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BGA2716,115 [NXP]

BGA2716 - MMIC wideband amplifier TSSOP 6-Pin;
BGA2716,115
型号： BGA2716,115
厂家： NXP    NXP
描述：

BGA2716 - MMIC wideband amplifier TSSOP 6-Pin

射频 微波
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BGA2716  
MMIC wideband amplifier  
Rev. 3 — 8 September 2011  
Product data sheet  
1. Product profile  
1.1 General description  
Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal  
matching circuit in a 6-pin SOT363 SMD plastic package.  
CAUTION  
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken  
during transport and handling.  
1.2 Features and benefits  
Internally matched to 50  
Wide frequency range (3.2 GHz at 3 dB bandwidth)  
Flat 23 dB gain (1 dB up to 2.7 GHz)  
9 dBm output power at 1 dB compression point  
Good linearity for low current (IP3out = 22 dBm)  
Low second harmonic; 38 dBc at PL = 5 dBm  
Unconditionally stable (K 1.2).  
1.3 Applications  
LNB IF amplifiers  
Cable systems  
ISM  
General purpose.  
1.4 Quick reference data  
Table 1.  
Symbol  
VS  
Quick reference data  
Parameter  
Conditions  
Min  
Typ  
5
Max  
Unit  
V
DC supply voltage  
supply current  
-
-
-
-
-
6
-
IS  
15.9  
22.9  
5.3  
mA  
dB  
s212  
NF  
insertion power gain  
noise figure  
f = 1 GHz  
f = 1 GHz  
f = 1 GHz  
-
-
dB  
PL(sat)  
saturated load power  
11.6  
-
dBm  
 
 
 
 
 
BGA2716  
NXP Semiconductors  
MMIC wideband amplifier  
2. Pinning information  
Table 2.  
Pinning  
Pin  
1
Description  
VS  
Simplified outline  
Symbol  
6
5
4
1
2, 5  
3
GND2  
RF_OUT  
GND1  
6
3
4
4
2, 5  
1
2
3
6
RF_IN  
sym052  
3. Ordering information  
Table 3.  
Ordering information  
Type number Package  
Name  
Description  
Version  
BGA2716  
-
plastic surface mounted package; 6 leads  
SOT363  
4. Marking  
Table 4.  
Marking  
Type number  
Marking code  
BGA2716  
B7-  
5. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
VS  
DC supply voltage  
RF input AC  
coupled  
-
6
V
IS  
supply current  
-
30  
mA  
mW  
C  
Ptot  
Tstg  
Tj  
total power dissipation  
storage temperature  
junction temperature  
maximum drive power  
Tsp 90 C  
-
200  
+150  
150  
10  
65  
-
-
C  
PD  
dBm  
BGA2716  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
2 of 15  
 
 
 
 
BGA2716  
NXP Semiconductors  
MMIC wideband amplifier  
6. Thermal characteristics  
Table 6.  
Symbol  
Rth(j-sp)  
Thermal characteristics  
Parameter  
thermal resistance from junction Ptot = 200 mW;  
Conditions  
Typ  
Unit  
300  
K/W  
to solder point  
Tsp 90 C  
7. Characteristics  
Table 7.  
Characteristics  
VS = 5 V; IS = 15.9 mA; Tj = 25 C; measured on demo board; unless otherwise specified.  
Symbol Parameter  
Conditions  
Min  
13  
21  
22  
22  
21  
20  
19  
15  
10  
10  
9
Typ  
15.9  
22.1  
22.9  
23.1  
22.8  
22.1  
20.8  
17  
Max  
21  
23  
24  
25  
24  
24  
22  
-
Unit  
mA  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
GHz  
IS  
supply current  
s212  
insertion power f = 100 MHz  
gain  
f = 1 GHz  
f = 1.8 GHz  
f = 2.2 GHz  
f = 2.6 GHz  
f = 3 GHz  
s112  
s222  
s122  
NF  
input return  
losses  
f = 1 GHz  
f = 2.2 GHz  
f = 1 GHz  
12  
-
output return  
losses  
12  
-
f = 2.2 GHz  
f = 1.6 GHz  
f = 2.2 GHz  
f = 1 GHz  
11  
-
isolation  
30  
33  
-
31  
-
35  
-
noise figure  
5.3  
5.4  
5.6  
-
f = 2.2 GHz  
at s212 3 dB below flat  
-
5.5  
3.2  
B
K
bandwidth  
3
gain at 1 GHz  
stability factor  
f = 1 GHz  
-
1.4  
1.9  
11.6  
7.5  
8.9  
-
-
-
-
-
f = 2.2 GHz  
-
PL(sat)  
saturated load f = 1 GHz  
10  
6
8
dBm  
dBm  
dBm  
power  
f = 2.2 GHz  
PL(1dB)  
load power  
at 1 dB gain compression;  
f = 1 GHz  
at 1 dB gain compression;  
f = 2.2 GHz  
5
6.1  
38  
-
-
dBm  
dBc  
IM2  
second order  
at PL = 5 dBm;  
36  
intermodulation f0 = 1 GHz  
product  
IP3in  
IP3out  
input, third  
order intercept  
point  
f = 1 GHz  
2  
8  
0.7  
6.9  
-
-
dBm  
dBm  
f = 2.2 GHz  
output, third  
order intercept  
point  
f = 1 GHz  
21  
15  
22.2  
15.9  
-
-
dBm  
dBm  
f = 2.2 GHz  
BGA2716  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
3 of 15  
 
 
BGA2716  
NXP Semiconductors  
MMIC wideband amplifier  
8. Application information  
Figure 1 shows a typical application circuit for the BGA2716 MMIC. The device is  
internally matched to 50 , and therefore does not need any external matching. The value  
of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF  
for applications above 100 MHz. However, when the device is operated below 100 MHz,  
the capacitor value should be increased.  
The nominal value of the RF choke L1 is 100 nH. At the frequencies below 100 MHz this  
value should be increased. At frequencies above 1 GHz, a lower value can be used to  
tune the output return loss. For optimal results, a good quality chip inductor or a  
wire-wound SMD type should be chosen.  
Both the RF choke and the 22 nF supply decoupling capacitor C1 should be located as  
close as possible to the MMIC.  
The printed-circuit board (PCB) top ground plane, connected to pins 2, 4 and 5 must be as  
close as possible to the MMIC, and ideally directly beneath it. When using via holes, use  
multiple via holes, located as close as possible to the MMIC.  
V
S
C1  
C2  
L1  
C3  
V
S
RF_OUT  
RF_IN  
RF input  
RF output  
GND1  
GND2  
mgu436  
Fig 1. Typical application circuit.  
Figure 2 shows the PCB layout, used for the standard demonstration board.  
BGA2716  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
4 of 15  
 
 
BGA2716  
NXP Semiconductors  
MMIC wideband amplifier  
30 mm  
PHILIPS  
PH  
30 mm  
IN  
OUT  
V
+
PHILIPS  
PH  
DUT  
C1  
C3  
C2  
L1  
IN  
OUT  
V
+
001aab256  
Material = FR4; thickness = 0.6 mm, r = 4.6.  
Fig 2. PCB layout and demonstration board showing components.  
8.1 Application examples  
The excellent wideband characteristics of the MMIC make it an ideal building block in IF  
amplifier such as LNBs (see Figure 3).  
BGA2716  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
5 of 15  
 
BGA2716  
NXP Semiconductors  
MMIC wideband amplifier  
As second amplifier after an LNA, the MMIC offers an easy matching, low noise solution  
(see Figure 4).  
As driver amplifier in the TX path, the good linear performance and matched input/output  
offer quick design solutions (see Figure 5).  
mixer  
to IF circuit  
from  
or demodulator  
RF circuit  
wideband  
amplifier  
oscillator  
mgu438  
Fig 3. Application as IF amplifier.  
mixer  
to IF circuit  
or demodulator  
antenna  
LNA  
wideband  
amplifier  
oscillator  
mgu439  
Fig 4. Application as RF amplifier.  
mixer  
from modulation  
or IF circuit  
to power  
amplifier  
wideband  
amplifier  
oscillator  
mgu440  
Fig 5. Application as driver amplifier.  
BGA2716  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
6 of 15  
 
 
BGA2716  
NXP Semiconductors  
MMIC wideband amplifier  
90°  
+1  
1.0  
0.8  
135°  
+0.2  
45°  
+0.5  
+2  
0.6  
0.4  
+5  
100 MHz  
0.5  
0.2  
4 GHz  
0
0.2  
1
2
5
10  
0°  
0
180°  
−5  
−0.2  
−2  
−0.5  
−135°  
−45°  
−1  
1.0  
001aab257  
−90°  
IS = 15.9 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .  
Fig 6. Input reflection coefficient (s11); typical values.  
90°  
+1  
1.0  
0.8  
0.6  
0.4  
0.2  
0
135°  
+0.2  
45°  
+0.5  
+2  
100 MHz  
+5  
4 GHz  
1
0
0.2  
0.5  
2
5
10  
0°  
180°  
−5  
−0.2  
−2  
−0.5  
−135°  
−45°  
−1  
1.0  
001aab258  
−90°  
IS = 15.9 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .  
Fig 7. Output reflection coefficient (s22); typical values.  
BGA2716  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
7 of 15  
BGA2716  
NXP Semiconductors  
MMIC wideband amplifier  
001aab259  
001aab260  
0
2
30  
2
|s  
21  
|
|s  
12  
|
(dB)  
(dB)  
(2)  
(1)  
−20  
20  
(3)  
−40  
−60  
10  
0
0
1000  
2000  
3000  
4000  
0
1000  
2000  
3000  
4000  
f (MHz)  
f (MHz)  
IS = 15.9 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .  
PD = 35 dBm; Zo = 50 .  
IS = 19.5 mA; VS = 5.5 V.  
(1)  
(2) IS = 15.9 mA; VS = 5 V.  
(3) IS = 12.4 mA; VS = 4.5 V.  
Fig 8. Isolation (s122) as a function of frequency;  
Fig 9. Insertion gain (s212) as a function of  
typical values.  
frequency; typical values.  
001aab261  
001aab262  
20  
20  
P
L
P
L
(dBm)  
(dBm)  
(1)  
(2)  
(3)  
10  
10  
(1)  
(2)  
(3)  
0
−10  
−20  
0
−10  
−20  
−40  
−30  
−20  
−10  
0
−40  
−30  
−20  
−10  
0
P
D
(dBm)  
P (dBm)  
D
f = 1 GHz; Zo = 50 .  
f = 2.2 GHz; Zo = 50 .  
(1) VS = 5.5 V.  
(2) VS = 5 V.  
(1) VS = 5.5 V.  
(2) VS = 5 V.  
(3)  
V
S = 4.5 V.  
(3) VS = 4.5 V.  
Fig 10. Load power as a function of drive power at  
1 GHz; typical values.  
Fig 11. Load power as a function of drive power at  
2.2 GHz; typical values.  
BGA2716  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
8 of 15  
BGA2716  
NXP Semiconductors  
MMIC wideband amplifier  
001aab263  
001aab264  
8
5
4
3
2
1
0
K
NF  
(dB)  
7
6
5
4
(1)  
(2)  
(3)  
0
500  
1000  
1500  
2000  
2500  
0
1000  
2000  
3000  
4000  
f (MHz)  
f (MHz)  
Zo = 50 .  
S = 19.5 mA; VS = 5.5 V.  
IS = 15.9 mA; VS = 5 V; Zo = 50 .  
(1)  
I
(2) IS = 15.9 mA; VS = 5 V.  
(3) IS = 12.4 mA; VS = 4.5 V.  
Fig 12. Noise figure as a function of frequency; typical Fig 13. Stability factor as a function of frequency;  
values. typical values.  
BGA2716  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
9 of 15  
BGA2716  
NXP Semiconductors  
MMIC wideband amplifier  
Table 8.  
Scattering parameters  
VS = 5 V; IS = 15.9 mA; PD = 35 dBm; Zo = 50 ; Tamb = 25 C.  
f (MHz) s11  
Magnitude Angle  
s21  
s12  
s22  
Magnitude Angle  
K-factor  
Magnitude Angle  
Magnitude Angle  
(ratio)  
(deg)  
(ratio)  
(deg)  
(ratio)  
(deg)  
(ratio)  
(deg)  
100  
0.182562  
0.123465  
0.107855  
0.114731  
0.130176  
0.144984  
0.160922  
0.179351  
0.20199  
102.7794  
87.55274  
58.58513  
40.14071  
24.28555  
9.657616  
12.69581  
13.13419  
13.47149  
13.57901  
13.67457  
13.91705  
13.48682  
0.029472  
28.74955  
0.39239  
91.48628  
62.37296  
24.6455  
1.3  
1.2  
1.2  
200  
5.272917 0.035438  
31.7377 0.035299  
2.202361 0.267851  
22.54301 0.227252  
43.06353 0.227993  
59.63503 0.234967  
76.09972 0.239818  
88.34045 0.242141  
101.2729 0.243087  
110.3342 0.24499  
121.0192 0.255598  
127.6765 0.269829  
137.8213 0.283613  
138.8717 0.29058  
147.6622 0.281505  
152.1988 0.25135  
163.8718 0.211425  
170.5637 0.165534  
176.5407 0.118726  
400  
600  
53.09631 0.033167  
73.60665 0.033194  
94.01973 0.029047  
3.493572 1.3  
31.11084 1.3  
60.54722 1.4  
91.56898 1.4  
124.5484 1.4  
158.6224 1.5  
800  
1000  
1200  
1400  
1600  
1800  
2000  
2200  
2400  
2600  
2800  
3000  
3200  
3400  
3600  
3800  
4000  
7.518892 14.10949  
23.35989 14.2808  
41.01349 14.3825  
60.71294 14.26935  
81.48254 14.0667  
103.1109 13.83968  
114.55  
0.028188  
135.3117 0.025188  
156.7041 0.022257  
178.3843 0.019611  
0.218268  
0.233965  
0.242904  
0.246576  
0.249069  
0.243665  
0.233266  
0.222055  
0.207486  
0.191654  
0.175783  
0.163768  
167.5983  
136.117  
1.7  
1.8  
1.9  
2.0  
2.2  
2.5  
160.1504  
138.2379  
115.7594  
93.38644  
71.02792  
50.42722  
30.75908  
11.98315  
0.018087  
0.017203  
0.016318  
0.015514  
0.014954  
0.015522  
0.016261  
0.016664  
106.0987  
77.95189  
50.68612  
24.40624  
125.52  
13.46447  
148.8707 12.74638  
172.646  
163.9035  
140.7754  
117.0531  
94.64431  
71.9551  
11.87558  
10.94049  
10.05626  
9.576357  
9.199166  
8.912598  
8.618058  
0.674037 2.7  
23.9944 2.9  
46.28101 3.0  
72.36691 3.2  
109.9804 3.3  
163.7132 3.3  
7.677643 0.016982  
27.73098 0.017094  
48.90874 0.017414  
176.9385  
165.8227  
157.6095  
0.083354  
0.058549  
0.055225  
49.89436  
BGA2716  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
10 of 15  
BGA2716  
NXP Semiconductors  
MMIC wideband amplifier  
9. Package outline  
Plastic surface-mounted package; 6 leads  
SOT363  
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1  
index  
A
A
1
1
2
3
c
e
1
b
L
p
w
M B  
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max  
0.30  
0.20  
1.1  
0.8  
0.25  
0.10  
2.2  
1.8  
1.35  
1.15  
2.2  
2.0  
0.45  
0.15  
0.25  
0.15  
mm  
0.1  
1.3  
0.65  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
04-11-08  
06-03-16  
SOT363  
SC-88  
Fig 14. Package outline; SOT363 (SC-88).  
BGA2716  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
11 of 15  
 
BGA2716  
NXP Semiconductors  
MMIC wideband amplifier  
10. Revision history  
Table 9.  
Revision history  
Document ID  
BGA2716 v.3  
Modifications:  
Release date  
Data sheet status  
Change notice  
Supersedes  
20110908  
Product data sheet  
-
BGA2716 v.2  
• The format of this data sheet has been redesigned to comply with the new identity  
guidelines of NXP Semiconductors.  
• Legal texts have been adapted to the new company name where appropriate.  
• Package outline drawings have been updated to the latest version.  
BGA2716 v.2  
20040924  
Product data sheet  
-
BGA2716_N v.1  
(9397 750 13292)  
BGA2716_N v.1  
20040202  
Preliminary data sheet  
-
-
(9397 750 12827)  
BGA2716  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
12 of 15  
 
BGA2716  
NXP Semiconductors  
MMIC wideband amplifier  
11. Legal information  
11.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of an NXP Semiconductors product can reasonably be expected  
11.2 Definitions  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
11.3 Disclaimers  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
BGA2716  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
13 of 15  
 
 
 
 
BGA2716  
NXP Semiconductors  
MMIC wideband amplifier  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
non-automotive qualified products in automotive equipment or applications.  
11.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
12. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
BGA2716  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
14 of 15  
 
 
BGA2716  
NXP Semiconductors  
MMIC wideband amplifier  
13. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
1.4  
General description . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits. . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data . . . . . . . . . . . . . . . . . . . . 1  
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Thermal characteristics . . . . . . . . . . . . . . . . . . 3  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Application information. . . . . . . . . . . . . . . . . . . 4  
Application examples . . . . . . . . . . . . . . . . . . . . 5  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12  
3
4
5
6
7
8
8.1  
9
10  
11  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
11.1  
11.2  
11.3  
11.4  
12  
13  
Contact information. . . . . . . . . . . . . . . . . . . . . 14  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2011.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 8 September 2011  
Document identifier: BGA2716  
 

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