BT151F-800 [NXP]

Thyristors; 晶闸管
BT151F-800
型号: BT151F-800
厂家: NXP    NXP
描述:

Thyristors
晶闸管

栅极 触发装置 可控硅整流器 局域网
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Philips Semiconductors  
Product specification  
Thyristors  
BT151F series  
GENERAL DESCRIPTION  
QUICK REFERENCE DATA  
Glass passivated thyristors in a full  
pack, plastic envelope, intended for  
use in applications requiring high  
SYMBOL PARAMETER  
MAX. MAX. MAX. UNIT  
BT151F-  
500  
500  
650  
650  
800  
800  
bidirectional  
blocking  
voltage  
VDRM  
VRRM  
IT(AV)  
,
Repetitive peak off-state  
V
capability and high thermal cycling  
performance. Typical applications  
include motor control, industrial and  
domestic lighting, heating and static  
switching.  
voltages  
Average on-state current  
RMS on-state current  
Non-repetitive peak on-state  
current  
5.7  
9
100  
5.7  
9
100  
5.7  
9
100  
A
A
A
IT(RMS)  
ITSM  
PINNING - SOT186  
PIN CONFIGURATION  
SYMBOL  
PIN  
1
DESCRIPTION  
cathode  
case  
a
k
2
anode  
gate  
3
g
1
2 3  
case isolated  
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum System (IEC 134).  
SYMBOL PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
-500  
-650  
-800  
800  
VDRM, VRRM Repetitive peak off-state  
voltages  
-
5001  
6501  
V
IT(AV)  
IT(RMS)  
ITSM  
Average on-state current half sine wave; Ths 87 ˚C  
-
-
5.7  
9
A
A
RMS on-state current  
Non-repetitive peak  
on-state current  
all conduction angles  
half sine wave; Tj = 125 ˚C prior  
to surge; with reapplied VDRM(max)  
t = 10 ms  
-
-
-
-
100  
110  
50  
A
A
t = 8.3 ms  
I2t  
dIT/dt  
I2t for fusing  
Repetitive rate of rise of  
on-state current after  
triggering  
t = 10 ms  
ITM = 20 A; IG = 50 mA;  
dIG/dt = 50 mA/µs  
A2s  
A/µs  
50  
IGM  
Peak gate current  
Peak gate voltage  
Peak reverse gate voltage  
Peak gate power  
Average gate power  
Storage temperature  
Operating junction  
temperature  
-
2
5
A
V
V
W
W
˚C  
˚C  
VGM  
VRGM  
PGM  
PG(AV)  
Tstg  
-
-
5
-
-
5
over any 20 ms period  
0.5  
150  
125  
-40  
-
Tj  
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the thyristor may  
switch to the on-state. The rate of rise of current should not exceed 15 A/µs.  
February 1996  
1
Rev 1.100  
Philips Semiconductors  
Product specification  
Thyristors  
BT151F series  
ISOLATION LIMITING VALUE & CHARACTERISTIC  
Ths = 25 ˚C unless otherwise specified  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Visol  
Cisol  
Repetitive peak voltage from all R.H. 65% ; clean and dustfree  
-
1500  
V
three terminals to external  
heatsink  
Capacitance from T2 to external f = 1 MHz  
heatsink  
-
12  
-
pF  
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Rth j-hs  
Thermal resistance  
junction to heatsink  
Thermal resistance  
junction to ambient  
with heatsink compound  
without heatsink compound  
in free air  
-
-
-
-
-
55  
4.5  
6.5  
-
K/W  
K/W  
K/W  
Rth j-a  
STATIC CHARACTERISTICS  
Tj = 25 ˚C unless otherwise stated  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
IGT  
IL  
Gate trigger current  
Latching current  
Holding current  
VD = 12 V; IT = 0.1 A  
VD = 12 V; IGT = 0.1 A  
VD = 12 V; IGT = 0.1 A  
IT = 23 A  
-
2
15  
40  
mA  
mA  
mA  
V
-
10  
7
IH  
-
-
20  
VT  
VGT  
On-state voltage  
Gate trigger voltage  
1.4  
0.6  
0.4  
0.1  
1.75  
1.5  
-
VD = 12 V; IT = 0.1 A  
VD = VDRM(max); IT = 0.1 A; Tj = 125 ˚C  
-
0.25  
-
V
V
mA  
ID, IR  
Off-state leakage current VD = VDRM(max); VR = VRRM(max); Tj = 125 ˚C  
0.5  
DYNAMIC CHARACTERISTICS  
Tj = 25 ˚C unless otherwise stated  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
dVD/dt  
Critical rate of rise of  
off-state voltage  
VDM = 67% VDRM(max); Tj = 125 ˚C;  
exponential waveform  
Gate open circuit  
GK = 100 Ω  
50  
200  
-
130  
1000  
2
-
-
-
V/µs  
V/µs  
µs  
R
tgt  
tq  
Gate controlled turn-on  
time  
Circuit commutated  
turn-off time  
ITM = 40 A; VD = VDRM(max); IG = 0.1 A;  
dIG/dt = 5 A/µs  
VD = 67% VDRM(max); Tj = 125 ˚C;  
ITM = 20 A; VR = 25 V; dITM/dt = 30 A/µs;  
dVD/dt = 50 V/µs; RGK = 100 Ω  
-
70  
-
µs  
February 1996  
2
Rev 1.100  
Philips Semiconductors  
Product specification  
Thyristors  
BT151F series  
ITSM / A  
Ptot / W  
10  
Ths(max) / C  
a = 1.57  
120  
100  
80  
60  
40  
20  
0
80  
89  
conduction form  
I
TSM  
time  
I
angle  
factor  
a
4
2.8  
2.2  
1.9  
1.57  
T
degrees  
30  
60  
90  
120  
180  
8
6
4
2
0
T
1.9  
Tj initial = 125 C max  
2.2  
2.8  
98  
4
107  
116  
125  
0
1
2
3
4
5
6
1
10  
100  
1000  
IF(AV) / A  
Number of half cycles at 50Hz  
Fig.1. Maximum on-state dissipation, Ptot, versus  
average on-state current, IT(AV), where  
Fig.4. Maximum permissible non-repetitive peak  
on-state current ITSM, versus number of cycles, for  
sinusoidal currents, f = 50 Hz.  
a = form factor = IT(RMS)/ IT(AV)  
.
ITSM / A  
IT(RMS) / A  
1000  
100  
10  
25  
20  
15  
10  
5
dIT/dt limit  
I
TSM  
time  
I
T
T
Tj initial = 125 C max  
0
10ms  
10us  
100us  
1ms  
0.01  
0.1  
surge duration / s  
1
10  
T / s  
Fig.2. Maximum permissible non-repetitive peak  
on-state current ITSM, versus pulse width tp, for  
sinusoidal currents, tp 10ms.  
Fig.5. Maximum permissible repetitive rms on-state  
current IT(RMS), versus surge duration, for sinusoidal  
currents, f = 50 Hz; Ths 87˚C.  
VGT(Tj)  
VGT(25 C)  
IT(RMS) / A  
10  
8
1.6  
1.4  
1.2  
1
87 C  
6
4
0.8  
0.6  
0.4  
2
0
-50  
0
50  
Ths / C  
100  
150  
-50  
0
50  
100  
150  
Tj / C  
Fig.3. Maximum permissible rms current IT(RMS)  
versus heatsink temperature Ths.  
,
Fig.6. Normalised gate trigger voltage  
VGT(Tj)/ VGT(25˚C), versus junction temperature Tj.  
February 1996  
3
Rev 1.100  
Philips Semiconductors  
Product specification  
Thyristors  
BT151F series  
IGT(Tj)  
IGT(25 C)  
IT / A  
30  
25  
20  
15  
10  
5
Tj = 125 C  
Tj = 25 C  
3
2.5  
2
Vo = 1.06 V  
Rs = 0.0304 ohms  
typ  
max  
1.5  
1
0.5  
0
0
-50  
0
50  
Tj / C  
100  
150  
0
0.5  
1
1.5  
2
VT / V  
Fig.7. Normalised gate trigger current  
IGT(Tj)/ IGT(25˚C), versus junction temperature Tj.  
Fig.10. Typical and maximum on-state characteristic.  
IL(Tj)  
IL(25 C)  
Zth j-hs (K/W)  
10  
1
3
2.5  
2
without heatsink compound  
with heatsink compound  
0.1  
1.5  
1
t
P
p
D
0.01  
t
0.5  
0
0.001  
10us  
0.1ms  
1ms  
10ms  
tp / s  
0.1s  
1s  
10s  
-50  
0
50  
Tj / C  
100  
150  
Fig.8. Normalised latching current IL(Tj)/ IL(25˚C),  
versus junction temperature Tj.  
Fig.11. Transient thermal impedance Zth j-hs, versus  
pulse width tp.  
IH(Tj)  
IH(25 C)  
dVD/dt (V/us)  
10000  
3
2.5  
2
1000  
RGK = 100 Ohms  
1.5  
1
100  
gate open circuit  
0.5  
0
10  
-50  
0
50  
Tj / C  
100  
150  
0
50  
100  
150  
Tj / C  
Fig.9. Normalised holding current IH(Tj)/ IH(25˚C),  
versus junction temperature Tj.  
Fig.12. Typical, critical rate of rise of off-state voltage,  
dVD/dt versus junction temperature Tj.  
February 1996  
4
Rev 1.100  
Philips Semiconductors  
Product specification  
Thyristors  
BT151F series  
MECHANICAL DATA  
Dimensions in mm  
Net Mass: 2 g  
10.2  
max  
5.7  
max  
3.2  
3.0  
4.4  
max  
0.9  
0.5  
2.9 max  
4.4  
4.0  
7.9  
7.5  
17  
max  
seating  
plane  
3.5 max  
not tinned  
4.4  
13.5  
min  
1
2
3
0.9  
0.7  
M
0.4  
0.55 max  
1.3  
2.54  
5.08  
top view  
Fig.13. SOT186; The seating plane is electrically isolated from all terminals.  
Notes  
1. Accessories supplied on request: refer to mounting instructions for F-pack envelopes.  
2. Epoxy meets UL94 V0 at 1/8".  
February 1996  
5
Rev 1.100  
Philips Semiconductors  
Product specification  
Thyristors  
BT151F series  
DEFINITIONS  
Data sheet status  
Objective specification  
This data sheet contains target or goal specifications for product development.  
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.  
Product specification  
This data sheet contains final product specifications.  
Limiting values  
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and  
operation of the device at these or at any other conditions above those given in the Characteristics sections of  
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
Philips Electronics N.V. 1996  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the  
copyright owner.  
The information presented in this document does not form part of any quotation or contract, it is believed to be  
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under patent or other  
industrial or intellectual property rights.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices or systems where malfunction of these  
products can be reasonably expected to result in personal injury. Philips customers using or selling these products  
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting  
from such improper use or sale.  
February 1996  
6
Rev 1.100  

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