BYG70D [NXP]

Fast soft-recovery controlled avalanche rectifiers; 快速软恢复控制雪崩整流器


型号：	BYG70D
厂家：	NXP
描述：	Fast soft-recovery controlled avalanche rectifiers 快速软恢复控制雪崩整流器
文件：	总6页 (文件大小：40K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DISCRETE SEMICONDUCTORS

DATA SHEET

, halfpage

M3D168

BYG70 series

Fast soft-recovery

controlled avalanche rectifiers

1996 Jun 05

Preliminary speciﬁcation

Philips Semiconductors

Preliminary speciﬁcation

Fast soft-recovery

controlled avalanche rectiﬁers

BYG70 series

The well-defined void-free case is of a

transfer-moulded thermo-setting

plastic.

FEATURES

DESCRIPTION

• Glass passivated

DO-214AC surface mountable

package with glass passivated chip.

• High maximum operating

temperature

• Low leakage current

• Excellent stability

cathode

band

handbook, 4 columns

• Guaranteed avalanche energy

absorption capability

• UL 94V-O classified plastic

package

• Shipped in 12 mm embossed tape.

MSA474

Top view

Side view

Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

V_RRM

repetitive peak reverse voltage

BYG70D

−

200

400

600

BYG70G

BYG70J

V_R

continuous reverse voltage

BYG70D

−

200

400

600

1.00

BYG70G

BYG70J

I_F(AV)

average forward current

averaged over any 20 ms period;

T_tp= 100 °C; see Fig.2

−

0.53

0.39

averaged over any 20 ms period;

Al₂O₃PCB mounting (see Fig.7);

T_amb= 60 °C; see Fig.3

averaged over any 20 ms period;

epoxy PCB mounting (see Fig.7);

T_amb= 60 °C; see Fig.3

I_FSM

non-repetitive peak forward current t = 10 ms half sine wave;

T_j= T_{j max}prior to surge;

V_R= V_RRMmax

E_RSM

non-repetitive peak reverse

avalanche energy

L = 120 mH; T_j= T_{j max}prior to surge;

inductive load switched off

T_stg

T_j

storage temperature

junction temperature

−65

+175 °C

see Fig.4

1996 Jun 05

Philips Semiconductors

Preliminary speciﬁcation

Fast soft-recovery

controlled avalanche rectiﬁers

BYG70 series

ELECTRICAL CHARACTERISTICS

T_j= 25 °C unless otherwise speciﬁed.

SYMBOL

PARAMETER

forward voltage

CONDITIONS

MIN.

TYP.

MAX.

2.1

UNIT

V_F

I_F= 1 A; T_j= T_{j max;}see Fig.5

I_F= 1 A; see Fig.5

I_R= 0.1 mA

−

3.6

V_(BR)R

reverse avalanche

breakdown voltage

BYG70D

BYG70G

300

500

700

−

BYG70J

I_R

reverse current

V_R= V_RRMmax

see Fig.6

;

µA

V_R= V_RRMmax; T_j= 165 °C;

see Fig.6

−

100

t_rr

reverse recovery time

diode capacitance

when switched from I_F= 0.5 A to

I_R= 1 A; measured at I_R= 0.25 A;

see Fig.8

C_d

V_R= 0 V; f = 1 MHz

−

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

R_{th j-tp}

R_{th j-a}

thermal resistance from junction to tie-point

thermal resistance from junction to ambient

K/W

note 1

note 2

100

150

Notes

1. Device mounted on Al₂O₃printed-circuit board, 0.7 mm thick; thickness of copper ≥35 µm, see Fig.7.

2. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.7.

For more information please refer to the “General Part of associated Handbook”.

1996 Jun 05

Philips Semiconductors

Preliminary speciﬁcation

Fast soft-recovery

controlled avalanche rectiﬁers

BYG70 series

GRAPHICAL DATA

MGD485

MGD486

2.0

0.8

handbook, halfpage

F(AV)

(A)

1.5

0.6

1.0

0.5

0.4

0.2

100

200

100

200

(°C)

amb

V_R= V_RRMmax; δ = 0.5; a = 1.57.

Device mounted as shown in Fig.7;

solid line: Al₂O₃PCB; dotted line: epoxy PCB.

Fig.2 Maximum permissible average forward

current as a function of tie-point temperature

(including losses due to reverse leakage).

Fig.3 Maximum permissible average forward

current as a function of ambient temperature

(including losses due to reverse leakage).

MGD487

MGD488

200

handbook, halfpage

(A)

(°C)

160

120

400

800

(V)

Device mounted as shown in Fig.7.

Solid line: Al₂O₃PCB.

Solid line: T_j= 25 °C.

Dotted line: epoxy PCB.

Dotted line: T_j= 175 °C.

Fig.4 Maximum permissible junction temperature

as a function of reverse voltage.

Fig.5 Forward current as a function of forward

voltage; maximum values.

1996 Jun 05

Philips Semiconductors

Preliminary speciﬁcation

Fast soft-recovery

controlled avalanche rectiﬁers

BYG70 series

MGC532

handbook, halfpage

(µA)

4.5

2.5

1.25

MSB213

100

200

T ( C)

V_R= V_RMMmax

Dimensions in mm.

Material: AL₂O₃or epoxy-glass.

Fig.6 Reverse current as a function of junction

temperature; maximum values.

Fig.7 Printed-circuit board for surface mounting.

handbook, full pagewidth

DUT

(A)

0.5

25 V

10 Ω

1 Ω

50 Ω

0.25

0.5

(A)

MAM057

1.0

Input impedance oscilloscope: 1 MΩ, 22 pF; t_r≤ 7 ns.

Source impedance: 50 Ω; t_r≤ 15 ns.

Fig.8 Test circuit and reverse recovery time waveform and definition.

1996 Jun 05

Philips Semiconductors

Preliminary speciﬁcation

Fast soft-recovery

controlled avalanche rectiﬁers

BYG70 series

PACKAGE OUTLINE

5.5

5.1

4.5

4.3

handbook, full pagewidth

2.3

2.0

0.05

0.2

3.3

2.7

MSA414

2.8 1.6

2.4 1.4

Marking band indicates the cathode.

Dimensions in mm.

Fig.9 DO-214AC; SOD106.

DEFINITIONS

Data sheet status

Objective speciﬁcation

Preliminary speciﬁcation

Product speciﬁcation

This data sheet contains target or goal speciﬁcations for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

1996 Jun 05

相关型号：