BAV10 [NXP]

High-speed diode; 高速二极管
BAV10
型号: BAV10
厂家: NXP    NXP
描述:

High-speed diode
高速二极管

整流二极管
文件: 总7页 (文件大小:38K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
BAV10  
High-speed diode  
1996 Sep 16  
Product specification  
Supersedes data of April 1996  
Philips Semiconductors  
Product specification  
High-speed diode  
BAV10  
FEATURES  
DESCRIPTION  
Hermetically sealed leaded glass  
SOD27 (DO-35) package  
The BAV10 is a high-speed switching diode fabricated in planar technology,  
and encapsulated in the hermetically sealed leaded glass SOD27 (DO-35)  
package.  
High switching speed: max. 6 ns  
General application  
Continuous reverse voltage:  
max. 60 V  
handbook, halfpage  
k
a
Repetitive peak reverse voltage:  
max. 60 V  
MAM246  
Repetitive peak forward current:  
max. 600 mA.  
The diode is type branded.  
APPLICATIONS  
Fig.1 Simplified outline (SOD27; DO-35) and symbol.  
High-speed switching.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VRRM  
VR  
repetitive peak reverse voltage  
continuous reverse voltage  
continuous forward current  
repetitive peak forward current  
60  
60  
V
V
IF  
see Fig.2; note 1  
300  
600  
mA  
mA  
IFRM  
IFSM  
non-repetitive peak forward current square wave; Tj = 25 °C prior to  
surge; see Fig.4  
t = 1 µs  
t = 100 µs  
t = 1 s  
9
3
A
A
1
A
Ptot  
Tstg  
Tj  
total power dissipation  
storage temperature  
junction temperature  
Tamb = 25 °C; note 1  
350  
+200  
200  
mW  
°C  
°C  
65  
Note  
1. Device mounted on an FR4 printed circuit-board; lead length 10 mm.  
1996 Sep 16  
2
Philips Semiconductors  
Product specification  
High-speed diode  
BAV10  
ELECTRICAL CHARACTERISTICS  
Tj = 25 °C; unless otherwise specified.  
SYMBOL  
PARAMETER  
forward voltage  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VF  
see Fig.3  
IF = 10 mA  
750  
1.0  
mV  
IF = 200 mA  
V
IF = 500 mA  
1.25  
950  
V
IF = 200 mA; Tj = 100 °C  
see Fig.5  
mV  
IR  
reverse current  
VR = 60 V  
100  
100  
2.5  
6
nA  
µA  
pF  
ns  
VR = 60 V; Tj = 150 °C  
f = 1 MHz; VR = 0; see Fig.6  
Cd  
trr  
diode capacitance  
reverse recovery time  
when switched from IF = 400 mA to  
IR = 400 mA; RL = 100 ;  
measured at IR = 40 mA; see Fig.7  
Vfr  
forward recovery voltage  
when switched from IF = 400 mA;  
tr = 30 ns; see Fig.8  
2
V
V
when switched from IF = 400 mA;  
tr = 10 ns; see Fig.8  
1.5  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
thermal resistance from junction to tie-point lead length 10 mm  
thermal resistance from junction to ambient lead length 10 mm; note 1  
VALUE  
240  
UNIT  
Rth j-tp  
Rth j-a  
K/W  
K/W  
500  
Note  
1. Device mounted on a printed circuit-board without metallization pad.  
1996 Sep 16  
3
Philips Semiconductors  
Product specification  
High-speed diode  
BAV10  
GRAPHICAL DATA  
MBG454  
MBG457  
400  
600  
handbook, halfpage  
handbook, halfpage  
I
F
(1) (2) (3)  
I
(mA)  
F
(mA)  
300  
400  
200  
100  
200  
0
0
0
0
o
100  
200  
1
2
T
( C)  
V
(V)  
amb  
F
(1) Tj = 175 °C; typical values.  
(2) Tj = 25 °C; typical values.  
(3) Tj = 25 °C; maximum values.  
Device mounted on an FR4 printed-circuit board; lead length 10 mm.  
Fig.2 Maximum permissible continuous forward  
current as a function of ambient  
temperature.  
Fig.3 Forward current as a function of forward  
voltage.  
MBG703  
2
10  
I
FSM  
(A)  
10  
1
1  
10  
2
3
4
1
10  
10  
10  
10  
t
(µs)  
p
Based on square wave currents.  
Tj = 25 °C prior to surge.  
Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.  
1996 Sep 16  
4
Philips Semiconductors  
Product specification  
High-speed diode  
BAV10  
MGD011  
MGD002  
3
10  
4
handbook, halfpage  
handbook, halfpage  
I
R
C
d
(µA)  
2
(pF)  
10  
3
(1)  
(2)  
(3)  
10  
1
2
1
1  
10  
2  
10  
0
0
0
100  
200  
o
10  
20  
30  
T ( C)  
V
(V)  
j
R
(1) VR = 60 V; maximum values.  
(2) VR = 60 V; typical values.  
(3) VR = 30 V; typical values.  
f = 1 MHz; Tj = 25 °C.  
Fig.5 Reverse current as a function of junction  
temperature.  
Fig.6 Diode capacitance as a function of reverse  
voltage; typical values.  
1996 Sep 16  
5
Philips Semiconductors  
Product specification  
High-speed diode  
BAV10  
t
t
p
r
t
D.U.T.  
10%  
I
F
I
t
R
= 50  
F
rr  
S
SAMPLING  
t
OSCILLOSCOPE  
R = 50 Ω  
V = V  
I x R  
F S  
R
i
(1)  
90%  
V
R
MGA881  
input signal  
output signal  
(1) IR = 40 mA.  
Fig.7 Reverse recovery voltage test circuit and waveforms.  
I
1 kΩ  
450 Ω  
I
V
90%  
R
= 50 Ω  
S
OSCILLOSCOPE  
V
fr  
D.U.T.  
R = 50 Ω  
i
10%  
MGA882  
t
t
t
t
p
r
input  
signal  
output  
signal  
Input signal: forward pulse duration tp = 300 ns; duty factor δ = 0.01.  
Fig.8 Forward recovery voltage test circuit and waveforms.  
6
1996 Sep 16  
Philips Semiconductors  
Product specification  
High-speed diode  
BAV10  
PACKAGE OUTLINE  
0.56  
max  
1.85  
max  
4.25  
max  
MLA428 - 1  
25.4 min  
25.4 min  
Dimensions in mm.  
Fig.9 SOD27 (DO-35).  
DEFINITIONS  
Data Sheet Status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1996 Sep 16  
7

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