BAT54XY_技术文档

BAT54XY

Schottky barrier quadruple diode in very small SOT363

package

Rev. 01 — 17 January 2005

Product data sheet

1. Product proﬁle

1.1 General description

Schottky barrier quadruple diode with an integrated guard ring for stress protection. Two

electrically isolated dual Schottky barrier diodes series, encapsulated in a SOT363 very

small SMD plastic package.

1.2 Features

■ Low forward voltage

■ Ultra small SMD plastic package

■ Low capacitance

1.3 Applications

■ Ultra high-speed switching

■ Voltage clamping

■ Line termination

■ Inverse-polarity protection

1.4 Quick reference data

Table 1:

Symbol

V_R

Quick reference data

Parameter

Conditions

Min

Typ

Max

30

Unit

V

continuous reverse voltage

continuous forward current

forward voltage

-

I_F

200

400

mA

mV

[1]

V_F

I_F= 10 mA;

see Figure 1

[1] Pulse test: t_p≤ 30ms; δ ≤ 0.02.

BAT54XY

Philips Semiconductors

Schottky barrier quadruple diode in very small SOT363 package

2. Pinning information

Table 2:

Pinning

1

Description

anode 1

Simpliﬁed outline

Symbol

6

5

4

6

5

4

2

cathode 2

3

anode 3 / cathode 4

anode 4

4

1

2

3

5

cathode 3

6

cathode 1 / anode 2

1

2

3

006aaa256

3. Ordering information

Table 3:

Ordering information

Type number Package

Name

Description

Version

BAT54XY

SC-88

plastic surface mounted package; 6 leads

SOT363

4. Marking

Table 4:

Marking codes

Type number

Marking code^[1]

BAT54XY

*C5

[1] * = -: made in Hong Kong

* = t: made in Malaysia

* = W: made in China

5. Limiting values

Table 5:

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Per diode

V_R

Parameter

Conditions

Min

Max

Unit

continuous reverse voltage

continuous forward current

-

30

V

I_F

200

300

mA

I_FRM

repetitive peak forward

current

t_p≤ 1 s; δ ≤ 0.5

I_FSM

non-repetitive peak forward t_p< 10 ms

current

-

600

mA

T_j

junction temperature

ambient temperature

storage temperature

-

125

°C

T_amb

T_stg

−65

+125

+150

9397 750 14141

Product data sheet

Rev. 01 — 17 January 2005

2 of 9

BAT54XY

Philips Semiconductors

Schottky barrier quadruple diode in very small SOT363 package

6. Thermal characteristics

Table 6:

Thermal characteristics

Symbol Parameter

Conditions

Min

Typ Max Unit

[1]

R_th(j-s)

thermal resistance from junction

to soldering point

in free air

-

260

K/W

[1] Soldering point at pins 2, 3, 5 and 6.

7. Characteristics

Table 7:

Characteristics

T_amb= 25 °C unless otherwise speciﬁed.

Symbol

Per diode

V_F

Parameter

Conditions

Min

Typ

Max Unit

[1]

forward voltage

see Figure 1;

I_F= 0.1 mA

-

240

320

400

500

800

2

mV

µA

I_F= 1 mA

I_F= 10 mA

I_F= 30 mA

I_F= 100 mA

V_R= 25 V; see Figure 2

I_R

reverse current

C_d

diode capacitance

V_R= 1 V; f = 1 MHz;

see Figure 3

10

pF

[1] Pulse test: t_p≤ 300 µs; δ ≤ 0.02.

9397 750 14141

Product data sheet

Rev. 01 — 17 January 2005

3 of 9

BAT54XY

Philips Semiconductors

Schottky barrier quadruple diode in very small SOT363 package

msa893

msa892

3

10

I

(1)

(2)

I

R

F

(1) (2) (3)

(µA)

(mA)

2

10

(1)

(2) (3)

1

(3)

−1

0

10

20

30

0

0.4

0.8

1.2

V

R

(V)

V

(V)

F

(1) T_amb= 125 °C.

(2) T_amb= 85 °C.

(3) T_amb= 25 °C.

(1) T_amb= 125 °C.

(2) T_amb= 85 °C.

(3) T_amb= 25 °C.

Fig 1. Forward current as a function of forward

voltage; typical values.

Fig 2. Reverse current as a function of reverse

voltage; typical values.

msa891

15

C

d

(pF)

10

5

0

10

20

30

V

(V)

R

T_amb= 25 °C; f = 1 MHz.

Fig 3. Diode capacitance as a function of reverse voltage; typical values.

9397 750 14141

Product data sheet

Rev. 01 — 17 January 2005

4 of 9

BAT54XY

Philips Semiconductors

Schottky barrier quadruple diode in very small SOT363 package

8. Package outline

Plastic surface mounted package; 6 leads

SOT363

D

B

E

A

X

y

H

v

M

A

E

6

5

4

Q

pin 1

index

A

1

2

3

c

e

1

b

p

L

p

w

M B

e

detail X

0

1

2 mm

scale

DIMENSIONS (mm are the original dimensions)

A

1

UNIT

A

b

c

D

E

e

H

L

Q

v

w

y

p

1

E

max

0.30

0.20

1.1

0.8

0.25

0.10

2.2

1.8

1.35

1.15

2.2

2.0

0.45

0.15

0.25

0.15

mm

0.1

1.3

0.65

0.2

0.1

REFERENCES

JEDEC JEITA

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

97-02-28

04-11-08

SOT363

SC-88

Fig 4. Package outline SOT363 (SC-88).

9397 750 14141

Product data sheet

Rev. 01 — 17 January 2005

5 of 9

BAT54XY

Philips Semiconductors

Schottky barrier quadruple diode in very small SOT363 package

9. Packing information

Table 8:

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code. ^[1]

Type number

Package

Description

Packing quantity

3000

-115

-125

10000

[2]

[3]

BAT54XY

SOT363

4 mm pitch, 8 mm tape and reel; T1

4 mm pitch, 8 mm tape and reel; T2

-135

-165

[1] For further information and the availability of packing methods, see Section 14.

[2] T1: normal taping

[3] T2: reverse taping

9397 750 14141

Product data sheet

Rev. 01 — 17 January 2005

6 of 9

BAT54XY

Philips Semiconductors

Schottky barrier quadruple diode in very small SOT363 package

10. Revision history

Table 9:

Revision history

Document ID

Release date Data sheet status

20050117 Product data sheet

Change notice Doc. number

9397 750 14141

Supersedes

BAT54XY_1

-

9397 750 14141

Product data sheet

Rev. 01 — 17 January 2005

7 of 9

BAT54XY

Philips Semiconductors

Schottky barrier quadruple diode in very small SOT363 package

11. Data sheet status

Level Data sheet status^[1]Product status^{[2] [3]}

Deﬁnition

I

Objective data

Development

This data sheet contains data from the objective speciﬁcation for product development. Philips

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

II

Preliminary data

Qualiﬁcation

This data sheet contains data from the preliminary speciﬁcation. Supplementary data will be published

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in

order to improve the design and supply the best possible product.

III

Product data

Production

This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

right to make changes at any time in order to improve the design, manufacturing and supply. Relevant

changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

[1]

[2]

Please consult the most recently issued data sheet before initiating or completing a design.

The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3]

For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

12. Deﬁnitions

13. Disclaimers

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips Semiconductors

customers using or selling these products for use in such applications do so

at their own risk and agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Limiting values deﬁnition — Limiting values given are in accordance with

the Absolute Maximum Rating System (IEC 60134). Stress above one or

more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any

other conditions above those given in the Characteristics sections of the

speciﬁcation is not implied. Exposure to limiting values for extended periods

may affect device reliability.

Right to make changes — Philips Semiconductors reserves the right to

make changes in the products - including circuits, standard cells, and/or

software - described or contained herein in order to improve design and/or

performance. When the product is in full production (status ‘Production’),

relevant changes will be communicated via a Customer Product/Process

Change Notiﬁcation (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these products, conveys no

license or title under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that these products are

free from patent, copyright, or mask work right infringement, unless otherwise

speciﬁed.

Application information — Applications that are described herein for any

of these products are for illustrative purposes only. Philips Semiconductors

make no representation or warranty that such applications will be suitable for

the speciﬁed use without further testing or modiﬁcation.

14. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

9397 750 14141

Product data sheet

Rev. 01 — 17 January 2005

8 of 9

BAT54XY

Philips Semiconductors

Schottky barrier quadruple diode in very small SOT363 package

15. Contents

1

Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

1.4

General description. . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data. . . . . . . . . . . . . . . . . . . . . 1

2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

Thermal characteristics. . . . . . . . . . . . . . . . . . . 3

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5

Packing information. . . . . . . . . . . . . . . . . . . . . . 6

Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . 8

Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Contact information . . . . . . . . . . . . . . . . . . . . . 8

3

4

5

6

7

8

9

10

11

12

13

14

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner. The information presented in this document does

not form part of any quotation or contract, is believed to be accurate and reliable and may

be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under

patent- or other industrial or intellectual property rights.

Date of release: 17 January 2005

Document number: 9397 750 14141

Published in The Netherlands


型号：	BAT54XY
厂家：	NXP
描述：	Schottky barrier quadruple diode in very small SOT363 package 在非常小的SOT363封装的肖特基势垒二极管翻两番二极管
文件：	总9页 (文件大小：51K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BAT54XY [NXP]

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