BLF184XR [NXP]
Power LDMOS transistor; 功率LDMOS晶体管型号: | BLF184XR |
厂家: | NXP |
描述: | Power LDMOS transistor |
文件: | 总10页 (文件大小:111K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BLF184XR; BLF184XRS
Power LDMOS transistor
Rev. 1 — 6 May 2013
Objective data sheet
1. Product profile
1.1 General description
A 650 W extremely rugged LDMOS power transistor for broadcast and industrial
applications in the HF to 600 MHz band.
Table 1.
Application information
Test signal
f
VDS
(V)
50
PL
Gp
D
(MHz)
108
(W)
650
(dB)
23.5
(%)
72
pulsed RF
1.2 Features and benefits
Easy power control
Integrated ESD protection
Excellent ruggedness
High efficiency
Excellent thermal stability
Designed for broadband operation (HF to 600 MHz)
Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances
(RoHS)
1.3 Applications
Industrial, scientific and medical applications
Broadcast transmitter applications
BLF184XR; BLF184XRS
NXP Semiconductors
Power LDMOS transistor
2. Pinning information
Table 2.
Pin
Pinning
Description
Simplified outline
Graphic symbol
BLF184XR (SOT1214A)
1
2
3
4
5
drain1
drain2
gate1
gate2
source
1
ꢀ
ꢃ
ꢁ
ꢄ
ꢂ
3
5
4
[1]
2
sym117
BLF184XRS (SOT1214B)
1
2
3
4
5
drain1
drain2
gate1
gate2
source
1
ꢀ
ꢂ
ꢁ
ꢃ
3
5
4
[1]
2
sym117
[1] Connected to flange.
3. Ordering information
Table 3.
Ordering information
Type number Package
Name
Description
Version
BLF184XR
-
flanged LDMOST ceramic package; 2 mounting holes; SOT1214A
4 leads
BLF184XRS
-
earless flanged LDMOST ceramic package; 4 leads
SOT1214B
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDS
Parameter
Conditions
Min
-
Max
135
+11
Unit
drain-source voltage
gate-source voltage
storage temperature
junction temperature
V
V
VGS
Tstg
6
65
-
+150 C
200 C
Tj
BLF184XR_BLF184XRS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Objective data sheet
Rev. 1 — 6 May 2013
2 of 10
BLF184XR; BLF184XRS
NXP Semiconductors
Power LDMOS transistor
5. Thermal characteristics
Table 5.
Thermal characteristics
Symbol Parameter
Conditions
Typ
Unit
[1][2]
Rth(j-c)
Zth(j-c)
thermal resistance from junction to case Tj = 150 C
<tbd> K/W
<tbd> K/W
transient thermal impedance from junction Tj = 150 C; tp = 100 s;
to case
= 20 %
[1] Tj is the junction temperature.
[2] Rth(j-c) is measured under RF conditions.
6. Characteristics
Table 6.
DC characteristics
Tj = 25 C; per section unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max Unit
V(BR)DSS drain-source breakdown
voltage
VGS = 0 V; ID = 2.75 mA 135
-
-
V
VGS(th)
VGSq
IDSS
gate-source threshold voltage VDS = 10 V; ID = 275 mA 1.25 1.7
2.25
1.8
1.4
-
V
gate-source quiescent voltage VDS = 50 V; ID = 50 mA
0.8
1.3
-
V
drain leakage current
drain cut-off current
VGS = 0 V; VDS = 50 V
-
-
A
A
IDSX
VGS = VGS(th) + 3.75 V;
VDS = 10 V
38
IGSS
gate leakage current
VGS = 11 V; VDS = 0 V
-
-
-
140
-
nA
RDS(on) drain-source on-state
resistance
VGS = VGS(th) + 3.75 V;
ID = 9.625 A
0.14
Table 7.
AC characteristics
Tj = 25 C; per section unless otherwise specified.
Symbol Parameter Conditions
feedback capacitance VGS = 0 V; VDS = 50 V; f = 1 MHz
Min Typ Max Unit
Crs
-
-
-
2.75
269
107
-
-
-
pF
pF
pF
Ciss
Coss
input capacitance
output capacitance
VGS = 0 V; VDS = 50 V; f = 1 MHz
VGS = 0 V; VDS = 50 V; f = 1 MHz
Table 8.
RF characteristics
Test signal: pulsed RF; tp = 100 s; = 2; f = 108 MHz; RF performance at VDS = 50 V;
Dq = 100 mA; Tcase = 25 C; unless otherwise specified; in a class-AB production test circuit.
I
Symbol
Parameter
Conditions
PL = 650 W
PL = 650 W
PL = 650 W
Min
Typ
Max
Unit
dB
Gp
power gain
<tbd> <tbd>
-
RLin
D
input return loss
drain efficiency
-
<tbd> <tbd> dB
<tbd> <tbd>
-
%
BLF184XR_BLF184XRS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Objective data sheet
Rev. 1 — 6 May 2013
3 of 10
BLF184XR; BLF184XRS
NXP Semiconductors
Power LDMOS transistor
7. Test information
7.1 Ruggedness in class-AB operation
The BLF184XR and BLF184XRS are capable of withstanding a load mismatch
corresponding to VSWR > 65 : 1 through all phases under the following conditions:
V
DS = 50 V; IDq = 100 mA; PL = 650 W pulsed; f = 108 MHz.
7.2 Impedance information
drain 1
gate 1
Z
Z
L
i
gate 2
drain 2
001aan207
Fig 1. Definition of transistor impedance
Table 9.
Typical push-pull impedance
Simulated Zi and ZL device impedance; impedance info at VDS = 50 V and PL = 650 W.
f
Zi
ZL
(MHz)
<tbd>
()
()
<tbd>
<tbd>
BLF184XR_BLF184XRS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Objective data sheet
Rev. 1 — 6 May 2013
4 of 10
BLF184XR; BLF184XRS
NXP Semiconductors
Power LDMOS transistor
8. Package outline
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Fig 2. Package outline SOT1214A
BLF184XR_BLF184XRS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Objective data sheet
Rev. 1 — 6 May 2013
5 of 10
BLF184XR; BLF184XRS
NXP Semiconductors
Power LDMOS transistor
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Fig 3. Package outline SOT1214B
BLF184XR_BLF184XRS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Objective data sheet
Rev. 1 — 6 May 2013
6 of 10
BLF184XR; BLF184XRS
NXP Semiconductors
Power LDMOS transistor
9. Handling information
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
10. Abbreviations
Table 10. Abbreviations
Acronym
CW
Description
Continuous Wave
ESD
ElectroStatic Discharge
HF
High Frequency
LDMOS
LDMOST
VSWR
Laterally Diffused Metal-Oxide Semiconductor
Laterally Diffused Metal-Oxide Semiconductor Transistor
Voltage Standing-Wave Ratio
11. Revision history
Table 11. Revision history
Document ID
Release date Data sheet status
20130506 Objective data sheet
Change notice Supersedes
BLF184XR_BLF184XRS v.1
-
-
BLF184XR_BLF184XRS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Objective data sheet
Rev. 1 — 6 May 2013
7 of 10
BLF184XR; BLF184XRS
NXP Semiconductors
Power LDMOS transistor
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
12.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
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Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
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full data sheet shall prevail.
Applications — Applications that are described herein for any of these
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representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
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accepts no liability for any assistance with applications or customer product
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data sheet shall define the specification of the product as agreed between
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12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
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purchase of NXP Semiconductors products by customer.
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limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
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construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
BLF184XR_BLF184XRS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Objective data sheet
Rev. 1 — 6 May 2013
8 of 10
BLF184XR; BLF184XRS
NXP Semiconductors
Power LDMOS transistor
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
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Translations — A non-English (translated) version of a document is for
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between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
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product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
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Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BLF184XR_BLF184XRS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Objective data sheet
Rev. 1 — 6 May 2013
9 of 10
BLF184XR; BLF184XRS
NXP Semiconductors
Power LDMOS transistor
14. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
3
4
5
6
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
7.1
7.2
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 4
Ruggedness in class-AB operation . . . . . . . . . 4
Impedance information. . . . . . . . . . . . . . . . . . . 4
8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Handling information. . . . . . . . . . . . . . . . . . . . . 7
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
9
10
11
12
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12.1
12.2
12.3
12.4
13
14
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 6 May 2013
Document identifier: BLF184XR_BLF184XRS
相关型号:
BLF188XR,112
TRANSISTOR 2 CHANNEL, UHF BAND, Si, N-CHANNEL, RF SMALL SIGNAL, MOSFET, ROHS COMPLIANT, CERAMIC PACKAGE-4, FET RF Small Signal
NXP
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