BFQ166T/R [NXP]
TRANSISTOR Si, NPN, RF SMALL SIGNAL TRANSISTOR, PLASTIC PACKAGE-4, BIP RF Small Signal;
| 型号： | BFQ166T/R |
| 厂家： | 
NXP |
| 描述： | TRANSISTOR Si, NPN, RF SMALL SIGNAL TRANSISTOR, PLASTIC PACKAGE-4, BIP RF Small Signal |
| 文件： | 总8页 (文件大小：55K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
BFQ166
NPN video transistor
Product specification
1997 Oct 02
Supersedes data of November 1995
File under Discrete Semiconductors, SC05
Philips Semiconductors
Product specification
NPN video transistor
BFQ166
FEATURES
DESCRIPTION
page
4
•Low output capacitance
• High gain bandwidth
• Good thermal stability
NPN video transistor in a SOT223
plastic package.
PINNING
• Gold metallization ensures
excellent reliability
PIN
DESCRIPTION
emitter
• High current applicability
• Surface mounting.
1
2
3
4
base
1
2
3
emitter
collector
MSB002 - 1
Top view
APPLICATIONS
Fig.1 Simplified outline
(SOT223).
• Video amplifier cascode driver in
high-resolution colour graphics
monitors.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
collector-base voltage
collector-emitter voltage
collector current (DC)
total power dissipation
DC current gain
CONDITIONS
MIN.
TYP. MAX. UNIT
VCBO
VCER
IC
open emitter
−
−
20
19
500
2
V
RBE = 100 Ω
−
−
V
−
−
mA
W
Ptot
hFE
fT
Ts ≤ 105 °C; note 1
−
−
IC = 300 mA; VCE = 5 V; see Fig.4
IC = 300 mA; VCE = 5 V; f = 100 MHz;
50
1
60
−
−
transition frequency
−
GHz
T
amb = 25 °C
Note
1. Ts is the temperature at the soldering point of the collector lead.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN. MAX. UNIT
VCBO
VCEO
VCER
VEBO
IC
collector-base voltage
collector-emitter voltage
collector-emitter voltage
emitter-base voltage
collector current (DC)
total power dissipation
storage temperature
junction temperature
open emitter
open base
−
20
10
19
3
V
−
V
RBE = 100 Ω
open collector
−
V
−
V
−
500
2
mA
W
Ptot
Ts ≤ 105 °C; note 1; see Fig.3
−
Tstg
Tj
−65
−
+150 °C
175 °C
Note
1. Ts is the temperature at the soldering point of the collector lead.
1997 Oct 02
2
Philips Semiconductors
Product specification
NPN video transistor
BFQ166
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-s
thermal resistance from junction to soldering point Ts = 105 °C; Ptot = 2 W;
35
K/W
notes 1 and 2
Notes
1. Ts is the temperature at the soldering point of the collector lead.
2. Device mounted on a printed-circuit board measuring 40 × 40 × 1 mm (collector pad 35 × 17 mm).
CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
IC = 5 mA; IE = 0
MIN. TYP. MAX. UNIT
V(BR)CBO collector-base breakdown voltage
V(BR)CER collector-emitter breakdown voltage
V(BR)CEO collector-emitter breakdown voltage
20
19
10
−
−
−
V
IC = 10 mA; RBE = 100 Ω
IC = 10 mA; IB = 0
−
−
V
−
−
V
ICES
hFE
Cc
collector-emitter cut-off current
DC current gain
VCE = 10 V; VBE = 0
−
100
−
µA
IC = 300 mA; VCE = 5 V; see Fig.4 50
60
4.5
3.2
collector capacitance
IE = ie = 0; VCB = 5 V; f = 1 MHz
−
−
−
pF
pF
Ccb
collector-base capacitance
IC = ic = 0; VCB = 5 V; f = 1 MHz;
see Fig.6
−
fT
transition frequency
IC = 300 mA; VCE = 5 V;
f = 100 MHz; Tamb = 25 °C;
see Fig.5
1
−
−
GHz
1997 Oct 02
3
Philips Semiconductors
Product specification
NPN video transistor
BFQ166
MRA601
MRA600
3
600
handbook, halfpage
handbook, halfpage
P
tot
I
C
(W)
(mA)
2
400
1
200
0
0
0
50
100
150
200
0
5
10
15
20
o
T
( C)
V
(V)
s
CER
RBE ≤ 100 Ω.
Fig.2 DC SOAR.
Fig.3 Power derating curve.
MBB436
MBB435
80
3
handbook, halfpage
handbook, halfpage
h
f
FE
T
(GHz)
70
60
50
2
1
40
0
0
0
200
400
600
100
200
300
I
(mA)
I
(mA)
C
C
VCE = 5 V.
VCE = 5 V; Tamb = 25 °C.
Fig.4 DC current gain as a function of
collector current; typical values.
Fig.5 Transition frequency as a function of
collector current; typical values.
1997 Oct 02
4
Philips Semiconductors
Product specification
NPN video transistor
BFQ166
MRA599
10
handbook, halfpage
C
cb
(pF)
8
6
4
2
0
0
4
8
12
16
V
20
(V)
CB
IC = 0; f = 1 MHz.
Fig.6 Collector-base capacitance as a function of
collector-base voltage; typical values.
1997 Oct 02
5
Philips Semiconductors
Product specification
NPN video transistor
BFQ166
PACKAGE OUTLINE
Plastic surface mounted package; collector pad for good heat transfer; 4 leads
SOT223
D
B
E
A
X
c
y
H
v
M
A
E
b
1
4
Q
A
A
1
L
1
2
3
p
e
b
p
w
M
B
detail X
1
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
b
b
c
D
E
e
e
H
L
p
Q
v
w
y
p
1
1
1
E
1.8
1.5
0.10 0.80
0.01 0.60
3.1
2.9
0.32
0.22
6.7
6.3
3.7
3.3
7.3
6.7
1.1
0.7
0.95
0.85
mm
4.6
2.3
0.2
0.1
0.1
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
96-11-11
97-02-28
SOT223
1997 Oct 02
6
Philips Semiconductors
Product specification
NPN video transistor
BFQ166
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Oct 02
7
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© Philips Electronics N.V. 1997
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
127027/00/02/pp8
Date of release: 1997 Oct 02
Document order number: 9397 750 02871
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