BFU725F,150 [NXP]
RF Small Signal Bipolar Transistor, 0.04A I(C), 1-Element, C Band, Silicon Germanium, NPN;型号: | BFU725F,150 |
厂家: | NXP |
描述: | RF Small Signal Bipolar Transistor, 0.04A I(C), 1-Element, C Band, Silicon Germanium, NPN 放大器 光电二极管 晶体管 |
文件: | 总13页 (文件大小:516K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BFU725F
NPN wideband silicon germanium RF transistor
Rev. 02 — 23 June 2010
Product data sheet
1. Product profile
1.1 General description
NPN silicon germanium microwave transistor for high speed, low noise applications in a
plastic, 4-pin dual-emitter SOT343F package.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
1.2 Features
Low noise high gain microwave transistor
Noise figure (NF) = 0.7 dB at 5.8 GHz
High maximum stable gain 27 dB at 1.8 GHz
110 GHz fT silicon germanium technology
1.3 Applications
2nd LNA stage and mixer stage in DBS LNB’s
Satellite radio
Low noise amplifiers for microwave communications systems
WLAN and CDMA applications
Analog/digital cordless applications
Ka band oscillators DRO’s
BFU725F
NXP Semiconductors
NPN wideband silicon germanium RF transistor
1.4 Quick reference data
Table 1.
Quick reference data
Symbol Parameter
Conditions
open emitter
Min Typ
Max
10
Unit
V
VCBO
VCEO
VEBO
IC
collector-base voltage
-
-
-
-
-
-
collector-emitter voltage open base
-
2.8
V
emitter-base voltage
collector current
open collector
-
0.55
40
V
25
-
mA
mW
[1]
Ptot
total power dissipation
DC current gain
Tsp ≤ 90 °C
136
640
hFE
IC = 10 mA; VCE = 2 V;
300 430
Tj = 25 °C
CCBS
fT
collector-base
capacitance
VCB = 2 V; f = 1 MHz
-
-
-
-
70
70
18
0.7
-
-
-
-
fF
transition frequency
IC = 25 mA; VCE = 2 V;
f = 2 GHz; Tamb = 25 °C
GHz
dB
dB
[2]
Gp(max) maximum power gain
NF noise figure
IC = 25 mA; VCE = 2 V;
f = 5.8 GHz; Tamb = 25 °C
IC = 5 mA; VCE = 2 V;
f = 5.8 GHz; ΓS = Γopt
[1] Tsp is the temperature at the solder point of the emitter lead.
[2] Gp(max) is the maximum power gain, if K > 1. If K < 1 then Gp(max) = Maximum Stable Gain (MSG).
2. Pinning information
Table 2.
Discrete pinning
Pin
1
Description
emitter
Simplified outline
Symbol
3
4
4
2
base
3
emitter
2
4
collector
1, 3
2
1
mbb159
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
-
Description
Version
BFU725F
plastic surface-mounted flat pack package; reverse
pinning; 4 leads
SOT343F
BFU725F
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 23 June 2010
2 of 13
BFU725F
NXP Semiconductors
NPN wideband silicon germanium RF transistor
4. Marking
Table 4.
Marking
Type number
Marking
Description
BFU725F
B6*
* = p : made in Hong Kong
* = t : made in Malaysia
* = w : made in China
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCBO
VCEO
VEBO
IC
Parameter
Conditions
open emitter
open base
Min
Max
10
Unit
V
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
-
-
2.8
V
open collector
-
0.55
40
V
-
mA
mW
°C
°C
[1]
Ptot
total power dissipation
storage temperature
junction temperature
Tsp ≤ 90 °C
-
136
+150
150
Tstg
−65
Tj
-
[1] Tsp is the temperature at the solder point of the emitter lead.
6. Thermal characteristics
Table 6.
Symbol Parameter
Rth(j-sp) thermal resistance from junction to solder point
Thermal characteristics
Conditions
Typ Unit
440 K/W
001aah424
200
tot
P
(mW)
150
100
50
0
0
40
80
120
160
T
sp
(°C)
Fig 1. Power derating curve
BFU725F
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 23 June 2010
3 of 13
BFU725F
NXP Semiconductors
NPN wideband silicon germanium RF transistor
7. Characteristics
Table 7.
Characteristics
Tj = 25 °C unless otherwise specified
Symbol Parameter
Conditions
Min Typ Max Unit
V(BR)CBO collector-base breakdown voltage
V(BR)CEO collector-emitter breakdown voltage
IC = 2.5 μA; IE = 0 mA
10
2.8
-
-
-
V
IC = 1 mA; IB = 0 mA
-
-
V
IC
collector current
25
-
40
mA
ICBO
hFE
collector-base cut-off current
DC current gain
IE = 0 mA; VCB = 4.5 V
IC = 10 mA; VCE = 2 V
VCB = 2 V; f = 1 MHz
VEB = 0.5 V; f = 1 MHz
VCB = 2 V; f = 1 MHz
-
100 nA
300 430 640
CCES
CEBS
CCBS
fT
collector-emitter capacitance
emitter-base capacitance
collector-base capacitance
transition frequency
-
-
-
-
268
342
70
-
-
-
-
fF
fF
fF
IC = 25 mA; VCE = 2 V; f = 2 GHz;
70
GHz
Tamb = 25 °C
[1]
Gp(max)
maximum power gain
insertion power gain
noise figure
IC = 25 mA; VCE = 2 V; Tamb = 25 °C
f = 1.5 GHz
-
-
-
-
-
28
-
-
-
-
-
dB
dB
dB
dB
dB
f = 1.8 GHz
27
f = 2.4 GHz
25.5
18
f = 5.8 GHz
f = 12 GHz
13
2
|s21
|
IC = 25 mA; VCE = 2 V; Tamb = 25 °C
f = 1.5 GHz
-
-
-
-
-
26.7
25.4
23
-
-
-
-
-
dB
dB
dB
dB
dB
f = 1.8 GHz
f = 2.4 GHz
f = 5.8 GHz
16
f = 12 GHz
9.3
NF
IC = 5 mA; VCE = 2 V; ΓS = Γopt
Tamb = 25 °C
;
f = 1.5 GHz
f = 1.8 GHz
-
-
-
-
-
0.42
0.43
0.47
0.7
-
-
-
-
-
dB
dB
dB
dB
dB
f = 2.4 GHz
f = 5.8 GHz
f = 12 GHz
1.1
Gass
associated gain
IC = 5 mA; VCE = 2 V; ΓS = Γopt;
T
amb = 25 °C
f = 1.5 GHz
f = 1.8 GHz
f = 2.4 GHz
f = 5.8 GHz
f = 12 GHz
-
-
-
-
-
24
-
-
-
-
-
dB
dB
dB
dB
dB
22
20
13.5
10
BFU725F
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 23 June 2010
4 of 13
BFU725F
NXP Semiconductors
NPN wideband silicon germanium RF transistor
Table 7.
Characteristics …continued
Tj = 25 °C unless otherwise specified
Symbol Parameter
Conditions
Min Typ Max Unit
PL(1dB)
output power at 1 dB gain compression
IC = 25 mA; VCE = 2 V; ZS = ZL = 50 Ω;
Tamb = 25 °C
f = 1.5 GHz
f = 1.8 GHz
f = 2.4 GHz
f = 5.8 GHz
-
-
-
-
8.5
9
-
-
-
-
dBm
dBm
dBm
dBm
8.5
8
IP3
third-order intercept point
IC = 25 mA; VCE = 2 V; ZS = ZL = 50 Ω;
Tamb = 25 °C
f = 1.5 GHz
f = 1.8 GHz
f = 2.4 GHz
f = 5.8 GHz
-
-
-
-
17
17
17
19
-
-
-
-
dBm
dBm
dBm
dBm
[1] Gp(max) is the maximum power gain, if K > 1. If K < 1 then Gp(max) = MSG.
BFU725F
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 23 June 2010
5 of 13
BFU725F
NXP Semiconductors
NPN wideband silicon germanium RF transistor
001aah425
001aah426
40
550
(1)
(2)
(3)
I
h
C
FE
(mA)
500
450
400
30
(4)
(5)
(6)
(7)
(8)
20
10
0
(9)
(1)
(2)
(3)
(10)
350
300
(11)
0
1
2
3
0
10
20
30
V
(V)
I (mA)
C
CE
(1) IB = 110 μA
(2) IB = 100 μA
(3) IB = 90 μA
(4) IB = 80 μA
(5) IB = 70 μA
(6) IB = 60 μA
(7) IB = 50 μA
(8) IB = 40 μA
(9) IB = 30 μA
(10) IB = 20 μA
(11) IB = 10 μA
(1) VCE = 1 V
(2) VCE = 1.5 V
(3) VCE = 2 V
Fig 2. Collector current as a function of
Fig 3. DC current gain as a function of collector
current; typical values
collector-emitter voltage; typical values
001aah427
001aah428
160
80
C
f
T
CBS
(fF)
(GHz)
120
60
80
40
0
40
20
0
0
4
8
12
0
10
20
30
40
V
CB
(V)
I (mA)
C
f = 1 MHz, Tamb = 25 °C
VCE = 2 V; f = 2 GHz; Tamb = 25 °C
Fig 4. Collector-base capacitance as a function of
collector-base voltage; typical values
Fig 5. Transition frequency as a function of collector
current; typical values
BFU725F
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 23 June 2010
6 of 13
BFU725F
NXP Semiconductors
NPN wideband silicon germanium RF transistor
001aah429
2
10
(1)
(2)
(3)
G
(dB)
MSG
(4)
(5)
G
max
MSG
10
G
max
1
10
−1
2
1
10
10
I
(mA)
C
(1) f = 1.5 GHz
(2) f = 1.8 GHz
(3) f = 2.4 GHz
(4) f = 5.8 GHz
(5) f = 12 GHz
VCE = 2 V; Tamb = 25 °C
Fig 6. Gain as a function of collector current; typical value
001aah430
001aah431
50
50
G
(dB)
G
(dB)
MSG
40
30
20
10
0
40
MSG
2
IS21I
30
20
10
0
2
IS21I
G
p(max)
G
p(max)
MSG
MSG
−2
−1
2
−2
−1
2
10
10
1
10
10
10
10
1
10
10
f (GHz)
f (GHz)
VCE = 2 V; IC = 5 mA; Tamb = 25 °C
VCE = 2 V; IC = 25 mA; Tamb = 25 °C
Fig 7. Gain as a function of frequency; typical values
Fig 8. Gain as a function of frequency; typical values
BFU725F
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 23 June 2010
7 of 13
BFU725F
NXP Semiconductors
NPN wideband silicon germanium RF transistor
001aah432
001aah433
2.0
2.0
NF
min
NF
min
(dB)
(dB)
1.6
1.6
(1)
(2)
(1)
(2)
1.2
0.8
0.4
0
1.2
0.8
0.4
0
(3)
(4)
(5)
0
10
20
30
0
4
8
12
16
I
(mA)
f (GHz)
C
(1) f = 12 GHz
(2) f = 5.8 GHz
(3) f = 2.4 GHz
(4) f = 1.8 GHz
(5) f = 1.5 GHz
(1) IC = 25 mA
(2) IC = 5 mA
VCE = 2 V; Tamb = 25 °C
VCE = 2 V; Tamb = 25 °C
Fig 9. Minimum noise figure as a function of collector
current; typical values
Fig 10. Minimum noise figure as a function of
frequency; typical values
BFU725F
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 23 June 2010
8 of 13
BFU725F
NXP Semiconductors
NPN wideband silicon germanium RF transistor
8. Package outline
Plastic surface-mounted flat pack package; reverse pinning; 4 leads
SOT343F
D
E
A
X
y
H
E
e
3
4
A
c
L
p
2
1
b
p
b
1
M
M
A
w
A
w
detail X
e
1
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
b
p
b
c
D
E
e
e
H
E
L
p
w
y
1
1
max
0.75
0.65
0.4
0.3
0.7
0.5
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.48
0.38
mm
1.3
1.15
0.2
0.1
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
05-07-12
06-03-16
SOT343F
Fig 11. Package outline SOT343F
BFU725F
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 23 June 2010
9 of 13
BFU725F
NXP Semiconductors
NPN wideband silicon germanium RF transistor
9. Abbreviations
Table 8.
Abbreviations
Description
Acronym
CDMA
DBS
DC
Code Division Multiple Access
Direct Broadcast Satellite
Direct Current
DRO
LNA
Dielectric Resonator Oscillator
Low Noise Amplifier
Ka
Kurtz above
LNB
Low Noise Block
NPN
RF
Negative-Positive-Negative
Radio Frequency
WLAN
Wireless Local Area Network
10. Revision history
Table 9.
Revision history
Document ID
BFU725F v.2
Modifications:
BFU725F v.1
Release date
Data sheet status
Change notice
Supersedes
20100623
Product data sheet
-
BFU725F v.1
• Legal information updated.
20071206 Product data sheet
-
-
BFU725F
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 23 June 2010
10 of 13
BFU725F
NXP Semiconductors
NPN wideband silicon germanium RF transistor
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
11.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
11.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
BFU725F
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 23 June 2010
11 of 13
BFU725F
NXP Semiconductors
NPN wideband silicon germanium RF transistor
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
12. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
BFU725F
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 23 June 2010
12 of 13
BFU725F
NXP Semiconductors
NPN wideband silicon germanium RF transistor
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
3
4
5
6
7
8
9
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 23 June 2010
Document identifier: BFU725F
相关型号:
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