BYV97GAMO [NXP]

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BYV97GAMO
型号: BYV97GAMO
厂家: NXP    NXP
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DISCRETE SEMICONDUCTORS  
DATA SHEET  
BYV97 series  
Fast soft-recovery  
controlled avalanche rectifiers  
1996 Jun 07  
Product specification  
Supersedes data of February 1994  
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYV97 series  
FEATURES  
DESCRIPTION  
Glass passivated  
Rugged glass SOD57 package, using a high temperature alloyed construction.  
This package is hermetically sealed and fatigue free as coefficients of  
expansion of all used parts are matched.  
High maximum operating  
temperature  
Low leakage current  
Excellent stability  
Guaranteed avalanche energy  
k
a
absorption capability  
MAM047  
Available in ammo-pack.  
Fig.1 Simplified outline (SOD57) and symbol.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VRRM  
repetitive peak reverse voltage  
BYV97F  
1200  
1400  
V
V
BYV97G  
VR  
continuous reverse voltage  
BYV97F  
1200  
1400  
1.6  
V
V
A
BYV97G  
IF(AV)  
average forward current  
Ttp = 60 °C; lead length = 10 mm  
see Fig.2;  
averaged over any 20 ms period;  
see also Fig.6  
IF(AV)  
average forward current  
Tamb = 50 °C; PCB mounting  
(see Fig. 12); see Fig.3;  
averaged over any 20 ms period;  
see also Fig.6  
0.9  
A
IFRM  
repetitive peak forward current  
Ttp = 65 °C; see Fig.4  
15  
8
A
A
A
Tamb = 65 °C; see Fig.5  
IFSM  
non-repetitive peak forward current  
t = 10 ms half sine wave;  
Tj = Tj max prior to surge;  
VR = VRRMmax  
20  
ERSM  
non-repetitive peak reverse  
avalanche energy  
L = 120 mH; Tj = Tj max prior to  
surge; inductive load switched off  
10 mJ  
Tstg  
Tj  
storage temperature  
junction temperature  
65  
65  
+175 °C  
+175 °C  
see Fig.7  
1996 Jun 07  
2
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYV97 series  
ELECTRICAL CHARACTERISTICS  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
forward voltage  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
VF  
IF = 3 A; Tj = Tj max; see Fig.8  
IF = 3 A; see Fig.8  
IR = 0.1 mA  
1.35  
1.65  
V
V
V(BR)R  
reverse avalanche  
breakdown voltage  
BYV97F  
BYV97G  
1300  
1500  
1
V
V
IR  
reverse current  
VR = VRRMmax  
see Fig.9  
;
µA  
µA  
ns  
VR = VRRMmax; Tj = 165 °C;  
see Fig.9  
150  
500  
trr  
reverse recovery time  
diode capacitance  
when switched from IF = 0.5 A  
to IR = 1 A; measured at  
IR = 0.25 A; see Fig.14  
Cd  
f = 1 MHz; VR = 0 V; see Fig.11  
35  
pF  
when switched from IF = 1 A to  
VR 30 V and dIF/dt = 1 A/µs;  
see Figs 10 and 13  
5
A/µs  
maximum slope of  
reverse recovery current  
dIR  
--------  
dt  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
VALUE  
UNIT  
Rth j-tp  
Rth j-a  
thermal resistance from junction to tie-point  
thermal resistance from junction to ambient  
lead length = 10 mm  
note 1  
46  
K/W  
K/W  
100  
Note  
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 µm, see Fig. 12.  
For more information please refer to the “General Part of associated Handbook”.  
1996 Jun 07  
3
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYV97 series  
GRAPHICAL DATA  
MBD419  
MBD420  
1.2  
2.0  
handbook, halfpage  
handbook, halfpage  
I
F(AV)  
I
(A)  
F(AV)  
1.6  
(A)  
lead length 10 mm  
0.8  
1.2  
0.8  
0.4  
0
0.4  
0
0
0
100  
200  
100  
200  
o
o
T
tp  
( C)  
T
( C)  
amb  
a = 1.57; VR = VRRMmax; δ = 0.5.  
a = 1.57; VR = VRRMmax; δ = 0.5.  
Device mounted as shown in Fig.12.  
Fig.2 Maximum permissible average forward  
current as a function of tie-point temperature  
(including losses due to reverse leakage).  
Fig.3 Maximum permissible average forward  
current as a function of ambient temperature  
(including losses due to reverse leakage).  
MBD448  
16  
I
= 0.05  
δ
FRM  
(A)  
12  
0.1  
8
4
0.2  
0.5  
1
0
10  
2
1
2
3
4
10  
1
10  
10  
10  
10  
t
(ms)  
p
Ttp = 65°C; Rth j-tp = 46 K/W.  
VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 1400 V.  
Fig.4 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.  
1996 Jun 07  
4
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYV97 series  
MBD442  
10  
I
FRM  
(A)  
8
= 0.05  
δ
6
4
2
0.1  
0.2  
0.5  
1
0
10  
2
1
2
3
4
10  
1
10  
10  
10  
10  
t
(ms)  
p
Tamb = 65 °C; Rth j-a = 100 K/W.  
VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 1400 V.  
Fig.5 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.  
MBD428  
MBD433  
3
200  
handbook, halfpage  
handbook, halfpage  
1.57  
1.42  
a = 3  
2.5  
2
P
(W)  
T
o
j
( C)  
2
1
100  
BYV97F  
1000  
BYV97G  
0
0
0
1
2
0
2000  
I
(A)  
V
(V)  
R
F(AV)  
a = IF(RMS)/IF(AV); VR = VRRMmax; δ = 0.5.  
Solid line = VR.  
Dotted line = VRRM; δ = 0.5.  
Fig.6 Maximum steady state power dissipation  
(forward plus leakage current losses,  
excluding switching losses) as a function  
of average forward current.  
Fig.7 Maximum permissible junction temperature  
as a function of reverse voltage.  
1996 Jun 07  
5
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYV97 series  
MGD316  
MGC574  
3
10  
10  
handbook, halfpage  
handbook, halfpage  
I
F
I
R
(A)  
(µA)  
8
2
10  
6
4
2
10  
1
1
10  
0
0
1
2
3
0
100  
200  
o
V
(V)  
T ( C)  
j
F
Dotted line: Tj = 175 °C.  
Solid line: Tj = 25 °C.  
VR = VRRMmax  
.
Fig.8 Forward current as a function of forward  
voltage; maximum values.  
Fig.9 Reverse current as a function of junction  
temperature; maximum values.  
MBD439  
10  
t
rr  
(µs)  
I
=
F
1
5 A  
1 A  
1
10  
1
2
10  
1
10  
10  
dl /dt (A/µs)  
F
Tj = 25°C.  
For definitions see Fig. 13.  
Fig.10 Maximum reverse recovery time as a function of the rate of fall of forward current.  
6
1996 Jun 07  
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYV97 series  
MGD317  
2
10  
50  
25  
handbook, halfpage  
handbook, halfpage  
C
d
(pF)  
10  
7
50  
2
3
1
1
2
3
MGA200  
10  
10  
10  
V
(V)  
R
f = 1 MHz; Tj = 25 °C.  
Dimensions in mm.  
Fig.11 Diode capacitance as a function of reverse  
voltage; typical values.  
Fig.12 Device mounted on a printed-circuit board.  
I
andbook, halfpage  
F
dI  
F
dt  
t
rr  
t
10%  
dI  
R
dt  
100%  
I
R
MGC499  
Fig.13 Reverse recovery definitions.  
1996 Jun 07  
7
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYV97 series  
DUT  
I
F
(A)  
+
0.5  
t
rr  
25 V  
10 Ω  
1 Ω  
50 Ω  
0
0.25  
0.5  
t
I
R
(A)  
MAM057  
1
Input impedance oscilloscope: 1 M, 22 pF; tr < 7 ns.  
Source impedance: 50 ; tr < 15 ns.  
Fig.14 Test circuit and reverse recovery time waveform and definition.  
1996 Jun 07  
8
Philips Semiconductors  
Product specification  
Fast soft-recovery  
controlled avalanche rectifiers  
BYV97 series  
PACKAGE OUTLINE  
k
a
0.81  
max  
3.81  
max  
4.57  
max  
MBC880  
28 min  
28 min  
Dimensions in mm.  
The marking band indicates the cathode.  
Fig.15 SOD57.  
DEFINITIONS  
Data Sheet Status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1996 Jun 07  
9

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