BB189 [NXP]
UHF variable capacitance diode; 超高频可变电容二极管
| 型号： | BB189 |
| 厂家： | 
NXP |
| 描述： | UHF variable capacitance diode |
| 文件： | 总6页 (文件大小：45K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BB189
UHF variable capacitance diode
Rev. 01 — 8 June 2009
Product data sheet
1. Product profile
1.1 General description
The BB189 is a planar technology variable capacitance diode in a SOD523 ultra small
leadless plastic SMD package. The excellent matching performance is achieved by gliding
matching and a Direct Matching Assembly (DMA) procedure.
1.2 Features
I Excellent linearity
I Excellent matching to 1.8 % DMA
I Ultra small plastic SMD package
I Cd(25V) : 2.05 pF; Cd(2V) to Cd(25V) ratio: 6.3 min.
I Low series resistance
1.3 Applications
I Voltage Controlled Oscillators (VCO)
I Electronic tuning in UHF television tuners
2. Pinning information
Table 1.
Pinning
Pin
1
Description
cathode
Simplified outline
Graphic symbol
[1]
2
anode
1
2
sym008
[1] The marking bar indicates the cathode.
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
plastic surface-mounted package; 2 leads
Version
BB189
SC-79
SOD523
BB189
NXP Semiconductors
UHF variable capacitance diode
4. Marking
Table 3.
Marking codes
Type number
Marking code
BB189
4
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
-
Max
32
Unit
V
VR
IF
reverse voltage
forward current
storage temperature
junction temperature
-
20
mA
°C
Tstg
Tj
−55
−55
+150
+125
°C
6. Characteristics
Table 5.
Characteristics
Tj = 25 °C unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IR
reverse current
see Figure 2
VR = 30 V
-
-
-
-
10
nA
nA
Ω
VR = 30 V; Tj = 85 °C
f = 470 MHz at Cd = 9 pF
-
200
0.7
rs
diode series resistance
diode capacitance
0.6
Cd
f = 1 MHz; see Figure 1 and
Figure 3
VR = 2 V
VR = 25 V
f = 1 MHz
14.15
1.89
6.3
-
-
-
-
15.75 pF
2.18
-
pF
Cd(2V)/Cd(25V) diode capacitance ratio (2 V to 25 V)
∆Cd/Cd
diode capacitance matching
VR = 2 V to 25 V; in sequence of
10 diodes (gliding)
-
1.8
%
BB189_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 8 June 2009
2 of 6
BB189
NXP Semiconductors
UHF variable capacitance diode
001aak204
30
C
d
(pF)
20
10
0
10
−1
2
1
10
10
V
R
(V)
Fig 1. Diode capacitance as a function of reverse voltage; typical values
001aak205
001aak206
3
−2
10
10
I
TC
(K
R
Cd
)
−1
(nA)
2
−3
10
10
10
10
−4
−5
10
1
−1
2
0
20
40
60
80
100
10
1
10
10
T (°C)
j
V
(V)
R
Tj = 0 °C to 85 °C.
Fig 2. Reverse current as a function of junction
temperature; maximum values
Fig 3. Temperature coefficient of diode capacitance
as a function of reverse voltage; typical values
BB189_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 8 June 2009
3 of 6
BB189
NXP Semiconductors
UHF variable capacitance diode
7. Package outline
Plastic surface-mounted package; 2 leads
SOD523
A
c
v
M
A
H
E
A
D
0
0.5
1 mm
scale
1
2
DIMENSIONS (mm are the original dimensions)
b
E
p
UNIT
A
b
c
D
E
H
v
p
E
0.34
0.26
0.17
0.11
0.65
0.58
1.25
1.15
0.85
0.75
1.65
1.55
mm
0.1
(1)
Note
1. The marking bar indicates the cathode.
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEITA
02-12-13
06-03-16
SOD523
SC-79
Fig 4. Package outline SOD523 (SC-79)
8. Abbreviations
Table 6.
Acronym
SMD
Abbreviations
Description
Surface Mounted Device
Ultra High Frequency
UHF
9. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BB189_1
20090608
Product data sheet
-
-
BB189_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 8 June 2009
4 of 6
BB189
NXP Semiconductors
UHF variable capacitance diode
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BB189_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 8 June 2009
5 of 6
BB189
NXP Semiconductors
UHF variable capacitance diode
12. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
3
4
5
6
7
8
9
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 4
10
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 5
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 5
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
10.1
10.2
10.3
10.4
11
12
Contact information. . . . . . . . . . . . . . . . . . . . . . 5
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 June 2009
Document identifier: BB189_1
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