BAV103/N,135 [NXP]

BAV103;


型号：	BAV103/N,135
厂家：	NXP
描述：	BAV103
文件：	总11页 (文件大小：100K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BAV102; BAV103

Single general-purpose switching diodes

Rev. 4 — 6 August 2010

Product data sheet

1. Product profile

1.1 General description

Single general-purpose switching diodes, fabricated in planar technology, and

encapsulated in small hermetically sealed glass SOD80C Surface-Mounted

Device (SMD) packages.

Table 1.

Product overview

Type number

Package

NXP

Configuration

JEITA

BAV102

BAV103

SOD80C

single

1.2 Features and benefits

High switching speed: t_rr≤ 50 ns

Low leakage current

Low capacitance: C_d≤ 5 pF

Small hermetically sealed glass

SMD package

1.3 Applications

High-speed switching

Voltage clamping

General-purpose switching

Reverse polarity protection

1.4 Quick reference data

Table 2.

Quick reference data

Symbol Parameter

Conditions

Min

Typ

Max Unit

[1][2]

I_F

forward current

250

V_R

reverse voltage

BAV102

150

200

BAV103

[3]

t_rr

reverse recovery time

[1] Pulse test: t_p≤ 300 μs; δ ≤ 0.02.

[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[3] When switched from I_F= 30 mA to I_R= 30 mA; R_L= 100 Ω; measured at I_R= 3 mA.

BAV102; BAV103

NXP Semiconductors

Single general-purpose switching diodes

2. Pinning information

Table 3.

Pinning

Description

cathode

Simplified outline

Graphic symbol

[1]

anode

006aab040

[1] The marking band indicates the cathode.

3. Ordering information

Table 4.

Ordering information

Type number

Package

Name

Description

Version

BAV102

BAV103

hermetically sealed glass surface-mounted package; SOD80C

2 connectors

4. Marking

Table 5.

Marking codes

Type number

BAV102

Marking code

marking band

BAV103

5. Limiting values

Table 6.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter

V_RRMrepetitive peak reverse

voltage

BAV102

Conditions

Min

Max

Unit

200

250

BAV103

V_R

reverse voltage

BAV102

150

200

250

625

BAV103

[1][2]

[3]

I_F

forward current

I_FRM

repetitive peak forward

current

I_FSM

non-repetitive peak

forward current

square wave

t_p= 1 μs

t_p= 100 μs

t_p= 1 s

BAV102_BAV103

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 6 August 2010

2 of 11

BAV102; BAV103

NXP Semiconductors

Single general-purpose switching diodes

Table 6.

Limiting values …continued

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter

Conditions

Min

Max

400

Unit

°C

[2]

P_tot

T_j

total power dissipation

T_amb≤ 25 °C

junction temperature

ambient temperature

storage temperature

175

T_amb

T_stg

−65

+175

°C

[1] Pulse test: t_p≤ 300 μs; δ ≤ 0.02.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[3] T_j= 25 °C prior to surge.

6. Thermal characteristics

Table 7.

Thermal characteristics

Symbol Parameter

Conditions

Min

Typ

Max Unit

[1]

R_th(j-a)

R_th(j-t)

thermal resistance from in free air

junction to ambient

375

K/W

thermal resistance from

junction to tie-point

300

K/W

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

7. Characteristics

Table 8.

Characteristics

T_amb= 25 °C unless otherwise specified.

Symbol Parameter Conditions

V_Fforward voltage

Min

Typ

Max Unit

[1]

I_F= 100 mA

I_F= 200 mA

1.0

1.25

I_R

reverse current

BAV102

V_R= 150 V

100

μA

V_R= 150 V; T_j= 150 °C

V_R= 200 V

BAV103

V_R= 200 V; T_j= 150 °C

f = 1 MHz; V_R= 0 V

C_d

t_rr

diode capacitance

[2]

reverse recovery time

[1] Pulse test: t_p≤ 300 μs; δ ≤ 0.02.

[2] When switched from I_F= 30 mA to I_R= 30 mA; R_L= 100 Ω; measured at I_R= 3 mA.

BAV102_BAV103

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 6 August 2010

3 of 11

BAV102; BAV103

NXP Semiconductors

Single general-purpose switching diodes

mbg703

mbg459

600

FSM

(A)

(mA)

400

(1)

(2)

(3)

200

−1

(V)

(μs)

(1) T_amb= 150 °C; typical values

(2) T_amb= 25 °C; typical values

(3) T_amb= 25 °C; maximum values

Based on square wave currents.

T_j= 25 °C; prior to surge

Fig 1. Forward current as a function of forward

voltage

Fig 2. Non-repetitive peak forward current as a

function of pulse duration; maximum values

mgd005

mgd009

1.6

(pF)

(μA)

1.4

1.2

1.0

0.8

−1

−2

100

200

(V)

T (°C)

V_R= V_Rmax

f = 1 MHz; T_amb= 25 °C

Solid line: maximum values

Dotted line: typical values

Fig 3. Reverse current as a function of junction

temperature

Fig 4. Diode capacitance as a function of reverse

voltage; typical values

BAV102_BAV103

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 6 August 2010

4 of 11

BAV102; BAV103

NXP Semiconductors

Single general-purpose switching diodes

mbh278

mgl588

300

(V)

(mA)

(1)

(2)

200

100

200

100

200

amb

(°C)

amb

(°C)

FR4 PCB, standard footprint

(1) BAV103

(2) BAV102

Fig 5. Forward current as a function of ambient

temperature; derating curve

Fig 6. Reverse voltage as a function of ambient

temperature; derating curve

8. Test information

D.U.T.

10 %

+ I

= 50 Ω

SAMPLING

OSCILLOSCOPE

= 50 Ω

V = V + I × R

(1)

90 %

mga881

input signal

output signal

(1) I_R= 1 mA

Fig 7. Reverse recovery time test circuit and waveforms

BAV102_BAV103

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 6 August 2010

5 of 11

BAV102; BAV103

NXP Semiconductors

Single general-purpose switching diodes

9. Package outline

1.60

1.45

0.3

3.7

3.3

Dimensions in mm

06-03-16

Fig 8. Package outline SOD80C

10. Packing information

Table 9.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.^[1]

Type number

Package

Description

Packing quantity

2500

10000

BAV102

BAV103

SOD80C

4 mm pitch, 8 mm tape and reel

-115

-135

[1] For further information and the availability of packing methods, see Section 14.

BAV102_BAV103

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 6 August 2010

6 of 11

BAV102; BAV103

NXP Semiconductors

Single general-purpose switching diodes

11. Soldering

4.55

4.30

2.30

solder lands

solder paste

solder resist

occupied area

2.25 1.70 1.60

Dimensions in mm

0.90

(2x)

sod080c

Fig 9. Reflow soldering footprint SOD80C

6.30

4.90

2.70

1.90

solder lands

solder resist

occupied area

tracks

2.90 1.70

Dimensions in mm

sod080c

Fig 10. Wave soldering footprint SOD80C

BAV102_BAV103

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 6 August 2010

7 of 11

BAV102; BAV103

NXP Semiconductors

Single general-purpose switching diodes

12. Revision history

Table 10. Revision history

Document ID

Release date

20100806

Data sheet status

Change notice

Supersedes

BAV102_BAV103 v.4

Modifications:

Product data sheet

BAV102_BAV103_3

• Section 4 “Marking”: updated

• Section 13 “Legal information”: updated

BAV102_BAV103_3

BAV100_2

20070816

19960917

19960423

Product data sheet

Product specification

BAV100_2

BAV100_1

BAV102_BAV103

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 6 August 2010

8 of 11

BAV102; BAV103

NXP Semiconductors

Single general-purpose switching diodes

13. Legal information

13.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

malfunction of an NXP Semiconductors product can reasonably be expected

13.2 Definitions

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

13.3 Disclaimers

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

BAV102_BAV103

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 6 August 2010

9 of 11

BAV102; BAV103

NXP Semiconductors

Single general-purpose switching diodes

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

13.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

BAV102_BAV103

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 6 August 2010

10 of 11

BAV102; BAV103

NXP Semiconductors

Single general-purpose switching diodes

15. Contents

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

1.4

General description . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits. . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . 1

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

Thermal characteristics . . . . . . . . . . . . . . . . . . 3

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6

Packing information . . . . . . . . . . . . . . . . . . . . . 6

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8

Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

13.1

13.2

13.3

13.4

Contact information. . . . . . . . . . . . . . . . . . . . . 10

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 6 August 2010

Document identifier: BAV102_BAV103

BAV103/N,135 [NXP]

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