BC817-25QA [NXP]
45 V, 500 mA NPN general-purpose transistors; 45 V ， 500毫安NPN通用晶体管
| 型号： | BC817-25QA |
| 厂家： | 
NXP |
| 描述： | 45 V, 500 mA NPN general-purpose transistors |
| 文件： | 总15页 (文件大小：211K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BC817-25QA; BC817-40QA
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45 V, 500 mA NPN general-purpose transistors
Rev. 1 — 3 September 2013
Product data sheet
1. Product profile
1.1 General description
500 mA NPN general-purpose transistors in a leadless ultra small
DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible
and solderable side pads.
Table 1.
Product overview
Type number
Package
NXP
PNP complement
JEITA
BC817-25QA
BC817-40QA
DFN1010D-3
(SOT1215)
-
BC807-25QA
BC807-40QA
1.2 Features and benefits
General-purpose transistor
Two current gain selections
Low package height of 0.37 mm
AEC-Q101 qualified
1.3 Applications
General-purpose switching and amplification
Mobile applications
1.4 Quick reference data
Table 2.
Quick reference data
Symbol Parameter
Conditions
Min
Typ
Max Unit
VCEO
IC
collector-emitter voltage open base
collector current
-
-
-
-
45
V
500
mA
[1]
hFE
DC current gain
BC817-25QA
BC817-40QA
VCE = 1 V; IC = 100 mA
160
250
-
-
400
600
[1] Pulse test: tp 300 s; 0.02.
BC817-25QA; BC817-40QA
NXP Semiconductors
45 V, 500 mA NPN general-purpose transistors
2. Pinning information
Table 3.
Pinning
Symbol Description
Pin
1
Simplified outline
Graphic symbol
B
E
C
C
base
C
2
emitter
collector
collector
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3
B
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4
E
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3. Ordering information
Table 4.
Ordering information
Package
Type
number
Name
Description
Version
BC817-25QA DFN1010D-3 plastic thermal enhanced ultra thin small outline
SOT1215
package; no leads; 3 terminals;
body: 1.1 1.0 0.37 mm
BC817-40QA
4. Marking
Table 5.
Marking codes
Type number
BC817-25QA
BC817-40QA
Marking code
11 01 00
10 11 00
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Fig 1. DFN1010D-3 (SOT1215) binary marking code description
BC817-25QA_40QA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
2 of 15
BC817-25QA; BC817-40QA
NXP Semiconductors
45 V, 500 mA NPN general-purpose transistors
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
open emitter
Min
Max
50
Unit
V
VCBO
VCEO
VEBO
IC
collector-base voltage
-
-
-
-
-
-
collector-emitter voltage open base
45
V
emitter-base voltage
collector current
open collector
5
V
500
1
mA
A
ICM
peak collector current
peak base current
total power dissipation
single pulse; tp 1 ms
single pulse; tp 1 ms
Tamb 25 C
IBM
200
mA
Ptot
[1]
[2]
[3]
[4]
-
-
-
300
500
560
900
150
+150
+150
mW
mW
mW
mW
C
Tj
junction temperature
ambient temperature
storage temperature
-
Tamb
Tstg
55
65
C
C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for collector 1 cm2.
[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated mounting pad for collector 1 cm2.
BC817-25QA_40QA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
3 of 15
BC817-25QA; BC817-40QA
NXP Semiconductors
45 V, 500 mA NPN general-purpose transistors
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(3) FR4 PCB, 4-layer copper, standard footprint
(4) FR4 PCB, single-sided copper, standard footprint
Fig 2. Power derating curves
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
[1]
[2]
[3]
[4]
-
-
-
-
-
-
-
-
417
250
223
139
K/W
K/W
K/W
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for collector 1 cm2.
[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated mounting pad for collector 1 cm2.
BC817-25QA_40QA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
4 of 15
BC817-25QA; BC817-40QA
NXP Semiconductors
45 V, 500 mA NPN general-purpose transistors
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Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
BC817-25QA_40QA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
5 of 15
BC817-25QA; BC817-40QA
NXP Semiconductors
45 V, 500 mA NPN general-purpose transistors
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Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
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Fig 6. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
BC817-25QA_40QA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
6 of 15
BC817-25QA; BC817-40QA
NXP Semiconductors
45 V, 500 mA NPN general-purpose transistors
7. Characteristics
Table 8.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max Unit
ICBO
collector-base
cut-off current
VCB = 20 V; IE = 0 A
-
-
-
-
100
5
nA
VCB = 20 V; IE = 0 A;
A
Tj = 150 C
IEBO
hFE
emitter-base
cut-off current
VEB = 5 V; IC = 0 A
-
-
100
nA
[1]
DC current gain
BC817-25QA
BC817-40QA
DC current gain
VCE = 1 V; IC = 100 mA
160
250
40
-
-
-
-
-
400
600
-
[1]
[1]
hFE
VCE = 1 V; IC = 500 mA
IC = 500 mA; IB = 50 mA
VCEsat
collector-emitter
700
mV
saturation voltage
[1]
VBE
Cc
base-emitter voltage
IC = 500 mA; VCE = 1 V
-
-
-
1.2
-
V
collector capacitance VCB = 10 V; IE = ie = 0 A;
f = 1 MHz
3
pF
fT
transition frequency
VCE = 5 V; IC = 10 mA;
f = 100 MHz
100
-
-
MHz
[1] Pulse test: tp 300 s; 0.02.
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(mA)
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VCE = 1 V
Tamb = 100 C
Tamb = 25 C
(1)
(2) Tamb = 25 C
(3) Tamb = 55 C
Fig 7. BC817-25QA: DC current gain as a function of
collector current; typical values
Fig 8. BC817-25QA: Collector current as a function
of collector-emitter voltage; typical values
BC817-25QA_40QA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
7 of 15
BC817-25QA; BC817-40QA
NXP Semiconductors
45 V, 500 mA NPN general-purpose transistors
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(1) Tamb = 55C
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(3) Tamb = 100 C
(1) Tamb = 55 C
(2) Tamb = 25 C
(3) Tamb = 100 C
Fig 9. BC817-25QA: Base-emitter voltage as a
function of collector current; typical values
Fig 10. BC817-25QA: Base-emitter saturation voltage
as a function of collector current; typical
values
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800
h
FE
V
CEsat
(V)
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600
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10
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0
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(2)
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10
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10
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2
3
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2
3
10
1
10
10
10
10
1
10
10
10
I
(mA)
I (mA)
C
C
IC/IB = 10
VCE = 1 V
(1) Tamb = 55C
(2) Tamb = 25 C
(1) Tamb = 100 C
(2) Tamb = 25 C
(3)
Tamb = 100 C
(3) Tamb = 55 C
Fig 11. BC817-25QA: Collector-emitter saturation
voltage as a function of collector current;
typical values
Fig 12. BC817-40QA: DC current gain as a function of
collector current; typical values
BC817-25QA_40QA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
8 of 15
BC817-25QA; BC817-40QA
NXP Semiconductors
45 V, 500 mA NPN general-purpose transistors
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Tamb = 25 C
VCE = 1 V
(1) Tamb = 55C
(2) Tamb = 25 C
(3) Tamb = 100 C
Fig 13. BC817-40QA: Collector current as a function
of collector-emitter voltage; typical values
Fig 14. BC817-40QA: Base-emitter voltage as a
function of collector current; typical values
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1
V
CEsat
(V)
V
BEsat
(V)
−1
10
1
(1)
(2)
(3)
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(3)
(2)
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10
−1
10
−3
10
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−1
2
3
−1
2
3
1
10
10
10
1
10
10
10
I
(mA)
I (mA)
C
C
IC/IB = 10
(1) Tamb = 55 C
(2) amb = 25 C
(3) Tamb = 100 C
IC/IB = 10
(1) Tamb = 55 C
(2) amb = 25 C
(3) Tamb = 100 C
T
T
Fig 15. BC817-40QA: Base-emitter saturation voltage
as a function of collector current; typical
values
Fig 16. BC817-40QA: Collector-emitter saturation
voltage as a function of collector current;
typical values
BC817-25QA_40QA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
9 of 15
BC817-25QA; BC817-40QA
NXP Semiconductors
45 V, 500 mA NPN general-purpose transistors
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
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Fig 17. Package outline DFN1010D-3 (SOT1215)
BC817-25QA_40QA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
10 of 15
BC817-25QA; BC817-40QA
NXP Semiconductors
45 V, 500 mA NPN general-purpose transistors
10. Soldering
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Fig 18. Reflow soldering footprint for DFN1010D-3 (SOT1215)
BC817-25QA_40QA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
11 of 15
BC817-25QA; BC817-40QA
NXP Semiconductors
45 V, 500 mA NPN general-purpose transistors
11. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BC817-25QA_40QA v.1
20130903
Product data sheet
-
-
BC817-25QA_40QA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
12 of 15
BC817-25QA; BC817-40QA
NXP Semiconductors
45 V, 500 mA NPN general-purpose transistors
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use in automotive applications — This NXP
12.2 Definitions
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BC817-25QA_40QA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
13 of 15
BC817-25QA; BC817-40QA
NXP Semiconductors
45 V, 500 mA NPN general-purpose transistors
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BC817-25QA_40QA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
14 of 15
BC817-25QA; BC817-40QA
NXP Semiconductors
45 V, 500 mA NPN general-purpose transistors
14. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Test information. . . . . . . . . . . . . . . . . . . . . . . . 10
Quality information . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12
3
4
5
6
7
8
8.1
9
10
11
12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
12.1
12.2
12.3
12.4
13
14
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 September 2013
Document identifier: BC817-25QA_40QA
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