BT300M [NXP]

Thyristors; 晶闸管


型号：	BT300M
厂家：	NXP
描述：	Thyristors 晶闸管
文件：	总6页 (文件大小：56K)
中文：	中文翻译
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Philips Semiconductors

Product specification

Thyristors

BT300S series

BT300M series

GENERAL DESCRIPTION

QUICK REFERENCE DATA

Glasspassivatedthyristorsinaplastic

envelope, suitable for surface

mounting, intended for use in

SYMBOL PARAMETER

MAX. MAX. MAX. UNIT

BT300S (or BT300M)- 500R 600R 800R

applications

bidirectional

requiring

blocking

high

V_DRM

V_RRM

I_T(AV)

Repetitive peak off-state

500

600

800

voltage

voltages

capability and high thermal cycling

performance. Typical applications

include motor control, industrial and

domestic lighting, heating and static

switching.

Average on-state current

RMS on-state current

Non-repetitive peak on-state

current

I_T(RMS)

I_TSM

PINNING - SOT428

PIN CONFIGURATION

SYMBOL

NUMBER

Standard Alternative

tab

cathode

anode

gate

anode

cathode

anode

tab

anode

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134).

SYMBOL PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

-500R -600R -800R

V_DRM, V_RRMRepetitive peak off-state

voltages

500¹

600¹

800

I_T(AV)

I_T(RMS)

I_TSM

Average on-state current half sine wave; T_mb≤ 107 ˚C

RMS on-state current

Non-repetitive peak

on-state current

all conduction angles

half sine wave; T_j= 25 ˚C prior to

surge

t = 10 ms

t = 8.3 ms

t = 10 ms

I_TM= 10 A; I_G= 50 mA;

dI_G/dt = 50 mA/µs

I²t

dI_T/dt

I²t for fusing

Repetitive rate of rise of

on-state current after

triggering

A²s

A/µs

I_GM

Peak gate current

Peak gate voltage

Peak reverse gate voltage

Peak gate power

Average gate power

Storage temperature

Operating junction

temperature

˚C

V_GM

V_RGM

P_GM

P_G(AV)

T_stg

over any 20 ms period

0.5

150

125

-40

T_j

1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the thyristor may

switch to the on-state. The rate of rise of current should not exceed 15 A/µs.

September 1997

Rev 1.100

Philips Semiconductors

Product specification

Thyristors

BT300S series

BT300M series

THERMAL RESISTANCES

SYMBOL PARAMETER

CONDITIONS

MIN. TYP. MAX. UNIT

R_{th j-mb}

Thermal resistance

junction to mounting base

Thermal resistance

junction to ambient

2.2

K/W

R_{th j-a}

pcb (FR4) mounted; footprint as in Fig.14

K/W

STATIC CHARACTERISTICS

T_j= 25 ˚C unless otherwise stated

SYMBOL PARAMETER

CONDITIONS

MIN. TYP. MAX. UNIT

I_GT

I_L

Gate trigger current

Latching current

Holding current

V_D= 12 V; I_T= 0.1 A

V_D= 12 V; I_GT= 0.1 A

I_T= 12 A

1.6

1.5

I_H

V_T

V_GT

On-state voltage

Gate trigger voltage

1.35

0.6

0.4

0.1

V_D= 12 V; I_T= 0.1 A

V_D= V_DRM(max); I_T= 0.1 A; T_j= 125 ˚C

0.25

I_D, I_R

Off-state leakage current V_D= V_DRM(max); V_R= V_RRM(max); T_j= 125 ˚C

0.5

DYNAMIC CHARACTERISTICS

T_j= 25 ˚C unless otherwise stated

SYMBOL PARAMETER

CONDITIONS

MIN. TYP. MAX. UNIT

dV_D/dt

Critical rate of rise of

off-state voltage

V_DM= 67% V_DRM(max); T_j= 125 ˚C;

exponential waveform.

Gate open circuit

_GK= 100 Ω

200

100

1000

V/µs

µs

t_gt

t_q

Gate controlled turn-on

time

Circuit commutated

turn-off time

I_TM= 10 A; V_D= V_DRM(max); I_G= 0.1 A;

dI_G/dt = 5 A/µs

V_D= 67% V_DRM(max); T_j= 125 ˚C;

µs

_TM= 12 A; V_R= 25 V; dI_TM/dt = 30 A/µs;

dV_D/dt = 50 V/µs; R_GK= 100 Ω

September 1997

Rev 1.100

Philips Semiconductors

Product specification

Thyristors

BT300S series

BT300M series

ITSM / A

BT300

Ptot / W

Tmb(max) / C

a = 1.57

TSM

conduction form

angle

factor

2.8

2.2

1.9

1.57

111

degrees

1.9

time

Tj initial = 25 C max

2.2

120

180

114.5

118

2.8

121.5

125

100

1000

IT(AV) / A

Number of half cycles at 50Hz

Fig.1. Maximum on-state dissipation, P_tot, versus

average on-state current, I_T(AV), where

Fig.4. Maximum permissible non-repetitive peak

on-state current I_TSM, versus number of cycles, for

sinusoidal currents, f = 50 Hz.

a = form factor = I_T(RMS)/ I_T(AV)

BT300

ITSM / A

BT150

IT(RMS) / A

1000

100

dI_T/dt limit

TSM

time

Tj initial = 25 C max

10ms

10us

100us

1ms

0.01

0.1

surge duration / s

T / s

Fig.2. Maximum permissible non-repetitive peak

on-state current I_TSM, versus pulse width t_p, for

sinusoidal currents, t_p≤ 10ms.

Fig.5. Maximum permissible repetitive rms on-state

current I_T(RMS), versus surge duration, for sinusoidal

currents, f = 50 Hz; T_mb≤ 107˚C.

BT300S

IT(RMS) / A

VGT(Tj)

BT151

VGT(25 C)

1.6

1.4

1.2

107 C

0.8

0.6

0.4

-50

Tmb / C

100

150

-50

100

150

Tj / C

Fig.3. Maximum permissible rms current I_T(RMS)

versus mounting base temperature T_mb.

Fig.6. Normalised gate trigger voltage

V_GT(T_j)/ V_GT(25˚C), versus junction temperature T_j.

September 1997

Rev 1.100

Philips Semiconductors

Product specification

Thyristors

BT300S series

BT300M series

BT300

IGT(Tj)

IGT(25 C)

IT / A

BT150

Tj = 125 C

Tj = 25 C

2.5

Vo = 1.21 V

Rs = 0.0313 ohms

typ

1.5

max

0.5

-50

Tj / C

100

150

0.5

1.5

VT / V

Fig.7. Normalised gate trigger current

I_GT(T_j)/ I_GT(25˚C), versus junction temperature T_j.

Fig.10. Typical and maximum on-state characteristic.

IL(Tj)

IL(25 C)

BT150

Zth j-mb (K/W)

BT150

2.5

1.5

0.1

0.01

0.5

10us

0.1ms

1ms

10ms

tp / s

0.1s

10s

-50

Tj / C

100

150

Fig.8. Normalised latching current I_L(T_j)/ I_L(25˚C),

versus junction temperature T_j.

Fig.11. Transient thermal impedance Z_{th j-mb}, versus

pulse width t_p.

IH(Tj)

IH(25 C)

dVD/dt (V/us)

10000

BT150

2.5

1000

RGK = 100 Ohms

1.5

100

gate open circuit

0.5

-50

Tj / C

100

150

100

150

Tj / C

Fig.9. Normalised holding current I_H(T_j)/ I_H(25˚C),

versus junction temperature T_j.

Fig.12. Typical, critical rate of rise of off-state voltage,

dV_D/dt versus junction temperature T_j.

September 1997

Rev 1.100

Philips Semiconductors

Product specification

Thyristors

BT300S series

BT300M series

MECHANICAL DATA

Dimensions in mm

Net Mass: 1.1 g

seating plane

2.38 max

0.93 max

1.1

5.4

6.73 max

tab

4 min

4.6

6.22 max

0.5 min

10.4 max

0.5

0.3

0.5

0.8 max

(x2)

2.285 (x2)

Fig.13. SOT428 : centre pin connected to tab.

MOUNTING INSTRUCTIONS

Dimensions in mm

7.0

2.15

2.5

1.5

4.57

Fig.14. SOT428 : minimum pad sizes for surface mounting.

Notes

1. Plastic meets UL94 V0 at 1/8".

September 1997

Rev 1.100

Philips Semiconductors

Product specification

Thyristors

BT300S series

BT300M series

DEFINITIONS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one

or more of the limiting values may cause permanent damage to the device. These are stress ratings only and

operation of the device at these or at any other conditions above those given in the Characteristics sections of

this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Philips Electronics N.V. 1997

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the

The information presented in this document does not form part of any quotation or contract, it is believed to be

accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under patent or other

industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these

products can be reasonably expected to result in personal injury. Philips customers using or selling these products

for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting

from such improper use or sale.

September 1997

Rev 1.100

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