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BGA2717,115 [NXP]

BGA2717 - MMIC wideband amplifier TSSOP 6-Pin;
BGA2717,115
型号： BGA2717,115
厂家： NXP    NXP
描述：

BGA2717 - MMIC wideband amplifier TSSOP 6-Pin

射频 微波
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BGA2717  
MMIC wideband amplifier  
Rev. 3 — 8 September 2011  
Product data sheet  
1. Product profile  
1.1 General description  
Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal  
matching circuit in a 6-pin SOT363 SMD plastic package.  
CAUTION  
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken  
during transport and handling.  
1.2 Features and benefits  
Internally matched to 50  
Wide frequency range (3.2 GHz at 3 dB bandwidth)  
Flat 24 dB gain (1 dB up to 2.8 GHz)  
2.5 dBm output power at 1 dB compression point  
Good linearity for low current (IP3out = 10 dBm)  
Low second harmonic; 38 dBc at PD = 40 dBm  
Low noise figure; 2.3 dB at 1 GHz  
Unconditionally stable (K 2).  
1.3 Applications  
LNB IF amplifiers  
Cable systems  
ISM  
General purpose.  
1.4 Quick reference data  
Table 1.  
Symbol  
VS  
Quick reference data  
Parameter  
Conditions  
Min  
Typ  
5
Max  
Unit  
V
DC supply voltage  
supply current  
-
-
-
-
-
6
-
IS  
8
mA  
dB  
s212  
NF  
insertion power gain  
noise figure  
f = 1 GHz  
f = 1 GHz  
f = 1 GHz  
24  
2.3  
1
-
-
dB  
PL(sat)  
saturated load power  
-
dBm  
 
 
 
 
 
BGA2717  
NXP Semiconductors  
MMIC wideband amplifier  
2. Pinning information  
Table 2.  
Pinning  
Pin  
1
Description  
VS  
Simplified outline  
Symbol  
6
5
4
1
2, 5  
3
GND2  
RF_OUT  
GND1  
6
3
4
4
2, 5  
1
2
3
6
RF_IN  
sym052  
3. Ordering information  
Table 3.  
Ordering information  
Type number Package  
Name  
Description  
Version  
BGA2717  
-
plastic surface mounted package; 6 leads  
SOT363  
4. Marking  
Table 4.  
Marking  
Type number  
Marking code  
BGA2717  
1B-  
5. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
VS  
DC supply voltage  
RF input AC  
coupled  
-
6
V
IS  
supply current  
-
15  
mA  
mW  
C  
Ptot  
Tstg  
Tj  
total power dissipation  
storage temperature  
junction temperature  
maximum drive power  
Tsp 90 C  
-
200  
+150  
150  
10  
65  
-
-
C  
PD  
dBm  
BGA2717  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
2 of 15  
 
 
 
 
BGA2717  
NXP Semiconductors  
MMIC wideband amplifier  
6. Thermal characteristics  
Table 6.  
Symbol  
Rth(j-sp)  
Thermal characteristics  
Parameter  
thermal resistance from junction Ptot = 200 mW;  
Conditions  
Typ  
Unit  
300  
K/W  
to solder point  
Tsp 90 C  
7. Characteristics  
Table 7.  
Characteristics  
VS = 5 V; IS = 8 mA; Tj = 25 C; measured on demo board; unless otherwise specified.  
Symbol Parameter  
Conditions  
Min  
6
Typ  
8
Max  
10  
20  
25  
27  
27  
26  
24  
-
Unit  
IS  
supply current  
mA  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
GHz  
s212  
insertion power f = 100 MHz  
gain  
18  
23  
24  
24  
22  
20  
15  
8
18.6  
23.9  
25  
f = 1 GHz  
f = 1.8 GHz  
f = 2.2 GHz  
f = 2.6 GHz  
f = 3 GHz  
25.1  
24  
22.1  
19  
s112  
s222  
s122  
NF  
input return  
losses  
f = 1 GHz  
f = 2.2 GHz  
f = 1 GHz  
9.4  
10  
-
output return  
losses  
8
-
f = 2.2 GHz  
f = 1.6 GHz  
f = 2.2 GHz  
f = 1 GHz  
5
6.8  
55  
-
isolation  
54  
38  
-
-
39  
-
noise figure  
2.3  
2.9  
3.2  
2.5  
3.1  
-
f = 2.2 GHz  
at s212 3 dB below flat  
-
B
K
bandwidth  
3
gain at 1 GHz  
stability factor  
f = 1 GHz  
-
13  
-
-
-
-
-
f = 2.2 GHz  
-
1.7  
PL(sat)  
saturated load f = 1 GHz  
0
1.4  
dBm  
dBm  
dBm  
power  
f = 2.2 GHz  
1  
4  
+0.1  
2.6  
PL(1dB)  
load power  
at 1 dB gain compression;  
f = 1 GHz  
at 1 dB gain compression;  
f = 2.2 GHz  
5  
3.1  
-
-
dBm  
dBc  
IM2  
second order  
at PD = 40 dBm;  
36  
38  
intermodulation f0 = 1 GHz  
product  
IP3in  
IP3out  
input, third  
order intercept  
point  
f = 1 GHz  
15  
20  
13.9  
18.8  
-
-
dBm  
dBm  
f = 2.2 GHz  
output, third  
order intercept  
point  
f = 1 GHz  
9
4
10  
-
-
dBm  
dBm  
f = 2.2 GHz  
6.3  
BGA2717  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
3 of 15  
 
 
BGA2717  
NXP Semiconductors  
MMIC wideband amplifier  
8. Application information  
Figure 1 shows a typical application circuit for the BGA2717 MMIC. The device is  
internally matched to 50 , and therefore does not need any external matching. The value  
of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF  
for applications above 100 MHz. However, when the device is operated below 100 MHz,  
the capacitor value should be increased.  
The 22 nF supply decoupling capacitor C1 should be located as close as possible to the  
MMIC.  
The printed-circuit board (PCB) top ground plane, connected to pins 2, 4 and 5 must be as  
close as possible to the MMIC, and ideally directly beneath it. When using via holes, use  
multiple via holes, located as close as possible to the MMIC.  
V
S
C1  
1
V
S
C2  
C3  
6
RF_IN  
RF_OUT 3  
RF input  
RF output  
GND1  
GND2  
2, 5  
4
mgu435  
Fig 1. Typical application circuit.  
Figure 2 shows the PCB layout, used for the standard demonstration board.  
BGA2717  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
4 of 15  
 
 
BGA2717  
NXP Semiconductors  
MMIC wideband amplifier  
30 mm  
PHILIPS  
PH  
30 mm  
IN  
OUT  
V
+
PHILIPS  
PH  
DUT  
C1  
C3  
C2  
IN  
OUT  
V
+
001aab255  
Material = FR4; thickness = 0.6 mm, r = 4.6.  
Fig 2. PCB layout and demonstration board showing components.  
8.1 Grounding and output impedance  
If the grounding is not optimal, the gain becomes less flat and the 50 output matching  
becomes worse. If a better output matching to 50 is required, a 12 resistor (R1) can  
be placed in series with C3 (see Figure 3). This will significantly improve the output  
impedance, at the cost of 1 dB gain and 1 dB output power.  
BGA2717  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
5 of 15  
 
BGA2717  
NXP Semiconductors  
MMIC wideband amplifier  
V
S
C1  
C2  
V
S
C3  
R1  
RF_OUT  
RF_IN  
RF input  
RF output  
GND1  
GND2  
001aab346  
Fig 3. Application circuit for better output impedance into 50 .  
8.2 Application examples  
The MMIC is very suitable as IF amplifier in e.g. LNBs. The excellent wideband  
characteristics make it an ideal building block (see Figure 4). As second amplifier after an  
LNA, the MMIC offers an easy matching, low noise solution (see Figure 5).  
mixer  
to IF circuit  
from  
or demodulator  
RF circuit  
wideband  
amplifier  
oscillator  
mgu438  
Fig 4. Application as IF amplifier.  
mixer  
to IF circuit  
or demodulator  
antenna  
LNA  
wideband  
amplifier  
oscillator  
mgu439  
Fig 5. Application as RF amplifier.  
BGA2717  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
6 of 15  
 
 
 
BGA2717  
NXP Semiconductors  
MMIC wideband amplifier  
90°  
+1  
1.0  
0.8  
135°  
+0.2  
45°  
+0.5  
+2  
0.6  
0.4  
4 GHz  
+5  
0.2  
100 MHz  
0
0.2  
0.5  
2
5
10  
0°  
0
180°  
−5  
−0.2  
−2  
−0.5  
−135°  
−45°  
−1  
1.0  
001aab265  
−90°  
IS = 8 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .  
Fig 6. Input reflection coefficient (s11); typical values.  
90°  
+1  
1.0  
0.8  
0.6  
0.4  
0.2  
0
135°  
+0.2  
45°  
+0.5  
+2  
100 MHz  
+5  
0
0.2  
0.5  
1
2
5
10  
0°  
180°  
4 GHz  
−5  
−0.2  
−2  
−0.5  
−135°  
−45°  
−1  
1.0  
001aab266  
−90°  
IS = 8 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .  
Fig 7. Output reflection coefficient (s22); typical values.  
BGA2717  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
7 of 15  
BGA2717  
NXP Semiconductors  
MMIC wideband amplifier  
001aab267  
001aab268  
0
2
30  
2
|s  
21  
|
|s  
12  
|
(dB)  
(dB)  
(2)  
(1)  
−20  
20  
(3)  
−40  
−60  
10  
0
0
1000  
2000  
3000  
4000  
0
1000  
2000  
3000  
4000  
f (MHz)  
f (MHz)  
IS = 8 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .  
PD = 35 dBm; Zo = 50 .  
IS = 8.9 mA; VS = 5.5 V.  
(1)  
(2) IS = 8 mA; VS = 5 V.  
(3) IS = 7.2 mA; VS = 4.5 V.  
Fig 8. Isolation (s122) as a function of frequency;  
Fig 9. Insertion gain (s212) as a function of  
typical values.  
frequency; typical values.  
001aab269  
001aab270  
10  
10  
P
L
P
L
(dBm)  
(dBm)  
(1)  
(3)  
(1)  
(3)  
(2)  
(2)  
0
0
−10  
−20  
−30  
−10  
−20  
−30  
−50  
−40  
−30  
−20  
−10  
(dBm)  
−50  
−40  
−30  
−20  
−10  
P (dBm)  
D
P
D
f = 1 GHz; Zo = 50 .  
f = 2.2 GHz; Zo = 50 .  
(1) VS = 5.5 V.  
(2) VS = 5 V.  
(1) VS = 5.5 V.  
(2) VS = 5 V.  
(3)  
V
S = 4.5 V.  
(3) VS = 4.5 V.  
Fig 10. Load power as a function of drive power at  
1 GHz; typical values.  
Fig 11. Load power as a function of drive power at  
2.2 GHz; typical values.  
BGA2717  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
8 of 15  
BGA2717  
NXP Semiconductors  
MMIC wideband amplifier  
001aab271  
001aab272  
4
25  
K
NF  
(dB)  
20  
15  
10  
5
3
(3)  
(2)  
(1)  
2
1
0
0
0
500  
1000  
1500  
2000  
2500  
0
1000  
2000  
3000  
4000  
f (MHz)  
f (MHz)  
Zo = 50 .  
IS = 8 mA; VS = 5 V; Zo = 50 .  
(1) IS = 8.9 mA; VS = 5.5 V.  
(2) IS = 8 mA; VS = 5 V.  
(3)  
IS = 7.2 mA; VS = 4.5 V.  
Fig 12. Noise figure as a function of frequency; typical Fig 13. Stability factor as a function of frequency;  
values. typical values.  
BGA2717  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
9 of 15  
BGA2717  
NXP Semiconductors  
MMIC wideband amplifier  
Table 8.  
Scattering parameters  
VS = 5 V; IS = 8 mA; PD = 35 dBm; Zo = 50 ; Tamb = 25 C.  
f (MHz) s11  
Magnitude Angle  
s21  
s12  
s22  
Magnitude Angle  
K-factor  
Magnitude Angle  
Magnitude Angle  
(ratio)  
(deg)  
(ratio)  
(deg)  
(ratio)  
(deg)  
(ratio)  
(deg)  
100  
0.074378  
0.076338  
0.123748  
0.145511  
0.134956  
0.114063  
0.101959  
0.125656  
0.16736  
13.78537  
13.70153  
8.465495  
9.420359  
22.90763  
7.358555  
0.003859  
0.003112  
66.39435 0.450496  
122.2687 0.354179  
79.88713  
40.70919  
0.3804  
12.2  
14.9  
19.1  
200  
400  
1.402521 11.56481  
31.32646 13.31271  
67.10955 14.56872  
111.2495 15.61733  
168.8557 16.45625  
14.92222 0.002011  
37.77988 0.001659  
61.08808 0.00169  
84.67015 0.002146  
107.9167 0.002901  
40.5142  
156.393  
0.312568  
0.3038  
600  
25.36808 20.2  
46.7704 18.1  
800  
164.4454 0.30873  
174.8593 0.319208  
1000  
1200  
1400  
1600  
1800  
2000  
2200  
2400  
2600  
2800  
3000  
3200  
3400  
3600  
3800  
4000  
68.71787 13.2  
91.58398 9.2  
116.5485 6.2  
140.7537 4.3  
167.9683 2.9  
139.8136  
123.527  
0.335623  
0.353582  
0.366893  
0.404064  
0.42512  
129.9717  
85.791  
17.05668  
17.49643  
17.90167  
17.86635  
131.63  
0.004053  
155.2301 0.005545  
179.6656 0.007498  
107.0763  
105.9423  
90.10168  
75.19814  
53.10814  
21.70136  
4.656224  
0.234721  
0.285944  
0.339673  
0.393746  
0.384353  
0.376183  
0.358586  
0.345562  
0.33312  
51.43065  
16.46701  
155.5993  
130.5601  
103.3297  
77.84766  
52.77053  
30.51455  
10.04765  
0.009779  
0.011736  
0.013927  
0.015937  
0.016795  
0.01786  
163.3173  
135.039  
2.2  
1.7  
1.5  
1.5  
1.7  
1.9  
2.0  
11.74152 17.96498  
47.58817 17.32414  
81.55786 15.87927  
0.459194  
0.459988  
0.428158  
0.393701  
103.1106  
75.83004  
50.16202  
26.66791  
6.504047  
112.353  
14.44081  
142.5801 12.67831  
171.7261 11.27597  
19.19006 0.3497  
32.22469 0.30875  
49.16136 0.279672  
59.65434 0.248479  
78.78085 0.21362  
94.87525 0.168643  
0.019217  
160.2254  
133.8644  
108.48  
10.43483  
9.743293  
9.072149  
8.513716  
9.842264 0.020551  
30.36495 0.020908  
12.63121 2.1  
33.64811 2.2  
56.42401 2.3  
80.24833 2.4  
0.331268  
0.337502  
0.344645  
50.7401  
0.022136  
84.75183  
71.86536 0.022792  
BGA2717  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
10 of 15  
BGA2717  
NXP Semiconductors  
MMIC wideband amplifier  
9. Package outline  
Plastic surface-mounted package; 6 leads  
SOT363  
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1  
index  
A
A
1
1
2
3
c
e
1
b
L
p
w
M B  
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max  
0.30  
0.20  
1.1  
0.8  
0.25  
0.10  
2.2  
1.8  
1.35  
1.15  
2.2  
2.0  
0.45  
0.15  
0.25  
0.15  
mm  
0.1  
1.3  
0.65  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
04-11-08  
06-03-16  
SOT363  
SC-88  
Fig 14. Package outline; SOT363 (SC-88).  
BGA2717  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
11 of 15  
 
BGA2717  
NXP Semiconductors  
MMIC wideband amplifier  
10. Revision history  
Table 9.  
Revision history  
Document ID  
BGA2717 v.3  
Modifications:  
Release date  
Data sheet status  
Change notice  
Supersedes  
20110908  
Product data sheet  
-
BGA2717 v.2  
• The format of this data sheet has been redesigned to comply with the new identity  
guidelines of NXP Semiconductors.  
• Legal texts have been adapted to the new company name where appropriate.  
• Package outline drawings have been updated to the latest version.  
BGA2717 v.2  
20040924  
Product data sheet  
-
BGA2717_N v.1  
(9397 750 13293)  
BGA2717_N v.1  
20040202  
Preliminary data sheet  
-
-
(9397 750 12828)  
BGA2717  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
12 of 15  
 
BGA2717  
NXP Semiconductors  
MMIC wideband amplifier  
11. Legal information  
11.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of an NXP Semiconductors product can reasonably be expected  
11.2 Definitions  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
11.3 Disclaimers  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
BGA2717  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
13 of 15  
 
 
 
 
BGA2717  
NXP Semiconductors  
MMIC wideband amplifier  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
non-automotive qualified products in automotive equipment or applications.  
11.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
12. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
BGA2717  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 8 September 2011  
14 of 15  
 
 
BGA2717  
NXP Semiconductors  
MMIC wideband amplifier  
13. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
1.4  
General description . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits. . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data . . . . . . . . . . . . . . . . . . . . 1  
2
3
4
5
6
7
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Thermal characteristics . . . . . . . . . . . . . . . . . . 3  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
8
8.1  
8.2  
Application information. . . . . . . . . . . . . . . . . . . 4  
Grounding and output impedance . . . . . . . . . . 5  
Application examples . . . . . . . . . . . . . . . . . . . . 6  
9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12  
10  
11  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
11.1  
11.2  
11.3  
11.4  
12  
13  
Contact information. . . . . . . . . . . . . . . . . . . . . 14  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2011.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 8 September 2011  
Document identifier: BGA2717  
 

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