BC860BW,135 [NXP]

BC859W; BC860W - PNP general purpose transistors SC-70 3-Pin;


型号：	BC860BW,135
厂家：	NXP
描述：	BC859W; BC860W - PNP general purpose transistors SC-70 3-Pin 放大器光电二极管晶体管
文件：	总7页 (文件大小：62K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DISCRETE SEMICONDUCTORS

DATA SHEET

book, halfpage

M3D187

BC859W; BC860W

PNP general purpose transistors

Product data sheet

1999 Apr 12

Supersedes data of 1997 Sep 03

NXP Semiconductors

Product data sheet

PNP general purpose transistors

BC859W; BC860W

FEATURES

PINNING

• Low current (max. 100 mA)

• Low voltage (max. 45 V).

DESCRIPTION

base

emitter

APPLICATIONS

collector

• Low noise stages in tape recorders, hi-fi amplifiers and

other audio-frequency equipment.

DESCRIPTION

handbook, halfpage

PNP transistor in a SOT323 plastic package.

NPN complements: BC849W and BC850W.

MARKING

TYPE

NUMBER

MARKING

CODE

TYPE

NUMBER

MARKING

CODE

BC859W

4D∗

4B∗

4C∗

BC860W

4H∗

4F∗

4G∗

BC859BW

BC859CW

BC860BW

BC860CW

Top view

MAM048

Note

1. ∗ = - : Made in Hong Kong.

∗ = t : Made in Malaysia.

Fig.1 Simplified outline (SOT323) and symbol.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

PARAMETER

CONDITIONS

open emitter

MIN.

MAX.

UNIT

V_CBO

collector-base voltage

BC859W

−

−30

BC860W

−50

V_CEO

collector-emitter voltage

BC859W

open base

−

−30

BC860W

−45

V_EBO

I_C

emitter-base voltage

collector current (DC)

peak collector current

peak base current

total power dissipation

storage temperature

junction temperature

operating ambient temperature

open collector

−5

−100

−200

200

°C

I_CM

I_BM

P_tot

T_stg

T_j

T_amb≤ 25 °C; note 1

−65

−

+150

150

°C

T_amb

−65

+150

°C

Note

1. Transistor mounted on an FR4 printed-circuit board.

1999 Apr 12

NXP Semiconductors

Product data sheet

PNP general purpose transistors

BC859W; BC860W

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

note 1

VALUE

UNIT

R_{th j-a}

thermal resistance from junction to ambient

625

K/W

Note

1. Transistor mounted on an FR4 printed-circuit board.

CHARACTERISTICS

T_amb= 25 °C unless otherwise specified.

SYMBOL

I_CBO

PARAMETER

CONDITIONS

I_E= 0; V_CB= −30 V

MIN.

TYP. MAX. UNIT

collector cut-off current

−

−15

−4

I_E= 0; V_CB= −30 V; T_j= 150 °C

I_C= 0; V_EB= −5 V

μA

I_EBO

h_FE

emitter cut-off current

DC current gain

−100 nA

I_C= −2 mA; V_CE= −5 V;

see Figs 2 and 3

BC859W; BC860W

BC859BW; BC860BW

BC859CW; BC860CW

220

420

−

800

475

800

V_CEsat

collector-emitter saturation

voltage

I_C= −10 mA; I_B= −0.5 mA

−300 mV

−650 mV

I_C= −100 mA; I_B= −5 mA; note 1

I_C= −2 mA; V_CE= −5 V

−

V_BE

base-emitter voltage

600

−

750

820

I_C= −10 mA; V_CE= −5 V

C_c

C_e

f_T

collector capacitance

emitter capacitance

transition frequency

I_E= i_e= 0; V_CB= −10 V; f = 1 MHz

I_C= i_c= 0; V_EB= −500 mV; f = 1 MHz

−

I_C= −10 mA; V_CE= −5 V; f = 100 MHz 100

−

MHz

noise figure;

I_C= −200 μA; V_CE= −5 V; R_S= 2 kΩ;

−

BC859W; BC860W;

BC859BW; BC860BW;

BC859CW; BC860CW

f = 10 Hz to 15.7 kHz

I_C= −200 μA; V_CE= −5 V; R_S= 2 kΩ;

f = 1 kHz; B = 200 Hz

−

Note

1. Pulse test: t_p≤ 300 μs; δ ≤ 0.02.

1999 Apr 12

NXP Semiconductors

Product data sheet

PNP general purpose transistors

BC859W; BC860W

MBH727

400

handbook, full pagewidth

= −5 V

300

200

100

−10

−2

−1

−10

−1

−10

(mA)

BC859BW; BC860BW.

Fig.2 DC current gain; typical values.

MBH728

600

handbook, full pagewidth

500

400

= −5 V

300

200

100

−2

−1

−10

−1

−10

(mA)

BC859CW; BC860CW.

Fig.3 DC current gain; typical values.

1999 Apr 12

NXP Semiconductors

Product data sheet

PNP general purpose transistors

BC859W; BC860W

PACKAGE OUTLINE

Plastic surface mounted package; 3 leads

SOT323

v M

M B

detail X

2 mm

scale

DIMENSIONS (mm are the original dimensions)

max

UNIT

1.1

0.8

0.4

0.3

0.25

0.10

2.2

1.8

1.35

1.15

2.2

2.0

0.45

0.15

0.23

0.13

0.1

1.3

0.65

0.2

REFERENCES

JEDEC

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

EIAJ

SOT323

SC-70

97-02-28

1999 Apr 12

NXP Semiconductors

Product data sheet

PNP general purpose transistors

BC859W; BC860W

DATA SHEET STATUS

DOCUMENT

STATUS⁽¹⁾

PRODUCT

STATUS⁽²⁾

DEFINITION

Objective data sheet

Development

This document contains data from the objective specification for product

development.

Preliminary data sheet

Product data sheet

Qualification

Production

This document contains data from the preliminary specification.

This document contains the product specification.

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this document was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DISCLAIMERS

above those given in the Characteristics sections of this

document is not implied. Exposure to limiting values for

extended periods may affect device reliability.

General ⎯ Information in this document is believed to be

accurate and reliable. However, NXP Semiconductors

does not give any representations or warranties,

expressed or implied, as to the accuracy or completeness

of such information and shall have no liability for the

consequences of use of such information.

Terms and conditions of sale ⎯ NXP Semiconductors

products are sold subject to the general terms and

conditions of commercial sale, as published at

http://www.nxp.com/profile/terms, including those

pertaining to warranty, intellectual property rights

infringement and limitation of liability, unless explicitly

otherwise agreed to in writing by NXP Semiconductors. In

case of any inconsistency or conflict between information

in this document and such terms and conditions, the latter

will prevail.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to information

published in this document, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for acceptance or the grant, conveyance or

implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Suitability for use ⎯ NXP Semiconductors products are

not designed, authorized or warranted to be suitable for

use in medical, military, aircraft, space or life support

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reasonably be

expected to result in personal injury, death or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at

the customer’s own risk.

Export control ⎯ This document as well as the item(s)

described herein may be subject to export control

regulations. Export might require a prior authorization from

national authorities.

Quick reference data ⎯ The Quick reference data is an

extract of the product data given in the Limiting values and

Characteristics sections of this document, and as such is

not complete, exhaustive or legally binding.

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use without further testing or modification.

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) may cause permanent damage to

the device. Limiting values are stress ratings only and

operation of the device at these or any other conditions

1999 Apr 12

NXP Semiconductors

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were

made to the content, except for the legal definitions and disclaimers.

Contact information

For additional information please visit: http://www.nxp.com

For sales offices addresses send e-mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

115002/00/04/pp7

Date of release: 1999 Apr 12

Document order number: 9397 750 05583

相关型号：