BC849CTRL [NXP]

TRANSISTOR 100 mA, 30 V, NPN, Si, SMALL SIGNAL TRANSISTOR, PLASTIC PACKAGE-3, BIP General Purpose Small Signal;
BC849CTRL
型号: BC849CTRL
厂家: NXP    NXP
描述:

TRANSISTOR 100 mA, 30 V, NPN, Si, SMALL SIGNAL TRANSISTOR, PLASTIC PACKAGE-3, BIP General Purpose Small Signal

放大器 光电二极管 晶体管
文件: 总8页 (文件大小:58K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
BC849; BC850  
NPN general purpose transistors  
Product specification  
2004 Jan 16  
Supersedes data of 1999 Apr 08  
Philips Semiconductors  
Product specification  
NPN general purpose transistors  
BC849; BC850  
FEATURES  
PINNING  
PIN  
Low current (max. 100 mA)  
Low voltage (max. 45 V).  
DESCRIPTION  
1
2
3
base  
emitter  
collector  
APPLICATIONS  
General purpose switching and amplification.  
DESCRIPTION  
NPN transistor in a SOT23 plastic package.  
PNP complements: BC859 and BC860.  
handbook, halfpage  
3
3
MARKING  
1
TYPE  
NUMBER  
MARKING  
CODE(1)  
TYPE  
NUMBER  
MARKING  
CODE(1)  
2
1
2
BC849B  
BC849C  
2B*  
2C*  
BC850B  
BC850C  
2F*  
Top view  
MAM255  
2G*  
Note  
1. * = p : Made in Hong Kong.  
* = t : Made in Malaysia.  
* = W : Made in China.  
Fig.1 Simplified outline (SOT23) and symbol.  
ORDERING INFORMATION  
TYPE  
PACKAGE  
DESCRIPTION  
plastic surface mounted package; 3 leads  
NUMBER  
NAME  
VERSION  
BC849B  
BC849C  
BC850B  
BC850C  
SOT23  
2004 Jan 16  
2
Philips Semiconductors  
Product specification  
NPN general purpose transistors  
BC849; BC850  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
SYMBOL  
PARAMETER  
collector-base voltage  
CONDITIONS  
open emitter  
MIN.  
MAX.  
UNIT  
VCBO  
BC849  
30  
V
V
BC850  
50  
VCEO  
collector-emitter voltage  
BC849  
open base  
30  
V
V
V
BC850  
45  
VEBO  
IC  
emitter-base voltage  
collector current (DC)  
peak collector current  
peak base current  
total power dissipation  
storage temperature  
junction temperature  
operating ambient temperature  
open collector  
5
100  
200  
200  
250  
+150  
150  
+150  
mA  
mA  
mA  
mW  
°C  
ICM  
IBM  
Ptot  
Tstg  
Tj  
Tamb 25 °C; note 1  
65  
°C  
Tamb  
65  
°C  
Note  
1. Transistor mounted on an FR4 printed-circuit board.  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
VALUE  
UNIT  
Rth(j-a)  
thermal resistance from junction to ambient note 1  
500  
K/W  
Note  
1. Transistor mounted on an FR4 printed-circuit board.  
2004 Jan 16  
3
Philips Semiconductors  
Product specification  
NPN general purpose transistors  
BC849; BC850  
CHARACTERISTICS  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
ICBO  
PARAMETER  
CONDITIONS  
IE = 0; VCB = 30 V  
MIN. TYP. MAX. UNIT  
collector cut-off current  
15  
5
nA  
µA  
nA  
IE = 0; VCB = 30 V; Tj = 150 °C  
IEBO  
hFE  
emitter cut-off current  
DC current gain  
IC = 0; VEB = 5 V  
100  
IC = 10 µA; VCE = 5 V;  
see Figs 2 and 3  
BC849B; BC850B  
BC849C; BC850C  
DC current gain  
240  
450  
IC = 2 mA; VCE = 5 V;  
see Figs 2 and 3  
BC849B; BC850B  
BC849C; BC850C  
200  
420  
290  
520  
90  
450  
800  
250  
600  
VCEsat  
VBEsat  
VBE  
collector-emitter saturation  
voltage  
IC = 10 mA; IB = 0.5 mA  
mV  
mV  
mV  
mV  
mV  
mV  
pF  
IC = 100 mA; IB = 5 mA  
200  
700  
900  
660  
base-emitter saturation voltage  
IC = 10 mA; IB = 0.5 mA; note 1  
IC = 100 mA; IB = 5 mA; note 1  
IC = 2 mA; VCE = 5 V; note 2  
IC = 10 mA; VCE = 5 V; note 2  
IE = ie = 0; VCB = 10 V; f = 1 MHz  
IC = ic = 0; VEB = 500 mV; f = 1 MHz  
base-emitter voltage  
580  
700  
770  
Cc  
Ce  
fT  
collector capacitance  
emitter capacitance  
transition frequency  
noise figure  
2.5  
11  
pF  
IC = 10 mA; VCE = 5 V; f = 100 MHz 100  
MHz  
dB  
F
IC = 200 µA; VCE = 5 V; RS = 2 k;  
4
f = 10 Hz to 15.7 kHz  
IC = 200 µA; VCE = 5 V; RS = 2 k;  
4
dB  
f = 1 kHz; B = 200 Hz  
Notes  
1. VBEsat decreases by about 1.7 mV/K with increasing temperature.  
2. VBE decreases by about 2 mV/K with increasing temperature.  
2004 Jan 16  
4
Philips Semiconductors  
Product specification  
NPN general purpose transistors  
BC849; BC850  
MBH724  
300  
V
= 5 V  
h
CE  
FE  
200  
100  
0
10  
2  
1  
2
3
10  
1
10  
10  
10  
I
(mA)  
C
BC849B; BC850B.  
Fig.2 DC current gain; typical values.  
MBH725  
600  
V
= 5 V  
CE  
h
FE  
400  
200  
0
10  
2  
1  
2
3
10  
1
10  
10  
10  
I
(mA)  
C
BC849C; BC850C.  
Fig.3 DC current gain; typical values.  
5
2004 Jan 16  
Philips Semiconductors  
Product specification  
NPN general purpose transistors  
BC849; BC850  
PACKAGE OUTLINE  
Plastic surface mounted package; 3 leads  
SOT23  
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
1
b
p
w M  
B
L
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.  
1.1  
0.9  
0.48  
0.38  
0.15  
0.09  
3.0  
2.8  
1.4  
1.2  
2.5  
2.1  
0.45  
0.15  
0.55  
0.45  
mm  
0.1  
1.9  
0.95  
0.2  
0.1  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
EIAJ  
97-02-28  
99-09-13  
SOT23  
TO-236AB  
2004 Jan 16  
6
Philips Semiconductors  
Product specification  
NPN general purpose transistors  
BC849; BC850  
DATA SHEET STATUS  
DATA SHEET  
STATUS(1)  
PRODUCT  
STATUS(2)(3)  
LEVEL  
DEFINITION  
I
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
II  
Preliminary data Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Relevant changes will  
be communicated via a Customer Product/Process Change Notification  
(CPCN).  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes in the products -  
including circuits, standard cells, and/or software -  
described or contained herein in order to improve design  
and/or performance. When the product is in full production  
(status ‘Production’), relevant changes will be  
Application information  
Applications that are  
communicated via a Customer Product/Process Change  
Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these  
products, conveys no licence or title under any patent,  
copyright, or mask work right to these products, and  
makes no representations or warranties that these  
products are free from patent, copyright, or mask work  
right infringement, unless otherwise specified.  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2004 Jan 16  
7
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.  
© Koninklijke Philips Electronics N.V. 2004  
SCA76  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
R75/06/pp8  
Date of release: 2004 Jan 16  
Document order number: 9397 750 12396  

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