BT139X-600E,127 [NXP]
BT139X-600E;
| 型号： | BT139X-600E,127 |
| 厂家： | 
NXP |
| 描述： | BT139X-600E 局域网 栅 三端双向交流开关 栅极 |
| 文件： | 总13页 (文件大小：88K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BT139X-600E
Triac; sensitive gate
Rev. 4 — 28 October 2011
Product data sheet
1. Product profile
1.1 General description
Passivated, sensitive gate triac in a ‘full pack’ SOT186A (TO-220) plastic package.
1.2 Features and benefits
High sensitivity in all four quadrants.
1.3 Applications
General purpose bidirectional switching Phase control.
1.4 Quick reference data
VDRM 600 V
IT(RMS) 16 A
ITSM 155 A
IGT 10 mA (T2+ G+; T2+ G; T2 G)
IGT 25 mA (T2 G+).
2. Pinning information
Table 1.
Pinning
Description
Pin
1
Simplified outline
Symbol
main terminal 1 (T1)
main terminal 2 (T2)
gate (G)
mb
T2
T1
G
2
3
sym051
mb
isolated
1
2 3
SOT186A (TO-220)
BT139X-600E
NXP Semiconductors
Triac; sensitive gate
3. Ordering information
Table 2.
Ordering information
Type number Package
Name
Description
Version
BT139X-600E
-
plastic single-ended package; isolated heatsink mounted; 1 mounting hole;
3 lead TO-220 ‘full pack’
SOT186A
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDRM
Parameter
Conditions
Min
Max
600
16
Unit
V
[1]
repetitive peak off-state voltage
RMS on-state current
-
-
IT(RMS)
ITSM
full sine wave; Ths 38 C
A
non-repetitive peak on-state current
full sine wave; Tj = 25 C
prior to surge
t = 20 ms
t = 16.7 ms
t = 10 ms
-
-
-
155
170
120
A
A
A2s
I2t
I2t for fusing
dIT/dt
repetitive rate of rise of on-state current after ITM = 20 A; IG = 0.2 A;
triggering
dIG/dt = 0.2 A/s
T2+ G+
-
50
50
50
10
2
A/s
A/s
A/s
A/s
A
T2+ G
-
T2 G
-
T2 G+
-
IGM
peak gate current
peak gate voltage
peak gate power
-
VGM
PGM
PG(AV)
Tstg
Tj
-
5
V
-
5
W
average gate power
storage temperature
junction temperature
over any 20 ms period
-
0.5
+150
125
W
40
C
-
C
[1] Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The
rate of rise of current should not exceed 15 A/s.
BT139X-600E
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 28 October 2011
2 of 13
BT139X-600E
NXP Semiconductors
Triac; sensitive gate
001aab096
25
25
P
T
hs(max)
tot
α =
(W)
20
(°C)
45
180
120
90
65
15
10
60
30
85
α
105
5
0
α
125
20
0
5
10
15
I
(A)
T(RMS)
= conduction angle.
Fig 1. Total power dissipation as a function of RMS on-state current; maximum values
001aab102
160
I
TSM
(A)
I
I
TSM
T
120
T
= 25 °C max
t
T
j(initial)
80
40
0
2
3
1
10
10
10
n
f = 50 Hz.
Fig 2. Non-repetitive peak on-state current as a function of the number (n) of sinusoidal current cycles;
maximum values
BT139X-600E
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 28 October 2011
3 of 13
BT139X-600E
NXP Semiconductors
Triac; sensitive gate
001aab092
3
10
I
TSM
(A)
2
10
(1)
(2)
I
I
TSM
T
T
t
T
= 25 °C max
j(initial)
10
10
−2
−1
2
10
1
10
10
T (ms)
tp 20 ms.
(1) dIT/dt limit.
(2) T2 G+ quadrant.
Fig 3. Non-repetitive peak on-state current as a function of pulse width; maximum values
001aab095
001aab090
20
50
I
T(RMS)
(A)
I
T(RMS)
(A)
(1)
40
30
20
10
0
15
10
5
0
−50
−2
−1
0
50
100
150
10
10
1
10
T
(°C)
surge duration (s)
hs
f = 50 Hz; Ths 38 C.
(1) Ths 38 C.
Fig 4. RMS on-state current as a function of surge
duration; maximum values
Fig 5. RMS on-state current as a function of
mounting base temperature; maximum values
BT139X-600E
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 28 October 2011
4 of 13
BT139X-600E
NXP Semiconductors
Triac; sensitive gate
5. Thermal characteristics
Table 4.
Symbol
Rth(j-hs)
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
Unit
thermal resistance junction
to heatsink
full or half cycle with heatsink
compound
-
-
4.0
K/W
full or half cycle without heatsink
compound
-
-
-
5.5
-
K/W
K/W
Rth(j-a)
thermal resistance junction
to ambient
in free air
55
001aab097
10
Z
th(j-hs)
(K/W)
(1)
(2)
1
(3)
(4)
−1
−2
−3
10
10
10
P
D
t
t
p
−5
−4
−3
−2
−1
10
10
10
10
10
1
10
t
(s)
p
(1) Unidirectional without heatsink compound.
(2) Unidirectional with heatsink compound.
(3) Bidirectional without heatsink compound.
(4) Bidirectional with heatsink compound.
Fig 6. Transient thermal impedance as a function of pulse width
6. Isolation characteristics
Table 5.
Isolation limiting values and characteristics
Ths = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
Visol
RMS value isolation voltage from all three
terminals to external heatsink
f = 50 to 60 Hz; sinusoidal
waveform; R.H. 65 %;
clean and dust free
-
-
2500
V
Cisol
capacitance from pin 2 to external heatsink f = 1 MHz
-
10
-
pF
BT139X-600E
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 28 October 2011
5 of 13
BT139X-600E
NXP Semiconductors
Triac; sensitive gate
7. Characteristics
Table 6.
Characteristics
Tj = 25 C unless otherwise specified.
Symbol Parameter
Static characteristics
IGT gate trigger current
Conditions
Min
Typ
Max
Unit
VD = 12 V; IT = 0.1 A; Figure 8
T2+ G+
T2+ G
T2 G
T2 G+
-
-
-
-
2.5
4
10
10
10
25
mA
mA
mA
mA
5
11
IL
latching current
VD = 12 V; IGT = 0.1 A;
Figure 10
T2+ G+
T2+ G
T2 G
T2 G+
-
-
-
-
-
3.2
16
4
30
40
30
40
45
mA
mA
mA
mA
mA
5.5
4
IH
holding current
VD = 12 V; IGT = 0.1 A;
Figure 11
VT
on-state voltage
IT = 20 A; Figure 9
-
1.2
0.7
0.4
1.6
1.5
-
V
V
V
VGT
gate trigger voltage
VD = 12 V; IT = 0.1 A; Figure 7
-
VD = 400 V; IT = 0.1 A;
0.25
Tj = 125 C
ID
off-state leakage
current
VD = VDRM(max); Tj = 125 C
-
0.1
0.5
mA
Dynamic characteristics
dVD/dt critical rate of rise of
VDM = 67 % VDRM(max)
Tj = 125 C; exponential
waveform; gate open circuit
;
-
-
50
2
-
-
V/s
s
off-state voltage
tgt
gate controlled
turn-on time
ITM = 20 A; VD = VDRM(max);
IG = 0.1 A; dIG/dt = 5 A/s
BT139X-600E
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 28 October 2011
6 of 13
BT139X-600E
NXP Semiconductors
Triac; sensitive gate
001aab101
001aab448
1.6
3
V
GT
I ( )
GT Tj
V
I
GT(25°C)
GT(25°C)
(1)
(2)
(3)
1.2
2
(4)
0.8
1
0.4
−50
0
−50
0
50
100
150
0
50
100
150
T (°C)
j
T (°C)
j
(1) T2 G+.
(2) T2+ G.
(3) T2 G.
(4) T2+ G+.
Fig 7. Normalized gate trigger voltage as a function
of junction temperature
Fig 8. Normalized gate trigger current as a function
of junction temperature
001aab100
001aab094
3
50
I
T
I
(A)
40
L
(1)
(2)
(3)
I
L(25°C)
2
30
20
10
0
1
0
−50
0
50
100
150
0
1
2
3
T (°C)
j
V
(V)
T
VO = 1.195 V.
Rs = 0.018 .
(1) Tj = 125 C; typical values.
(2) Tj = 25 C; maximum values.
(3) Tj = 125 C; maximum values.
Fig 9. On-state current characteristics
Fig 10. Normalized latching current as a function of
junction temperature
BT139X-600E
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 28 October 2011
7 of 13
BT139X-600E
NXP Semiconductors
Triac; sensitive gate
001aab099
001aab452
3
3
10
I
H
I
H(25°C)
dV /dt
D
(V/μs)
2
2
10
1
0
−50
10
0
50
100
150
0
50
100
150
T (°C)
j
T (°C)
j
Fig 11. Normalized holding current as a function of
junction temperature
Fig 12. Critical rate of rise of off-state voltage as a
function of junction temperature; minimum
values
8. Package information
Epoxy meets requirements of UL94 V-0 at 1⁄8 inch.
BT139X-600E
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 28 October 2011
8 of 13
BT139X-600E
NXP Semiconductors
Triac; sensitive gate
9. Package outline
Plastic single-ended package; isolated heatsink mounted;
1 mounting hole; 3-lead TO-220 'full pack'
SOT186A
E
P
A
A
1
q
D
1
mounting
base
T
D
j
L
L
2
1
K
Q
b
b
1
L
2
1
2
3
b
c
w
M
e
e
1
0
5
scale
10 mm
DIMENSIONS (mm are the original dimensions)
(1)
(2)
L
A
A
b
b
c
D
D
1
E
e
e
j
K
L
L
1
P
Q
q
T
w
b
UNIT
mm
2
1
1
1
2
max.
1.1
0.9
1.4
1.0
2.7
1.7
0.6 14.4 3.30
0.4 13.5 2.79
2.6
2.3
4.6 2.9
4.0 2.5
0.9
0.7
3.0
2.6
0.7 15.8 6.5 10.3
0.4 15.2 6.3 9.7
3.2
3.0
3
5.08
2.54
2.5
0.4
Notes
1. Terminal dimensions within this zone are uncontrolled.
2. Both recesses are ∅ 2.5 × 0.8 max. depth
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
02-04-09
06-02-14
SOT186A
3-lead TO-220F
Fig 13. Package outline; SOT186A (TO-220)
BT139X-600E
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 28 October 2011
9 of 13
BT139X-600E
NXP Semiconductors
Triac; sensitive gate
10. Revision history
Table 7.
Revision history
Document ID
BT139X-600E v.4
Modifications:
Release date
Data sheet status
Change notice
Supersedes
20111028
Product data sheet
BT139X-600E v.3
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
BT139X-600E v.3
20040923
20011001
19970901
Product data sheet
Product specification
Product specification
BT139X-600E v.2
BT139X-600E v.2
BT139X_SERIES_E v.1
-
BT139X_SERIES_E v.1
BT139X-600E
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 28 October 2011
10 of 13
BT139X-600E
NXP Semiconductors
Triac; sensitive gate
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
11.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
11.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
BT139X-600E
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 28 October 2011
11 of 13
BT139X-600E
NXP Semiconductors
Triac; sensitive gate
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BT139X-600E
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 28 October 2011
12 of 13
BT139X-600E
NXP Semiconductors
Triac; sensitive gate
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 5
Isolation characteristics . . . . . . . . . . . . . . . . . . 5
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package information . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
3
4
5
6
7
8
9
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 October 2011
Document identifier: BT139X-600E
相关型号：
©2020 ICPDF网 联系我们和版权申明