BGO827 [NXP]

870 MHz optical receivers; 870 MHz的光学接收器
BGO827
型号: BGO827
厂家: NXP    NXP
描述:

870 MHz optical receivers
870 MHz的光学接收器

文件: 总10页 (文件大小:93K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
book, halfpage  
MD46  
BGO827; BGO827/FC0;  
BGO827/SC0  
870 MHz optical receivers  
Product specification  
2004 Apr 07  
Supersedes data of 2002 Dec 10  
Philips Semiconductors  
Product specification  
BGO827; BGO827/FC0;  
BGO827/SC0  
870 MHz optical receivers  
FEATURES  
DESCRIPTION  
PINNING  
Excellent linearity  
Low noise  
High dynamic range optical receiver  
amplifier modules in a standard  
SOT115 package where the  
non-jacketed fibre has either no  
connector or has an FC/APC or  
SC/APC connector.  
PIN  
DESCRIPTION  
monitor current  
1
2
3
4
5
7
8
9
Excellent flatness  
Standard CATV outline  
Rugged construction  
common  
common  
+VB of the photo diode  
+VB of the amplifier  
common  
Gold metallization ensures  
excellent reliability  
The amplifier supply voltage pin and  
the photo diode bias voltage pin both  
connect to 24 V (DC).  
High optical input power range.  
common  
The modules have a monomode  
optical input suitable for  
output  
APPLICATIONS  
1290 to 1600 nm wavelengths, a  
terminal to monitor the photo diode  
current and an electrical output  
having a characteristic impedance  
of 75 .  
CATV optical node systems  
operating in the 40 to 870 MHz  
frequency range.  
fpage  
2
4
8
4
2
8
2
4
8
1
3
5
7
9
1
3
5
7
9
1
3
5
7
9
Side view  
Side view  
MBK044  
Side view  
MBL041  
MBL040  
Fig.2 Simplified outline  
SOT115X  
Fig.3 Simplified outline  
SOT115Y  
Fig.1 Simplified outline  
SOT115T (BGO827).  
(BGO827/FC0).  
(BGO827/SC0).  
QUICK REFERENCE DATA  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
870  
UNIT  
MHz  
f
frequency range  
40  
11  
45  
s22  
output return losses  
f = 40 to 870 MHz  
dB  
optical input return losses  
second order distortion  
equivalent noise input  
total current consumption (DC)  
dB  
d2  
F
f = 854.5 MHz  
f = 40 to 870 MHz  
VB = 24 V  
57  
8.5  
205  
dB  
pA/Hz  
mA  
Itot  
175  
CAUTION  
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport  
and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.  
2004 Apr 07  
2
Philips Semiconductors  
Product specification  
BGO827; BGO827/FC0;  
BGO827/SC0  
870 MHz optical receivers  
ORDERING INFORMATION  
PACKAGE  
TYPE NUMBER  
NAME  
DESCRIPTION  
VERSION  
BGO827  
rectangular single-ended package; aluminium flange;  
2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting  
holes; optical input; 8 gold-plated in-line leads  
SOT115T  
SOT115X  
SOT115Y  
BGO827/FC0  
BGO827/SC0  
rectangular single-ended package; aluminium flange;  
2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting  
holes; optical input with connector; 8 gold-plated in-line leads  
rectangular single-ended package; aluminium flange;  
2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting  
holes; optical input with connector; 8 gold-plated in-line leads  
HANDLING  
Fibreglass optical coupling: maximum tensile strength = 5 N; minimum bending radius = 35 mm.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
SYMBOL  
PARAMETER  
frequency range  
CONDITIONS  
MIN.  
40  
MAX.  
870  
UNIT  
MHz  
°C  
f
Tstg  
Tmb  
Pin  
storage temperature  
40  
20  
+85  
+85  
5
operating mounting base temperature  
optical input power  
°C  
continuous  
mW  
V
ESD  
ESD sensitivity  
human body model;  
500  
R = 1.5 k; C = 100 pF  
CHARACTERISTICS  
Bandwidth 40 to 870 MHz; VB = 24 V; Tmb = 30 °C; ZL = 75 .  
SYMBOL  
PARAMETER  
responsivity  
CONDITIONS  
λ = 1300 nm  
MIN.  
TYP.  
MAX.  
UNIT  
S
BGO827  
800  
V/W  
BGO827/FC0, BGO827/SC0  
responsivity difference  
750  
V/W  
V/W  
S  
resp at Tmb = 85 °C resp at  
Tmb = 30 °C; f = 870 MHz  
50  
FL  
flatness straight line (peak to  
valley)  
f = 40 to 870 MHz  
1
dB  
SL  
slope straight line  
slope difference  
f = 40 to 870 MHz  
0
2
dB  
dB  
SL  
slope at Tmb = 85 °C slope at  
Tmb = 30 °C  
0.35  
s22  
output return losses  
f = 40 to 870 MHz  
11  
45  
dB  
dB  
optical input return losses  
2004 Apr 07  
3
Philips Semiconductors  
Product specification  
BGO827; BGO827/FC0;  
BGO827/SC0  
870 MHz optical receivers  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
68  
UNIT  
dB  
d2  
second order distortion  
fm = 446.5 MHz; notes 1 and 3  
fm = 746.5 MHz; notes 1 and 4  
fm = 854.5 MHz; notes 1 and 5  
63  
57  
dB  
dB  
dB  
d2  
second order distortion  
difference  
d2 at Tmb = 85 °C d2  
at Tmb = 30 °C  
2.5  
d2 at Tmb = 20 °C d2  
at Tmb = 30 °C  
1.5  
dB  
d3  
third order distortion  
fm = 853.25 MHz; notes 2 and 6  
73  
dB  
dB  
d3  
third order distortion difference d3 at Tmb = 85 °C d3  
at Tmb = 30 °C  
1
d3 at Tmb = 20 °C d3  
at Tmb = 30 °C  
1  
dB  
F
equivalent noise input  
spectral sensitivity  
f = 40 to 450 MHz  
f = 450 to 750 MHz  
f = 750 to 870 MHz  
λ = 1310 ±20 nm  
λ = 1550 ±20 nm  
7
pA/Hz  
pA/Hz  
pA/Hz  
A/W  
8
8.5  
sλ  
0.85  
0.9  
A/W  
λ
optical wavelength  
1290  
1600  
nm  
L
length of optical fibre  
fibre; SM type; 9/125 µm  
BGO827  
1
m
BGO827/FC0, BGO827/SC0  
total current consumption (DC)  
diode bias current at pin 4 (DC)  
746  
175  
861  
205  
25  
mm  
mA  
mA  
Itot  
Ibias  
Notes  
1. Two laser test; each laser with a modulation index of 40%; Popt = 1 mW (total).  
2. Three laser test; each laser with a modulation index of 60%; Popt = 1 mW (total).  
3. fm = 446.5 MHz; fp = 97.25 MHz; fq = 349.25 MHz.  
4. fm = 746.5 MHz; fp = 133.25 MHz; fq = 613.25 MHz.  
5. fm = 854.5 MHz; fp = 133.25 MHz; fq = 721.25 MHz.  
6. fm = 853.25 MHz; fp = 133.25 MHz; fq = 265.25 MHz; fr = 721.25 MHz.  
2004 Apr 07  
4
Philips Semiconductors  
Product specification  
BGO827; BGO827/FC0;  
BGO827/SC0  
870 MHz optical receivers  
handbook, halfpage  
photo  
current  
10 kΩ  
Pin 1  
1 kΩ  
MLB151  
Fig.4 Monitor current pin.  
2004 Apr 07  
5
Philips Semiconductors  
Product specification  
BGO827; BGO827/FC0;  
BGO827/SC0  
870 MHz optical receivers  
PACKAGE OUTLINES  
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;  
SOT115T  
2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input; 8 gold-plated in-line leads  
N
D
N
E
1
S
N
Z
p
2
2
M
M
M
1
2
A
2
1
2
3
4
5
7
8
9
A
S
1
L
F
S
W
e
b
M
w
c
e
1
d
q
y
M
B
2
U
Q
2
B
q
x
M
B
1
y
M
B
p
U
q
1
Z
max.  
W
w
x
y
S
S
U
U
2
1
2
1
0
5
10 mm  
16.7 4.95 44.75 8.2 6-32  
16.1 4.55 44.25 7.8 UNC  
scale  
0.25 0.7 0.1 12  
optical input  
DIMENSIONS (mm are the original dimensions)  
A
A
max.  
D
d
E
L
min.  
Q
max.  
N
min.  
2
UNIT  
e
e
p
q
b
c
F
M
M
M
N
N
q
q
2
S
1
1
2
1
2
1
max. max. max.  
max.  
0.51  
0.38  
10.7  
0.0  
5
0
4.15  
3.85  
mm 20.8 9.1  
0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8  
1000  
2.4 38.1 25.4 10.2 4.2  
2.5 1.6 0.9  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
JEITA  
01-08-10  
04-02-04  
SOT115T  
2004 Apr 07  
6
Philips Semiconductors  
Product specification  
BGO827; BGO827/FC0;  
BGO827/SC0  
870 MHz optical receivers  
Rectangular single-ended package; aluminium flange;  
2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes;  
optical input with connector; 8 gold-plated in-line leads  
SOT115X  
N
E
D
1
S
Z
p
N
2
2
M
M
M
1
2
A
2
1
2
3
4
5
7
8
9
A
S
1
L
F
S
c
W
e
b
M
w
d
e
1
U
Q
2
B
q
y
M
B
2
q
x
M
B
y
M
B
1
p
N
R
U
q
1
0
25 mm  
Scale  
connector  
Z
max.  
0
5
10 mm  
S
S
1
S
2
W
w
x
y
U
U
2
1
scale  
16.7 4.95 44.75 8.2  
16.1 4.55 44.25 7.8  
6-32  
UNC  
4.2  
0.25 0.7 0.1 12  
DIMENSIONS (mm are the original dimensions)  
A
A
max.  
D
d
E
L
min.  
Q
max.  
R
min.  
2
UNIT  
e
e
1
p
q
b
c
F
M
M
M
2
q
q
2
N
N
2
N
1
1
1
max. max. max.  
max.  
0.51  
0.38  
861 10.7  
746 0.0  
5
0
4.15  
3.85  
mm 20.8 9.1  
0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8 2.5 1.6 0.9  
2.4 38.1 25.4 10.2 35  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
JEITA  
01-08-10  
04-02-04  
SOT115X  
2004 Apr 07  
7
Philips Semiconductors  
Product specification  
BGO827; BGO827/FC0;  
BGO827/SC0  
870 MHz optical receivers  
Rectangular single-ended package; aluminium flange;  
2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes;  
optical input with connector; 8 gold-plated in-line leads  
SOT115Y  
N
E
D
1
S
Z
p
N
2
2
M
M
M
1
2
A
2
1
2
3
4
5
7
8
9
A
S
1
L
F
S
c
W
e
b
M
w
d
e
1
U
Q
2
B
q
y
M
B
2
q
x
M
B
y
M
B
1
p
N
R
U
q
1
0
25 mm  
Scale  
connector  
Z
max.  
0
5
10 mm  
S
S
1
S
2
W
w
x
y
U
U
2
1
scale  
16.7 4.95 44.75 8.2 6-32  
16.1 4.55 44.25 7.8 UNC  
4.2  
0.25 0.7 0.1 12  
DIMENSIONS (mm are the original dimensions)  
A
A
max.  
D
d
E
L
min.  
Q
p
R
min.  
2
UNIT  
e
e
q
b
c
F
q
q
2
M
M
M
N
N
N
2
1
1
1
2
1
max. max. max.  
max.  
max.  
0.51  
0.38  
861 10.7  
746 0.0  
5
0
4.15  
3.85  
mm 20.8 9.1  
0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8 2.5 1.6 0.9  
2.4 38.1 25.4 10.2 35  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
JEITA  
01-08-10  
04-02-05  
SOT115Y  
2004 Apr 07  
8
Philips Semiconductors  
Product specification  
BGO827; BGO827/FC0;  
BGO827/SC0  
870 MHz optical receivers  
DATA SHEET STATUS  
DATA SHEET  
STATUS(1)  
PRODUCT  
STATUS(2)(3)  
LEVEL  
DEFINITION  
I
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
II  
Preliminary data Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Relevant changes will  
be communicated via a Customer Product/Process Change Notification  
(CPCN).  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes in the products -  
including circuits, standard cells, and/or software -  
described or contained herein in order to improve design  
and/or performance. When the product is in full production  
(status ‘Production’), relevant changes will be  
Application information  
Applications that are  
communicated via a Customer Product/Process Change  
Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these  
products, conveys no licence or title under any patent,  
copyright, or mask work right to these products, and  
makes no representations or warranties that these  
products are free from patent, copyright, or mask work  
right infringement, unless otherwise specified.  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2004 Apr 07  
9
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.  
© Koninklijke Philips Electronics N.V. 2004  
SCA76  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
R77/03/pp10  
Date of release: 2004 Apr 07  
Document order number: 9397 750 13061  

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