BC846ST/R [NXP]

TRANSISTOR 100 mA, 65 V, 2 CHANNEL, NPN, Si, SMALL SIGNAL TRANSISTOR, PLASTIC, SC-88, 6 PIN, BIP General Purpose Small Signal;


型号：	BC846ST/R
厂家：	NXP
描述：	TRANSISTOR 100 mA, 65 V, 2 CHANNEL, NPN, Si, SMALL SIGNAL TRANSISTOR, PLASTIC, SC-88, 6 PIN, BIP General Purpose Small Signal 开关光电二极管晶体管
文件：	总7页 (文件大小：63K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DISCRETE SEMICONDUCTORS

DATA SHEET

andbook, halfpage

MBD128

BC846S

NPN general purpose double

transistor

Product data sheet

1999 Sep 01

Supersedes data of 1999 May 28

NXP Semiconductors

Product data sheet

NPN general purpose double transistor

BC846S

FEATURES

• Two transistors in one package

• Reduces number of components and board space

handbook, halfpage

• No mutual interference between the transistors.

TR2

APPLICATIONS

TR1

• General purpose switching and small signal

amplification.

Top view

MAM340

DESCRIPTION

NPN double transistor in an SC-88 (SOT363) plastic six

lead package.

Fig.1 Simplified outline (SC-88) and symbol.

PINNING

DESCRIPTION

MARKING

1, 4

2, 5

6, 3

emitter

base

TR1; TR2

TYPE NUMBER

BC846S

MARKING CODE

collector

4Ft

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

Per transistor

V_CBO

V_CEO

V_EBO

I_C

collector-base voltage

open emitter

−

collector-emitter voltage

emitter-base voltage

open base

open collector

collector current (DC)

total power dissipation

storage temperature

100

200

+150

150

+150

°C

P_tot

T_amb≤ 25 °C

T_stg

T_j

−65

−

junction temperature

T_amb

operating ambient temperature

−65

Per device

P_tot

total power dissipation

T_amb≤ 25 °C; note 1

−

300

Note

1. Refer to SC-88 (SOT363) standard mounting conditions.

1999 Sep 01

NXP Semiconductors

Product data sheet

NPN general purpose double transistor

BC846S

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

note 1

VALUE

UNIT

R_{th j-a}

thermal resistance from junction to ambient

416

K/W

Note

1. Refer to SC-88 (SOT363) standard mounting conditions.

CHARACTERISTICS

T_amb= 25 °C unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Per transistor

I_CBO

collector cut-off current

I_E= 0; V_CB= 30 V

−

I_E= 0; V_CB= 30 V; T_j= 150 °C

I_C= 0; V_EB= 5 V

−

μA

I_EBO

h_FE

emitter cut-off current

DC current gain

−

100

−

I_C= 2 mA; V_CE= 5 V

110

−

V_CEsat

collector-emitter saturation I_C= 10 mA; I_B= 0.5 mA

voltage

−

100

300

−

I_C= 100 mA; I_B= 5 mA; note 1

−

V_BEsat

base-emitter saturation

voltage

I_C= 10 mA; I_B= 0.5 mA

−

770

C_c

f_T

collector capacitance

transition frequency

I_E= i_e= 0; V_CB= 10 V; f = 1 MHz

−

1.5

I_C= 10 mA; V_CE= 5 V;

f = 100 MHz

100

−

MHz

Note

1. Pulse test: t_p≤ 300 μs; δ ≤ 0.02.

1999 Sep 01

NXP Semiconductors

Product data sheet

NPN general purpose double transistor

BC846S

MGL738

MGL739

1200

handbook, halfpage

(mV)

CEsat

1000

(mV)

(1)

(2)

800

600

(1)

(2)

(3)

400

200

−1

(mA)

I_C/I_B= 20.

V_CE= 5 V.

(1) T_amb= 150 °C.

(2) T_amb= 25 °C.

(3) T_amb= −55 °C.

(1) T_amb= −55 °C.

(2) T_amb= 25 °C.

(3) T_amb= 150 °C.

Fig.2 Collector-emitter saturation voltage as a

function of collector current; typical values.

Fig.3 Base-emitter voltage as a function of

collector current; typical values.

MGL740

400

handbook, full pagewidth

(1)

300

(2)

200

(3)

100

−1

(mA)

V_CE= 5 V.

(2) T_amb= 25 °C.

(3) _amb= −55 °C.

(1)

T_amb= 150 °C.

Fig.4 DC current gain as a function of collector current; typical values.

1999 Sep 01

NXP Semiconductors

Product data sheet

NPN general purpose double transistor

BC846S

PACKAGE OUTLINE

Plastic surface mounted package; 6 leads

SOT363

pin 1

index

M B

detail X

2 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

max

0.30

0.20

1.1

0.8

0.25

0.10

2.2

1.8

1.35

1.15

2.2

2.0

0.45

0.15

0.25

0.15

0.1

1.3

0.65

0.2

0.1

REFERENCES

JEDEC

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

EIAJ

97-02-28

SOT363

SC-88

1999 Sep 01

NXP Semiconductors

Product data sheet

NPN general purpose double transistor

BC846S

DATA SHEET STATUS

DOCUMENT

STATUS⁽¹⁾

PRODUCT

STATUS⁽²⁾

DEFINITION

Objective data sheet

Development

This document contains data from the objective specification for product

development.

Preliminary data sheet

Product data sheet

Qualification

Production

This document contains data from the preliminary specification.

This document contains the product specification.

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this document was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DISCLAIMERS

above those given in the Characteristics sections of this

document is not implied. Exposure to limiting values for

extended periods may affect device reliability.

General ⎯ Information in this document is believed to be

accurate and reliable. However, NXP Semiconductors

does not give any representations or warranties,

expressed or implied, as to the accuracy or completeness

of such information and shall have no liability for the

consequences of use of such information.

Terms and conditions of sale ⎯ NXP Semiconductors

products are sold subject to the general terms and

conditions of commercial sale, as published at

http://www.nxp.com/profile/terms, including those

pertaining to warranty, intellectual property rights

infringement and limitation of liability, unless explicitly

otherwise agreed to in writing by NXP Semiconductors. In

case of any inconsistency or conflict between information

in this document and such terms and conditions, the latter

will prevail.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to information

published in this document, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for acceptance or the grant, conveyance or

implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Suitability for use ⎯ NXP Semiconductors products are

not designed, authorized or warranted to be suitable for

use in medical, military, aircraft, space or life support

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reasonably be

expected to result in personal injury, death or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at

the customer’s own risk.

Export control ⎯ This document as well as the item(s)

described herein may be subject to export control

regulations. Export might require a prior authorization from

national authorities.

Quick reference data ⎯ The Quick reference data is an

extract of the product data given in the Limiting values and

Characteristics sections of this document, and as such is

not complete, exhaustive or legally binding.

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use without further testing or modification.

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) may cause permanent damage to

the device. Limiting values are stress ratings only and

operation of the device at these or any other conditions

1999 Sep 01

NXP Semiconductors

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were

made to the content, except for the legal definitions and disclaimers.

Contact information

For additional information please visit: http://www.nxp.com

For sales offices addresses send e-mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

115002/02/pp7

Date of release: 1999 Sep 01

Document order number: 9397 750 06102

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