BAS40-05/T3_技术文档

BAS40 series;

1PSxxSB4x series

General-purpose Schottky diodes

Rev. 9 — 18 March 2015

Product data sheet

1. Product profile

1.1 General description

General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic

packages.

Table 1.

Product overview

Type number

Package

NXP

Configuration

JEITA

1PS70SB40

1PS76SB40

1PS79SB40

BAS40

SOT323

SOD323

SOD523

SOT23

SC-70

single diode

SC-76

single diode

SC-79

single diode

-

single diode

BAS40H

SOD123F

SOD882

SOT323

SOT23

-

single diode

BAS40L

-

single diode

BAS40W

SC-70

single diode

1PS70SB44

BAS40-04

BAS40-04W

1PS70SB45

1PS75SB45

BAS40-05

BAS40-05W

1PS70SB46

BAS40-06

BAS40-06W

BAS40-07

BAS40-07V

BAS40-05V

SC-70

dual series

-

dual series

SOT323

SOT416

SOT23

SC-70

dual series

SC-70

dual common cathode

dual common anode

dual isolated

SC-75

-

SOT323

SOT23

SC-70

-

SOT323

SOT143B

SOT666

SC-70

-

dual isolated

quadruple common cathode/

common cathode

1PS88SB48

BAS40XY

SOT363

SC-88

quadruple common cathode/

common cathode

quadruple; 2 series

BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

1.2 Features and benefits

 High switching speed

 Low leakage current

 Low capacitance

 High breakdown voltage

 AEC-Q101 qualified

1.3 Applications

 Ultra high-speed switching

 Voltage clamping

1.4 Quick reference data

Table 2.

Symbol

Per diode

I_F

Quick reference data

Parameter

Conditions

Min

Typ

Max

Unit

forward current

forward voltage

reverse voltage

-

120

380

40

mA

mV

V

[1]

V_F

I_F= 1 mA

V_R

[1] Pulse test: t_p 300 s;   0.02.

2. Pinning information

Table 3.

BAS40H; 1PS76SB40; 1PS79SB40

Pinning

Description

Simplified outline

Symbol

[1]

1

2

cathode

anode

1

2

1

2

sym001

001aab540

BAS40L

[1]

1

2

cathode

anode

1

2

1

2

sym001

Transparent

top view

BAS40; BAS40W; 1PS70SB40

1

2

3

anode

3

not connected

cathode

2

n.c.

1

006aaa436

1

2

006aaa144

BAS40_1PSXXSB4X_SER

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Product data sheet

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2 of 22

BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

Table 3.

BAS40-04; BAS40-04W; 1PS70SB44

Pinning …continued

Description

Simplified outline

Symbol

1

2

3

anode (diode 1)

3

cathode (diode 2)

cathode (diode 1),

anode (diode 2)

1

2

006aaa437

1

2

006aaa144

BAS40-05; BAS40-05W; 1PS70SB45; 1PS75SB45

1

2

3

anode (diode 1)

anode (diode 2)

3

cathode (diode 1),

cathode (diode 2)

2

1

2

006aaa144

006aaa438

BAS40-06; BAS40-06W; 1PS70SB46

1

2

3

cathode (diode 1)

cathode (diode 2)

3

anode (diode 1),

anode (diode 2)

1

2

006aaa439

2

006aaa144

BAS40-07

1

2

3

4

cathode (diode 1)

cathode (diode 2)

anode (diode 2)

anode (diode 1)

4

3

4

3

2

1

2

1

006aaa434

BAS40-07V

1

2

3

4

5

6

anode (diode 1)

not connected

6

5

2

4

3

6

1

5

2

4

3

cathode (diode 2)

anode (diode 2)

not connected

006aaa440

1

cathode (diode 1)

BAS40_1PSXXSB4X_SER

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Product data sheet

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3 of 22

BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

Table 3.

BAS40-05V; 1PS88SB48

Pinning …continued

Description

Simplified outline

Symbol

1

2

3

anode (diode 1)

6

5

2

4

6

1

5

2

4

anode (diode 2)

cathode (diode 3),

cathode (diode 4)

4

5

6

anode (diode 3)

anode (diode 4)

3

1

3

001aab555

006aaa446

cathode (diode 1),

cathode (diode 2)

BAS40XY

1

2

3

anode (diode 1)

6

1

5

2

4

3

6

5

4

cathode (diode 2)

anode (diode 3),

cathode (diode 4)

4

5

6

anode (diode 4)

cathode (diode 3)

1

2

3

cathode (diode 1),

anode (diode 2)

006aaa256

[1] The marking bar indicates the cathode.

BAS40_1PSXXSB4X_SER

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Product data sheet

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4 of 22

BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

3. Ordering information

Table 4.

Ordering information

Type number

Package

Name

Description

Version

SOT323

SOD323

SOD523

SOT23

1PS70SB40

1PS76SB40

1PS79SB40

BAS40

SC-70

plastic surface-mounted package; 3 leads

plastic surface-mounted package; 2 leads

plastic surface-mounted package; 3 leads

plastic surface-mounted package; 2 leads

SC-76

SC-79

-

BAS40H

SOD123F

SOD882

BAS40L

leadless ultra small plastic package; 2 terminals;

body 1.0  0.6  0.5 mm

BAS40W

SC-70

-

plastic surface-mounted package; 3 leads

plastic surface-mounted package; 4 leads

plastic surface-mounted package; 6 leads

SOT323

SOT23

1PS70SB44

BAS40-04

BAS40-04W

1PS70SB45

1PS75SB45

BAS40-05

SC-70

SC-75

-

SOT323

SOT416

SOT23

BAS40-05W

1PS70SB46

BAS40-06

SC-70

-

SOT323

SOT23

BAS40-06W

BAS40-07

SC-70

-

SOT323

SOT143B

SOT666

SOT363

BAS40-07V

BAS40-05V

1PS88SB48

BAS40XY

-

SC-88

BAS40_1PSXXSB4X_SER

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Product data sheet

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5 of 22

BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

4. Marking

Table 5.

Marking codes

Type number

1PS70SB40

1PS76SB40

1PS79SB40

BAS40

Marking code^[1]

Type number

1PS75SB45

BAS40-05

Marking code^[1]

6*3

S4

T

45

45*

65*

6*6

46*

66*

47*

67

BAS40-05W

1PS70SB46

BAS40-06

43*

AJ

BAS40H

BAS40L

S6

63*

6*4

44*

64*

6*5

BAS40-06W

BAS40-07

BAS40W

1PS70SB44

BAS40-04

BAS40-04W

1PS70SB45

BAS40-07V

BAS40-05V

1PS88SB48

BAS40XY

65

8*5

40*

[1] * = -: made in Hong Kong

* = p: made in Hong Kong

* = t: made in Malaysia

* = W: made in China

5. Limiting values

Table 6.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Per diode

V_R

Parameter

Conditions

Min

Max

Unit

reverse voltage

forward current

-

40

V

I_F

120

mA

I_FRM

repetitive peak forward

current

t_p 1 s;   0.5

[1]

I_FSM

non-repetitive peak forward t_p 10 ms

-

200

mA

current

T_j

junction temperature

ambient temperature

storage temperature

-

150

C

T_amb

T_stg

65

+150

[1] T_j= 25 C prior to surge.

BAS40_1PSXXSB4X_SER

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Product data sheet

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6 of 22

BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

6. Thermal characteristics

Table 7.

Symbol

Per device

R_th(j-a)

Thermal characteristics

Parameter

Conditions

Min

Typ

Max

Unit

[1]

thermal resistance from

junction to ambient

in free air

SOT23

-

500

416

833

225

416

330

450

500

625

K/W

SOT143B

SOT363 (1PS88SB48)

SOT416

[2]

SOT666 (BAS40-05V)

SOT666 (BAS40-07V)

SOD123F

SOD323

[2]

SOD523

SOD882

SOT323

R_th(j-sp)

thermal resistance from

junction to solder point

[3]

SOT363 (BAS40XY)

-

260

K/W

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2] Reflow soldering is the only recommended soldering method.

[3] Soldering point at pins 2, 3, 5 and 6.

7. Characteristics

Table 8.

Characteristics

T_amb= 25 C unless otherwise specified.

Symbol Parameter

Per diode

Conditions

Min

Typ

Max Unit

[1]

V_F

forward voltage

I_F= 1 mA

-

380

500

1

mV

V

I_F= 10 mA

I_F= 40 mA

V_R= 30 V

I_R

reverse current

1

A

pF

V_R= 40 V

10

5

C_d

diode capacitance

V_R= 0 V; f = 1 MHz

[1] Pulse test: t_p 300 s;   0.02.

BAS40_1PSXXSB4X_SER

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Product data sheet

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7 of 22

BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

mlc362

mlc361

2

3

10

I

R

I

F

(μA)

(mA)

(1)

(2)

2

10

1

(1) (2) (3)

(4)

1

−1

10

−1

10

(3)

−2

10

0

0.2

0.4

0.6

0.8

1

0

10

20

30

40

V

(V)

V

(V)

F

R

(1) T_amb= 125 C

(2) T_amb= 85 C

(3) T_amb= 25 C

(1) T_amb= 125 C

(2) T_amb= 85 C

(3) T_amb= 25 C

(4)

T_amb= 40 C

Fig 1. Forward current as a function of forward

voltage; typical values

Fig 2. Reverse current as a function of reverse

voltage; typical values

mlc363

mlc364

3

10

5

C

d

(pF)

r

dif

(Ω)

4

2

10

3

2

1

0

10

1

10

−1

2

0

10

20

30

40

1

10

V

(V)

I

(mA)

F

R

f = 10 kHz

T_amb= 25 C; f = 1 MHz

Fig 3. Differential resistance as a function of forward

current; typical values

Fig 4. Diode capacitance as a function of reverse

voltage; typical values

BAS40_1PSXXSB4X_SER

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Product data sheet

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8 of 22

BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in automotive applications.

9. Package outline

0.85

0.75

0.65

0.58

1.35

1.15

1.1

0.8

0.45

0.15

1

1.65 1.25

1.55 1.15

2.7 1.8

2.3 1.6

2

0.40

0.25

0.10

0.34

0.26

0.17

0.11

Dimensions in mm

03-12-17

Dimensions in mm

02-12-13

Fig 5. Package outline SOD323 (SC-76)

Fig 6. Package outline SOD523 (SC-79)

1.7

1.5

1.2

1.0

3.0

2.8

1.1

0.9

1

3

0.55

0.35

0.45

0.15

2.5 1.4

2.1 1.2

3.6 2.7

3.4 2.5

1

2

0.48

0.38

0.15

0.09

0.70

0.55

0.25

0.10

1.9

Dimensions in mm

04-11-04

Dimensions in mm

04-11-29

Fig 7. Package outline SOT23 (TO-236AB)

Fig 8. Package outline SOD123F

BAS40_1PSXXSB4X_SER

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Product data sheet

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9 of 22

BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

2.2

1.8

1.1

0.8

0.50

0.46

0.62

0.55

0.45

0.15

3

2

1

0.30

0.22

2.2 1.35

2.0 1.15

1.02

0.95

0.65

0.30

0.22

1

2

0.4

0.3

0.25

0.10

0.55

0.47

cathode marking on top side (if applicable)

03-04-17

1.3

Dimensions in mm

04-11-04

Fig 9. Package outline SOD882

Fig 10. Package outline SOT323 (SC-70)

3.0

2.8

2.2

1.8

1.1

0.8

1.1

0.9

1.9

0.45

0.15

6

5

4

3

0.45

0.15

2.5 1.4

2.1 1.2

2.2 1.35

2.0 1.15

pin 1

index

1

2

1

2

3

0.88

0.78

0.48

0.38

0.15

0.09

0.25

0.10

0.3

0.2

0.65

1.7

1.3

Dimensions in mm

14-10-03

Dimensions in mm

04-11-16

Fig 11. Package outline SOT143B

Fig 12. Package outline SOT363 (SC-88)

1.7

1.5

0.6

0.5

1.8

1.4

0.95

0.60

6

5

4

3

0.45

0.15

0.3

0.1

1.75 0.9

1.45 0.7

1.7 1.3

1.5 1.1

pin 1 index

1

2

1

2

3

0.30

0.15

0.25

0.10

0.18

0.08

0.27

0.17

0.5

1

Dimensions in mm

04-11-04

Dimensions in mm

04-11-08

Fig 13. Package outline SOT416 (SC-75)

Fig 14. Package outline SOT666

BAS40_1PSXXSB4X_SER

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Product data sheet

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BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

10. Packing information

Table 9.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.^[1]

Type number Package Description

Packing quantity

3000 4000 8000 10000

1PS70SB40

1PS76SB40

1PS79SB40

SOT323

SOD323

SOD523

4 mm pitch, 8 mm tape and reel

2 mm pitch, 8 mm tape and reel

4 mm pitch, 8 mm tape and reel

-115

-

-135

-

-315

-115

-215

-115

-

-135

-235

-135

-315

-135

-235

-135

-235

-135

-235

-135

-235

-

BAS40

SOT23

-

BAS40H

SOD123F 4 mm pitch, 8 mm tape and reel

-

BAS40L

SOD882

SOT323

SOT23

2 mm pitch, 8 mm tape and reel

4 mm pitch, 8 mm tape and reel

-

BAS40W

-115

-215

-115

-215

-115

-215

-115

-215

-

1PS70SB44

BAS40-04

BAS40-04W

1PS70SB45

1PS75SB45

BAS40-05

BAS40-05W

1PS70SB46

BAS40-06

BAS40-06W

BAS40-07

BAS40-07V

-

SOT323

SOT416

SOT23

-

SOT323

SOT23

-

SOT323

-

SOT143B 4 mm pitch, 8 mm tape and reel

-

SOT666

SOT363

2 mm pitch, 8 mm tape and reel

4 mm pitch, 8 mm tape and reel

2 mm pitch, 8 mm tape and reel

4 mm pitch, 8 mm tape and reel

4 mm pitch, 8 mm tape and reel; T1

4 mm pitch, 8 mm tape and reel; T2

4 mm pitch, 8 mm tape and reel; T1

4 mm pitch, 8 mm tape and reel; T2

-

-315

-

-115

-

BAS40-05V

1PS88SB48

BAS40XY

-

-315

-

-115

-

[2]

[3]

[2]

[3]

-115

-125

-115

-125

-

-135

-165

-135

-165

[1] For further information and the availability of packing methods, see Section 14.

[2] T1: normal taping

[3] T2: reverse taping

BAS40_1PSXXSB4X_SER

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Product data sheet

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BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

11. Soldering

3.05

2.80

2.10

1.60

solder lands

solder resist

1.65 0.95

0.50 0.60

occupied area

solder paste

0.50

(2×)

msa433

Dimensions in mm

Fig 15. Reflow soldering footprint SOD323 (SC-76)

5.00

4.40

1.40

solder lands

solder resist

occupied area

2.75 1.20

msa415

preferred transport direction during soldering

Dimensions in mm

Fig 16. Wave soldering footprint SOD323 (SC-76)

2.15

0.50 0.60

1.20

solder lands

solder paste

solder resist

occupied area

0.30

0.40

1.80

1.90

mgs343

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 17. Reflow soldering footprint SOD523 (SC-79)

BAS40_1PSXXSB4X_SER

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BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

2.90

2.50

solder lands

solder resist

2

1

0.85

occupied area

solder paste

2.70

3.00

1.30

3

0.60

(3x)

0.50 (3x)

0.60 (3x)

1.00

3.30

MSA439

Dimensions in mm

Fig 18. Reflow soldering footprint SOT23 (TO-236AB)

3.40

1.20 (2x)

solder lands

solder resist

occupied area

2

1

4.60 4.00 1.20

3

preferred transport direction during soldering

2.80

4.50

MSA427

Dimensions in mm

Fig 19. Wave soldering footprint SOT23 (TO-236AB)

BAS40_1PSXXSB4X_SER

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Product data sheet

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BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

4.4

4

2.9

1.6

solder lands

solder resist

2.1 1.6

1.1 1.2

solder paste

occupied area

1.1

(2×)

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 20. Reflow soldering footprint SOD123F

1.30

0.30

R = 0.05 (8×)

0.60 0.70 0.80

(2×) (2×) (2×)

0.90

0.30

(2×)

0.40

(2×)

0.50

(2×)

solder lands

solder paste

solder resist

occupied area

mbl872

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 21. Reflow soldering footprint SOD882

BAS40_1PSXXSB4X_SER

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Product data sheet

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BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

2.65

0.75

1.30

1.325

solder lands

solder paste

2

0.50

3

0.60

(3×)

2.35 0.85

1.90

(3×)

solder resist

occupied area

Dimensions in mm

1

0.55

(3×)

msa429

2.40

Fig 22. Reflow soldering footprint SOT323 (SC-70)

4.60

4.00

1.15

2

3

3.65 2.10

2.70

solder lands

0.90

(2×)

solder resist

1

occupied area

Dimensions in mm

msa419

preferred transport direction during soldering

Fig 23. Wave soldering footprint SOT323 (SC-70)

BAS40_1PSXXSB4X_SER

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Product data sheet

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BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

3.25

0.60 (3x)

0.50 (3x)

solder lands

0.60

(4x)

solder resist

occupied area

solder paste

4

3

2

2.70

1.30 3.00

1

msa441

0.90

1.00

2.50

Dimensions in mm

Fig 24. Reflow soldering footprint SOT143B

4.45

1.20 (3×)

4

3

1.15 4.00 4.60

solder lands

solder resist

occupied area

1

2

Dimensions in mm

1.00

preferred transport direction during soldering

3.40

msa422

Fig 25. Wave soldering footprint SOT143B

BAS40_1PSXXSB4X_SER

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Product data sheet

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BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

2.65

solder lands

0.4 (2×)

1.5

2.35

0.6

0.5

solder resist

(4×)

solder paste

0.5

(4×)

0.6

(2×)

occupied area

0.6

(4×)

Dimensions in mm

1.8

sot363_fr

Fig 26. Reflow soldering footprint SOT363 (SC-88)

1.5

solder lands

solder resist

occupied area

2.5

0.3

4.5

1.5

Dimensions in mm

preferred transport

direction during soldering

1.3

2.45

5.3

sot363_fw

Fig 27. Wave soldering footprint SOT363 (SC-88)

BAS40_1PSXXSB4X_SER

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Product data sheet

Rev. 9 — 18 March 2015

17 of 22

BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

2.2

0.6

1.1

0.7

2

3

2.0 0.85

1.5

0.5

(3x)

1

0.6

(3x)

msa438

1.9

Dimensions in mm

solder lands

solder resist

solder paste

occupied area

Fig 28. Reflow soldering footprint SOT416

2.75

2.45

2.1

1.6

solder lands

0.4

(6×)

0.3

(2×)

0.25

(2×)

placement area

0.538

0.55

1.075

1.7

2

(2×)

solder paste

occupied area

0.325 0.375

(4×) (4×)

Dimensions in mm

1.7

0.45

0.6

(4×)

(2×)

0.5

0.65

(4×)

(2×)

sot666_fr

Reflow soldering is the only recommended soldering method.

Fig 29. Reflow soldering footprint SOT666

BAS40_1PSXXSB4X_SER

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Product data sheet

Rev. 9 — 18 March 2015

18 of 22

BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

12. Revision history

Table 10. Revision history

Document ID

Release date

20150318

Data sheet status

Change notice Supersedes

- BAS40_1PSXXSB4X_SER_8

BAS40_1PSXXSB4X_SER

v.9

Product data sheet

Modifications:

• The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

BAS40_1PSXXSB4X_SER_8 20100113

BAS40_1PSXXSB4X_SER_7 20060512

BAS40_1PSXXSB4X_SER_6 20050809

Product data sheet

-

BAS40_1PSXXSB4X_SER_7

BAS40_1PSXXSB4X_SER_6

1PS70SB40_3

1PS75SB45_2

1PS76SB40_3

1PS79SB40_2

1PS88SB48_3 BAS40H_1

BAS40L_1 BAS40-05V_1

BAS40-07V_1 BAS40W_3

BAS40_SERIES_5

1PS70SB40_3

1PS75SB45_2

1PS76SB40_3

1PS79SB40_2

1PS88SB48_3

BAS40H_1

19990426

20040126

19990426

20021107

20050425

20030520

20021121

20020327

19990426

20011010

Product specification

Product data sheet

Product specification

-

1PS70SB40_2

1PS75SB45_1

1PS76SB40_2

1PS79SB40_1

1PS88SB48_2

-

BAS40L_1

-

BAS40-05V_1

BAS40-07V_1

BAS40W_3

-

BAS40W_2

BAS40_4

BAS40_SERIES_5

BAS40_1PSXXSB4X_SER

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Product data sheet

Rev. 9 — 18 March 2015

19 of 22

BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

13. Legal information

13.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use in automotive applications — This NXP

13.2 Definitions

Semiconductors product has been qualified for use in automotive

applications. Unless otherwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer's own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

13.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

BAS40_1PSXXSB4X_SER

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 9 — 18 March 2015

20 of 22

BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

BAS40_1PSXXSB4X_SER

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 9 — 18 March 2015

21 of 22

BAS40 series; 1PSxxSB4x series

NXP Semiconductors

General-purpose Schottky diodes

15. Contents

1

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

General description . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits. . . . . . . . . . . . . . . . . . . . 2

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Quick reference data . . . . . . . . . . . . . . . . . . . . 2

1.1

1.2

1.3

1.4

2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 5

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

Thermal characteristics . . . . . . . . . . . . . . . . . . 7

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7

Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9

Quality information . . . . . . . . . . . . . . . . . . . . . . 9

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

Packing information . . . . . . . . . . . . . . . . . . . . 11

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19

3

4

5

6

7

8

8.1

9

10

11

12

13

Legal information. . . . . . . . . . . . . . . . . . . . . . . 20

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21

13.1

13.2

13.3

13.4

14

15

Contact information. . . . . . . . . . . . . . . . . . . . . 21

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 18 March 2015

Document identifier: BAS40_1PSXXSB4X_SER


型号：	BAS40-05/T3
厂家：	NXP
描述：	0.12A, 40V, 2 ELEMENT, SILICON, SIGNAL DIODE, TO-236AB, PLASTIC PACKAGE-3 光电二极管
文件：	总22页 (文件大小：342K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BAS40-05/T3 [NXP]

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