150  
50  
0
150  
100  
T (°C)  
T (°C)  
j
j
(1) LD+ G-  
(2) LD- G-  
Fig 6. Normalized gate trigger current as a function of  
junction temperature  
Fig 7. Normalized latching current as a function of  
junction temperature  
ACT108-600D  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 02 — 27 December 2010  
7 of 14  
 
 
 
ACT108-600D  
NXP Semiconductors  
AC Thyristor power switch  
003aac810  
003aaf722  
3
2.0  
I
T
I
H
(A)  
I
H(25°C)  
1.5  
2
1.0  
0.5  
0.0  
(1)  
(2)  
(3)  
1
0
50  
0.0  
0.5  
1.0  
1.5  
2.0  
0
50  
100  
150  
V
(V)  
T
T (°C)  
j
Fig 8. Normalized holding current as a function of  
junction temperature  
Fig 9. On-state current as a function of on-state  
voltage  
003aac813  
003aac814  
12  
12  
A
B
A
B
10  
8
6
8
4
0
4
2
0
25  
50  
75  
100  
125  
25  
50  
75  
100  
125  
T (°C)  
j
T (°C)  
j
A is dVD/dt at condition Tj °C  
B is dVD/dt at condition Tj 125 °C  
A is dIcom/dt at condition Tj °C  
B is dIcom/dt at condition Tj 125 °C  
VD = 400 V  
Fig 10. Normalized rate of rise of off-state voltage as a  
function of junction temperature  
Fig 11. Normalized critical rate of rise of commutating  
current as a function of junction temperature  
ACT108-600D  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 02 — 27 December 2010  
8 of 14  
ACT108-600D  
NXP Semiconductors  
AC Thyristor power switch  
003aac815  
003aac817  
1.2  
2.0  
A [B]  
V
CL  
A [spec]  
V
CL(25°C)  
1.5  
1.0  
0.5  
0.8  
0.4  
0
0
50  
1  
2
10  
1
10  
10  
0
50  
100  
150  
B (V/μs)  
T (°C)  
j
A[B] is dIcom/dt at condition B, dVcom/dt  
A[spec] is the specified data sheet value of dIcom/dt  
turn-off time < 20 ms  
Fig 12. Normalized critical rate of change of  
commutating current as a function of critical  
rate of change of commutating voltage;  
minimum values  
Fig 13. Normalized clamping voltage (upper limit) as a  
function of junction temperature; minimum  
values  
ACT108-600D  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 02 — 27 December 2010  
9 of 14  
ACT108-600D  
NXP Semiconductors  
AC Thyristor power switch  
7. Package outline  
Plastic single-ended leaded (through hole) package; 3 leads  
SOT54  
c
E
d
A
L
b
1
2
e
1
e
D
3
b
1
L
1
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
L
1
UNIT  
A
b
b
c
D
d
E
e
e
L
1
1
max.  
5.2  
5.0  
0.48  
0.40  
0.66  
0.55  
0.45  
0.38  
4.8  
4.4  
1.7  
1.4  
4.2  
3.6  
14.5  
12.7  
mm  
2.54  
1.27  
2.5  
Note  
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.  
REFERENCES  
OUTLINE  
EUROPEAN  
ISSUE DATE  
PROJECTION  
VERSION  
IEC  
JEDEC  
JEITA  
04-06-28  
04-11-16  
SOT54  
TO-92  
SC-43A  
Fig 14. Package outline SOT54 (TO-92)  
ACT108-600D  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 02 — 27 December 2010  
10 of 14  
 
ACT108-600D  
NXP Semiconductors  
AC Thyristor power switch  
8. Revision history  
Table 7.  
Revision history  
Document ID  
ACT108-600D v.2  
Modifications:  
Release date  
Data sheet status  
Change notice  
Supersedes  
20101227  
Product data sheet  
-
ACT108-600D v.1  
Status changed from preliminary to product.  
Various changes to content.  
ACT108-600D v.1  
20100902  
Preliminary data sheet  
-
-
ACT108-600D  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 02 — 27 December 2010  
11 of 14  
 
ACT108-600D  
NXP Semiconductors  
AC Thyristor power switch  
9. Legal information  
9.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Definition  
Objective [short] data sheet  
Development  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term 'short data sheet' is explained in section "Definitions".  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product  
status information is available on the Internet at URL http://www.nxp.com.  
Suitability for use — NXP Semiconductors products are not designed,  
9.2 Definitions  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
9.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
ACT108-600D  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 02 — 27 December 2010  
12 of 14  
 
 
 
 
 
 
 
ACT108-600D  
NXP Semiconductors  
AC Thyristor power switch  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Export control — This document as well as the item(s) described herein may  
be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
9.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,  
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,  
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,  
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,  
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.  
non-automotive qualified products in automotive equipment or applications.  
HD Radio and HD Radio logo — are trademarks of iBiquity Digital  
Corporation.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
10. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
ACT108-600D  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 02 — 27 December 2010  
13 of 14  
 
 
ACT108-600D  
NXP Semiconductors  
AC Thyristor power switch  
11. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1  
1.1  
1.2  
1.3  
1.4  
General description . . . . . . . . . . . . . . . . . . . . . .1  
Features and benefits. . . . . . . . . . . . . . . . . . . . .1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1  
Quick reference data . . . . . . . . . . . . . . . . . . . . .1  
2
3
4
5
6
7
8
Pinning information. . . . . . . . . . . . . . . . . . . . . . .2  
Ordering information. . . . . . . . . . . . . . . . . . . . . .2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3  
Thermal characteristics . . . . . . . . . . . . . . . . . . .6  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .7  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . .11  
9
Legal information. . . . . . . . . . . . . . . . . . . . . . . .12  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .12  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13  
9.1  
9.2  
9.3  
9.4  
10  
Contact information. . . . . . . . . . . . . . . . . . . . . .13  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2010.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 27 December 2010  
Document identifier: ACT108-600D  

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