BZV55-B13T/R [NXP]

DIODE 13 V, 0.4 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Voltage Regulator Diode;
BZV55-B13T/R
型号: BZV55-B13T/R
厂家: NXP    NXP
描述:

DIODE 13 V, 0.4 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Voltage Regulator Diode

二极管 齐纳二极管
文件: 总13页 (文件大小:410K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BZV55 series  
Voltage regulator diodes  
Rev. 5 — 26 January 2011  
Product data sheet  
1. Product profile  
1.1 General description  
Low-power voltage regulator diodes in small hermetically sealed glass SOD80C  
Surface-Mounted Device (SMD) packages. The diodes are available in the normalized  
E24 2 % (BZV55-B) and approximately 5 % (BZV55-C) tolerance range.  
The series consists of 37 types with nominal working voltages from 2.4 V to 75 V.  
1.2 Features and benefits  
Non-repetitive peak reverse power  
dissipation: 40 W  
Wide working voltage range:  
nominal 2.4 V to 75 V (E24 range)  
Total power dissipation: 500 mW  
Two tolerance series: 2 % and 5 %  
Low differential resistance  
Small hermetically sealed glass  
SMD package  
1.3 Applications  
General regulation functions  
1.4 Quick reference data  
Table 1.  
Quick reference data  
Symbol Parameter  
Conditions  
Min  
Typ  
Max  
0.9  
40  
Unit  
V
VF  
forward voltage  
IF = 10 mA  
-
-
-
-
[1]  
PZSM  
non-repetitive peak  
W
reverse power dissipation  
[1] tp = 100 s; square wave; Tj = 25 C prior to surge  
2. Pinning information  
Table 2.  
Pinning  
Pin  
1
Description  
cathode  
Simplified outline  
Graphic symbol  
[1]  
k
a
2
anode  
2
1
006aaa152  
[1] The marking band indicates the cathode.  
BZV55 series  
NXP Semiconductors  
Voltage regulator diodes  
3. Ordering information  
Table 3.  
Ordering information  
Type number  
Package  
Name  
-
Description  
Version  
BZV55-B2V4 to  
BZV55-C75[1]  
hermetically sealed glass surface-mounted  
package; 2 connectors  
SOD80C  
[1] The series consists of 74 types with nominal working voltages from 2.4 V to 75 V.  
4. Marking  
Table 4.  
Marking codes  
Type number  
Marking code  
BZV55-B2V4 to BZV55-C75  
marking band  
5. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
IF  
Parameter  
Conditions  
Min  
Max  
250  
see  
Table 8  
and 9  
Unit  
forward current  
-
-
mA  
[1]  
[1]  
IZSM  
non-repetitive peak  
reverse current  
PZSM  
Ptot  
non-repetitive peak  
reverse power dissipation  
-
40  
W
[2]  
[2]  
total power dissipation  
Tamb 50 C  
Ttp 50 C  
-
400  
mW  
mW  
C  
-
500  
Tstg  
Tj  
storage temperature  
junction temperature  
65  
65  
+200  
+200  
C  
[1] tp = 100 s; square wave; Tj = 25 C prior to surge  
[2] Device mounted on a ceramic substrate of 10 10 0.6 mm.  
6. Thermal characteristics  
Table 6.  
Thermal characteristics  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Unit  
[1]  
Rth(j-a)  
thermal resistance from  
junction to ambient  
in free air  
-
-
380  
K/W  
Rth(j-sp)  
thermal resistance from  
junction to solder point  
-
-
300  
K/W  
[1] Device mounted on a ceramic substrate of 10 10 0.6 mm.  
BZV55_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 26 January 2011  
2 of 13  
BZV55 series  
NXP Semiconductors  
Voltage regulator diodes  
006aab072  
3
10  
δ = 1  
Z
th(j-a)  
0.75  
0.50  
0.33  
(K/W)  
2
10  
0.20  
0.10  
0.05  
0.02  
0.01  
10  
0.001  
1
10  
1  
2
3
4
5
1
10  
10  
10  
10  
10  
t
(ms)  
p
Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values  
7. Characteristics  
Table 7.  
Characteristics  
Tj = 25 C unless otherwise specified.  
Symbol Parameter  
Conditions  
Min  
Typ  
Max Unit  
VF  
IR  
forward voltage  
reverse current  
BZV55-B/C2V4  
BZV55-B/C2V7  
BZV55-B/C3V0  
BZV55-B/C3V3  
BZV55-B/C3V6  
BZV55-B/C3V9  
BZV55-B/C4V3  
BZV55-B/C4V7  
BZV55-B/C5V1  
BZV55-B/C5V6  
BZV55-B/C6V2  
BZV55-B/C6V8  
BZV55-B/C7V5  
BZV55-B/C8V2  
BZV55-B/C9V1  
BZV55-B/C10  
BZV55-B/C11  
BZV55-B/C12  
BZV55-B/C13  
IF = 10 mA  
-
-
0.9  
V
VR = 1 V  
VR = 1 V  
VR = 1 V  
VR = 1 V  
VR = 1 V  
VR = 1 V  
VR = 1 V  
VR = 2 V  
VR = 2 V  
VR = 2 V  
VR = 4 V  
VR = 4 V  
VR = 5 V  
VR = 5 V  
VR = 6 V  
VR = 7 V  
VR = 8 V  
VR = 8 V  
VR = 8 V  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
50  
20  
10  
5
A  
A  
A  
A  
A  
A  
A  
A  
A  
A  
A  
A  
A  
nA  
nA  
nA  
nA  
nA  
nA  
nA  
5
3
3
3
2
1
3
2
1
700  
500  
200  
100  
100  
100  
50  
BZV55-B/C15 to BZV55-B/C75 VR = 0.7VZ(nom)  
BZV55_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 26 January 2011  
3 of 13  
BZV55 series  
NXP Semiconductors  
Voltage regulator diodes  
Table 8.  
Characteristics per type; BZV55-B2V4 to BZV55-C24  
Tj = 25 C unless otherwise specified.  
BZV55- Sel  
xxx  
Working  
voltage  
VZ (V)  
Differential resistance  
dif ()  
Temperature  
coefficient  
SZ (mV/K)  
Diode  
capacitance  
Cd (pF)[1]  
Non-repetitive  
peak reverse  
current  
r
IZSM (A)[2]  
IZ = 5 mA  
IZ = 1 mA  
IZ = 5 mA  
IZ = 5 mA  
Min  
2.35  
2.2  
Max  
Typ  
Max Typ  
Max Min  
100  
Typ  
Max  
Max  
Max  
2V4  
2V7  
3V0  
3V3  
3V6  
3V9  
4V3  
4V7  
5V1  
5V6  
6V2  
6V8  
7V5  
8V2  
9V1  
10  
B
C
B
C
B
C
B
C
B
C
B
C
B
C
B
C
B
C
B
C
B
C
B
C
B
C
B
C
B
C
B
C
B
C
B
C
2.45  
2.6  
275  
600  
600  
600  
600  
600  
600  
600  
500  
480  
400  
150  
80  
70  
75  
80  
85  
85  
85  
80  
50  
40  
15  
6
3.5  
3.5  
3.5  
3.5  
3.5  
3.5  
3.5  
3.5  
2.7  
2.0  
0.4  
1.6  
0
450  
6.0  
2.65  
2.5  
2.75  
2.9  
300  
325  
350  
375  
400  
410  
425  
400  
80  
100  
95  
95  
90  
90  
90  
80  
60  
40  
10  
15  
15  
15  
15  
20  
20  
25  
2.0  
2.1  
2.4  
2.4  
2.5  
2.5  
1.4  
0.8  
1.2  
0
450  
450  
450  
450  
450  
450  
300  
300  
300  
200  
200  
150  
150  
150  
90  
6.0  
6.0  
6.0  
6.0  
6.0  
6.0  
6.0  
6.0  
6.0  
6.0  
6.0  
4.0  
4.0  
3.0  
3.0  
2.5  
2.5  
2.94  
2.8  
3.06  
3.2  
0
3.23  
3.1  
3.37  
3.5  
0
3.53  
3.4  
3.67  
3.8  
0
3.82  
3.7  
3.98  
4.1  
0
4.21  
4.0  
4.39  
4.6  
0
4.61  
4.4  
4.79  
5.0  
0.2  
1.2  
2.5  
3.7  
4.5  
5.3  
6.2  
7.0  
8.0  
9.0  
10.0  
5.0  
5.2  
4.8  
5.4  
5.49  
5.2  
5.71  
6.0  
6.08  
5.8  
6.32  
6.6  
40  
2.3  
6.66  
6.4  
6.94  
7.2  
30  
6
1.2  
3.0  
7.35  
7.0  
7.65  
7.9  
30  
80  
6
2.5  
4.0  
8.04  
7.7  
8.36  
8.7  
40  
80  
6
3.2  
4.6  
8.92  
8.5  
9.28  
9.6  
40  
100  
150  
150  
150  
6
3.8  
5.5  
9.8  
10.2  
10.6  
11.2  
11.6  
12.2  
12.7  
50  
8
4.5  
6.4  
9.4  
11  
10.8  
10.4  
11.8  
11.4  
50  
10  
10  
5.4  
7.4  
85  
12  
50  
6.0  
8.4  
85  
BZV55_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 26 January 2011  
4 of 13  
BZV55 series  
NXP Semiconductors  
Voltage regulator diodes  
Table 8.  
Characteristics per type; BZV55-B2V4 to BZV55-C24 …continued  
Tj = 25 C unless otherwise specified.  
BZV55- Sel  
xxx  
Working  
voltage  
VZ (V)  
Differential resistance  
rdif ()  
Temperature  
coefficient  
SZ (mV/K)  
Diode  
capacitance  
Cd (pF)[1]  
Non-repetitive  
peak reverse  
current  
IZSM (A)[2]  
IZ = 5 mA  
IZ = 1 mA  
IZ = 5 mA  
IZ = 5 mA  
Min  
Max  
Typ  
Max Typ  
Max Min  
Typ  
Max  
Max  
Max  
13  
15  
16  
18  
20  
22  
24  
B
C
B
C
B
C
B
C
B
C
B
C
B
C
12.7  
12.4  
14.7  
13.8  
15.7  
15.3  
17.6  
16.8  
19.6  
18.8  
21.6  
20.8  
23.5  
22.8  
13.3  
14.1  
15.3  
15.6  
16.3  
17.1  
18.4  
19.1  
20.4  
21.2  
22.4  
23.3  
24.5  
25.6  
50  
170  
200  
200  
225  
225  
250  
250  
10  
10  
10  
10  
15  
20  
25  
30  
30  
40  
45  
55  
55  
70  
7.0  
9.4  
11.0  
80  
2.5  
50  
50  
50  
60  
60  
60  
9.2  
11.4  
12.4  
14.4  
15.6  
17.6  
19.6  
13.0  
14.0  
16.0  
18.0  
20.0  
22.0  
75  
75  
70  
60  
60  
55  
2.0  
10.4  
12.4  
12.3  
14.1  
15.9  
1.5  
1.5  
1.5  
1.25  
1.25  
[1] f = 1 MHz; VR = 0 V  
[2] tp = 100 s; square wave; Tj = 25 C prior to surge  
BZV55_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 26 January 2011  
5 of 13  
BZV55 series  
NXP Semiconductors  
Voltage regulator diodes  
Table 9.  
Characteristics per type; BZV55-B27 to BZV55-C75  
Tj = 25 C unless otherwise specified.  
BZV55- Sel  
xxx  
Working  
voltage  
VZ (V)  
Differential resistance  
dif ()  
Temperature  
coefficient  
SZ (mV/K)  
Diode  
capacitance  
Cd (pF)[1]  
Non-repetitive  
peak reverse  
current  
r
IZSM (A)[2]  
IZ = 2 mA  
IZ = 0.5 mA  
IZ = 2 mA  
IZ = 2 mA  
Min  
Max  
Typ  
Max Typ  
Max Min  
Typ  
Max  
Max  
Max  
27  
30  
33  
36  
39  
43  
47  
51  
56  
62  
68  
75  
B
C
B
C
B
C
B
C
B
C
B
C
B
C
B
C
B
C
B
C
B
C
B
C
26.5  
25.1  
29.4  
28.0  
32.3  
31.0  
35.3  
34.0  
38.2  
37.0  
42.1  
40.0  
46.1  
44.0  
50.0  
48.0  
54.9  
52.0  
60.8  
58.0  
66.6  
64.0  
73.5  
70.0  
27.5  
28.9  
30.6  
32.0  
33.7  
35.0  
36.7  
38.0  
39.8  
41.0  
43.9  
46.0  
47.9  
50.0  
52.0  
54.0  
57.1  
60.0  
63.2  
66.0  
69.4  
72.0  
76.5  
79.0  
65  
300  
300  
325  
350  
350  
375  
375  
400  
425  
450  
475  
500  
25  
30  
35  
35  
40  
45  
50  
60  
70  
80  
90  
95  
80  
18.0  
20.6  
23.3  
26.0  
28.7  
31.4  
35.0  
38.6  
42.2  
58.8  
65.6  
73.4  
22.7  
25.3  
50  
1.0  
70  
80  
25.7  
28.7  
31.8  
34.8  
38.8  
42.9  
46.9  
52.0  
64.4  
71.7  
80.2  
29.4  
33.4  
37.4  
41.2  
46.6  
51.8  
57.2  
63.8  
71.6  
79.8  
88.6  
50  
45  
45  
45  
40  
40  
40  
40  
35  
35  
35  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.3  
0.25  
0.2  
75  
80  
80  
90  
80  
130  
150  
170  
180  
200  
215  
240  
255  
85  
85  
90  
100  
120  
150  
170  
[1] f = 1 MHz; VR = 0 V  
[2] tp = 100 s; square wave; Tj = 25 C prior to surge  
BZV55_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 26 January 2011  
6 of 13  
BZV55 series  
NXP Semiconductors  
Voltage regulator diodes  
mbg801  
mbg781  
3
10  
300  
P
ZSM  
I
F
(W)  
(mA)  
2
200  
10  
(1)  
(2)  
10  
100  
1
10  
0
0.6  
1  
0.8  
1
1
10  
t
(ms)  
V
(V)  
p
F
(1) Tj = 25 C (prior to surge)  
(2) Tj = 150 C (prior to surge)  
Tj = 25 C  
Fig 2. Non-repetitive peak reverse power dissipation  
as a function of pulse duration; maximum  
values  
Fig 3. Forward current as a function of forward  
voltage; typical values  
mbg782  
mbg783  
10  
0
12  
S
S
Z
(mV/K)  
Z
11  
4V3  
(mV/K)  
10  
9V1  
5
1  
3V9  
8V2  
7V5  
6V8  
3V6  
6V2  
5V6  
5V1  
0
2  
3  
3V3  
4V7  
3V0  
2V4  
2V7  
5  
0
4
8
12  
16  
20  
0
20  
40  
60  
I
(mA)  
Z
I
(mA)  
Z
BZV55-B/C2V4 to BZV55-B/C4V3  
BZV55-B/C4V7 to BZV55-B/C12  
Tj = 25 C to 150 C  
Tj = 25 C to 150 C  
Fig 4. Temperature coefficient as a function of  
working current; typical values  
Fig 5. Temperature coefficient as a function of  
working current; typical values  
BZV55_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 26 January 2011  
7 of 13  
BZV55 series  
NXP Semiconductors  
Voltage regulator diodes  
8. Package outline  
1.60  
1.45  
0.3  
0.3  
3.7  
3.3  
Dimensions in mm  
06-03-16  
Fig 6. Package outline SOD80C  
9. Packing information  
Table 10. Packing methods  
The indicated -xxx are the last three digits of the 12NC ordering code.[1]  
Type number Package Description  
Packing quantity  
2500  
10000  
BZV55-B2V4 to SOD80C  
BZV55-C75  
4 mm pitch, 8 mm tape and reel  
-115  
-135  
[1] For further information and the availability of packing methods, see Section 13.  
BZV55_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 26 January 2011  
8 of 13  
BZV55 series  
NXP Semiconductors  
Voltage regulator diodes  
10. Soldering  
4.55  
4.30  
2.30  
solder lands  
solder paste  
2.25 1.70 1.60  
solder resist  
occupied area  
Dimensions in mm  
0.90  
(2x)  
sod080c  
Fig 7. Reflow soldering footprint SOD80C  
6.30  
4.90  
2.70  
1.90  
solder lands  
solder resist  
occupied area  
tracks  
2.90 1.70  
Dimensions in mm  
sod080c  
Fig 8. Wave soldering footprint SOD80C  
BZV55_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 26 January 2011  
9 of 13  
BZV55 series  
NXP Semiconductors  
Voltage regulator diodes  
11. Revision history  
Table 11. Revision history  
Document ID  
BZV55_SER v.5  
Modifications:  
Release date  
20110126  
Data sheet status  
Change notice  
Supersedes  
Product data sheet  
-
BZV55_SER v.4  
Section 4 “Marking”: updated  
Table 6 “Thermal characteristics”: changed Rth(j-t) for Rth(j-sp)  
Figure 6: superseded by minimized outline drawing  
Section 12 “Legal information”: updated  
BZV55_SER v.4  
BZV55 v.3  
20070719  
20020228  
19990521  
19960426  
Product data sheet  
Product specification  
Product specification  
Product specification  
CPCN200508022F BZV55 v.3  
-
-
-
BZV55 v.2  
BZV55 v.1  
-
BZV55 v.2  
BZV55 v.1  
BZV55_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 26 January 2011  
10 of 13  
BZV55 series  
NXP Semiconductors  
Voltage regulator diodes  
12. Legal information  
12.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of an NXP Semiconductors product can reasonably be expected  
12.2 Definitions  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
12.3 Disclaimers  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
BZV55_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 26 January 2011  
11 of 13  
BZV55 series  
NXP Semiconductors  
Voltage regulator diodes  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
non-automotive qualified products in automotive equipment or applications.  
12.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
13. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
BZV55_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 26 January 2011  
12 of 13  
BZV55 series  
NXP Semiconductors  
Voltage regulator diodes  
14. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
1.4  
General description . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits. . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data . . . . . . . . . . . . . . . . . . . . 1  
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Thermal characteristics . . . . . . . . . . . . . . . . . . 2  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Packing information . . . . . . . . . . . . . . . . . . . . . 8  
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10  
3
4
5
6
7
8
9
10  
11  
12  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
12.1  
12.2  
12.3  
12.4  
13  
14  
Contact information. . . . . . . . . . . . . . . . . . . . . 12  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2011.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 26 January 2011  
Document identifier: BZV55_SER  

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