BGY916 [NXP]
UHF amplifier module; UHF放大器器模块
| 型号： | BGY916 |
| 厂家： | 
NXP |
| 描述： | UHF amplifier module |
| 文件： | 总12页 (文件大小：92K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
handbook, halfpage
BGY916
UHF amplifier module
1998 May 27
Product specification
Supersedes data of 1997 Jul 11
Philips Semiconductors
Product specification
UHF amplifier module
BGY916
FEATURES
PINNING - SOT365A
PIN
• 26 V nominal supply voltage
DESCRIPTION
• 16 W output power into a load of 50 Ω with an RF drive
power of 25 mW.
1
RF input
VS1
2
3
4
VS2
APPLICATIONS
RF output
ground
• Base station transmitting equipment operating in the
920 to 960 MHz frequency range.
flange
DESCRIPTION
handbook, halfpage
The BGY916 is a three-stage UHF amplifier module in a
SOT365A package. It consists of one NPN silicon planar
transistor die and two silicon MOS-FET dies mounted on a
metallized ceramic AlN substrate, together with matching
and bias circuitry.
1
2
3
4
MSA447
Fig.1 Simplified outline.
QUICK REFERENCE DATA
RF performance at Tmb = 25 °C.
f
VS1; VS2
(V)
PL
(W)
Gp
(dB)
η
(%)
ZS; ZL
(Ω)
MODE OF OPERATION
CW
(MHz)
920 to 960
26
16
≥28
≥35
50
1998 May 27
2
Philips Semiconductors
Product specification
UHF amplifier module
BGY916
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VS1
VS2
PD
DC supply voltage
DC supply voltage
input drive power
load power
−
−
−
−
28
28
80
25
V
V
mW
W
PL
Tstg
Tmb
storage temperature
−30
−10
+100
+90
°C
operating mounting base temperature
°C
CHARACTERISTICS
Tmb = 25 °C; VS1 = VS2 = 26 V; PL = 16 W; ZS = ZL = 50 Ω unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN.
frequency 920
TYP.
MAX.
960
UNIT
MHz
f
−
IS1
IS2
PL
supply current
supply current
load power
−
50
−
mA
mA
W
PD < −60 dBm
−
150
19
30
1
−
16
28
−
−
Gp
∆Gp
power gain
32
4
dB
dB
gain ripple
40 dB dynamic range at
f = 920 to 960 MHz
η
efficiency
35
−
40
−
%
H2
second harmonic
third harmonic
input VSWR
isolation
−47
−55
−35
−45
dBc
dBc
H3
−
VSWRin
−
1 : 1.5 2 : 1
V
S1 = 0
−
−
−
−40
−60
dBm
dBc
stability
VSWR ≤ 3 : 1 through all phases;
−
VS2 = 24 to 28 V
reverse intermodulation
Pcarrier = 16 W; Pinterference = 16 µW;
−
−68
−65
dBc
fi = fc ±600 kHz
F
B
noise figure
AM bandwidth
ruggedness
−
5
8
dBc
2
−
−
MHz
VSWR ≤ 5 : 1 through all phases
no degradation
1998 May 27
3
Philips Semiconductors
Product specification
UHF amplifier module
BGY916
MBG286
MBG287
50
50
50
η
(%)
handbook, halfpage
handbook, halfpage
P
(dBm)
D
G
P
η
p
L
+15
+12
+9
(dB)
40
(dBm)
40
40
30
20
10
0
+6
+3
0
G
p
30
20
10
0
30
20
10
0
900
900
920
940
960
980
920
940
960
980
f (MHz)
f (MHz)
VS1 = VS2 = 26 V; ZS = ZL = 50 Ω; Tmb = 25 °C.
VS1 = VS2 = 26 V; PL = 16 W; ZS = ZL = 50 Ω; Tmb = 25 °C.
Fig.2 Load power as a function of frequency;
typical values.
Fig.3 Power gain and efficiency as functions of
frequency; typical values.
MBG285
MGD185
20
50
handbook, halfpage
handbook, halfpage
H
, H
2
3
P
L
(dBc)
30
(dBm)
30
H
H
2
3
40
50
60
70
10
−10
−30
900
920
940
960
980
0
10
20
30
f (MHz)
V
(V)
S1
VS1 = VS2 = 26 V; PL = 16 W; ZS = ZL = 50 Ω; Tmb = 25 °C.
f = 940 MHz; VS2 = 26 V; ZS = ZL = 50 Ω; Tmb = 25 °C.
Fig.4 Harmonics as a function of frequency;
typical values.
Fig.5 Load power as a function of supply
voltage; typical values.
1998 May 27
4
Philips Semiconductors
Product specification
UHF amplifier module
BGY916
handbook, halfpage
pin
numbers
1
2
3
4
C3
C4
Z
Z
2
R1
L1
R2
L2
1
C1
C2
RF
input
V
V
RF
output
s1
s2
MGL161
Fig.6 Test circuit.
1998 May 27
5
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90
1
4
C4
C3
L1
L2
R1
R2
C1
C2
2
3
MGL162
Dimensions in mm.
ahdnbok,uflapegwidt
Fig.7 Printed-circuit board component layout.
Philips Semiconductors
Product specification
UHF amplifier module
BGY916
List of components (see Figs 6 and 7)
COMPONENT
C1, C2
DESCRIPTION
VALUE
10 µF; 35 V
CATALOGUE NO.
electrolytic capacitor
C3, C4
L1, L2
R1, R2
Z1, Z2
multilayer ceramic chip capacitor
Grade 4S2 Ferroxcube bead
metal film resistor
100 nF; 50 V
4330 030 36300
2322 195 13109
−
10 Ω; 0.4 W
50 Ω
stripline; note 1
Note
1. The striplines are on a double copper-clad printed-circuit board with epoxy dielectric (εr = 4.5); thickness = 1 mm.
The module should be mounted to the heatsink using
3 mm bolts with flat washers. The bolts should first be
tightened to “finger tight” and then further tightened in
alternating steps to a maximum torque of 0.4 to 0.6 Nm.
MOUNTING RECOMMENDATIONS
To ensure a good thermal contact and to prevent
mechanical stresses when bolted down, the flatness of the
mounting base is designed to be typically better than
0.1 mm. The mounting area of the heatsink should be flat
and free from burrs and loose particles. The heatsink
should be rigid and not prone to bowing under thermal
cycling conditions. The thickness of a solid heatsink
should be not less than 5 mm to ensure a rigid assembly.
Once mounted on the heatsink, the module leads can be
soldered to the printed-circuit board. A soldering iron may
be used up to a temperature of 250 °C for a maximum of
10 seconds at a distance of 2 mm from the plastic cap.
ESD precautions must be taken to protect the device from
electrostatic damage.
A thin, even layer of thermal compound should be used
between the mounting base and the heatsink to achieve
the best possible contact thermal resistance. Excessive
use of thermal compound will result in an increase in
thermal resistance and possible bowing of the mounting
base; too little will also result in poor thermal conduction.
1998 May 27
7
Philips Semiconductors
Product specification
UHF amplifier module
BGY916
PACKAGE OUTLINE
Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads
SOT365A
v
M
B
D
A
F
y
U
B
v
M
B
q
v
M
C
A
C
U
2
U
1
E
L
P
1
2
3
4
b
p
w
M
v
c
A
e
e
e
d
Q
1
0
10
20 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
c
D
d
E
e
e
F
L
P
Q
q
U
U
U
2
v
w
y
p
1
1
9.5 0.56
9.0 0.46
4.0
3.8
0.3 30.1 12.8 18.6
0.2 29.9 12.6 18.4
3.25 6.5
3.15 6.1
4.1
3.9
40.74 48.0 15.4 7.75
40.54 48.4 15.2 7.55
mm
2.54 17.78
0.2 0.25 0.1
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
SOT365A
97-05-25
1998 May 27
8
Philips Semiconductors
Product specification
UHF amplifier module
BGY916
DEFINITIONS
Data Sheet Status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 May 27
9
Philips Semiconductors
Product specification
UHF amplifier module
BGY916
NOTES
1998 May 27
10
Philips Semiconductors
Product specification
UHF amplifier module
BGY916
NOTES
1998 May 27
11
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© Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
125108/00/04/pp12
Date of release: 1998 May 27
Document order number: 9397 750 03925
相关型号：
BGY916/5,127
RF/Microwave Amplifier, 920 MHz - 960 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER, PLASTIC, SOT365A, 4 PIN
NXP
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