BYV25D-600 [NXP]
Rectifier diode, ultrafast; 整流二极管,超快型号: | BYV25D-600 |
厂家: | NXP |
描述: | Rectifier diode, ultrafast |
文件: | 总9页 (文件大小:67K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BYV25D-600
Rectifier diode, ultrafast
Rev. 01 — 29 July 2008
Product data sheet
1. Product profile
1.1 General description
Ultrafast, epitaxial rectifier diode in a SOT428 (DPAK) surface-mountable plastic package.
1.2 Features
I Fast switching
I Low thermal resistance
I Soft recovery characteristic
I Low forward voltage drop
I High thermal cycling performance
1.3 Applications
I High frequency switched-mode power
I Discontinuous Current Mode (DCM)
supplies
Power Factor Correction (PFC)
1.4 Quick reference data
I VRRM ≤ 600 V
I VF ≤ 1.11 V
I IF(AV) ≤ 5 A
I trr ≤ 60 ns
2. Pinning information
Table 1.
Pinning
Pin
1
Description
Simplified outline
Graphic symbol
no connection
cathode (k)
mb
k
a
[1]
2
001aaa020
3
anode (a)
mb
mounting base; cathode (k)
2
1
3
SOT428 (DPAK)
[1] It is not possible to connect to pin 2 of the SOT428 package.
BYV25D-600
NXP Semiconductors
Rectifier diode, ultrafast
3. Ordering information
Table 2.
Ordering information
Type number Package
Name
Description
plastic single-ended surface-mounted package (DPAK); 3-leads (one lead cropped)
Version
BYV25D-600 DPAK
SOT428
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min Max Unit
VRRM
VRWM
VR
repetitive peak reverse voltage
-
-
-
-
-
-
-
600
600
600
5
V
V
V
A
A
A
A
crest working reverse voltage
reverse voltage
square waveform; δ = 1.0; Tmb ≤ 100 °C
square waveform; δ = 0.5; Tmb ≤ 131 °C
square waveform; δ = 0.5; Tmb ≤ 131 °C
t = 10 ms; sinusoidal waveform
IF(AV)
IFRM
IFSM
average forward current
repetitive peak forward current
non-repetitive peak forward current
10
60
t = 8.3 ms; sinusoidal waveform
66
Tstg
Tj
storage temperature
junction temperature
−40 +150 °C
150 °C
-
BYV25D-600_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 29 July 2008
2 of 9
BYV25D-600
NXP Semiconductors
Rectifier diode, ultrafast
5. Thermal characteristics
Table 4.
Symbol Parameter
Rth(j-mb) thermal resistance from junction to
mounting base
Thermal characteristics
Conditions
Min
Typ
Max
Unit
with heatsink compound;
see Figure 1
-
-
3.0
K/W
[1]
Rth(j-a)
thermal resistance from junction to ambient in free air
-
50
-
K/W
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
003aac235
10
Z
th(j-mb)
(K/W)
1
t
−1
−2
−3
p
10
10
10
P
δ =
T
t
t
p
T
−6
−5
−4
−3
−2
−1
10
10
10
10
10
10
1
10
t
(s)
p
Fig 1. Transient thermal impedance from junction to mounting base as a function of pulse width
BYV25D-600_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 29 July 2008
3 of 9
BYV25D-600
NXP Semiconductors
Rectifier diode, ultrafast
6. Characteristics
Table 5.
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
Static characteristics
Conditions
Min
Typ
Max
Unit
VF
forward voltage
IF = 5 A; Tj = 150 °C; see Figure 2
IF = 5 A
-
-
-
-
0.97
1.12
2
1.11
1.30
50
V
V
IR
reverse current
VR = 600 V
µA
mA
VR = 600 V; Tj = 100 °C
0.1
0.35
Dynamic characteristics
Qr
recovered charge
IF = 2 A to VR ≥ 30 V; dIF/dt = 20 A/µs;
see Figure 3
-
-
-
40
50
3
70
60
5.5
nC
ns
A
trr
reverse recovery time
IF = 1 A to VR ≥ 30 V;
dIF/dt = 100 A/µs; see Figure 3
IRM
peak reverse recovery IF = 10 A to VR ≥ 30 V;
current
dIF/dt = 50 A/µs; Tj = 100 °C;
see Figure 3
VFR
forward recovery
voltage
IF = 10 A; dIF/dt = 10 A/µs;
see Figure 4
-
3.2
-
V
003aac232
15
10
IF
(A)
(1)
(2)
(3)
5
0
0
0.4
0.8
1.2
1.6
V
F (V)
(1) Tj = 150 °C; typical values
(2) Tj = 150 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig 2. Forward current as a function of forward voltage
BYV25D-600_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 29 July 2008
4 of 9
BYV25D-600
NXP Semiconductors
Rectifier diode, ultrafast
I
F
dl
F
I
F
dt
t
rr
time
time
10 %
V
F
V
FR
100 %
Q
r
V
F
I
I
RM
R
time
001aab911
001aab912
Fig 3. Reverse recovery definitions
Fig 4. Forward recovery definitions
003aac233
003aac234
10
8
P
P
tot
tot
δ = 1
(W)
(W)
8
a = 1.57
6
1.9
0.5
6
2.2
2.8
4
0.2
4.0
4
0.1
2
2
0
0
0
2
4
6
8
0
2
4
6
I
(A)
I
(A)
F(AV)
F(AV)
IF(AV) = IF(RMS) × √δ
a = form factor = IF(RMS) / IF(AV)
Fig 5. Forward power dissipation as a function of
average forward current; square waveform;
maximum values
Fig 6. Forward power dissipation as a function of
average forward current; sinusoidal waveform;
maximum values
BYV25D-600_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 29 July 2008
5 of 9
BYV25D-600
NXP Semiconductors
Rectifier diode, ultrafast
7. Package outline
Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped)
SOT428
y
E
A
A
A
b
2
E
1
1
mounting
base
D
2
D
1
H
D
2
L
L
2
L
1
1
3
b
1
b
M
c
w
A
e
e
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
y
max
D
min
E
min
L
1
min
2
1
UNIT
A
A
1
b
b
b
c
D
E
e
e
1
H
D
L
L
2
w
1
2
1
2.38
2.22
0.93
0.46
0.89
0.71
1.1
0.9
5.46
5.00
0.56
0.20
6.22
5.98
6.73
6.47
10.4
9.6
2.95
2.55
0.9
0.5
4.0
4.45
0.5
mm
2.285 4.57
0.2
0.2
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
06-02-14
06-03-16
SOT428
SC-63
TO-252
Fig 7. Package outline SOT428 (TO-252)
BYV25D-600_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 29 July 2008
6 of 9
BYV25D-600
NXP Semiconductors
Rectifier diode, ultrafast
8. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BYV25D-600_1
20080729
Product data sheet
-
-
BYV25D-600_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 29 July 2008
7 of 9
BYV25D-600
NXP Semiconductors
Rectifier diode, ultrafast
9. Legal information
9.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
9.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
9.3
Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
9.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BYV25D-600_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 29 July 2008
8 of 9
BYV25D-600
NXP Semiconductors
Rectifier diode, ultrafast
11. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
3
4
5
6
7
8
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
9
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
9.1
9.2
9.3
9.4
10
11
Contact information. . . . . . . . . . . . . . . . . . . . . . 8
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 29 July 2008
Document identifier: BYV25D-600_1
相关型号:
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