BZD142W-200,115 [NXP]

DIODE 100 W, UNIDIRECTIONAL, SILICON, TVS DIODE, HERMEIC SEALED, GLASS, SMD, 2 PIN, Transient Suppressor;
BZD142W-200,115
型号: BZD142W-200,115
厂家: NXP    NXP
描述:

DIODE 100 W, UNIDIRECTIONAL, SILICON, TVS DIODE, HERMEIC SEALED, GLASS, SMD, 2 PIN, Transient Suppressor

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文件: 总8页 (文件大小:50K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
age  
BZD142W  
ZenBlockTM; zener with integrated  
blocking diode  
Product specification  
2001 Oct 10  
Supersedes data of 2000 May 01  
Philips Semiconductors  
Product specification  
ZenBlockTM; zener with  
integrated blocking diode  
BZD142W  
FEATURES  
handbook, halfpage  
Zener and 600 V/100 ns blocking function in one  
package(1)  
Protects MOSFETS or power IC controllers such as  
(3)  
TINYSwitch (2), TOPSwitch (2) and STARplug  
Glass passivated  
MAM433  
Excellent clamping capability and stability  
Supplied in 8 mm embossed tape.  
Fig.1 Simplified outline (SOD87).  
DESCRIPTION  
(4)  
Cavity free cylindrical glass package through Implotec  
technology. This package is hermetically sealed and  
fatigue free as coefficients of expansion of all used parts  
are matched.  
(1) Types BZD142W-68,-100 and -160 have a 600 V blocking  
diode with a minimum trr of 1000 ns.  
(2) TINYSwitch and TOPSwitch are trademarks of Power  
Integrations.  
(3) STARplug is a trademark of Koninklijke Philips Electronics  
N.V.  
(4) Implotec is a trademark of Koninklijke Philips Electronics N.V.  
LIMITING VALUES  
SYMBOL  
PARAMETER  
storage temperature  
junction temperature  
CONDITIONS  
MIN.  
65  
MAX.  
+150  
UNIT  
°C  
Tstg  
Tj  
65  
+150  
°C  
Limiting values zener  
Ptot  
total power dissipation  
Ttp = 105 °C; see Fig.2  
1.5  
W
W
PRSM  
non-repetitive peak reverse power  
dissipation  
10/1000 µs exponential pulse;  
Tj = 25 °C prior to surge; see Fig.5  
100  
Limiting values blocking diode  
VR  
continuous reverse voltage  
600  
7.5  
V
ERSM  
non-repetitive peak reverse  
avalanche energy  
L = 120 mH; Tj = Tj max prior to  
surge; inductive load switched off  
mJ  
2001 Oct 10  
2
Philips Semiconductors  
Product specification  
ZenBlockTM; zener with  
integrated blocking diode  
BZD142W  
ELECTRICAL CHARACTERISTICS ZENER/TVS  
Tj = 25 °C unless otherwise specified.  
REVERSE CURRENT  
at STAND-OFF  
VOLTAGE  
TEMPERATURE  
COEFFICIENT CURRENT  
TEST  
CLAMPING  
VOLTAGE  
WORKING VOLTAGE  
VZ (V) at Itest  
TYPE  
NUMBER  
SUFFIX(1)  
V(CL)R  
(V)  
SZ (%/K) at Itest  
Itest (mA)  
IR (µA)  
at IRSM  
(A)(2)  
at VR (V)  
MIN.  
NOM.  
MAX.  
MIN.  
MAX.  
MAX.  
MAX.  
68  
61  
90  
68  
100  
160  
180  
200  
75  
110  
171  
198  
220  
0.07  
0.07  
0.07  
0.07  
0.07  
0.12  
0.12  
0.12  
0.12  
0.12  
10  
5
106  
139  
224  
250  
277  
0.94  
0.72  
0.45  
0.40  
0.36  
5
5
5
5
5
56  
82  
100  
160  
180  
200  
149  
162  
180  
5
130  
150  
160  
5
5
Notes  
1. To complete the type number the suffix is added to the basic type number, e.g. BZD142W-68.  
2. Non-repetitive peak reverse current in accordance with “IEC 60060-1, Section 8” (10/1000 µs pulse); see Fig.5.  
ELECTRICAL CHARACTERISTICS BLOCKING DIODE  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
IR = 0.1 mA  
MIN.  
700  
TYP.  
MAX.  
UNIT  
V(BR)R  
reverse avalanche breakdown  
voltage  
V
IR  
reverse current  
VR = 600 V  
5
µA  
µA  
pF  
VR = 600 V; Tj = 150 °C  
100  
Cd  
diode capacitance  
f = 1 MHz; VR = 0 V;  
see Fig.3  
15  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
VALUE  
UNIT  
Rth j-tp  
Rth j-a  
thermal resistance from junction to tie-point  
thermal resistance from junction to ambient  
30  
K/W  
K/W  
note 1  
150  
Note  
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 µm, see Fig.4.  
For more information please refer to the “General Part of associated Handbook”.  
2001 Oct 10  
3
Philips Semiconductors  
Product specification  
ZenBlockTM; zener with  
integrated blocking diode  
BZD142W  
GRAPHICAL DATA  
MBL106  
MBL107  
2
10  
3.0  
handbook, halfpage  
handbook, halfpage  
P
(W)  
C
d
(pF)  
2.0  
10  
1.0  
0
1
1
2
3
10  
10  
10  
0
40  
80  
120  
160  
200  
V
(V)  
R
T (°C)  
Solid line: tie-point temperature.  
Dotted line: ambient temperature;  
device mounted (see Fig.4).  
f = 1 MHz; Tj = 25 °C.  
Fig.2 Maximum total power dissipation as a  
function of temperature.  
Fig.3 Diode capacitance as a function of reverse  
voltage; typical values.  
I
handbook, halfpage  
RSM  
(%)  
100  
90  
50  
50  
10  
4.5  
50  
2.5  
t
t
1
t
MGD521  
2
1.25  
MSB213  
In accordance with “IEC 60060-1, Section 8”.  
t1 = 10 µs.  
t2 = 1000 µs.  
Dimensions in mm.  
Fig.5 Non-repetitive peak reverse current pulse  
definition.  
Fig.4 Printed-circuit board for surface mounting.  
2001 Oct 10  
4
Philips Semiconductors  
Product specification  
ZenBlockTM; zener with  
integrated blocking diode  
BZD142W  
PACKAGE OUTLINE  
Hermetically sealed glass surface mounted package;  
ImplotecTM(1) technology; 2 connectors  
SOD87  
k
a
(2)  
D
D
1
L
L
H
DIMENSIONS (mm are the original dimensions)  
D1  
L
D
H
UNIT  
0
1
2 mm  
scale  
2.1  
2.0  
2.0  
1.8  
3.7  
3.3  
mm  
0.3  
Notes  
1. Implotec is a trademark of Philips.  
2. The marking indicates the cathode.  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
99-03-31  
99-06-04  
SOD87  
100H03  
2001 Oct 10  
5
Philips Semiconductors  
Product specification  
ZenBlockTM; zener with  
integrated blocking diode  
BZD142W  
DATA SHEET STATUS  
PRODUCT  
DATA SHEET STATUS(1)  
STATUS(2)  
DEFINITIONS  
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Changes will be  
communicated according to the Customer Product/Process Change  
Notification (CPCN) procedure SNW-SQ-650A.  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes, without notice, in the  
products, including circuits, standard cells, and/or  
software, described or contained herein in order to  
improve design and/or performance. Philips  
Semiconductors assumes no responsibility or liability for  
the use of any of these products, conveys no licence or title  
under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that  
these products are free from patent, copyright, or mask  
work right infringement, unless otherwise specified.  
Application information  
Applications that are  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2001 Oct 10  
6
Philips Semiconductors  
Product specification  
ZenBlockTM; zener with  
integrated blocking diode  
BZD142W  
NOTES  
2001 Oct 10  
7
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.  
© Koninklijke Philips Electronics N.V. 2001  
SCA73  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
613510/02/pp8  
Date of release: 2001 Oct 10  
Document order number: 9397 750 08603  

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