BC847BMB [NXP]

45 V, 100 mA NPN general-purpose transistors; 45 V , 100毫安NPN通用晶体管
BC847BMB
型号: BC847BMB
厂家: NXP    NXP
描述:

45 V, 100 mA NPN general-purpose transistors
45 V , 100毫安NPN通用晶体管

晶体 晶体管
文件: 总14页 (文件大小:349K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BC847xMB series  
SOT883B  
45 V, 100 mA NPN general-purpose transistors  
Rev. 1 — 5 March 2012  
Product data sheet  
1. Product profile  
1.1 General description  
NPN general-purpose transistors in a leadless ultra small SOT883B  
Surface-Mounted Device (SMD) plastic package.  
Table 1.  
Product overview  
Type number  
Package  
NXP  
PNP complement  
JEITA  
JEDEC  
BC847AMB  
BC847BMB  
BC847CMB  
SOT883B  
SOT883B  
SOT883B  
-
-
-
-
-
-
BC857AMB  
BC857BMB  
BC857CMB  
1.2 Features and benefits  
Leadless ultra small SMD plastic  
Power dissipation comparable to SOT23  
AEC-Q101 qualified  
package  
Low package height of 0.37 mm  
1.3 Applications  
General-purpose switching and amplification  
Mobile applications  
1.4 Quick reference data  
Table 2.  
Symbol  
VCEO  
IC  
Quick reference data  
Parameter  
Conditions  
Min Typ Max Unit  
collector-emitter voltage  
collector current  
DC current gain  
BC847AMB  
open base  
-
-
-
-
45  
V
100 mA  
hFE  
VCE = 5 V; IC = 2 mA  
110  
200  
420  
-
-
-
220  
450  
800  
BC847BMB  
BC847CMB  
BC847xMB series  
NXP Semiconductors  
45 V, 100 mA NPN general-purpose transistors  
2. Pinning information  
Table 3.  
Pinning  
Pin  
1
Description  
base  
Simplified outline  
Graphic symbol  
3
1
2
emitter  
3
3
collector  
1
2
Transparent  
top view  
2
sym021  
3. Ordering information  
Table 4.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
BC847xMB series -  
leadless ultra small plastic package; 3 solder lands;  
SOT883B  
body 1.0 0.6 0.37 mm  
4. Marking  
Table 5.  
Marking codes  
Type number  
BC847AMB  
BC847BMB  
BC847CMB  
Marking code[1]  
0100 0001  
0100 0010  
0100 0011  
[1] For SOT883B binary marking code description, see Figure 1.  
4.1 Binary marking code description  
PIN 1 INDICATION  
READING DIRECTION  
READING EXAMPLE:  
0111  
1011  
MARKING CODE  
(EXAMPLE)  
READING DIRECTION  
006aac673  
Fig 1. SOT883B binary marking code description  
BC847XMB_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 5 March 2012  
2 of 14  
BC847xMB series  
NXP Semiconductors  
45 V, 100 mA NPN general-purpose transistors  
5. Limiting values  
Table 6.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Parameter  
Conditions  
open emitter  
open base  
Min  
Max  
50  
Unit  
V
collector-base voltage  
collector-emitter voltage  
emitter-base voltage  
collector current  
-
-
-
-
-
45  
V
open collector  
6
V
100  
200  
mA  
mA  
ICM  
peak collector current  
single pulse;  
tp 1 ms  
IBM  
peak base current  
single pulse;  
-
100  
mA  
tp 1 ms  
[1][2]  
Ptot  
Tj  
total power dissipation  
junction temperature  
ambient temperature  
storage temperature  
Tamb 25 C  
-
250  
mW  
C  
-
150  
Tamb  
Tstg  
55  
65  
+150  
+150  
C  
C  
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard  
footprint.  
[2] Reflow soldering is the only recommended soldering method.  
BC847XMB_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 5 March 2012  
3 of 14  
BC847xMB series  
NXP Semiconductors  
45 V, 100 mA NPN general-purpose transistors  
6. Thermal characteristics  
Table 7.  
Symbol  
Rth(j-a)  
Thermal characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
[1][2]  
thermal resistance from  
junction to ambient  
in free air  
-
-
500  
K/W  
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.  
[2] Reflow soldering is the only recommended soldering method.  
006aab603  
3
10  
duty cycle =  
1
Z
th(j-a)  
0.75  
(K/W)  
0.5  
0.2  
0.33  
2
10  
0.1  
0.05  
0.02  
10  
0.01  
0
1
10  
5  
4  
3  
2  
1  
2
3
10  
10  
10  
10  
1
10  
10  
10  
t
(s)  
p
FR4 PCB, standard footprint  
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values  
BC847XMB_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 5 March 2012  
4 of 14  
BC847xMB series  
NXP Semiconductors  
45 V, 100 mA NPN general-purpose transistors  
7. Characteristics  
Table 8.  
Characteristics  
Tamb = 25 C unless otherwise specified.  
Symbol Parameter  
Conditions  
Min  
Typ  
Max  
15  
5
Unit  
nA  
ICBO  
collector-base  
cut-off current  
VCB = 30 V; IE = 0 A  
-
-
-
-
VCB = 30 V; IE = 0 A;  
A  
Tj = 150 C  
IEBO  
hFE  
emitter-base  
cut-off current  
VEB = 5 V; IC = 0 A  
-
-
100  
nA  
DC current gain  
BC847AMB  
BC847BMB  
BC847CMB  
VCE = 5 V; IC = 2 mA  
110  
-
220  
450  
800  
200  
400  
-
200  
-
420  
-
VCEsat  
VBEsat  
VBE  
collector-emitter  
saturation voltage  
IC = 10 mA; IB = 0.5 mA  
IC = 100 mA; IB = 5 mA  
IC = 10 mA; IB = 0.5 mA  
IC = 100 mA; IB = 5 mA  
-
90  
200  
700  
900  
660  
-
mV  
mV  
mV  
mV  
mV  
mV  
MHz  
[1]  
[1]  
-
base-emitter  
saturation voltage  
-
-
-
base-emitter voltage IC = 2 mA; VCE = 5 V  
IC = 10 mA; VCE = 5 V  
580  
-
700  
770  
-
fT  
transition frequency VCE = 5 V; IC = 10 mA;  
f = 100 MHz  
100  
-
Cc  
Ce  
NF  
collector capacitance VCB = 10 V; IE = ie = 0 A;  
f = 1 MHz  
-
-
-
-
1.5  
-
pF  
pF  
dB  
emitter capacitance VEB = 0.5 V; IC = ic = 0 A;  
f = 1 MHz  
11  
2
noise figure  
IC = 200 A; VCE = 5 V;  
RS = 2 k; f = 1 kHz;  
B = 200 Hz  
10  
[1] Pulse test: tp 300 s;   0.02.  
BC847XMB_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 5 March 2012  
5 of 14  
BC847xMB series  
NXP Semiconductors  
45 V, 100 mA NPN general-purpose transistors  
mgt723  
mgt724  
400  
1200  
V
BE  
(mV)  
1000  
h
FE  
(1)  
300  
(1)  
(2)  
800  
600  
400  
200  
0
(2)  
(3)  
200  
100  
0
(3)  
1  
2
3
1  
2
3
10  
1
10  
10  
10  
10  
1
10  
10  
10  
I
(mA)  
I (mA)  
C
C
VCE = 5 V  
VCE = 5 V  
(1) Tamb = 150 C  
(2) Tamb = 25 C  
(1) Tamb = 55 C  
(2) Tamb = 25 C  
(3)  
Tamb = 55 C  
(3) Tamb = 150 C  
Fig 3. BC847AMB: DC current gain as a function of  
collector current; typical values  
Fig 4. BC847AMB: Base-emitter voltage as a function  
of collector current; typical values  
mgt725  
mgt726  
3
10  
1200  
V
BEsat  
(mV)  
1000  
V
(mV)  
CEsat  
(1)  
(2)  
800  
600  
400  
200  
0
2
10  
(1)  
(2)  
(3)  
(3)  
10  
10  
1  
2
3
1  
2
3
1
10  
10  
10  
10  
1
10  
10  
10  
I
(mA)  
I (mA)  
C
C
IC/IB = 20  
(1) Tamb = 150 C  
(2) amb = 25 C  
(3) Tamb = 55 C  
IC/IB = 10  
(1) Tamb = 55 C  
(2) amb = 25 C  
(3) Tamb = 150 C  
T
T
Fig 5. BC847AMB: Collector-emitter saturation  
voltage as a function of collector current;  
typical values  
Fig 6. BC847AMB: Base-emitter saturation voltage  
as a function of collector current; typical  
values  
BC847XMB_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 5 March 2012  
6 of 14  
BC847xMB series  
NXP Semiconductors  
45 V, 100 mA NPN general-purpose transistors  
mgt728  
mgt727  
1200  
600  
V
BE  
h
FE  
(mV)  
1000  
(1)  
(2)  
500  
(1)  
(2)  
800  
600  
400  
200  
0
400  
300  
200  
100  
0
(3)  
(3)  
2  
1  
2
3
1  
2
3
10  
10  
1
10  
10  
10  
10  
1
10  
10  
10  
I
(mA)  
I (mA)  
C
C
VCE = 5 V  
amb = 150 C  
VCE = 5 V  
(1) Tamb = 55 C  
(1)  
T
(2) Tamb = 25 C  
(3) Tamb = 55 C  
(2) Tamb = 25 C  
(3) Tamb = 150 C  
Fig 7. BC847BMB: DC current gain as a function of  
collector current; typical values  
Fig 8. BC847BMB: Base-emitter voltage as a function  
of collector current; typical values  
mgt729  
mgt730  
4
10  
1200  
V
BEsat  
(mV)  
1000  
V
CEsat  
(mV)  
(1)  
(2)  
3
10  
800  
600  
400  
200  
0
(3)  
2
10  
(1)  
(3) (2)  
10  
10  
1  
2
3
1  
2
3
1
10  
10  
10  
10  
1
10  
10  
10  
I
(mA)  
I (mA)  
C
C
IC/IB = 20  
IC/IB = 10  
(1) Tamb = 150 C  
(2) Tamb = 25 C  
(1) Tamb = 55 C  
(2) Tamb = 25 C  
(3)  
Tamb = 55 C  
(3) Tamb = 150 C  
Fig 9. BC847BMB: Collector-emitter saturation  
voltage as a function of collector current;  
typical values  
Fig 10. BC847BMB: Base-emitter saturation voltage  
as a function of collector current; typical  
values  
BC847XMB_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 5 March 2012  
7 of 14  
BC847xMB series  
NXP Semiconductors  
45 V, 100 mA NPN general-purpose transistors  
mgt732  
mgt731  
1200  
1200  
V
BE  
h
FE  
(mV)  
1000  
1000  
800  
600  
400  
200  
0
(1)  
(1)  
(2)  
800  
600  
400  
200  
0
(2)  
(3)  
(3)  
2  
1  
2
3
1  
2
3
10  
10  
1
10  
10  
10  
10  
1
10  
10  
10  
I
(mA)  
I (mA)  
C
C
VCE = 5 V  
amb = 150 C  
VCE = 5 V  
(1) Tamb = 55 C  
(1)  
T
(2) Tamb = 25 C  
(3) Tamb = 55 C  
(2) Tamb = 25 C  
(3) Tamb = 150 C  
Fig 11. BC847CMB: DC current gain as a function of  
collector current; typical values  
Fig 12. BC847CMB: Base-emitter voltage as a function  
of collector current; typical values  
mgt733  
mgt734  
4
10  
1200  
V
BEsat  
(mV)  
1000  
V
CEsat  
(mV)  
(1)  
(2)  
3
10  
800  
600  
400  
200  
0
(3)  
2
10  
(1)  
(3) (2)  
10  
10  
1  
2
3
1  
2
3
1
10  
10  
10  
10  
1
10  
10  
10  
I
(mA)  
I (mA)  
C
C
IC/IB = 20  
IC/IB = 10  
(1) Tamb = 150 C  
(2) Tamb = 25 C  
(1) Tamb = 55 C  
(2) Tamb = 25 C  
(3)  
Tamb = 55 C  
(3) Tamb = 150 C  
Fig 13. BC847CMB: Collector-emitter saturation  
voltage as a function of collector current;  
typical values  
Fig 14. BC847CMB: Base-emitter saturation voltage  
as a function of collector current; typical  
values  
BC847XMB_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 5 March 2012  
8 of 14  
BC847xMB series  
NXP Semiconductors  
45 V, 100 mA NPN general-purpose transistors  
8. Test information  
8.1 Quality information  
This product has been qualified in accordance with the Automotive Electronics Council  
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is  
suitable for use in automotive applications.  
9. Package outline  
0.65  
0.55  
0.40  
0.34  
0.35  
0.20  
0.12  
0.04 max  
1
2
0.30  
0.22  
1.05  
0.95  
0.65  
0.30  
0.22  
3
0.55  
0.47  
Dimensions in mm  
11-11-02  
Fig 15. Package outline SOT883B  
10. Packing information  
Table 9.  
Packing methods  
The indicated -xxx are the last three digits of the 12NC ordering code.[1]  
Type number  
Package  
Description  
Packing quantity  
10000  
BC847xMB series SOT883B  
2 mm pitch, 8 mm tape and reel  
-315  
[1] For further information and the availability of packing methods, see Section 14.  
BC847XMB_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 5 March 2012  
9 of 14  
BC847xMB series  
NXP Semiconductors  
45 V, 100 mA NPN general-purpose transistors  
11. Soldering  
Footprint information for reflow soldering  
SOT883B  
1.3  
0.7  
R0.05 (8x)  
0.9  
0.6 0.7  
0.25  
(2x)  
0.3  
(2x)  
0.3  
0.4  
0.4  
(2x)  
solder land  
solder land plus solder paste  
solder paste deposit  
occupied area  
solder resist  
Dimensions in mm  
sot883b_fr  
Reflow soldering is the only recommended soldering method.  
Fig 16. Reflow soldering footprint SOT883B  
BC847XMB_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 5 March 2012  
10 of 14  
BC847xMB series  
NXP Semiconductors  
45 V, 100 mA NPN general-purpose transistors  
12. Revision history  
Table 10. Revision history  
Document ID  
Release date  
20120305  
Data sheet status  
Change notice  
Supersedes  
BC847XMB_SER v.1  
Product data sheet  
-
-
BC847XMB_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 5 March 2012  
11 of 14  
BC847xMB series  
NXP Semiconductors  
45 V, 100 mA NPN general-purpose transistors  
13. Legal information  
13.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
Suitability for use — NXP Semiconductors products are not designed,  
13.2 Definitions  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
13.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
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products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
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agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
BC847XMB_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 5 March 2012  
12 of 14  
BC847xMB series  
NXP Semiconductors  
45 V, 100 mA NPN general-purpose transistors  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
13.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
14. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
BC847XMB_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 1 — 5 March 2012  
13 of 14  
BC847xMB series  
NXP Semiconductors  
45 V, 100 mA NPN general-purpose transistors  
15. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
1.4  
General description . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits. . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data . . . . . . . . . . . . . . . . . . . . 1  
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Binary marking code description. . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Thermal characteristics . . . . . . . . . . . . . . . . . . 4  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9  
Quality information . . . . . . . . . . . . . . . . . . . . . . 9  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Packing information . . . . . . . . . . . . . . . . . . . . . 9  
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11  
3
4
4.1  
5
6
7
8
8.1  
9
10  
11  
12  
13  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
13.1  
13.2  
13.3  
13.4  
14  
15  
Contact information. . . . . . . . . . . . . . . . . . . . . 13  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2012.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 5 March 2012  
Document identifier: BC847XMB_SER  

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