BGA3023_技术文档

BGA3023

ꢀ

2

6

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1.2 GHz 20 dB gain CATV amplifier

Rev. 2 — 25 February 2015

Product data sheet

1. Product profile

1.1 General description

The BGA3023 MMIC is a dual wideband amplifier with internal biasing. It is a Medium

Power Amplifier (MPA), specifically designed as an output stage for high linearity CATV

optical mini- and midi-nodes, operating over a frequency range of 40 MHz to 1200 MHz.

The MPA is housed in a lead free 8-pin HSO8 package.

1.2 Features and benefits

 Internally biased

 High gain output 1dB compression

point of 30 dBm

 Frequency range of 40 MHz to 1200 MHz  75  input and output impedance

 High linearity with an IP3_Oof 46.5 dBm and  I_CC(tot)can be controlled between

an IP2_Oof 85 dBm

175 mA and 350 mA

 Operating from 5 V to 8 V supply

 Integrated feedback

1.3 Applications

 CATV infrastructure network medium power output stage in optical nodes (FTTx),

distribution amplifiers, trunk amplifiers and line extenders

1.4 Quick reference data

Table 1.

Quick reference data

T_amb= 25 C; typical values at V_CC= 8 V; Z_S= Z_L= 75 ; input and output connected with 1:1 balun, V_I(CTRL)= 3.3 V or open

(maximum total supply current); 40 MHz  f₁ 1200 MHz unless otherwise specified.

Symbol

V_CC

Parameter

Conditions

Min Typ

Max Unit

supply voltage

RF input AC coupled

7.6

8.0

350

-

8.4

V

I_CC(tot)

T_amb

total supply current

-

mA

C

ambient temperature

40

+85

P_L(1dB)

IP3_O

output power at 1 dB gain compression

output third-order intercept point

output second-order intercept point

-

30

-

dBm

[1]

[2]

46.5

85

IP2_O

[1] Fundamental frequency f₁= 500 MHz, fundamental frequency f₂= 501 MHz. The intermodulation product (IM3) is measured at

² f₁ f₂= 499 MHz. The output power of the fundamental frequencies is 10 dBm per frequency.

[2] Fundamental frequency f₁= 240 MHz, fundamental frequency f₂= 260 MHz. The intermodulation product (IM2) is measured at

f₁+ f₂= 500 MHz. The output power of the fundamental frequencies is 10 dBm per frequency.

BGA3023

NXP Semiconductors

1.2 GHz 20 dB gain CATV amplifier

2. Pinning information

2.1 Pinning

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Fig 1. Pin configuration for SOT786-2

2.2 Pin description

Table 2.

Pin description

Symbol

AMPA_IN

TMP_SENS

CTRL

1

Description

input amplifier A

temperature sense

total supply current control

input amplifier B

output amplifier B ^[1]

supply ^[1]

2

3

AMPB_IN

AMPB_OUT

V_CC

4

5

6

V_CC

7

supply ^[1]

AMPA_OUT

GND

8

output amplifier A ^[1]

exposed die pad ^[2]

ground

[1] See Figure 2 for correct connection.

[2] The center metal base of the HSO8 also functions as heatsink for the power amplifier.

3. Ordering information

Table 3.

Ordering information

Type number

Package

Name

Description

Version

BGA3023

HSO8

plastic thermal enhanced small outline package;

8 leads; body width 3.9 mm; exposed die pad

SOT786-2

BGA3023

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Product data sheet

Rev. 2 — 25 February 2015

2 of 14

BGA3023

NXP Semiconductors

1.2 GHz 20 dB gain CATV amplifier

4. Limiting values

Table 4.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_CC

Parameter

Conditions

Min Max Unit

supply voltage

RF input AC coupled

0.6 +12

0.6 +8

V

V_I(CTRL)

V_{I(TMP_SENS)}

P_i

input voltage on pin CTRL

input voltage on pin TMP_SENS

input power

V

[1]

single tone; on balun

-

20

dBm

T_stg

storage temperature

junction temperature

ambient temperature

electrostatic discharge voltage

65 +150 C

T_j

-

150

C

kV

T_amb

40 +85

V_ESD

Human Body Model (HBM);

According JEDEC standard 22-A114E

2

-

Charged Device Model (CDM);

500

V

According JEDEC standard 22-C101B

[1] P_i= 17 dBm on AMPA_IN (pin 1) and AMPB_IN (pin 4).

5. Thermal characteristics

Table 5.

Symbol

R_th(j-c)

Thermal characteristics

Parameter

thermal resistance from junction to case

Conditions

Typ Unit

[1][2]

15

K/W

[1] Case is ground solder pad.

[2] Thermal resistance measured using infrared measurement technique, device mounted on application board

and placed in still air.

BGA3023

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Product data sheet

Rev. 2 — 25 February 2015

3 of 14

BGA3023

NXP Semiconductors

1.2 GHz 20 dB gain CATV amplifier

6. Characteristics

Table 6.

Characteristics at V_CC= 8 V; I_CC= 350 mA

T_amb= 25 C; typical values at V_CC= 8 V; Z_S= Z_L= 75 ; input and output connected with

1:1 balun, V_I(CTRL)= 3.3 V or open (maximum total supply current); 40 MHz  f₁ 1200 MHz unless

otherwise specified.

Symbol Parameter

Conditions

Min Typ Max Unit

V_CC

I_CC(tot)

s₂₁²

SL_sl

FL

supply voltage

RF input AC coupled

7.6 8.0 8.4

V

total supply current

insertion power gain

slope straight line

-

350

20

-

mA

dB

dBm

f = 40 MHz

2.2 -

[1]

flatness of frequency response

0.4

30

-

P_L(1dB)output power at

1 dB gain compression

[2]

[3]

IP3_O

output third-order

intercept point

-

46.5 -

dBm

IP2_O

output second-order

intercept point

85

-

[4]

CTB

CSO

composite triple beat

V_O= 43 dBmV

-

64

75

-

dBc

composite second-order

distortion

NF

noise figure

f = 500 MHz

-

5.0

-

dB

RL_in

input return loss

f = 40 MHz to 80 MHz

f = 80 MHz to 160 MHz

f = 160 MHz to 320 MHz

f = 320 MHz to 640 MHz

f = 640 MHz to 1000 MHz

f = 1000 MHz to 1200 MHz

f = 40 MHz to 80 MHz

f = 80 MHz to 160 MHz

f = 160 MHz to 320 MHz

f = 320 MHz to 640 MHz

f = 640 MHz to 1000 MHz

f = 1000 MHz to 1200 MHz

18

19

15

17

19

17

14

RL_out

output return loss

[1] Flatness is defined as peak deviation to straight line.

[2] Fundamental frequency f₁= 500 MHz, fundamental frequency f₂= 501 MHz. The intermodulation product

^{(IM3) is measured at 2} f₁ f₂= 499 MHz. The output power of the fundamental frequencies is 10 dBm

per frequency.

[3] Fundamental frequency f₁= 240 MHz, fundamental frequency f₂= 260 MHz. The intermodulation product

(IM2) is measured at f₁+ f₂= 500 MHz. The output power of the fundamental frequencies is 10 dBm per

frequency.

[4] Measured with 79 NTSC channels.

BGA3023

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Product data sheet

Rev. 2 — 25 February 2015

4 of 14

BGA3023

NXP Semiconductors

1.2 GHz 20 dB gain CATV amplifier

Table 7.

Characteristics at V_CC= 8 V; I_CC= 175 mA

T_amb= 25 C; typical values at V_CC= 8 V; Z_S= Z_L= 75 ; input and output connected with

1:1 balun, V_I(CTRL)= 0 V (minimum total supply current); 40 MHz  f₁ 1200 MHz unless otherwise

specified.

Symbol Parameter

Conditions

Min Typ

Max Unit

V_CC

I_CC(tot)

s₂₁²

SL_sl

FL

supply voltage

RF input AC coupled

7.6 8.0

8.4

V

total supply current

insertion power gain

slope straight line

-

175

19.4

2.7

0.5

-

mA

dB

f = 40 MHz

[1]

flatness of

frequency response

P_L(1dB)output power at

1 dB gain compression

-

25

38

67

-

dBm

[2]

[3]

IP3_O

output third-order

intercept point

IP2_O

output second-order

intercept point

[4]

CTB

CSO

composite triple beat

V_O= 35 dBmV

-

65

75

-

dBc

composite second-order

distortion

NF

noise figure

f = 500 MHz

-

3.7

-

dB

RL_in

input return loss

f = 40 MHz to 80 MHz

f = 80 MHz to 160 MHz

f = 160 MHz to 320 MHz

f = 320 MHz to 640 MHz

f = 640 MHz to 1000 MHz

f = 1000 MHz to 1200 MHz

f = 40 MHz to 80 MHz

f = 80 MHz to 160 MHz

f = 160 MHz to 320 MHz

f = 320 MHz to 640 MHz

f = 640 MHz to 1000 MHz

f = 1000 MHz to 1200 MHz

20

18

17

13

20

19

17

13

RL_out

output return loss

[1] Flatness is defined as peak deviation to straight line.

[2] Fundamental frequency f₁= 500 MHz, fundamental frequency f₂= 501 MHz. The intermodulation product

^{(IM3) is measured at 2} f₁ f₂= 499 MHz. The output power of the fundamental frequencies is 10 dBm

per frequency.

[3] Fundamental frequency f₁= 240 MHz, fundamental frequency f₂= 260 MHz. The intermodulation product

(IM2) is measured at f₁+ f₂= 500 MHz. The output power of the fundamental frequencies is 10 dBm per

frequency.

[4] Measured with 79 NTSC channels.

BGA3023

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Product data sheet

Rev. 2 — 25 February 2015

5 of 14

BGA3023

NXP Semiconductors

1.2 GHz 20 dB gain CATV amplifier

Table 8.

Characteristics at V_CC= 5 V; I_CC= 165 mA

T_amb= 25 C; typical values at V_CC= 5 V; Z_S= Z_L= 75 ; input and output connected with

1:1 balun, V_I(CTRL)= 0 V (minimum total supply current); 40 MHz  f₁ 1200 MHz unless otherwise

specified.

Symbol Parameter

Conditions

Min Typ

Max Unit

V_CC

I_CC(tot)

s₂₁²

SL_sl

FL

supply voltage

RF input AC coupled

4.75 5.00 5.25 V

total supply current

insertion power gain

slope straight line

-

165

19.5

2.6

0.5

-

mA

dB

f = 40 MHz

[1]

flatness of

frequency response

P_L(1dB)output power at

1 dB gain compression

-

23

38

68

-

dBm

[2]

[3]

IP3_O

output third-order

intercept point

IP2_O

output second-order

intercept point

[4]

CTB

CSO

composite triple beat

V_O= 35 dBmV

-

65

75

-

dBc

composite second-order

distortion

NF

noise figure

f = 500 MHz

-

3.7

-

dB

RL_in

input return loss

f = 40 MHz to 80 MHz

f = 80 MHz to 160 MHz

f = 160 MHz to 320 MHz

f = 320 MHz to 640 MHz

f = 640 MHz to 1000 MHz

f = 1000 MHz to 1200 MHz

f = 40 MHz to 80 MHz

f = 80 MHz to 160 MHz

f = 160 MHz to 320 MHz

f = 320 MHz to 640 MHz

f = 640 MHz to 1000 MHz

f = 1000 MHz to 1200 MHz

20

19

18

13

20

19

17

13

RL_out

output return loss

[1] Flatness is defined as peak deviation to straight line.

[2] Fundamental frequency f₁= 500 MHz, fundamental frequency f₂= 501 MHz. The intermodulation product

^{(IM3) is measured at 2} f₁ f₂= 499 MHz. The output power of the fundamental frequencies is 10 dBm

per frequency.

[3] Fundamental frequency f₁= 240 MHz, fundamental frequency f₂= 260 MHz. The intermodulation product

(IM2) is measured at f₁+ f₂= 500 MHz. The output power of the fundamental frequencies is 10 dBm per

frequency.

[4] Measured with 79 NTSC channels.

BGA3023

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 25 February 2015

6 of 14

BGA3023

NXP Semiconductors

1.2 GHz 20 dB gain CATV amplifier

7. Application information

The BGA3023 can be used in other applications. Please contact your local sales

representative for more information. Application notes are available on the NXP website.

7.1 Application board

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See Table 9 for list of components.

Fig 2. Circuit MPA only evaluation board

BGA3023

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Product data sheet

Rev. 2 — 25 February 2015

7 of 14

BGA3023

NXP Semiconductors

1.2 GHz 20 dB gain CATV amplifier

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See Table 9 for list of components.

Fig 3. Printed-Circuit Board (PCB) layout MPA only evaluation board

Table 9.

List of components

See Figure 2 for schematics and Figure 3 for Printed-Circuit Board (PCB).

Component

Description

Value

Remarks

C1, C3, C4, C5, C9,

C11, C12, C13

capacitor

10 nF

Murata GRM155R71E103KA01D

C2

capacitor

0.47 pF

Phycomp 2238 869 14477

Murata GRM155R61A104KA01D

Murata GRM1555C1H1R0CA01D

Bomar 861V509ER6

C10

capacitor

100 nF

C6, C7, C14, C15

capacitor

1 pF

J1, J2

J3

F-connector

header 6-pin

SMD inductor

choke

75 

-

Molex 22-29-2061

L1

1.0 nH

Murata LQG15HS1N0S02D

Murata BLM15HD182SN1D

Yageo RC0402FR-0715RL

Murata RC0402JR-070RL

MACOM MABA-007159-000000

MACOM MABA-010245-CT1160

NXP

L2, L3

R3

-

chip resistor

balun transformer

BGA3023

15 

R4

0 

T1

-

T2

U1

BGA3023

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Product data sheet

Rev. 2 — 25 February 2015

8 of 14

BGA3023

NXP Semiconductors

1.2 GHz 20 dB gain CATV amplifier

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Fig 4. Recommended Printed-Circuit Board (PCB) footprint

BGA3023

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Product data sheet

Rev. 2 — 25 February 2015

9 of 14

BGA3023

NXP Semiconductors

1.2 GHz 20 dB gain CATV amplifier

8. Package outline

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Fig 5. Package outline SOT786-2 (HSO8)

BGA3023

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 25 February 2015

10 of 14

BGA3023

NXP Semiconductors

1.2 GHz 20 dB gain CATV amplifier

9. Abbreviations

Table 10. Abbreviations

Acronym

CATV

FTTx

Description

Community Antenna TeleVision

Fiber To The “x”

MMIC

MPA

Monolithic Microwave Integrated Circuit

Medium Power Amplifier

Surface Mounted Device

SMD

10. Revision history

Table 11. Revision history

Document ID

BGA3023 v.2

BGA3023 v.1

Release date

Data sheet status

Change notice

Supersedes

BGA3023 v.1

-

20150225

20141128

Product data sheet

-

Preliminary data sheet

BGA3023

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Product data sheet

Rev. 2 — 25 February 2015

11 of 14

BGA3023

NXP Semiconductors

1.2 GHz 20 dB gain CATV amplifier

11. Legal information

11.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use — NXP Semiconductors products are not designed,

11.2 Definitions

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

11.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

BGA3023

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 25 February 2015

12 of 14

BGA3023

NXP Semiconductors

1.2 GHz 20 dB gain CATV amplifier

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

non-automotive qualified products in automotive equipment or applications.

11.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

12. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

BGA3023

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 25 February 2015

13 of 14

BGA3023

NXP Semiconductors

1.2 GHz 20 dB gain CATV amplifier

13. Contents

1

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

1.4

General description . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits. . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2

2.1

2.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2

3

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Thermal characteristics . . . . . . . . . . . . . . . . . . 3

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Application information. . . . . . . . . . . . . . . . . . . 7

Application board . . . . . . . . . . . . . . . . . . . . . . . 7

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 11

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11

4

5

6

7

7.1

8

9

10

11

Legal information. . . . . . . . . . . . . . . . . . . . . . . 12

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

11.1

11.2

11.3

11.4

12

13

Contact information. . . . . . . . . . . . . . . . . . . . . 13

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 February 2015

Document identifier: BGA3023


型号：	BGA3023
厂家：	NXP
描述：	RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER 放大器射频微波功率放大器
文件：	总14页 (文件大小：214K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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