BAS116H [NXP]
75 V, low leakage diode in small SOD123F package; 75 V ，小SOD123F封装低泄漏二极管
| 型号： | BAS116H |
| 厂家： | 
NXP |
| 描述： | 75 V, low leakage diode in small SOD123F package |
| 文件： | 总9页 (文件大小：52K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BAS116H
75 V, low leakage diode in small SOD123F package
Rev. 01 — 11 April 2005
Product data sheet
1. Product profile
1.1 General description
Low leakage switching diode, encapsulated in a SOD123F small SMD plastic package.
1.2 Features
■ Small and flat lead SMD plastic package
■ Low leakage current
1.3 Applications
■ General-purpose switching
1.4 Quick reference data
Table 1:
Quick reference data
Parameter
Symbol
Conditions
Min
Typ
Max
215
75
Unit
mA
V
IF
forward current
reverse voltage
reverse current
-
-
-
-
-
VR
IR
VR = 75 V
0.003 5.0
nA
BAS116H
Philips Semiconductors
75 V, low leakage diode in small SOD123F package
2. Pinning information
Table 2:
Pinning
Pin
1
Description
cathode
Simplified outline
Symbol
[1]
1
2
2
anode
1
2
sym001
[1] The marking bar indicates the cathode.
3. Ordering information
Table 3:
Ordering information
Type number Package
Name
Description
Version
BAS116H
-
plastic surface mounted package; 2 leads
SOD123F
4. Marking
Table 4:
Marking codes
Type number
Marking code
BAS116H
B1
5. Limiting values
Table 5:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Per diode
VRRM
Parameter
Conditions
Min
Max
Unit
repetitive peak reverse
voltage
-
85
V
VR
IF
reverse voltage
forward current
-
-
-
75
V
215
500
mA
mA
IFRM
repetitive peak forward
current
IFSM
non-repetitive peak forward tp = 1 µs
-
4
A
current
tp = 1 ms
-
1
A
tp = 1 s
-
0.5
375
150
+150
+150
A
[1]
Ptot
Tj
total power dissipation
junction temperature
ambient temperature
storage temperature
Tamb ≤ 25 °C
-
mW
°C
°C
°C
-
Tamb
Tstg
−65
−65
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
9397 750 14881
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 11 April 2005
2 of 9
BAS116H
Philips Semiconductors
75 V, low leakage diode in small SOD123F package
6. Thermal characteristics
Table 6:
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Min
Typ
Max Unit
[1] [2]
thermal resistance from
junction to ambient
in free air
-
-
330
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
-
-
70
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
7. Characteristics
Table 7:
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Per diode
VF
Parameter
Conditions
Min
Typ
Max
Unit
[1]
[1]
[1]
[1]
forward voltage
IF = 1 mA
-
-
-
-
-
-
-
-
-
-
-
-
0.90
1.00
1.10
1.25
mV
mV
mV
mV
nA
nA
pF
IF = 10 mA
IF = 50 mA
IF = 150 mA
VR = 75 V
IR
reverse current
0.003 5.0
VR = 75 V; Tj = 150 °C
3
80.0
Cd
trr
diode capacitance VR = 0 V; f = 1 MHz
2
-
[2]
reverse recovery
time
0.8
3.0
µs
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
[2] When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA
9397 750 14881
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 11 April 2005
3 of 9
BAS116H
Philips Semiconductors
75 V, low leakage diode in small SOD123F package
mbg704
mlb752
2
10
300
I
F
I
FSM
(A)
(mA)
200
10
(1) (2)
(3)
100
1
−1
0
10
2
3
4
0
0.4
0.8
1.2
1.6
1
10
10
10
10
V
(V)
F
t
(µs)
p
(1) Tamb = 150 °C; typical values
(2) Tamb = 25 °C; typical values
(3) Tamb = 25 °C; maximum values
Based on square wave currents
(1) Tj = 25 °C; prior to surge
Fig 1. Forward current as a function of forward
voltage
Fig 2. Non-repetitive peak forward current as a
function of pulse duration
mbg526
mlb754
2
2
10
I
R
(nA)
(1)
C
d
10
(pF)
1
1
−1
10
(2)
−2
10
−3
0
10
0
5
10
15
20
0
50
100
150
200
V
R
(V)
T (°C)
j
VR = 75 V
Tamb = 25 °C; f = 1 MHz
(1) Maximum values
(2) Typical values
Fig 3. Reverse current as a function of junction
temperature
Fig 4. Diode capacitance as a function of reverse
voltage; typical values
9397 750 14881
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 11 April 2005
4 of 9
BAS116H
Philips Semiconductors
75 V, low leakage diode in small SOD123F package
8. Test information
t
t
p
r
t
D.U.T.
10 %
I
+ I
F
t
F
rr
R
S
= 50 Ω
SAMPLING
OSCILLOSCOPE
t
R
i
= 50 Ω
V = V + I × R
S
R
F
(1)
90 %
V
R
mga881
input signal
output signal
(1) IR = 1 mA
Fig 5. Reverse recovery time test circuit and waveforms
9397 750 14881
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 11 April 2005
5 of 9
BAS116H
Philips Semiconductors
75 V, low leakage diode in small SOD123F package
9. Package outline
1.7
1.5
1.2
1.0
1
0.55
0.35
3.6 2.7
3.4 2.5
2
0.70
0.55
0.25
0.10
Dimensions in mm
04-11-29
Fig 6. Package outline SOD123F
10. Packing information
Table 8:
Packing methods
The -xxx numbers are the last three digits of the 12NC ordering code. [1]
Type number
Package
Description
Packing quantity
3000
10000
BAS116H
SO123F
4 mm pitch, 8 mm tape and reel
-115
-135
[1] For further information and the availability of packing methods, see Section 16.
11. Soldering
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 7. Reflow soldering footprint SOD123F
9397 750 14881
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 11 April 2005
6 of 9
BAS116H
Philips Semiconductors
75 V, low leakage diode in small SOD123F package
12. Revision history
Table 9:
Revision history
Document ID
Release date Data sheet status
20050411 Product data sheet
Change notice Doc. number
9397 750 14881
Supersedes
BAS116H_1
-
-
9397 750 14881
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 11 April 2005
7 of 9
BAS116H
Philips Semiconductors
75 V, low leakage diode in small SOD123F package
13. Data sheet status
Level Data sheet status[1] Product status[2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
[2]
Please consult the most recently issued data sheet before initiating or completing a design.
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
14. Definitions
15. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
16. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
9397 750 14881
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 11 April 2005
8 of 9
BAS116H
Philips Semiconductors
75 V, low leakage diode in small SOD123F package
17. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing information. . . . . . . . . . . . . . . . . . . . . . 6
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Contact information . . . . . . . . . . . . . . . . . . . . . 8
3
4
5
6
7
8
9
10
11
12
13
14
15
16
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 11 April 2005
Document number: 9397 750 14881
Published in The Netherlands
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