BAP70-02 [NXP]

Silicon PIN diode; 硅PIN二极管
BAP70-02
型号: BAP70-02
厂家: NXP    NXP
描述:

Silicon PIN diode
硅PIN二极管

二极管
文件: 总8页 (文件大小:53K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
BAP70-02  
Silicon PIN diode  
Product specification  
2002 Aug 06  
Supersedes data of 2002 Jul 02  
Philips Semiconductors  
Product specification  
Silicon PIN diode  
BAP70-02  
FEATURES  
PINNING  
High voltage, current controlled RF resistor for  
attenuators  
PIN  
DESCRIPTION  
1
2
cathode  
Low diode capacitance  
anode  
Very low series inductance.  
APPLICATIONS  
handbook, halfpage  
1
2
RF attenuators  
(SAT)TV  
Top view  
MAM405  
Car radio.  
Marking code: K8.  
DESCRIPTION  
Fig.1 Simplified outline (SOD523) and symbol.  
Planar PIN diode in a SOD523 ultra small SMD plastic  
package.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
SYMBOL  
PARAMETER  
continuous reverse voltage  
continuous forward current  
total power dissipation  
storage temperature  
CONDITIONS  
MIN.  
MAX.  
50  
UNIT  
VR  
IF  
V
100  
mA  
mW  
°C  
Ptot  
Tstg  
Tj  
Ts = 90 °C  
415  
65  
65  
+150  
+150  
junction temperature  
°C  
ELECTRICAL CHARACTERISTICS  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
VF  
PARAMETER  
forward voltage  
CONDITIONS  
IF = 50 mA  
TYP.  
MAX.  
UNIT  
0.9  
1.1  
V
IR  
reverse leakage current  
diode capacitance  
VR = 50 V  
20  
nA  
fF  
fF  
fF  
fF  
Cd  
VR = 0 V; f = 1 MHz  
VR = 1 V; f = 1 MHz  
VR = 5 V; f = 1 MHz  
VR = 20 V; f = 1 MHz  
IF = 0.5 mA; f = 100 MHz  
IF = 1 mA; f = 100 MHz  
IF = 10 mA; f = 100 MHz  
IF = 100 mA; f = 100 MHz  
570  
400  
270  
200  
77  
250  
100  
50  
7
rD  
diode forward resistance  
40  
5.4  
1.4  
1.9  
τL  
charge carrier life time  
series inductance  
when switched from IF = 10 mA to 1.25  
IR = 6 mA; RL = 100 ;  
measured at IR = 3 mA  
µs  
LS  
IF = 100 mA; f = 100 MHz  
0.6  
nH  
2002 Aug 06  
2
Philips Semiconductors  
Product specification  
Silicon PIN diode  
BAP70-02  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
VALUE  
UNIT  
Rth j-s  
thermal resistance from junction to soldering point  
145  
K/W  
GRAPHICAL DATA  
MCE007  
MCE008  
3
10  
600  
handbook, halfpage  
handbook, halfpage  
C
d
r
D
(fF)  
()  
500  
2
10  
400  
300  
200  
100  
10  
1
10  
0
0
1  
2
1
10  
10  
5
10  
15  
20  
I
(mA)  
V
(V)  
F
R
f = 100 MHz; Tj = 25 °C.  
f = 1 MHz; Tj = 25 °C.  
Fig.2 Forward resistance as a function of forward  
current; typical values.  
Fig.3 Diode capacitance as a function of reverse  
voltage; typical values.  
2002 Aug 06  
3
Philips Semiconductors  
Product specification  
Silicon PIN diode  
BAP70-02  
PACKAGE OUTLINE  
Plastic surface mounted package; 2 leads  
SOD523  
A
c
v
M
A
H
E
A
D
0
0.5  
1 mm  
scale  
1
2
DIMENSIONS (mm are the original dimensions)  
b
E
p
UNIT  
A
b
c
D
E
H
v
p
E
0.35  
0.25  
0.2  
0.1  
0.7  
0.5  
1.3  
1.1  
0.9  
0.7  
1.7  
1.5  
mm  
0.15  
(1)  
Note  
1. The marking bar indicates the cathode.  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
98-11-25  
SOD523  
SC-79  
2002 Aug 06  
4
Philips Semiconductors  
Product specification  
Silicon PIN diode  
BAP70-02  
DATA SHEET STATUS  
PRODUCT  
STATUS(2)  
DATA SHEET STATUS(1)  
DEFINITIONS  
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
Preliminary data  
Product data  
Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Changes will be  
communicated according to the Customer Product/Process Change  
Notification (CPCN) procedure SNW-SQ-650A.  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes, without notice, in the  
products, including circuits, standard cells, and/or  
software, described or contained herein in order to  
improve design and/or performance. Philips  
Semiconductors assumes no responsibility or liability for  
the use of any of these products, conveys no licence or title  
under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that  
these products are free from patent, copyright, or mask  
work right infringement, unless otherwise specified.  
Application information  
Applications that are  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2002 Aug 06  
5
Philips Semiconductors  
Product specification  
Silicon PIN diode  
BAP70-02  
NOTES  
2002 Aug 06  
6
Philips Semiconductors  
Product specification  
Silicon PIN diode  
BAP70-02  
NOTES  
2002 Aug 06  
7
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.  
© Koninklijke Philips Electronics N.V. 2002  
SCA74  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
613516/03/pp8  
Date of release: 2002 Aug 06  
Document order number: 9397 750 10093  

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